CN111163592A

CN111163592A - PCB baking device

Info

Publication number: CN111163592A
Application number: CN202010068548.5A
Authority: CN
Inventors: 李家祥
Original assignee: Shenzhen Ruirong Automation Co Ltd
Current assignee: Shenzhen Ruirong Automation Co Ltd
Priority date: 2020-01-21
Filing date: 2020-01-21
Publication date: 2020-05-15

Abstract

The invention discloses a PCB baking device, and relates to the technical field of circuit board processing. The embodiment of the invention provides a PCB baking device, which comprises a box body. A heating cavity is arranged in the box body, a heating assembly is arranged in the heating cavity, the heating assembly comprises an air filter, a heater and an air inlet, the air filter, the heater and the air inlet are sequentially arranged, and the air inlet is communicated with the air inlet pipe; wherein, air that gets into from the air intake passes through the air cleaner and gets into the heating chamber after heater heating. The plate is subjected to heat exchange in the heating cavity to finish the baking operation.

Description

PCB baking device

Technical Field

The invention relates to the technical field of circuit board processing, in particular to a PCB baking device.

Background

After the PCB is manufactured, the PCB has a quality guarantee period, and the PCB needs to be baked beyond the quality guarantee period, otherwise, the PCB is easy to explode when the PCB is produced on line by SMT. The baking can eliminate the internal stress of the PCB and stabilize the size of the PCB.

The baking of the PCB is usually carried out in an oven, air enters through an air inlet and flows into the oven after being heated by a heat pipe, however, the air flow close to the heat pipe is heated quickly, the air flow far away from the heat pipe is heated slowly, and part of the air flow is not heated uniformly and is sent into the oven, so that the overall heating efficiency of the oven is low, and the energy consumption is high.

Disclosure of Invention

The invention aims to solve the technical problems of low heating efficiency and high energy consumption of the existing oven and provides a novel PCB baking device.

In order to solve the above problems, the present invention proposes the following technical solutions:

a PCB baking device comprises a box body, wherein a heating cavity is arranged in the box body, a heating assembly is arranged in the heating cavity, the heating assembly comprises an air filter, a heater and an air inlet, the air filter, the heater and the air inlet are sequentially arranged, and the air inlet is communicated with an air inlet pipe; wherein, air that gets into from the air intake passes through the air cleaner and gets into the heating chamber after heater heating.

Further, the heating assembly comprises at least 2 air inlets, air inlet pipes communicated with the air inlets are connected to a main air inlet pipe, and the main air inlet pipe is connected with the fan.

Further, the heating cavity is provided with at least 2 heating elements.

Further, the heating assembly is arranged at the bottom of the heating cavity.

Further, the heating cavity is provided with an air outlet.

Further, PCB baking equipment still includes the exhaust pipe, the one end of exhaust pipe with the air exit is connected, the other end set up in the outside of box.

Further, the heating chamber is provided with an inner door.

Furthermore, the box body is provided with an outer door, and the outer door is arranged on one side of the inner door.

Furthermore, the outlet of the box body is provided with a lifting baffle.

Furthermore, the inlet of the box body is provided with a lifting baffle.

Compared with the prior art, the invention can achieve the following technical effects: air directly is heated by the heater after the air intake gets into to utilize air intake department air flow fast, the air that is close to the heater can both be fast by the mixing heating with the air of keeping away from the heater, thereby gets into heating chamber work, and heat transfer efficiency is high, effectively reduces the heat loss.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a PCB baking apparatus according to an embodiment of the present invention;

FIG. 2 is an enlarged view of the portion A-A in FIG. 1;

fig. 3 is a schematic structural diagram of a box body of a PCB baking apparatus according to an embodiment of the present invention;

fig. 4 is another schematic structural diagram of a box body of a PCB baking apparatus according to an embodiment of the present invention;

fig. 5 is a schematic external structural diagram of a box body of a PCB baking apparatus according to an embodiment of the present invention.

Reference numerals

The heating device comprises a box body 10, an outer door 11, a lifting baffle plate 12, a heating cavity 20, a heating assembly 21, an air filter 211, a heater 212, an air inlet 213, an air inlet pipe 214, a main air inlet pipe 215, an air outlet 22, an inner door 23 and an exhaust pipe 30.

Detailed Description

The technical solutions in the embodiments will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, wherein like reference numerals represent like elements in the drawings. It is apparent that the embodiments to be described below are only a part of the embodiments of the present invention, and not all of them. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

It is also to be understood that the terminology used in the description of the embodiments of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments of the invention. As used in the description of embodiments of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

Referring to fig. 1 to 5, an embodiment of the present invention provides a PCB baking apparatus, including a box 10. A heating cavity 20 is arranged in the box body 10, a heating assembly 21 is arranged in the heating cavity 20, the heating assembly 21 comprises an air filter 211, a heater 212 and an air inlet 213 which are sequentially arranged, and the air inlet 213 is communicated with an air inlet pipe 214; wherein, the air entering from the air inlet 213 enters the heating cavity 20 through the air filter 211 after being heated by the heater 212. The plate is heat exchanged in the heating chamber 20 to complete the baking operation.

It is understood that the air inlet 213 is provided with a filter to filter particles in the air.

In this embodiment, the air is directly heated by the heater 212 after entering through the air inlet 213, and the air flowing speed at the air inlet 213 is fast, so that the air close to the heater 212 and the air far from the heater 212 can be uniformly mixed and heated quickly, and then enter the heating cavity 20 to work, the heat transfer efficiency is high, and the heat loss is effectively reduced.

With continued reference to fig. 1-5, in an exemplary embodiment, the heating assembly 21 includes at least 2 air inlets 213, an air inlet pipe 214 connected to each air inlet 213 is connected to a main air inlet pipe 215, and the main air inlet pipe 215 is connected to a fan.

The present embodiment divides the air flow from the main air inlet duct 215 to the air inlet ducts 214 and enters the heater 212, so that the air can be heated more rapidly and the heating efficiency can be improved.

In other embodiments, the heating cavity 20 is provided with at least 2 heating elements 21. The heating assembly 21 is disposed at the bottom of the heating cavity 20. In an embodiment, the number of the heating assemblies 21 is set according to the bottom area of the heating cavity 20, and in order to improve the heating efficiency, the heating assemblies 21 may be arranged at the bottom of the heating cavity 20 side by side, and a plurality of heaters 212 are provided to achieve the effect of rapid heating.

In an embodiment, the heating cavity 20 is provided with an air outlet 22. The heated air is used for baking the plate through heat conduction, the temperature is further reduced, the low-temperature air is exhausted out of the heating cavity 20 from the air outlet 22, and the temperature in the heating cavity 20 cannot be influenced.

In specific implementation, the PCB baking apparatus further includes an exhaust duct 30, one end of the exhaust duct 30 is connected to the exhaust port 22, and the other end is disposed at the outer side of the box 10. The exhaust duct 30 exhausts the low temperature air out of the heating cavity 20, and in other embodiments, the other end of the exhaust duct 30 is connected to the inlet of the blower to achieve the effect of air circulation.

In one embodiment, in order to improve the thermal efficiency of the heating module and reduce heat loss, the heating chamber 20 is provided with a plurality of inner doors 23, and the number of the inner doors 23 may be multiple. The provision of the inner door 23 facilitates maintenance and cleaning of the heating chamber 20.

In one embodiment, the top and the bottom of the heating cavity 20 are provided with partitions to isolate the box 10, and the space between the partitions and the box can reduce the heat loss of the heating cavity 20 and prevent the heating cavity 20 from directly contacting the outside air.

In one embodiment, the case 10 is provided with an outer door 11, and the outer door 11 is provided at one side of the inner door 23.

The outlet and the inlet of the box body 10 are provided with lifting baffles 12. When the board enters the PCB baking device, the lifting baffle 12 can close the outlet and the inlet to start baking the board, thereby reducing the heat loss of the heating cavity and saving energy.

In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.

While the invention has been described with reference to specific embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A PCB baking device comprises a box body and is characterized in that a heating cavity is arranged in the box body, a heating assembly is arranged in the heating cavity, the heating assembly comprises an air filter, a heater and an air inlet which are sequentially arranged, and the air inlet is communicated with an air inlet pipe; wherein, air that gets into from the air intake passes through the air cleaner and gets into the heating chamber after heater heating.

2. The PCB baking apparatus of claim 1, wherein the heating assembly includes at least 2 air inlets, each air inlet communicating with an air inlet pipe connected to a main air inlet pipe, and the main air inlet pipe is connected to a fan.

3. The PCB burning apparatus of claim 2, wherein the heating cavity is provided with at least 2 heating elements.

4. The PCB burning apparatus of claim 3, wherein the heating element is disposed at the bottom of the heating cavity.

5. The PCB baking apparatus of claim 4 wherein the heating cavity is provided with an air vent.

6. The PCB baking apparatus of claim 5, further comprising an exhaust duct, wherein one end of the exhaust duct is connected to the exhaust outlet, and the other end is disposed outside the box body.

7. The PCB toasting apparatus of claim 6 wherein the heating cavity is provided with an internal door.

8. The PCB toasting apparatus of claim 7 wherein the housing has an outer door disposed on one side of the inner door.

9. The PCB toasting apparatus of claim 8 wherein the outlet of the housing is provided with a lift baffle.

10. The PCB toasting apparatus of claim 9 wherein the entrance of the housing is provided with a lift stop.