CN110571256A - Display panel, manufacturing method thereof and display device - Google Patents
Display panel, manufacturing method thereof and display device Download PDFInfo
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- CN110571256A CN110571256A CN201910856977.6A CN201910856977A CN110571256A CN 110571256 A CN110571256 A CN 110571256A CN 201910856977 A CN201910856977 A CN 201910856977A CN 110571256 A CN110571256 A CN 110571256A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
the invention discloses a display panel, a manufacturing method thereof and a display device, relates to the technical field of display, and achieves the purposes of reducing the influence of laser cutting of a protective film of a PAD area on the internal structure of the display panel and ensuring the display effect of the display panel. The main technical scheme of the invention is as follows: the display panel includes that display area and setting are in the PAD district of display area one side, the PAD district includes detection area and bonding area, bonding area sets up the detection area is kept away from one side of display area still includes: a protective film which is laminated on the surface of the display panel; and the heat insulation buffer layer is arranged in the PAD area and is arranged between the protective film and the display panel.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel, a manufacturing method of the display panel and a display device.
Background
the OLED is named as an "organic electroluminescent display" in chinese, and is also called as an "organic electroluminescent display", which has many advantages of active light emission, fast response speed, low voltage driving, low power consumption, full solid structure, ultra-light and thin, wide viewing angle, large usable temperature range, etc., and is referred to as a "illusion display" in the industry, and represents the development direction of the current display technology. The flexible OLED display screen has the characteristics of low power consumption, flexibility and the like, brings profound influence on the application of portable electronic equipment and wearable electronic equipment, and adopts plastics to replace glass to manufacture the display screen, so that the display screen is more durable and lighter.
the flexible OLED display screen is packaged by adopting a thin film packaging (TFE) process, a thin film packaging layer is manufactured in a display area of the display panel, and then a protective film with low viscosity is pasted on the thin film packaging layer and covers the whole display panel, and the protective film is mainly used for protecting the thin film packaging layer from being scratched in a subsequent process and further improving the packaging effect to the maximum extent; after that, the protective film of the PAD area (including the detection area and the bonding area) needs to be removed in order to test and subsequently bond the display panel.
Currently, the method for removing the protective film on the PAD area is as follows: cutting the protective film at the preset position by adopting laser, and separating the protective film in the preset area; in the process of cutting the protective film, due to high laser energy, part of the structure of the PAD area is damaged during cutting, so that normal display of the display panel is influenced.
Disclosure of Invention
In view of this, embodiments of the present invention provide a display panel, a method for manufacturing the same, and a display device, and mainly aim to reduce the influence of laser cutting on the internal structure of the display panel when the protective film of the PAD area is cut by laser, so as to ensure the display effect of the display panel.
In order to achieve the purpose, the invention mainly provides the following technical scheme:
in one aspect, an embodiment of the present invention provides a display panel, where the display panel includes a display area and a PAD area disposed on one side of the display area, the PAD area includes a detection area and a bonding area, the bonding area is disposed on one side of the detection area, which is far away from the display area, and the display panel further includes:
A protective film which is laminated on the surface of the display panel;
and the heat insulation buffer layer is arranged in the PAD area and is arranged between the protective film and the display panel.
optionally, the heat insulation buffer layer is made of an organic material with a preset heat insulation effect.
Optionally, the thermal insulation buffer layer has a preset thickness along a first direction;
wherein the first direction is a direction perpendicular to the display panel.
On the other hand, an embodiment of the present invention further provides a method for manufacturing a display panel, where the method includes:
Forming a thermal insulation buffer layer on the surface of the display panel, wherein the thermal insulation buffer layer is formed in the PAD area;
pasting a protective film on the surface of the heat insulation buffer layer;
And cutting the protective film along a preset position to peel off the protective film on the first side of the preset position.
optionally, the forming of the thermal insulation buffer layer on the surface of the display panel includes:
And forming the heat insulation buffer layer on the surface of the display panel by adopting an ink-jet printing process.
Optionally, cutting the protective film along a preset position includes:
Adopt laser along preset position cutting the protection film, and the protection film is close to one side heat formation influence district of display panel.
optionally, the preset position is located in the detection area of the PAD area, and the heat affected area is located in the detection area.
Optionally, the preset thickness of the thermal insulation buffer layer along the first direction is not less than the depth of the heat affected zone.
optionally, the cross-sectional area of the thermal insulation buffer layer is not smaller than the area of the heat affected zone;
wherein, the cross section of thermal-insulated buffer layer is the cross section of perpendicular to first direction.
on the other hand, an embodiment of the present invention further provides a display device, including: the display panel is provided.
According to the display panel, the manufacturing method thereof and the display device provided by the embodiment of the invention, the heat insulation buffer layer is arranged between the display panel and the protection film corresponding to the PAD area, so that the functions of heat insulation and buffering can be achieved when the protection film of the PAD area is cut by laser, and the heat brought by the laser is prevented from influencing partial films and devices of the PAD area, so that the hidden danger that the water and oxygen blocking effect of a display area is influenced due to the formation of a water and oxygen channel caused by the damage of the films and the condition that the picture display effect of the display area is influenced due to the corrosion and damage of the devices of the PAD area can be avoided, the PAD area can be protected, and the display effect of the display panel can.
Drawings
Fig. 1 is a schematic top view of a display panel according to an embodiment of the present invention;
Fig. 2 is a schematic cross-sectional view of a partial area of a display panel according to an embodiment of the invention;
FIG. 3 is a schematic view of a heat-affected zone of a display panel without an insulating buffer layer according to an embodiment of the present invention;
FIG. 4 is a schematic view of a heat-affected zone of a display panel provided by an embodiment of the present invention when an insulating buffer layer is disposed;
Fig. 5 is a schematic flowchart of a method for manufacturing a display panel according to an embodiment of the present invention.
Detailed Description
to further illustrate the technical means and effects of the present invention adopted to achieve the predetermined objects, the following detailed description of the display panel, the manufacturing method thereof, and the display device according to the present invention, the specific implementation, structure, features, and effects thereof will be provided with reference to the accompanying drawings and the preferred embodiments.
example one
As shown in fig. 1 to 4, a display panel according to an embodiment of the present invention is provided, where the display panel 1 includes a display area 11 and a PAD area 12 disposed on a side of the display area 11, the PAD area 12 includes a detection area 121 and a bonding area 122, the bonding area 122 is disposed on a side of the detection area 121 away from the display area 11, and the display panel 1 further includes:
A protective film 2, wherein the protective film 2 is arranged on the surface of the display panel 1 in a laminated manner; and the thermal insulation buffer layer 3, the thermal insulation buffer layer 3 is correspondingly arranged in the PAD area 12, and the thermal insulation buffer layer 3 is arranged between the protective film 2 and the display panel 1.
The display panel 1 can be a flexible OLED display panel, and the display panel can structurally include a substrate base plate, a display function layer and a thin film encapsulation layer, wherein the display function layer and the thin film encapsulation layer are arranged on the substrate base plate; the thin film encapsulation layer is used for encapsulating the OLED device in the display area 11, can achieve a good effect of blocking water and oxygen, and can be formed by adopting a method of alternately depositing multiple layers of thin films by organic and inorganic materials. As shown in fig. 1, the display panel 1 includes a display region 11 for displaying, and a PAD region 12 disposed on one side of the display region 11, the PAD region 12 includes a detection region 121 and a bonding region 122, wherein the detection region 121 is used for detecting the display panel 1, and the structure thereof includes an ET trace and an electrostatic protection (ESD) unit 4, as shown in fig. 2, a planarization layer 5(PLN) and a pixel definition layer 6(PDL) are disposed on an upper side of the electrostatic protection (ESD) unit 4, the detection region 121 further includes an organic layer 7 on a lower side of the planarization layer 5(PLN), the organic layer 7 may include an interlayer dielectric layer 71(ILD), a first insulating layer 72(GI1), a second insulating layer 73(GI2), and the like, the detection region 121 further includes a circuit structure, such as a VGH voltage generation circuit, and the VGH voltage is responsible for charging and turning on a gate capacitor of a Thin Film Transistor (TFT) and keeping the capacitor voltage for one field period, the VGH voltage generation circuit is located between the first insulating layer 72(GI1) and the second insulating layer 73(GI2) shown in fig. 2; the bonding area 122 is used to bond a driving chip and a circuit board (e.g., a flexible circuit board, etc.), and the circuit board and the driving chip are used to drive the display function layer in the display area 11 for displaying.
At present, the display panel 1 is generally prepared by the following steps: manufacturing a display function layer and a thin film packaging layer on a substrate, then, attaching a protective film 2 with low adhesive force on the thin film packaging layer, wherein the protective film 2 covers the upper surface of the whole display panel 1 and is mainly used for protecting the thin film packaging layer of a display area 11, so that the thin film packaging layer is prevented from being scratched and damaged in the subsequent process, and the packaging effect can be further improved to the maximum extent; then, when the display panel 1 is tested and subjected to a subsequent bonding process, the protective film 2 corresponding to the PAD area 12 (including the detection area 121 and the bonding area 122) needs to be removed; finally, the protective film 2 corresponding to the display area 11 of the display panel 1 is removed, and the required functional films are attached, such as: barrier film, pol (polarizer), etc., to complete the manufacturing process of the display panel 1. In the above step, when the protection film 2 corresponding to the PAD area 12 is removed, the protection film 2 is usually required to be cut by laser, and the protection film 2 is peeled off after cutting, but due to the high energy of the laser, when cutting, a part of the film layer and the device inside the display panel 1 may be affected by the heat of the laser, causing damage to the part of the film layer and the device, and thus affecting the normal display effect of the display panel 1, specifically, as shown in fig. 2, under the influence of the heat of the laser, the flat layer 5 and the pixel definition layer 6 on the upper portion of the display panel 1 are easily damaged, so that a water and oxygen ingress channel may be formed, easily affecting the OLED device in the display area 11, and the layers of the flat layer 5 and the pixel definition layer 6 are thin, so that the heat generated by laser cutting cannot be isolated, the TFT characteristic curve is biased at a high temperature, and the leakage current may increase, thereby possibly causing corrosion of the electrostatic protection (, the operation may cause a full bright line to appear in the display area 11, which may affect the normal display of the display area 11 of the display panel 1. In the present embodiment, the thermal insulation buffer layer 3 is disposed on the surface of the PAD area 12 of the display panel 1, as shown in fig. 2, since the PAD area 12 is a non-display area, the PAD area 12 does not need to be disposed with a thin film encapsulation layer, the thermal insulation buffer layer 3 is disposed between the pixel definition layer 6 on the uppermost layer of the display panel 1 and the protection film 2, i.e., before the protection film is attached, the preparation of the thermal insulation buffer layer 3 is completed, when the protection film 2 is laser cut, the thermal insulation buffer layer 3 can isolate heat, protect the display panel 1, and can avoid the influence on the internal structure of the display panel 1 when the protection film 2 of the PAD area 21 is laser cut, so as to improve the display effect of the display panel 1.
The display panel provided by the embodiment of the invention has the advantages that the heat insulation buffer layer is arranged between the display panel and the protection film corresponding to the PAD area, so that the functions of heat insulation and buffering can be realized when the protection film of the PAD area is cut by laser, and the heat brought by the laser is prevented from influencing partial films and devices of the PAD area, so that the hidden danger that the water and oxygen blocking effect of the display area is influenced due to the fact that water and oxygen channels are formed due to damage of the films and the picture display effect of the display area is influenced due to the fact that the devices of the PAD area are corroded and damaged can be prevented from influencing the PAD area, the PAD area can be protected, and the display effect of the display.
Specifically, in order to ensure that the thermal insulation buffer layer 3 has good thermal insulation and buffering effects, the thermal insulation buffer layer 3 may be made of an organic material having a predetermined thermal insulation effect. Further, the thermal insulation buffer layer 3 may be formed using an inkjet printing process.
specifically, in order to ensure that the thermal insulation buffer layer 3 has good thermal insulation and buffering effects, the thickness of the thermal insulation buffer layer 3 can be increased under the condition that the setting condition allows, that is, the thermal insulation buffer layer 3 with the preset thickness is arranged, so that the thermal insulation buffer layer 3 is ensured to have good thermal insulation protection effects. At present, when the thermal insulation buffer layer 3 is not provided, when the protective film 2 of the PAD region 12 is removed, the influence range of the generated heat in depth after the protective film 2 is cut by the laser cutting line almost relates to the thickness range of the PAD region 12 in which the display panel 1 is located above the substrate, as shown in fig. 3, the depth influenced by the laser heat is almost the total thickness of the planarization layer 5(PLN), the pixel definition layer 6(PDL), and the organic layer 7 in this embodiment includes the interlayer dielectric layer 71(ILD), the first insulating layer 72(GI1), and the second insulating layer 73(GI2), and the thicknesses of the planarization layer 5(PLN), the pixel definition layer 6(PDL), the interlayer dielectric layer 71(ILD), the first insulating layer 72(GI1), and the second insulating layer 73(GI2) are about 3.05 μm, in order to avoid the influence of the heat generated by the laser cutting on the display panel 1, as shown in fig. 4, the preset thickness of the thermal insulation buffer layer 3 may be set to be not less than the total thickness of the display planarization layer 5(PLN), the pixel definition layer 6(PDL), and the organic layer 7, that is, the preset thickness of the thermal insulation buffer layer 3 should be not less than 3.05 μm, so that the range of the influence of the heat generated by the laser on the depth is not in contact with the pixel definition layer 6(PDL), that is, the heat generated by the laser does not affect the display panel 1, specifically, the thickness of the thermal insulation buffer layer 3 may be specifically set according to the actual situation, and the thickness of the thermal insulation buffer layer 3 may be set to be 3.1-3.5 μm, for example: the thickness of the buffer layer 3 is 3.5 μm, but not limited thereto, the buffer layer 3 can effectively isolate the heat generated by the laser cutting line, and has good heat insulation and buffer protection effects on the display panel 1.
Example two
as shown in fig. 5, a second embodiment of the present invention provides a method for manufacturing a display device, including:
S1: forming a thermal insulation buffer layer 3 on the surface of the display panel 1, wherein the thermal insulation buffer layer 3 is formed in the PAD area 12;
S2: a protective film 2 is pasted on the surface of the heat insulation buffer layer 3;
s3: the protective film 2 is cut along the predetermined position 8 to peel off the protective film 2 on the first side of the predetermined position 8.
Specifically, after the display function layer and the thin film encapsulation layer are manufactured on the substrate of the display panel 1, the thermal insulation buffer layer 3 is formed in the PAD area 12, and the thermal insulation buffer layer 3 may have a preset thickness and may be made of an organic material having a good thermal insulation effect; then, a protective film 2 with low adhesive force is pasted on the thin film packaging layer, the protective film 2 covers the upper surface of the whole display panel 1 and is mainly used for protecting the thin film packaging layer of the display area 11 so as to prevent the thin film packaging layer from being scratched and damaged in the subsequent process; thereafter, when testing and subsequent bonding processes are performed on the display panel 1, the protective film 2 corresponding to the PAD area 12 (including the detection area 121 and the bonding area 122) needs to be removed, and the protective film may be cut along the preset position, so as to peel off the protective film on a first side of the preset position, where the first side may be a side away from the display area 11.
The second embodiment of the invention provides a display device, wherein the heat insulation buffer layer is arranged between the display panel and the protection film corresponding to the PAD area, so that the heat insulation buffer layer can play a role in heat insulation and buffering when the protection film of the PAD area is cut by laser, the heat brought by the laser is prevented from influencing partial films and devices of the PAD area, the PAD area can be protected, and the display effect of the display device is improved. And the thermal insulation buffer layer is formed by the ink-jet printing process, so that the thermal insulation buffer layer has good thermal insulation and buffering effects, the preparation process of the thermal insulation buffer layer can be simplified, and the manufacturing cost of the display panel is reduced.
specifically, the specific method for forming the thermal insulation buffer layer on the surface of the display panel includes: and forming a heat insulation buffer layer on the surface of the display panel by adopting an ink-jet printing process. The film packaging layer of the display area 11 mostly adopts an inorganic-organic laminated film packaging structure, and adopts an organic film layer and an inorganic film layer to alternately stack up to form the packaging structure, and generally comprises a three-layer or five-layer structure, wherein the inorganic film layer plays a role in blocking water and oxygen, the organic film layer plays a role in flatness, particle wrapping, stress releasing and prolonging the path between inorganic holes, and the inorganic film layer is generally positioned on an odd layer, taking the three-layer structure as an example: the first layer is an inorganic film layer, the second layer is an organic film layer, and the third layer is an inorganic film layer. Among them, the organic film layer is generally prepared using an inkjet printing apparatus. In order to ensure that the thermal insulation buffer layer 3 has good thermal insulation and buffering effects, the thermal insulation buffer layer 3 can be formed by adopting an inkjet printing process. Namely, the thermal insulation buffer layer 3 can be printed on the surface of the PAD area 12 of the display panel 1 at a preset position through an ink jet printer, the used solvent can be ink or other organic solvents which can be used by the ink jet printer, and the formed ink jet printing layer is the thermal insulation buffer layer 3; when the thermal insulation buffer layer 3 is prepared, the thermal insulation buffer layer and the organic film layer in the film packaging layer can be prepared by the same material and the same process, so that the preparation process of the thermal insulation buffer layer 3 can be simplified, the manufacturing efficiency of the display panel 1 can be improved, the utilization rate of the material can be improved, and the manufacturing cost of the display panel 1 can be reduced.
As shown in fig. 2 to 4, the cutting of the protective film 2 along the predetermined position 8 includes: the protective film 2 is cut along the predetermined position 8 by laser, and a heat-affected zone 9 is formed on the side of the protective film 2 close to the display panel 1. Specifically, in the operation of removing the protective film 2, the preset position 8 is a position corresponding to a preset laser cutting line for cutting the protective film 2, the laser cutting line cuts the preset position 8 of the protective film 2, the adhesion between the protective film 2 and the display panel 1 can be reduced, the protective film 2 located on the side of the preset position 8 away from the display area 11 is peeled and removed, as shown in fig. 2, the right side of the preset position 8 is the side away from the display area 11, the energy generated by laser cutting is high, a heat affected zone 9 is formed in the PAD area 12, the heat affected zone is an area affected by the heat of the laser in the PAD area 12, the heat insulating buffer layer 3 is provided for isolating and buffering the heat generated by the laser cutting line, after the position of the preset position 8 is preset, the position of the heat insulating buffer layer 3 can be set corresponding to the range of the heat affected zone 9, that is, it can be ensured that the heat insulating buffer layer 3, Buffering avoids the influence of heat to PAD district 12 inner structure, plays the effect of protection display panel 1, also can reduce the range of setting up of thermal-insulated buffer layer 3 in PAD district 12, can save material, and simplify display panel 1's manufacture craft.
2-4, there are a variety of specific settable positions for the predetermined position 8, for example, the predetermined position 8 may be located within the detection region 121 of the PAD area 12 and the heat affected zone 9 may be located within the detection region 121. In order to realize the test and the subsequent bonding process of the display panel 1, the protective film 2 of the PAD area 12 needs to be cut and removed by laser, so that the ET detection line of the PAD area 12 and the bonding area 122 are exposed, and therefore, during the cutting, only the protective film 2 in the area corresponding to the ET detection line and the bonding area 122 can be removed, so that the position of the preset position 8 does not need to be arranged at the connection position of the PAD area 12 and the display area 11, and can be arranged in the PAD area 12, and a preset distance can be arranged between the preset position 8 and the display area 11, wherein the preset distance can be a distance which ensures that the heat affected area 9 formed by the preset position 8 is not in contact with the display area 11, so that the preset position 8 is prevented from being close to the display area 11, and the heat generated by the laser preset position 8 affects the display devices in the display area 11 and affects the normal display of the display area 11; preset position 8 and bonding area 122 between also can set up preset distance to make the heat affected zone 9 that preset position 8 formed not contact with bonding area 122, thereby can avoid the heat that the laser cutting region produced to bonding area 122's influence, avoid influencing subsequent bonding technology's going on.
in the present embodiment, the predetermined position 8 is located in the detection area 121 of the PAD area 12, and the heat affected area 9 formed by the predetermined position 8 is also located in the detection area 121, when actually disposed, in order to meet the current design requirement, the design of the PAD area 12 of the display panel tends to be narrow, the position of the predetermined position 8 inevitably approaches the electrostatic protection (ESD) unit 4 of the detection area, the spot diameter of the laser cutting line is about 120 μm, as shown in fig. 3 and 4, the area width of the heat affected area 9 formed on the surface of the display panel 1 after cutting is about 100 μm, so the total area width of the heat affected area 9 formed by the laser cutting line inside the display panel 1 is about 200 μm, the electrostatic protection (ESD) unit 4 is located in the heat affected area 9, the film layer of the planarization layer 5(PLN) and the pixel definition layer 6(PDL) on the upper side of the electrostatic protection (ESD) unit 4 is thin, the damage is easy to be caused, so that a water and oxygen channel can be formed, the effect of isolating water and oxygen of the display area 11 is influenced, the total thickness of the flat layer 5(PLN) and the pixel definition layer 6(PDL) is about 3 μm, the influence of heat generated by a laser cutting line on an electrostatic protection (ESD) unit 4 cannot be isolated, the TFT characteristic curve is positively biased at high temperature, the leakage current is increased, the electrostatic protection (ESD) unit 4 is corroded, the display area 11 is subjected to full-screen bright line, and the normal display effect of the display area 11 of the display panel 1 is influenced. Based on the influence of the laser cutting line on the PAD area 12 and the display area 11, by arranging the above thermal insulation buffer layer 3, the heat transferred from the thermal influence area 9 to the display panel 1 of the PAD area 12 can be isolated, so that the damage caused by the flat layer 5(PLN) and the pixel definition layer 6(PDL) can be avoided, and the heat is prevented from being transferred to the electrostatic protection (ESD) avoiding unit 4, so that the electrostatic protection (ESD) unit 4 can be protected, the problems of corrosion and the like of the unit can be avoided, the water and oxygen isolation effect of the display device in the display area 11 can be improved, and the good display effect of the display area 11 can be ensured.
Specifically, in actual operation, after the preset position 8 is determined in advance, the thermal insulation buffer layer 3 may be printed based on the preset position 8 as a center, the printing range may be set to correspond to and be equal to the range of the heat affected zone 9, or the printing range may be larger than the range of the heat affected zone 9, the thickness of the thermal insulation buffer layer 3 may be set according to actual conditions, and the thickness of the thermal insulation buffer layer 3 may be increased when the setting conditions allow, so that the thermal insulation buffer layer 3 has a good thermal insulation protection effect.
Specifically, the preset thickness of the heat insulation buffer layer 3 along the first direction is not less than the depth of the heat affected zone 9; the first direction is a direction perpendicular to the display panel. As shown in fig. 4, the thickness of the thermal insulation buffer layer 3 may be set to be not less than the total thickness of the display planarization layer 5(PLN), the pixel definition layer 6(PDL), and the organic layer 7, that is, the thickness of the thermal insulation buffer layer 3 should be not less than 3.05 μm, so that the range of the depth of the heat affected zone 9 is not in contact with the pixel definition layer 6(PDL), that is, it is ensured that the heat of the heat affected zone 9 does not affect the display panel 1, and a good thermal insulation and buffer protection effect is exerted on the display panel 1.
in order to ensure that the thermal insulation buffer layer 3 has a good thermal insulation protection effect on the PAD area 12, specifically, the area of the cross section of the thermal insulation buffer layer 3 perpendicular to the first direction may be set to be not smaller than the area of the heat affected zone 9, that is, the coverage area of the thermal insulation buffer layer 3 is not smaller than the area of the cross section of the heat affected zone 9, the length and the width of the thermal insulation buffer layer 3 are not smaller than the area of the heat affected zone 9, and the coverage area of the thermal insulation buffer layer 3 can wrap the affected section of the heat affected zone 9. The PAD region 12 can be reliably protected from heat of the laser cutting line damaging the planarization layer 5(PLN) and the pixel definition layer 6(PDL), and further, corrosion of the electrostatic protection (ESD) unit 4 due to high temperature can be prevented.
EXAMPLE III
an embodiment of the present invention provides a display device, including: the display panel is provided.
specifically, the display device may be an electronic device with a display function, such as a television, a mobile phone, a tablet computer, and the like, and the display device may implement the display function through the display panel 1.
The third embodiment of the invention provides a display device, wherein the heat insulation buffer layer is arranged between the display panel and the protection film corresponding to the PAD area, so that the functions of heat insulation and buffering can be achieved when the protection film of the PAD area is cut by laser, and the heat brought by the laser is prevented from influencing partial films and devices of the PAD area, so that the hidden danger that water and oxygen blocking effects of the display area are influenced due to the fact that water and oxygen channels are formed due to damage of the films and the picture display effect of the display area is influenced due to the fact that devices of the PAD area are corroded and damaged can be avoided, the PAD area can be protected, and the display effect of the display device can be improved.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. A display panel, display panel includes display area and sets up the PAD district of display area one side, the PAD district includes detection zone and bonding area, bonding area sets up the detection zone is kept away from one side of display area, its characterized in that includes:
A protective film which is laminated on the surface of the display panel;
and the heat insulation buffer layer is arranged in the PAD area and is arranged between the protective film and the display panel.
2. The display panel according to claim 1,
The heat insulation buffer layer is made of organic materials with preset heat insulation effect.
3. The display panel according to claim 1,
The heat insulation buffer layer has a preset thickness along a first direction;
wherein the first direction is a direction perpendicular to the display panel.
4. A method for manufacturing a display panel is characterized by comprising the following steps:
Forming a thermal insulation buffer layer on the surface of the display panel, wherein the thermal insulation buffer layer is formed in the PAD area;
Pasting a protective film on the surface of the heat insulation buffer layer;
And cutting the protective film along a preset position to peel off the protective film on the first side of the preset position.
5. The method for manufacturing a display panel according to claim 4,
The thermal insulation buffer layer formed on the surface of the display panel comprises:
And forming the heat insulation buffer layer on the surface of the display panel by adopting an ink-jet printing process.
6. The method for manufacturing a display panel according to claim 5,
Cutting along preset position the protection film includes:
adopt laser along preset position cutting the protection film, and the protection film is close to one side heat formation influence district of display panel.
7. The method for manufacturing a display panel according to claim 6,
The preset position is located in the detection area of the PAD area, and the heat affected zone is located in the detection area.
8. The method for manufacturing a display panel according to claim 6,
the preset thickness of the heat insulation buffer layer along the first direction is not less than the depth of the heat affected zone.
9. the method for manufacturing a display panel according to claim 6,
the cross-sectional area of the heat insulation buffer layer is not smaller than the area of the heat affected zone;
wherein, the cross section of thermal-insulated buffer layer is the cross section of perpendicular to first direction.
10. A display device, comprising:
A display panel as claimed in any one of claims 1-3.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112467059A (en) * | 2020-11-12 | 2021-03-09 | 安徽熙泰智能科技有限公司 | Method for opening Pad of Mirco OLED, Mirco OLED and manufacturing method of Mirco OLED |
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