CN111146124A - 一种扩大芯片自动筛选及测试接触面的优化装置 - Google Patents

一种扩大芯片自动筛选及测试接触面的优化装置 Download PDF

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CN111146124A
CN111146124A CN201911375217.XA CN201911375217A CN111146124A CN 111146124 A CN111146124 A CN 111146124A CN 201911375217 A CN201911375217 A CN 201911375217A CN 111146124 A CN111146124 A CN 111146124A
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golden finger
test
contact
insulating baffle
contact surface
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顾春华
周俊
吴勇佳
叶建明
王静
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Sino IC Technology Co Ltd
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Sino IC Technology Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67121Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

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  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

本发明公开了一种扩大芯片自动筛选及测试接触面的优化装置,包括绝缘挡板,所述绝缘挡板设置在金手指固定装置、金手指的背面,所述金手指设置在金手指固定装置上;本发明提供的一种扩大芯片自动筛选及测试接触面的优化装置,通过以上对金手指的改造,可以有效的增加金手指与IC管脚之间的接触面积,使得阻抗变小,来满足某些对接触阻抗有严格要求的测试项,如交流测试,功能测试等,这样可以有效的提高FT测试过程中的良率,避免不必要的二次测试或是三次测试,减少了成本。

Description

一种扩大芯片自动筛选及测试接触面的优化装置
技术领域
本发明涉及半导体芯片封装后的测试技术领域,进一步说,尤其涉及一种扩大芯片自动筛选及测试接触面的优化装置。
背景技术
术语解释:
FT:半导体芯片封装后的测试;
IC:半导体芯片封装后的成品,待测器件;
handler:FT测试中使用的自动化设备;
金手指:与封装芯片进行接触的配件。
FT测试过程中常用的handler为重力式机械手,该类型制造结构简单,成本比较低廉,因此市场占有量比较高。重力式机械手和IC的接触方式都是通过金手指与IC管脚的接触,来实现FT测试过程的自动化测试。金手指与IC管脚的接触是,点对点的接触方式,由于是点对点的接触,不可能避免的会造成IC管脚或金手指产生形变,这样就造成了,金手指与IC管脚的接触不是很紧密充分,导致两者之间的接触面积变小,阻抗变大,这样肯定会对测试产生影响,导致某些参数测试会失效。为了解决重力式机械手与IC接触不充分的问题,目前常规的解决办法是加大IC管脚“施加的力”来增加与金手指之间“接触面积”,依靠IC管脚的硬度和金手指的硬度的能力来实现。“施加的力”对于重力式机械手而言是可控的,但是IC管脚“施加的力”肯定与金手指“承受的力”是不同的,势必会导致其中一方产生形变,使两者无法紧密的接触,而且“施加的力”,也不能无限制的加大,总有个上限,用于保护IC。
本发明就是为了解决重力式机械手与IC接触不充分的问题,提供了一种扩大芯片自动筛选及测试接触面的优化装置,通过从金手指入手,在其背面增加一块绝缘的贴合金手指形状的绝缘板,来保证金手指在IC管脚“施加力不断增大”的情况下,不产生形变,已达到充分接触的目的。
发明内容
本发明为解决上述技术问题而采用的技术方案是提供一种扩大芯片自动筛选及测试接触面的优化装置,其中,具体技术方案为:
包括绝缘挡板,所述绝缘挡板设置在金手指固定装置、金手指的背面,所述金手指设置在金手指固定装置上。
上述的一种扩大芯片自动筛选及测试接触面的优化装置,其中:所述绝缘挡板贴合金手指背面的形状,用于防止金手指变形。
上述的一种扩大芯片自动筛选及测试接触面的优化装置,其中:所述绝缘挡板、金手指固定装置上设置螺孔,所述螺孔内设置螺丝。
本发明相对于现有技术具有如下有益效果:通过设置绝缘挡板,使得阻抗变小,可以有效的增加金手指与IC管脚之间的接触面积,来满足某些对接触阻抗有严格要求的测试项,如交流测试,功能测试等,这样可以有效的提高FT测试过程中的良率,避免不必要的二次测试或是三次测试,减少了成本。
附图说明
图1为现有技术金手指部分配件的示意图。
图2为一种扩大芯片自动筛选及测试接触面的优化装置的侧视图。
图3为一种扩大芯片自动筛选及测试接触面的优化装置的主视图。
图中:
1绝缘挡板2螺丝3金手指固定装置4金手指5金手指与器件接触点6螺孔
具体实施方式
下面结合附图和实施例对本发明作进一步的描述。
一种扩大芯片自动筛选及测试接触面的优化装置,包括绝缘挡板1,所述绝缘挡板1设置在金手指固定装置3、金手指4的背面,所述金手指4设置在金手指固定装置3上。所述绝缘挡板1贴合金手指4背面的形状,用于防止金手指变形。所述绝缘挡板1、金手指4固定装置上设置螺孔6,所述螺孔6内设置螺丝2。
通过对金手指4的部分配件进行改造,来满足某些对接触阻抗有严格要求的IC芯片的测试。仅仅只是改造了金手指4部分,就能使重力式机械手的测试良率提高到95%以上,极大的提高了厂能,而且改造和安装又非常的简洁和方便,非常适合量产,也利于一线人员的操作。
虽然本发明已以较佳实施例揭示如上,然其并非用以限定本发明,任何本领域技术人员,在不脱离本发明的精神和范围内,当可作些许的修改和完善,因此本发明的保护范围当以权利要求书所界定的为准。

Claims (3)

1.一种扩大芯片自动筛选及测试接触面的优化装置,其特征在于:包括绝缘挡板,所述绝缘挡板设置在金手指固定装置、金手指的背面,所述金手指设置在金手指固定装置上。
2.如权利要求1所述的一种扩大芯片自动筛选及测试接触面的优化装置,其特征在于:所述绝缘挡板贴合金手指背面的形状,用于防止金手指变形。
3.如权利要求2所述的一种扩大芯片自动筛选及测试接触面的优化装置,其特征在于:所述绝缘挡板、金手指固定装置上设置螺孔,所述螺孔内设置螺丝。
CN201911375217.XA 2019-12-27 2019-12-27 一种扩大芯片自动筛选及测试接触面的优化装置 Pending CN111146124A (zh)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6573738B1 (en) * 1999-03-25 2003-06-03 Tokyo Cathode Laboratory Co., Ltd. Multi-layered probe for a probecard
CN1523361A (zh) * 2003-02-18 2004-08-25 雅马哈株式会社 探头、探头装配方法和探针板
US20070045535A1 (en) * 2005-08-29 2007-03-01 Mjc Probe Incorporation Electrical contact device of probe card
TW201102671A (en) * 2009-02-20 2011-01-16 Qmc Co Ltd LED chip sorting apparatus
CN103630827A (zh) * 2013-11-27 2014-03-12 杭州友旺电子有限公司 集成电路自动测试装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6573738B1 (en) * 1999-03-25 2003-06-03 Tokyo Cathode Laboratory Co., Ltd. Multi-layered probe for a probecard
CN1523361A (zh) * 2003-02-18 2004-08-25 雅马哈株式会社 探头、探头装配方法和探针板
US20070045535A1 (en) * 2005-08-29 2007-03-01 Mjc Probe Incorporation Electrical contact device of probe card
TW201102671A (en) * 2009-02-20 2011-01-16 Qmc Co Ltd LED chip sorting apparatus
CN103630827A (zh) * 2013-11-27 2014-03-12 杭州友旺电子有限公司 集成电路自动测试装置

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