Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, but the present application may be practiced in other ways than those described herein, and it will be apparent to those of ordinary skill in the art that the present application is not limited to the specific embodiments disclosed below.
As described in the background section, the drop strength of the OLED display panel needs to be improved in practical applications.
The inventor researches and discovers that due to the fact that film layers or lines with different thicknesses exist in step areas on the periphery of a frame area of a display panel, corresponding gap heights of different film layers or lines at corresponding positions are different, as shown in fig. 1, gap heights between an area a and an area B on a lower substrate 01 of the display panel and an upper substrate 02 of the display panel are different, wherein a gap height B at the area B is larger than a gap height a at the area a, and therefore after the display panel falls, acting force applied to the display panel is concentrated at the area B, the area B becomes a stress concentration point, a high-proportion failure phenomenon easily occurs, and falling strength of the display panel is to be improved.
In view of this, an embodiment of the present application provides a display panel, as shown in fig. 2 and fig. 3, where fig. 3 is a cross-sectional view taken along EF of fig. 2, the display panel includes:
a first substrate 10 and a second substrate 20 disposed opposite to each other;
an encapsulation layer 30 located in a frame region between the first substrate 10 and the second substrate 20;
a connection area located on a side of the first substrate 10 facing the second substrate 20, the connection area being used for transmitting an external signal to each structure inside the encapsulation layer 30, the connection area including a first area 101 and a second area 102, wherein a first gap is located between the first area 101 and the second substrate 20, a second gap is located between the second area 102 and the second substrate 20, and a height of the first gap is greater than a height of the second gap in a direction X from the first substrate 10 to the second substrate 20;
and a filling layer 40 located in the first gap.
Optionally, in an embodiment of the present application, the display panel is an OLED display panel, but the present application does not limit this, and in other embodiments of the present application, the display panel may also be a liquid crystal display panel or an LED display panel, as the case may be.
In the display panel provided by the embodiment of the application, the connection area for transmitting the external signal to each structure inside the packaging layer comprises a first area and a second area, wherein a first gap is formed between the first area and the second substrate, a second gap is formed between the second area and the second substrate, the height of the first gap is larger than that of the second gap, and a filling layer is arranged at the first gap, so that the gap height difference between the area where the first gap is located and the area where the second gap is located can be reduced by the filling layer, and after the display panel falls, the acting force of the display panel is more uniformly distributed to the connection area (such as the first area and the second area) of the display panel, the stress concentration point of the first area is reduced, and the probability of failure of the first area is made so as to solve the problem that the falling strength of the display panel is to be improved due to the high probability of failure of the first area.
On the basis of the above embodiments, in an embodiment of the present application, the first region is an insulating region, and the second region is a conducting wire region. Specifically, in an embodiment of the present application, the first region does not have an electrical connection line, the second region has an electrical connection line, and optionally, the electrical connection line may be an anti-static signal line, a shift register signal line, a power signal line, or a cathode supply line.
On the basis of the above embodiment, in an embodiment of the present application, the first region 101 has an insulating layer 50, the first gap exposes the surface of the insulating layer 50, and the filling layer 40 covers the surface of the insulating layer 50, that is, the filling layer 40 covers the surface of one side of the insulating layer 50 facing the second substrate 20, so as to fill the first gap, and reduce a gap height difference between a region where the first gap is located and a region where the second gap is located. Optionally, in an embodiment of the present application, the insulating layer 50 is an inorganic layer.
Specifically, on the basis of the above embodiments, in an embodiment of the present application, as shown in fig. 3, the insulating layer 50 is not only located in the first region 101, but also located in the second region 102, the electrical connection line 60 of the second region 102 is located on the surface of the insulating layer 50, that is, the insulating layer 50 is only located in the first region 101, and the electrical connection line 60 is also located in the surface of the insulating layer 50 in the second region 102, so that the height difference of the first gap corresponding to the first region 101 is greater than the height difference of the second gap corresponding to the second region 102.
In another embodiment of the present application, the first region is a conductive region, and the second region is a conductive region, and in the embodiment of the present application, a height difference between a first gap corresponding to the first region and a second gap corresponding to the second region is caused by different circuit designs.
Optionally, on the basis of the above embodiments, in an embodiment of the present application, as shown in fig. 4, the first area 101 has at least one first connection line 1011, and the at least one first connection line 1011 extends from the outer side of the encapsulation layer 30 to the inner side of the encapsulation layer 30, so as to transmit an external signal to each structure inside the encapsulation layer 30; the second region 102 has at least one second connection line 1021, and the at least one second connection line 1021 extends from the outer side of the package layer 30 to the inner side of the package layer 30 so as to transmit external signals to structures inside the package layer 30; the filling layer 40 is located on a side of the at least one first connection line 1011 facing away from the insulating layer 50, and covers the at least one first connection line 1011.
In another embodiment of the present application, as shown in fig. 5, the filling layer 40 is not only located in the first gap directly above the first area 101, but also located in the gap between the first area 101 and the second area 102, that is, the filling layer 40 not only covers the at least one first connection line 1011, but also fills the gap between the at least one first connection line 1011 and the at least one second connection line 1021.
As shown in fig. 6 and 7, fig. 6 is a partial top view of a display panel provided in an embodiment of the present application, where a region of a dashed line frame C is a connection region, and fig. 7 is a partial enlarged view of a region of a dashed line frame D in fig. 6. In the present embodiment, the connection regions include a first connection region 110, a second connection region 120, a third connection region 130, a fourth connection region 140, and a fifth connection region 150, wherein the first connection region 110 is an insulating region, the second connection region 120, the third connection region 130, the fourth connection region 140, and the fifth connection region 150 are conductive regions, optionally, in one embodiment of the present application, the first connection region 110 has no electrical connection line, and the second connection region 120 has at least one power signal line; the third connection region 130 has at least one antistatic signal line; the fourth connection region 140 has at least one shift register signal line; the fifth connection area 150 has at least one cathode supply line.
On the basis of the above embodiments, in an embodiment of the present application, the first region is the third connection region, and the first connection line is an anti-static signal line of the display panel. Specifically, in an embodiment of the present application, the first area is the third connection area, the first connection line is an antistatic signal line of the display panel, the second area is the fourth connection area, and the second connection line is a shift register signal line in the display panel; in another embodiment of the present application, the first area is the third connection area, the first connection line is an anti-static signal line of the display panel, the second area is the second connection area, and the second connection line is a power signal line of the display panel; in yet another embodiment of the present application, the first area is the third connection area, the first connection line is an anti-static signal line of the display panel, the second area is the fifth connection area, and the second connection line is a cathode supply line of the display panel.
In another embodiment of the present application, the first region is the fourth connection region, and the first connection line is a shift register signal line of the display panel. Specifically, in an embodiment of the present application, the first area is the fourth connection area, the first connection line is a shift register signal line of the display panel, the second area is the third connection area, and the second connection line is an anti-static signal line of the display panel; in another embodiment of the present application, the first area is the fourth connection area, the first connection line is a shift register signal line of the display panel, the second area is the second connection area, and the second connection line is a power supply signal line of the display panel; in another embodiment of the present application, the first area is the fourth connection area, the first connection line is a shift register signal line of the display panel, the second area is the fifth connection area, and the second connection line is a cathode supply line of the display panel, but the present application is not limited thereto, as the case may be.
In addition to any of the above embodiments, in an embodiment of the present application, after the filling layer is formed, a height of a gap between the first region and the second substrate and a height of a gap between the second region and the second substrate are substantially the same, so that after the display panel is dropped, forces applied to the first region and the second region are as the same as possible, and thus, on the basis of reducing a probability that the first region becomes a stress concentration point and causes a failure of the first region, the second region does not become a stress concentration point and the probability that the second region fails is increased.
On the basis of the above embodiment, in an embodiment of the present application, as shown in fig. 5, after the filling layer 40 is formed, a height of a gap between the first region 101 and the second substrate 20 and a height of a gap between the second region 102 and the second substrate 20 are substantially the same, which is a distance between the at least one second connection line 1021 and the second substrate 20; in another embodiment of the present application, as shown in fig. 8, the filling layer 40 fills not only the first gap but also the second gap, and after the filling layer 40 is formed, a height of a gap between the first region 101 and the second substrate 20 and a height of a gap between the second region 102 and the second substrate 20 are substantially the same and are zero or close to zero, that is, the filling layer 40 completely fills the first gap and the second gap, which is not limited in the present application, as the case may be.
On the basis of any of the above embodiments, as shown in fig. 9, in an embodiment of the present application, the connection region further includes a third region 103, a third gap is formed between the third region and the second substrate 20, and a height of the third gap is greater than a height of the second gap in a direction X from the first substrate 10 to the second substrate 20, in the embodiment of the present application, the filling layer 40 is further located in the third region 103, so as to reduce a difference between a height of the gap between the third region 103 and the second substrate 20 and a height of the gap between the second region 102 and the second substrate 20, and reduce a probability that the third region 103 fails due to a large stress after the display panel falls off. It should be noted that, in the embodiment of the present application, before the filling layer 40 is formed, a height of the first gap corresponding to the first region 101 may be the same as or different from a height of the third gap corresponding to the third region 103, and this is not limited in this application, depending on the circumstances.
Optionally, on the basis of the above embodiment, in an embodiment of the present application, as shown in fig. 9, the filling layer 40 is further located in a gap between the first region 101 and the third region 103, so as to reduce a probability that the gap between the first region 101 and the third region 103 fails due to a large stress after the display panel falls off.
On the basis of the above embodiments, in an embodiment of the present application, after the filling layer is formed, a height of a gap between the first region and the second substrate, a height of a gap between the second region and the second substrate, and a height of a gap between the third region and the second substrate are substantially the same. Optionally, in an embodiment of the present application, as shown in fig. 9 again, after the filling layer 40 is formed, a height of a gap between the first area 101 and the second substrate 20, a height of a gap between the second area 102 and the second substrate 20, and a height of a gap between the third area 103 and the second substrate 20 are substantially the same, which is a distance between the at least one second connection line 1021 and the second substrate 20; in another embodiment of the present application, as shown in fig. 10, after the filling layer 40 is formed, a height of a gap between the first region 101 and the second substrate 20, a height of a gap between the second region 102 and the second substrate 20, and a height of a gap between the third region 103 and the second substrate 20 are substantially the same, and are zero or substantially zero, that is, the filling layer 40 completely fills the first gap, the second gap, and the third gap, but the present application is not limited thereto, as the case may be.
It should be noted that, when the filling layer completely fills the first gap, the second gap, and the third gap, the filling layer also fills the gap between the first region and the second region and the gap between the first region and the third region.
In another embodiment of the present application, in the direction X from the first substrate 10 to the second substrate 20, the height of the third gap may also be equal to the height of the second gap, and in an embodiment of the present application, the filling layer is only located in the first region, so that after the filling layer is formed, the heights of gaps between the first region, the second region and the third region and the second substrate are substantially the same. In another embodiment of the present application, the filling layer is not only located in the first region, but also located in the second region and the third region, that is, the filling layer completely fills the first gap, the second gap, the third gap, and the gap between the first region and the second region and the gap between the first region and the third region, so that after the filling layer is formed, the gap heights between the first region, the second region, and the third region and the second substrate are substantially the same.
In a further embodiment of the present application, in the direction X from the first substrate 10 to the second substrate 20, the height of the third gap may also be smaller than the height of the second gap, and in this embodiment, the filling layer is further located in the second region, that is, the filling layer is located in the first region and the second region, but not located in the third region, so that after the filling layer is formed, the gap heights of the first region, the second region and the third region are substantially the same as the gap height of the second substrate. It should be noted that, in the embodiment of the present application, a thickness of the filling layer at the first gap is different from a thickness of the filling layer at the second gap, specifically, the thickness of the filling layer at the first gap is greater than the thickness of the filling layer at the second gap, so that after the filling layer is formed, heights of gaps between the first region and the second substrate are substantially the same. In another embodiment of the present application, the filling layer is not only located in the first region, but also located in the second region, the third region, a gap between the first region and the second region, and a gap between the first region and the third region, that is, the filling layer completely fills the first gap, the second gap, and the third gap, so that after the filling layer is formed, the gap heights between the first region and the second substrate are substantially the same.
On the basis of the above embodiments, in one embodiment of the present application, as shown in fig. 9 and 10, the third region 103 is a conductive region. Optionally, in this embodiment of the application, the third region 103 has at least one third connecting line 1031, and the at least one third connecting line 1031 extends from the outer side of the package layer 30 to the inner side of the package layer 30, and transmits an external signal to each structure inside the package layer 30.
Specifically, on the basis of the above example, in an embodiment of the present application, if the height of the third gap corresponding to the third region 103 is greater than the height of the second gap corresponding to the second region 102 before the filling layer 40 is formed, in an embodiment of the present application, the first region 101 is the third connection region, the first connection line 1011 is an anti-static signal line of the display panel, the third region 103 is the fourth connection region, the third connection line 1031 is a shift register signal line of the display panel, the second region 102 is the second connection region or the fifth connection region, and the second connection line 1021 is a power supply signal line or a cathode supply line; in another embodiment of the present application, the first area 101 is the fourth connection area, the first connection line 1011 is a shift register signal line of the display panel, the third area 103 is the third connection area, the third connection line 1031 is an anti-static signal line of the display panel, the second area 102 is the second connection area or the fifth connection area, and the second connection line 1021 is a power signal line or a cathode power supply line, which is not limited in this application, and is determined as the case may be.
In another embodiment of the present application, if a height of a third gap corresponding to the third region 103 is smaller than a height of a second gap corresponding to the second region 102 before the filling layer 40 is formed, in an embodiment of the present application, the first region 101 is the third connection region, the first connection line 1011 is an anti-static signal line of the display panel, the second region 102 is the fourth connection region, the second connection line 1021 is a shift register signal line of the display panel, the third region 103 is the second connection region or the fifth connection region, and the third connection line 1031 is a power signal line or a cathode supply line; in another embodiment of the present application, the first area 101 is the fourth connection area, the first connection line 1011 is a shift register signal line of the display panel, the second area 102 is the third connection area, the second connection line 1021 is an anti-static signal line of the display panel, the third area 103 is the second connection area or the fifth connection area, and the third connection line 1031 is a power signal line or a cathode power supply line, which is not limited in this application, and is determined as the case may be.
In any of the above embodiments, the shift register signal line includes: and at least one of signal lines such as a high-level signal line VGH, a low-level signal line VGL, a clock signal line CK, and a trigger signal line STV. The present application is not limited thereto, as the case may be.
In still another embodiment of the present application, as shown in fig. 11, the connection region includes a first region 101, a second region 102, a third region 103, a fourth region 104 and a fifth region 105, wherein the first region 101 is an insulating region, the second region 102, the third region 103, the fourth region 104 and the fifth region 105 are conductive regions, and before the filling layer 40 is formed, a height of a second gap formed between the second region 102 and the second substrate 20 is equal to a height of a fifth gap formed between the fifth region 105 and the second substrate 20, a height of a fourth gap formed between the fourth region 104 and the second substrate 20 is equal to a height of a third gap formed between the third region 103 and the second substrate 20, and a height of a fourth gap formed between the second region 102 and the second substrate 20 is smaller than a height of a fourth gap formed between the fourth region 104 and the second substrate 20, and is smaller than a height of a gap formed between the first region 101 and the second substrate 20.
On the basis of the above embodiments, in an embodiment of the present application, as shown in fig. 11, the filling layer 40 is located in the first gap, the third gap, and the fourth gap, but not located in the second gap and the fifth gap, so as to reduce a gap height difference between different regions of the connection region and the second substrate, thereby reducing a probability that the connection region will be subject to stress concentration and fail after the display panel falls. In another embodiment of the present application, as shown in fig. 12, the filling layer 40 is not only located in the first gap, the third gap and the fourth gap, but also located in the second gap, the fifth gap and any two gaps of the first region, the second region, the third region, the fourth region and the fifth region, so as to reduce a gap height difference between different regions of the connection region and the second substrate, thereby reducing a probability that the connection region is subject to stress concentration and fails after the display panel falls.
Optionally, in the above embodiment, the first region 101 is the first connection region, the first region 101 does not have an electrical connection line, and the surface of the insulation layer 50 is exposed; the second region 102 is the second connection region, the second region 102 has at least one second connection line 1021, and the second connection line 1021 is a power signal line; the third region 103 is the third connecting region, the third region 103 has at least one third connecting line 1031, and the third connecting line 1031 is an antistatic signal line; the fourth region 104 is the fourth connection region, the fourth region 104 has at least one fourth connection line 1041, and the fourth connection line 1041 is a shift register signal line; the fifth region 105 is the fifth connection region, the fifth region 105 has at least one fifth connection line 1051, and the fifth connection line 1051 is a cathode supply line.
On the basis of any one of the above embodiments, in an embodiment of the present application, as shown in fig. 13, the display panel further includes: a metal reflective layer 70 between the encapsulation layer 30 and the first substrate 10 to improve the curing efficiency of the encapsulation layer 30 during the curing process. Optionally, in an embodiment of the present application, the metal reflective layer 70 has a plurality of through holes therein, so as to release stress and heat in the metal reflective layer 70 during the curing process of the encapsulation layer 30, and reduce the probability of occurrence of phenomena such as fracture of the metal reflective layer 70 due to non-uniform stress or heat.
On the basis of the above-described embodiments, in an embodiment of the present application, if the connection region has an anti-static signal line, the anti-static signal line is electrically connected to the metal reflective layer to facilitate discharge of static electricity in the anti-static signal line. Optionally, in an embodiment of the present application, the anti-static signal line and the metal reflective layer are formed in a same step process, so as to simplify a manufacturing process of the display panel.
On the basis of any of the above embodiments, in an embodiment of the present application, the filling layer is formed by curing a filling medium, and the filling medium has fluidity so that the filling medium better fills the first gap, the second gap, the third gap, and gaps between the regions in the connection region, and further reduces the probability of stress concentration points existing in the connection region.
Optionally, on the basis of the foregoing embodiment, in an embodiment of the present application, the density of the filling medium is within a preset density range, the viscosity of the filling medium is within a preset viscosity range, so as to ensure the flowability and adhesion of the filling medium, and the hardness of the filling medium is within a preset hardness range, so as to ensure that after the filling medium forms the filling layer, the difference between the hardness of the filling region and the hardness of the non-filling region in the connection region is not large, so that after the display panel falls, the acting force applied to the display panel can be more uniformly distributed in the connection region, thereby avoiding the occurrence of a stress concentration point at a fixed position in the connection region.
Specifically, on the basis of the above embodiments, in one embodiment of the present application, under the test standard of ASTM D1875, the preset density range is 0.768g/ml to 1.152g/ml, and optionally 0.864g/ml to 1.056g/ml; under the test standard of ASTM D1084, the preset viscosity ranges from 261.6cP (20 rpm) to 392.4cP (20 rpm), and can be selected from 294.3cP (20 rpm) to 359.7cP
(20 rpm); under the test standard of ASTM D2240, the preset hardness range is A68-A102, and can be A76.5-A93.5.
It should be noted that ASTM (American Society for Testing and Materials) is an English abbreviation of the American Society for Testing and Materials. The technical association, established in 1898, was used to establish performance and performance standards, test methods and procedures standards in the fields of materials, products, systems and services. In specific application, the ASTM standard is represented by a standard code number + letter classification code + standard serial number, wherein the meaning of each letter classification code is as follows: a represents a ferrous metal; b represents a non-ferrous metal; c represents cement, ceramic, concrete and masonry materials; d represents other various materials (such as petroleum products, fuel, low-strength plastics and the like); e represents miscellaneous species (metal chemical analysis, fire resistance test, nondestructive test, statistical method, etc.); f represents the corrosion, deterioration and degradation of special-purpose materials (such as electronic materials, shockproof materials, medical and surgical materials and the like).
Based on the above examples, in one embodiment of the present application, the filling medium has a density of 0.96g/ml under the test standard of ASTM D1875, a viscosity of 327cP (20 rpm) under the test standard of ASTM D1084, and a hardness of A85 under the test standard of ASTM D2240.
On the basis of the above embodiments, in one embodiment of the present application, the filling medium is UV, but the present application does not limit this, and in other embodiments of the present application, the filling medium is a foaming material, as the case may be.
On the basis of the above embodiments, in another embodiment of the present application, as shown in fig. 14 and 15, fig. 15 is an enlarged view of a dotted line frame M area in fig. 14, where the plurality of through holes 71 in the metal reflective layer 70 includes at least three rows of through holes arranged along a preset direction Y, and the filling layer 40 is filled to a preset position along the preset direction Y, so as to ensure a filling effect of the filling layer 40, effectively improve a stress concentration phenomenon in the first area, and improve a falling strength of the display panel; the preset direction Y is directed to the inner side of the packaging layer from the outer side of the packaging layer, and the distance between the preset position and the outer side edge of the packaging layer is not smaller than the distance between the third row of through holes in the metal reflecting layer and the outer side edge of the packaging layer.
Experiments show that the falling strength of the display panel provided by the embodiment of the application at a low height can be effectively improved, and particularly, the display panel provided by the embodiment of the application can basically avoid the phenomenon that the display panel fails due to stress concentration at the fixing position of the connecting area after the display panel falls at a height of less than 1.4 m.
Correspondingly, an embodiment of the present application further provides a manufacturing method of a display panel, as shown in fig. 16, the manufacturing method includes:
s1: and forming a connection area on the surface of the first substrate, wherein the connection area is used for transmitting an external signal to each structure positioned on the inner side of the packaging area of the display panel. Optionally, the first substrate is an array substrate, and the connection region has at least one electrical connection line for transmitting an external signal to each structure located inside the package region of the display panel.
Specifically, in an embodiment of the present application, the forming of the connection region on the surface of the first substrate includes:
forming an insulating layer on the surface of the first substrate, wherein the insulating layer covers the first region and the second region;
and forming at least one electrical connection line on the surface of the insulating layer corresponding to the second region.
In another embodiment of the present application, the first region is a conductive region, and the second region is a conductive region, and in the embodiment of the present application, forming the connection region on the surface of the first substrate includes:
forming an insulating layer on the surface of the first substrate, wherein the insulating layer covers the first region and the second region;
forming at least one first connecting line on the surface of the insulating layer corresponding to the first area;
and forming at least one second connecting line on the surface of the insulating layer corresponding to the second region.
It should be noted that, in the embodiment of the present application, the first connection line and the second connection line may be located in the same layer, or may be located in different layers.
On the basis of the above embodiments, in an optional embodiment of the present application, the insulating layer is an inorganic layer, in another optional embodiment of the present application, the insulating layer is a stacked structure of a buffer layer and an inorganic layer, and in other embodiments of the present application, the insulating layer may also be in other structures.
On the basis of the above embodiments, in an embodiment of the present application, the first connection line is an anti-static signal line of the display panel. Specifically, in an embodiment of the present application, the first connection lines are anti-static signal lines of the display panel, and the second connection lines are shift register signal lines in the display panel; in another embodiment of the present application, the first connection line is an anti-static signal line of the display panel, and the second connection line is a power signal line of the display panel; in yet another embodiment of the present application, the first connection line is an anti-static signal line of the display panel, and the second connection line is a cathode supply line of the display panel.
In another embodiment of the present application, the first connection line is a shift register signal line of the display panel. Specifically, in an embodiment of the present application, the first connection line is a shift register signal line of the display panel, and the second connection line is an anti-static signal line of the display panel; in another embodiment of the present application, the first connection lines are shift register signal lines of the display panel, and the second connection lines are power supply signal lines of the display panel; in another embodiment of the present application, the first connection line is a shift register signal line of the display panel, and the second connection line is a cathode supply line of the display panel, but the present application is not limited thereto, as the case may be.
It should be noted that, on the basis of any of the above embodiments, in an embodiment of the present application, after the filling layer is formed at the first gap, the height of the gap between the first region and the second substrate and the height of the gap between the second region and the substrate are substantially the same, so that after the display panel falls off, the acting forces applied to the first region and the second region are as the same as possible, and on the basis of reducing the probability that the first region becomes a stress concentration point and causes the failure of the first region, the second region does not become a stress concentration point and the probability that the second region fails is increased.
S2: and forming an encapsulation layer in the encapsulation area of the second substrate. Specifically, in an embodiment of the present application, forming an encapsulation layer in the encapsulation region of the second substrate includes: and coating an encapsulation material on the encapsulation area of the second substrate to form an encapsulation layer on the encapsulation area of the second substrate.
S3: and fixing the first substrate on one side of the packaging layer, which is far away from the second substrate, wherein the connecting area of the first substrate faces the second substrate and is positioned on the outer side of the packaging area. The connecting region comprises a first region and a second region, a first gap is formed between the first region and the second substrate, a second gap is formed between the second region and the second substrate, and the height of the first gap is larger than that of the second gap in the direction from the first substrate to the second substrate.
Specifically, in an embodiment of the present application, fixing the first substrate on a side of the encapsulation layer facing away from the second substrate includes:
placing the packaging layer of the second substrate above the first substrate towards the first substrate, wherein the packaging layer of the second substrate is correspondingly positioned in the packaging area of the first substrate, and the connecting area of the first substrate faces the second substrate;
and curing the packaging layer to realize the fixed connection of the first substrate and the second substrate, and fixing the first substrate on one side of the packaging layer departing from the second substrate.
Optionally, on the basis of the foregoing embodiment, in an embodiment of the present application, the curing the encapsulation layer includes: and irradiating the packaging layer from one side of the second substrate, which is far away from the first substrate, by using light rays to realize the solidification of the packaging layer.
On the basis of the foregoing embodiment, in an embodiment of the present application, before fixing the first substrate to a side of the encapsulation layer facing away from the second substrate, the method further includes:
and forming a metal reflecting layer in the area of the first substrate where the packaging layer is to be fixed, so that when the packaging layer is irradiated from one side of the second substrate, which is far away from the first substrate, to realize the curing of the packaging layer, the light penetrating through the packaging layer and emitted to the first substrate can be reflected by the metal reflecting layer, the light utilization rate is improved, and meanwhile, the curing efficiency of the packaging layer is improved.
On the basis of the above embodiment, in an embodiment of the present application, the method further includes: and forming a plurality of through holes in the metal reflecting layer so that when the packaging layer is irradiated by light from one side of the second substrate, which is far away from the first substrate, to cure the packaging layer, stress and heat in the metal reflecting layer can be released through the through holes, and the probability of breakage of the metal reflecting layer or the packaging layer is reduced.
S4: a fill layer is formed at the first gap.
Optionally, in an embodiment of the present application, the forming the filling layer at the first gap includes: filling a filling medium into the first gap from the region of the surface of the first substrate, which is positioned outside the packaging region; and curing the filling medium to form a filling layer at the first gap. Specifically, in an embodiment of the present application, filling the filling medium into the first gap from a region of the first substrate surface located outside the encapsulation region includes: forming a filling medium at the position of the first area from the area, located outside the packaging area, on the surface of the first substrate; the first gap is filled by utilizing the fluidity of the filling medium.
On the basis of the above embodiment, in an embodiment of the present application, filling a filling medium into the first gap from a region of the first substrate surface located outside the encapsulation region includes: forming a filling medium at the position of the first area from the area, located on the outer side of the packaging area, on the surface of the first substrate; and enabling the filling medium to flow in the direction of the first gap for preset time by utilizing the fluidity of the filling medium, so that the filling medium is filled in the first gap. Optionally, the preset time is 2 seconds, so as to ensure the filling effect of the filling medium, effectively improve the stress concentration phenomenon of the first region, and improve the falling strength of the display panel.
Optionally, on the basis of the above embodiment, in an embodiment of the present application, the filling medium is a UV glue, and in another embodiment of the present application, the filling medium is a foaming material.
Taking the filling medium as an example of UV glue, in an embodiment of the present application, the filling medium into the first gap from the region of the first substrate surface located outside the encapsulation region includes: horizontally or vertically placing the display panel; rotating the display panel by a preset angle along a preset direction so that the dispensing direction of the dispensing device points to the first area from a dispensing outlet of the dispensing device; dispensing glue from the area, located outside the packaging area, on the surface of the first substrate at the position where the first area is located by using a glue dispensing device; and enabling the glue to flow towards the direction of the first gap for a preset time by utilizing the fluidity of the glue, so that the glue is filled in the first gap.
Taking a middle line between an upper frame and a lower frame of the display panel as a reference line, specifically, in an embodiment of the present application, as shown in fig. 17 and 18, fig. 17 is a top view of the display panel 100 and the dispensing device 200, and fig. 18 is a left view of the display panel 100 and the dispensing device 200, where only the first substrate 10 and the second substrate 20 are shown in the display panel 100, in this embodiment, if the display panel 100 is horizontally placed and the first area is located on a first side (e.g., left side) of the reference line HK, then the display panel 100 is rotated by a preset angle in a counterclockwise direction in a horizontal plane (i.e., in a plane where the display panel is located), i.e., rotated by a preset angle θ to a second side (e.g., right side) of the reference line HK, as shown in fig. 19 and 20, fig. 19 is a top view of the display panel 100 and the dispensing device 200 after the display panel is rotated, and fig. 20 is a left view of the display panel 100 and the dispensing device 200 after the display panel is rotated, so that the direction of the dispensing device is from an outlet of the dispensing device, and the first dispensing device is directed to the filling area faster than the dispensing device;
as shown in fig. 21, fig. 21 is a top view of the display panel 100 and the dispensing device 200, if the display panel 100 is horizontally disposed and the first area is located on a second side (e.g. right side) of the reference line HK, the apparent panel 100 is rotated by a predetermined angle clockwise within a horizontal plane (i.e. within a plane where the display panel is located), i.e. rotated by a predetermined angle θ towards a first side (e.g. left side) of the reference line HK, as shown in fig. 22, fig. 22 is a top view of the display panel 100 and the dispensing device 200 after the display panel is rotated, so that the dispensing direction of the dispensing device is directed from the dispensing outlet of the dispensing device 200 to the first area, thereby increasing the filling speed of the first area.
On the basis of any one of the above embodiments, in an embodiment of the present application, if the display panel is horizontally disposed, the plane where the display panel is located is rotated by a preset angle, so that the side where the first region is located is higher than the side opposite to the first region in the display panel, and thus the filling speed of the first region is accelerated by using the gravity. As shown in fig. 23 and 24, fig. 23 is a left side view of the display panel before rotation, and fig. 24 is a left side view of the display panel after rotation.
On the basis of any of the embodiments described above, in an embodiment of the present application, when dispensing is performed on the first area, the first substrate is located below the second substrate, as shown in fig. 13, so as to be compatible with a manufacturing process of an existing display panel, and not to excessively increase the process complexity when dispensing is performed on the first area, and improve the filling effect of the gap between the first area and the second area.
In another embodiment of the present application, if the display panel is vertically disposed and the first area is located on a first side (e.g., left side) of the reference line, the front panel is rotated by a preset angle in a counterclockwise direction within a vertical plane, i.e., rotated by a preset angle toward a second side (e.g., right side) of the reference line, so that a dispensing direction of the dispensing device is directed from a dispensing outlet of the dispensing device to the first area, thereby increasing a filling speed of the first area;
if the display panel is vertically placed and the first area is located on the second side (for example, the right side) of the reference line, the display panel is rotated by a preset angle in the vertical direction (that is, in the plane where the display panel is located), that is, rotated by a preset angle towards the first side (for example, the left side) of the reference line, so that the dispensing direction of the dispensing device is directed to the first area from the dispensing outlet of the dispensing device, and the filling speed of the first area is accelerated.
In another embodiment of the present application, if the display panel is vertically disposed, the plane where the display panel is located is rotated by a preset angle, so that when the first area is dispensed, the plane where the first substrate is located below the plane where the second substrate is located in the vertical direction, thereby improving the filling effect of the gap between the first area and the second area. As shown in fig. 25 and 26, fig. 25 is a left side view of the display panel before rotation, and fig. 26 is a left side view of the display panel after rotation.
And when the first area is subjected to dispensing, the plane where the first substrate is located below the plane where the second substrate is located in the vertical direction, and the structures on the first substrate can be utilized, so that the filling medium flows to the gaps of the first area and the second area in a concentrated manner, the utilization rate of the filling medium is improved, the use amount of the filling medium is reduced on the basis of ensuring the filling effect of the first area and the second area, and the cost of the display panel is reduced.
In another embodiment of the present application, the plurality of through holes in the metal reflective layer include at least three rows of through holes arranged along a predetermined direction, and the filling of the filling medium into the first gap from the region of the first substrate surface located outside the encapsulation region further includes:
when the filling medium is filled to a preset position along a preset direction, stopping forming the filling medium at the position of the second area from the area, located on the outer side of the packaging area, on the surface of the first substrate;
wherein, predetermine the direction by the outside of encapsulation layer is directional the inboard of encapsulation layer predetermine on the direction, predetermine the position with distance between the encapsulation layer outside side is not less than in the metal reflecting layer in the third row the through-hole with distance between the encapsulation layer outside side is in order to guarantee the filling effect of packing medium effectively improves the stress concentration phenomenon in first region improves display panel's falling intensity.
In addition to any of the above embodiments, in an embodiment of the present application, the connection region further includes a third region, a third gap is provided between the third region and the second substrate, and a height of the third gap is greater than a height of the second gap in a direction from the first substrate to the second substrate.
On the basis of the above embodiments, in one embodiment of the present application, the third region is a conductive region. Optionally, in this embodiment of the application, the third area has at least one third connection line, and the at least one third connection line extends from the outer side of the encapsulation layer to the inner side of the encapsulation layer, and transmits an external signal to each structure inside the encapsulation layer. Correspondingly, in this embodiment, the insulating layer formed on the surface of the first substrate further covers the third region, and the method further includes: and forming at least one third connecting line on the surface of the insulating layer corresponding to the third area.
Specifically, on the basis of the above example, in an embodiment of the present application, the first connection line is an anti-static signal line of the display panel, the third connection line is a shift register signal line of the display panel, and the second connection line is a power supply signal line or a cathode supply line; in another embodiment of the present application, the first connection line is a shift register signal line of the display panel, the third connection line is an anti-static signal line of the display panel, and the second connection line is a power signal line or a cathode power supply line, which is not limited in this application, as the case may be.
On the basis of any of the above embodiments, in an embodiment of the present application, if the connection region has an anti-static signal line, the anti-static signal line is electrically connected to the metal reflective layer, so as to facilitate discharge of static electricity in the anti-static signal line. Optionally, in an embodiment of the present application, the anti-static signal line and the metal reflective layer are formed in a same step process, so as to simplify a manufacturing process of the display panel.
To sum up, in the display panel and the manufacturing method thereof provided by the embodiment of the application, the connection area for transmitting the external signal to each structure inside the encapsulation layer includes a first area and a second area, wherein a first gap is provided between the first area and the second substrate, a second gap is provided between the second area and the second substrate, the height of the first gap is greater than the height of the second gap, and a filling layer is provided at the first gap, so that the filling layer can be used to reduce the gap height difference between the area where the first gap is located and the area where the second gap is located, and then after the display panel falls, the acting force of the display panel is more uniformly distributed to the connection area (such as the first area and the second area) of the display panel, thereby reducing the probability that the first area becomes a stress concentration point, so that the probability that the first area fails is made to solve the problem that the falling strength of the display panel is to be improved due to the high probability of failure of the first area, and improving the falling strength of the display panel.
In the description, each part is described in a progressive manner, each part is emphasized to be different from other parts, and the same and similar parts among the parts are referred to each other.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.