CN111141164A

CN111141164A - Main board of intercooler, intercooler and manufacturing method of intercooler

Info

Publication number: CN111141164A
Application number: CN201911412865.8A
Authority: CN
Inventors: 李天�; 汤平强; 谢建; 刘伟锋; 谢先龙; 姚斌; 闵富海; 陈宇涛
Original assignee: Zhejiang Yinlun Machinery Co Ltd
Current assignee: Zhejiang Yinlun Machinery Co Ltd
Priority date: 2019-12-31
Filing date: 2019-12-31
Publication date: 2020-05-12
Also published as: WO2021136017A1

Abstract

The disclosure relates to the technical field of heat exchange equipment, in particular to a main board of an intercooler, the intercooler and a manufacturing method of the intercooler. The utility model aims to provide a mainboard, intercooler and intercooler manufacturing method to present intercooler when adapting to outside installation space size, be difficult to guarantee the problem of heat transfer performance.

Description

Main board of intercooler, intercooler and manufacturing method of intercooler

Technical Field

The disclosure relates to the technical field of heat exchange equipment, in particular to a main board of an intercooler, the intercooler and a manufacturing method of the intercooler.

Background

At present, the more and more diversified of mechanical equipment function, function original paper in the mechanical equipment is also more and more, and the installation space that corresponding each part can utilize is more and more littleer, in order to adapt to the installation space, the intercooler that adopts among the mechanical equipment often need carry out miniaturized design, and at present, the miniaturization of intercooler usually means to reduce the heat transfer core, and then sacrifices the heat transfer performance of intercooler, and this makes the intercooler when adapting to outside installation space size, is difficult to guarantee the heat transfer performance.

Disclosure of Invention

The utility model aims to provide a mainboard, intercooler and intercooler manufacturing method to present intercooler when adapting to outside installation space size, be difficult to guarantee the problem of heat transfer performance.

In order to achieve the purpose, the following technical scheme is adopted in the disclosure:

one aspect of the present disclosure provides a main plate of an intercooler, the main plate being configured to connect a core and a chamber of the intercooler, a through passage being formed in the main plate, through which the core penetrates the main plate to extend into the chamber.

Optionally, the inner wall of the through channel is a plane for fitting and sealing connection with the outer wall of the core.

The technical scheme has the beneficial effects that: the core body is generally in a cuboid or cube structure, the through channel is correspondingly provided with four inner walls, and the four inner walls are attached to the core body; the inner wall through making the through channel can then increase the area that the mainboard covered on the core for the plane, and then increases the joint strength between mainboard and the core and the bulk strength of core self, simultaneously, runs through the in-process through channel at the core, and the inner wall through channel can also play the effect of leading to the relative motion of core and mainboard.

Another aspect of the present disclosure provides an intercooler, including the main plate provided by the present disclosure.

Optionally, the chamber comprises a core and a chamber body connected by the main plate, wherein the core penetrates through the main plate and extends into the chamber body through the through channel.

The technical scheme has the beneficial effects that: the core body penetrates through the through channel and extends into the chamber body, so that the space in the chamber body can be fully utilized, and compared with an intercooler which has the same volume and is provided with the core body and the chamber body in the prior art, the intercooler provided by the embodiment of the disclosure has the core body with the larger volume and the better heat exchange performance.

Optionally, the core body penetrates through the main plate in a first direction, a connecting hole for connecting with an external pipeline is formed in the core body, and the connecting hole is far away from two side edges of the core body in the first direction.

The technical scheme has the beneficial effects that: that is, the position of the connecting hole in the first direction is located in the middle of the core or close to the middle of the core, and because the connecting hole is connected with the pipeline for conveying the medium, when the main board is installed on the core, the position of the pipeline limits the range of the installation position of the main board on the core, when the connecting hole is far away from the edges of the two sides of the core in the first direction as far as possible, the installation position of the main board can have a wide range of choice, and further, the position relation among the core, the main board and the chamber body can be selected more flexibly according to the size of the external installation space of the intercooler.

Optionally, the core penetrates the main board in a first direction, the core includes a housing having a first shell and a second shell, a seam extending in the first direction is formed at a joint where the first shell and the second shell are joined, an air blocking portion penetrating the seam is formed on the first shell, a groove portion for accommodating the air blocking portion is formed on the second shell, and the main board covers the air blocking portion.

The technical scheme has the beneficial effects that: when the shell leaks at the seam, because this gas blocking part runs through the seam, make gas blocking part can form in the first direction and block the air current of revealing, when the air current of revealing flows in the clearance between gas blocking part and the concave part, because the mainboard covers gas blocking part, make the mainboard cover above-mentioned clearance, make the air current be difficult to reveal from above-mentioned clearance.

Optionally, the core includes a seal on an inner side of the outer shell, the seal covering the seam and the air dam, and the seal being sealingly connected to the outer shell at the seam.

The technical scheme has the beneficial effects that: make the air current difficult to reveal at the seam crossing through this sealing member, especially in above-mentioned fender gas portion and concave part complex position, seal the clearance between fender gas portion and the concave part through mainboard and sealing member simultaneously, reduced the air current and appeared revealing the possibility in the direction of perpendicular to seam, and when the air current flows along the seam, will receive the blocking of bellying and concave part again, and then reduce the possibility that gas revealed.

Optionally, the core has a core piece located inside the housing, the sealing member is the core piece, and the core piece has a flange, and the flange is connected with the housing at the seam in a sealing manner.

The technical scheme has the beneficial effects that: in the core body, the chip is an essential component, and the cost caused by additionally arranging other components as the sealing member can be avoided by using the chip as the sealing member; specifically, the flanging can be welded with the first shell, the second shell and the gas blocking part to realize sealing.

Optionally, the core has a side plate located inside the shell, the seal being the side plate.

The technical scheme has the beneficial effects that: when adopting above-mentioned chip as the sealing member, although can reduce cost, but need guarantee that the turn-ups of chip has certain size in the third direction, in order to guarantee that the turn-ups can cover seam and gas blocking portion, this has increased the size of chip in the third direction, after a plurality of chips pile up into the core, also increased the size of core in the third direction to a certain extent, and be the sealing member through making above-mentioned curb plate, then need not turn-ups cover seam and gas blocking portion, turn-ups's size in the third direction that can be appropriate reduces, and then reduce the size of core in the third direction, be favorable to the miniaturization of intercooler.

Optionally, the core comprises a shell, the outer wall of the shell being planar.

The technical scheme has the beneficial effects that: can make the core be cuboid or square structure, the shell correspondence has four outer walls, and the outer wall then can increase shell and mainboard area of contact for the plane, and then increases the joint strength between mainboard and the core, simultaneously, runs through the in-process that link up the passageway at the core, and the outer wall of shell can also play the effect that leads to the relative motion of core and mainboard.

Yet another aspect of the present disclosure provides a method of manufacturing an intercooler, the intercooler including a core and a main plate on which through passages are formed, the through passages penetrating the main plate, the method including:

and sleeving the main plate on the core body through the through channel, and enabling the core body to penetrate through the main plate through the through channel.

Optionally, the core has a casing including a first shell and a second shell, and a plurality of chip components mounted inside the casing;

before the sleeving the main plate on the core body through the through channel and the core body penetrates through the main plate through the through channel, the method comprises the following steps:

stacking each of the chip assemblies within the first housing;

docking the first housing with the second housing to form the enclosure.

The technical scheme has the beneficial effects that: this enables the chip components and the housing to be first formed as a single body through which the assembly with the main board is made easier.

Optionally, the first shell has a first edge, the second shell has a second edge, the first shell and the second shell are butted through the first edge and the second edge, an air blocking portion is formed on one of the first edge and the second edge, and a groove portion is formed on the other one;

said interfacing said first shell with said second shell to form said enclosure comprises:

and positioning and matching the air blocking part and the groove part to enable the first shell and the second shell to be butted to form the shell.

The technical scheme has the beneficial effects that: when the first shell is in butt joint with the second shell, the air blocking part is matched and positioned with the groove part, so that the assembly precision and the assembly efficiency of the intercooler are improved; moreover, after the first edge is in butt joint with the second edge, a joint is formed between the first edge and the second edge, and the air blocking portion penetrates through the joint and is matched with the groove portion, so that when air leakage occurs at the joint, the air blocking portion and the groove portion can block air flow in the extending direction of the joint, and further the air leakage degree is relieved.

Optionally, the intercooler includes a seal located inside the outer shell, the first shell and the second shell form a seam between the first edge and the second edge after being butted together;

after the docking the first housing with the second housing to form the enclosure, further comprising:

sealingly connecting the housing to the seal at the seam.

The technical scheme has the beneficial effects that: this reduces the possibility of air leakage at the joints after the intercooler is assembled.

Optionally, the sealing member is one of the chip components.

The technical scheme has the beneficial effects that: this reduces the possibility that air leakage will occur at the seams after the intercooler is assembled, and because in the core, the chip assembly is an indispensable component, the sealing seams are less costly in a manner of hermetically connecting the housing and the chip assembly at the seams, compared with sealing seams which are specially provided for other components.

Optionally, the seal is a side plate;

prior to said stacking each of said chip assemblies within said first housing, further comprising:

mounting a side plate within the first housing;

sealingly connecting the housing to the side panel at the seam.

The technical scheme has the beneficial effects that: when adopting the chip subassembly to do the joint sealing, although can reduce cost, nevertheless need guarantee that the turn-ups of chip has certain width to guarantee that the turn-ups can cover the seam, this has increased the size of chip, piles up into the core when a plurality of chips after, has also increased the size of core to a certain extent, and through adopting the curb plate, joint sealing, the turn-ups's that can be appropriate size that reduces, and then the size of reducing the core is favorable to the miniaturization of intercooler.

Optionally, after the sleeving the main plate on the core body through the through channel and the core body penetrating the main plate through the through channel, the method further includes:

covering the main board on the air blocking part and the groove part.

The technical scheme has the beneficial effects that: when the mainboard covers from the outside of shell and keeps off gas portion, make first casing, second casing and keep off gas portion and the connection that the concave part can be inseparable be a whole, make first casing and second casing be difficult to produce relative motion, and then make seam crossing be difficult for appearing leading to the gap of gas leakage, reduced the possibility of intercooler gas leakage.

Optionally, the chip assembly includes a first chip and a second chip, the first chip has a first board surface and a first flange formed on the first board surface, and the second chip has a fourth board surface and a second flange formed on the fourth board surface;

and oppositely arranging the first plate surface and the fourth plate surface, and overlapping the first flanging and the second flanging, so that the extending direction of the first flanging and the extending direction of the second flanging are the flow direction of the cooled medium flowing through the first chip.

The technical scheme has the beneficial effects that: through first turn-ups and second turn-ups overlap joint, not only can realize being connected between first chip and the second chip, moreover, can also fix a position the relative position between first chip and the second chip at the in-process that first chip is connected with the second chip, improve assembly precision and assembly efficiency.

Optionally, a seam is formed after the first shell and the second shell are butted;

and the shell is hermetically connected with the first flange or the second flange at the seam.

The technical scheme has the beneficial effects that: by using the first flange or the second flange to seal the joint, the cost is lower by using the structure of the chip assembly per se compared with the joint which is additionally sealed by using other components.

Optionally, a protruding portion is formed on the first board surface, an intra-group positioning portion is formed at the protruding portion, the second chip has a fourth board surface, and an intra-group positioning protrusion is formed on the fourth board surface;

and the first plate surface and the fourth plate surface are oppositely arranged, and the group positioning bulges are matched with the group positioning parts for positioning.

The technical scheme has the beneficial effects that: when assembling the chip assembly, the positioning part in the group and the positioning protrusion in the group are matched and positioned, so that the assembly accuracy and the assembly efficiency are improved.

Optionally, before the oppositely disposing the first panel and the fourth panel and overlapping the first flange and the second flange, the method further includes:

and forming a blocking part on the first flanging so that the blocking part extends out of the middle part of the first plate surface in the direction perpendicular to the first flanging.

The technical scheme has the beneficial effects that: the intercooler after the equipment is accomplished is when using, because the chip both sides are mostly coolant import and export, the middle part of being mainly concentrated on the chip by coolant and coolant, but by coolant when flowing through the core, often some are imported and exported from coolant with coolant stream and the first turn-ups between the position flow, lead to this part by the unable heat transfer of coolant, the heat transfer performance of intercooler has been reduced, and above-mentioned block part of shaping on first turn-ups, make the block part after the shaping can to form to the certain extent and block by coolant, reduce the volume of flowing into coolant between coolant import and export and the first turn-ups by coolant, and then improve the heat transfer performance of intercooler.

Optionally, the first core piece has a third flange formed on the first plate surface and extending perpendicular to the first flange, and the second core piece has a fourth flange formed on the fourth plate surface and extending perpendicular to the second flange;

and overlapping the third flanging with the fourth flanging.

The technical scheme has the beneficial effects that: through the lap joint between the third flanging and the fourth flanging, the connection between the first chip and the second chip is facilitated, the positioning effect on the first chip and the second chip can be realized during assembly, and the assembly efficiency and the assembly precision are improved; and the third flanging and the fourth flanging can also form certain blocking to the cooled medium which flows into the first flanging and the cooling medium inlet and outlet, so that the heat exchange performance of the intercooler is improved.

Optionally, the chip assembly includes a first chip and a second chip which are stacked, the first chip has a second board surface which is arranged away from the second chip, the second chip has a third board surface which is arranged away from the first chip, a first inter-group positioning portion is formed on the second board surface, and a second inter-group positioning portion is formed on the third board surface;

said stacking each of said chip assemblies within said first housing, comprising:

positioning two adjacent chip assemblies by matching the first group of positioning parts on one chip assembly with the second group of positioning parts on the other chip assembly so as to stack each chip assembly in the first shell.

The technical scheme has the beneficial effects that: the stacking between the chip assemblies is positioned by matching the first inter-group positioning part with the second inter-group positioning part, so that the assembly efficiency and precision are improved.

Optionally, the first inter-group positioning part is an inter-group positioning protrusion.

Optionally, the chip assembly includes a first chip and a second chip which are stacked, the first chip has a second board surface which is arranged away from the second chip, the second chip has a third board surface which is arranged away from the first chip, a first high-temperature coolant flow channel and a first low-temperature coolant flow channel which are recessed into the second board surface are formed on the second board surface, and a second high-temperature coolant flow channel and a second low-temperature coolant flow channel which are recessed into the third board surface are formed on the third board surface;

overlapping the first high-temperature coolant flow channel on one of the chip assemblies with the second high-temperature coolant flow channel on the other of the chip assemblies between two adjacent chip assemblies, and overlapping the first low-temperature coolant flow channel on one of the chip assemblies with the second low-temperature coolant flow channel on the other of the chip assemblies.

The technical scheme has the beneficial effects that: therefore, a closed high-temperature cooling liquid flow passage is formed by the first high-temperature cooling liquid flow passage and the second high-temperature cooling liquid flow passage, and a closed low-temperature cooling liquid flow passage is formed between the first low-temperature cooling liquid flow passage and the second low-temperature cooling liquid flow passage.

Optionally, the first high-temperature coolant flow channel, the first low-temperature coolant flow channel, the second high-temperature coolant flow channel and the second low-temperature coolant flow channel have the same width dimension.

The technical scheme has the beneficial effects that: in the embodiment of the present disclosure, the width dimensions of the first high-temperature coolant flow channel, the first low-temperature coolant flow channel, the second high-temperature coolant flow channel, and the second low-temperature coolant flow channel are the same, so that the heat load of the low-temperature radiator and the resistance to the coolant in the high-temperature coolant flow channel are limited to a lower level while the dimensions of the high-temperature coolant flow channel and the low-temperature coolant flow channel meet a certain heat exchange requirement.

Optionally, a first thermal insulation hole is formed between the first high-temperature coolant flow channel and the first low-temperature coolant flow channel on the first chip, and a second thermal insulation hole is formed between the second high-temperature coolant flow channel and the second low-temperature coolant flow channel on the second chip;

said stacking each of said chip assemblies within said first housing further comprising:

overlapping the first thermal via on one of the chip assemblies with the second thermal via on the other of the chip assemblies between two adjacent chip assemblies.

The technical scheme has the beneficial effects that: this makes first thermal-insulated hole and second thermal-insulated hole all uncovered, has avoided on a chip subassembly between high temperature coolant liquid runner and the low temperature coolant liquid runner though through thermal-insulated hole thermal insulation, but leads to the problem that thermal-insulated effect descends through another chip subassembly connection, and then makes the thermal-insulated hole to the certain assurance of the effect of low temperature coolant liquid runner and high temperature coolant liquid runner thermal insulation.

Optionally, the core comprises a first cover plate and a second cover plate;

mounting the first cover plate within the first housing;

after said stacking each of said chip assemblies within said first housing, further comprising:

after stacking each of the chip components on the first cover plate, stacking the second cover plate on the chip components so that each chip component is located between the first cover plate and the second cover plate.

The technical scheme has the beneficial effects that: this realizes that when each chip component is mounted between the first cover plate and the second cover plate and each chip component is mounted between the first cover plate and the second cover plate, the first heat insulating hole and the second heat insulating hole can be covered by the first cover plate and the second cover plate, and the possibility of leakage of the air flow through the first heat insulating hole and the second heat insulating hole can be reduced.

The technical scheme provided by the disclosure can achieve the following beneficial effects:

when the intercooler is assembled, the core body can penetrate through the main board through the through channel on the main board and extend into the chamber body due to the fact that the main board does not have fillets, space in the chamber body is effectively utilized, the installation position of the main board on the core body can be determined properly according to the size of an external installation space during assembly, and then after the core body, the main board and the chamber body are assembled into the intercooler, the intercooler can adapt to the size of the external installation space, meanwhile, the size of the core body does not need to be changed when the whole size of the intercooler is reduced, and therefore heat exchange performance is guaranteed; and, in the same time, because the core can run through the mainboard and stretch into the room internal, when assembling the intercooler, can adopt the great core of length, increase the heat transfer performance of intercooler under the unchangeable circumstances of whole intercooler volume of guaranteeing.

Additional features of the disclosure and advantages thereof will be set forth in the description which follows, or may be learned by practice of the disclosure.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings used in the description of the embodiments will be briefly described below. It should be apparent that the drawings in the following description are of some embodiments of the disclosure and that other drawings may be derived from those drawings by one of ordinary skill in the art without inventive faculty.

Fig. 1 is a schematic partial perspective view of an intercooler according to an embodiment of the present disclosure;

fig. 2 is a schematic perspective view of an embodiment of a motherboard according to an embodiment of the present disclosure;

FIG. 3 is a schematic perspective view of one embodiment of a housing provided by an embodiment of the present disclosure;

FIG. 4 is a schematic side view of one embodiment of a housing provided by an embodiment of the present disclosure;

FIG. 5 is an enlarged view of a portion of FIG. 4 at A;

FIG. 6 is a schematic view of an embodiment of an air dam portion engaged with a recessed portion according to an embodiment of the disclosure;

FIG. 7 is a schematic view of another embodiment of an air dam portion engaged with a recessed portion according to an embodiment of the present disclosure;

fig. 8 is a schematic partial front view illustrating an intercooler according to an embodiment of the present disclosure;

FIG. 9 is an enlarged partial view at B of FIG. 8;

fig. 10 is a schematic partial front view illustrating a intercooler according to another embodiment of the present disclosure;

FIG. 11 is an enlarged view of a portion of FIG. 10 at C;

FIG. 12 is a schematic diagram of a partial perspective view of one embodiment of a core provided by an embodiment of the present disclosure;

fig. 13 is a schematic perspective view of one embodiment of a chip assembly according to an embodiment of the disclosure;

FIG. 14 is a schematic perspective view of the alternate angle of FIG. 13;

FIG. 15 is a top view of FIG. 14;

FIG. 16 is a cross-sectional view taken at D-D of FIG. 15;

fig. 17 is a schematic structural diagram of an embodiment of a first chip of one chip assembly and a second chip of another chip assembly of two adjacent chip assemblies according to an embodiment of the present disclosure;

FIG. 18 is an enlarged partial cross-sectional view taken at E in FIG. 17;

fig. 19 is a schematic perspective view of an implementation manner of a first chip according to an embodiment of the disclosure;

fig. 20 is a schematic top view diagram of an embodiment of a first chip according to an embodiment of the disclosure;

fig. 21 is a schematic top view diagram of another implementation manner of a first chip according to an embodiment of the disclosure;

FIG. 22 is a schematic perspective view of the alternate angle of FIG. 19;

fig. 23 is a schematic perspective view of an implementation manner of a second chip according to an embodiment of the disclosure;

fig. 24 to 29 are schematic partial structural views of six implementations of a chip assembly provided in an embodiment of the disclosure;

fig. 30 to 34 are schematic flow charts illustrating an implementation manner of a manufacturing method of an intercooler provided in the embodiment of the present disclosure.

Reference numerals:

100-a main board;

110-a through channel;

111-inner wall;

200-a core;

210-a housing;

211-a first housing;

212-a second housing;

213-a seam;

214-gas barrier;

214 a-edge;

214 b-arcuate guide surface;

215-gap;

216-gap;

220-a chip assembly;

221-a first chip;

221 a-second deck;

221 b-inter-group positioning projections;

221 c-first high temperature coolant flow channel;

221ca — first end;

221 d-first cryogenic coolant flow channel;

221 da-second end;

221 e-boss;

221 f-stop;

221 g-a first flange;

221 h-third flanging;

221 i-an intra-group positioning portion;

221 j-first board surface;

221 k-first insulating hole;

221 l-through hole;

222-a second chip;

222 a-a fourth flange;

222 b-second flange;

222 c-third board surface;

222 d-a second inter-group positioning portion;

222 e-a second high temperature coolant channel;

222 f-a second cryogenic coolant flow channel;

222 g-fourth plate surface;

222 h-inner positioning protrusions;

222 i-a support;

222 j-a second insulating aperture;

222 k-bump structure;

230-a first cover plate;

240-gas flow-through channel;

250-connecting hole;

260-side plate;

300-a first water chamber;

400-a first liquid inlet connecting pipe;

500-second liquid outlet connecting pipe;

600-second liquid inlet connecting pipe.

Detailed Description

The technical solutions of the present disclosure will be described clearly and completely with reference to the accompanying drawings, and it is to be understood that the described embodiments are only some embodiments of the present disclosure, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure.

In the description of the present disclosure, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of describing and simplifying the present disclosure, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present disclosure. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present disclosure, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present disclosure can be understood in specific instances by those of ordinary skill in the art.

As shown in fig. 1 to 29, the present disclosure provides an intercooler, as shown in fig. 1 and 2, having a main plate 100, the main plate 100 being used to connect a core 200 of the intercooler with a chamber, and a through passage 110 formed in the main plate 100 for the core 200 to pass through the main plate 100 to extend into the chamber.

The mainboard 100 that present intercooler adopted generally has the fillet, this fillet is located between the room body and the core 200 after the intercooler is assembled, play and alternate the effect of fixed cooling pipe or increase the core 200 bulk strength behind the installation mainboard 100, but this fillet is when playing above-mentioned effect, also restricted mainboard 100, the relative position between the room body and the core 200, therefore, improve the intercooler at present and make its adaptation outside less installation space, generally realize in order to sacrifice heat transfer performance through reducing the core 200 volume, when the heat transfer performance of intercooler needs to be increased, then need be when increasing core 200 volume, make the also corresponding increase of volume of intercooler, and then make the intercooler of volume increase be difficult to install on former installation position.

When the intercooler is assembled, the main board 100 does not have fillets, so that the core 200 can penetrate through the main board 100 through the through channel 110 in the main board 100 and extend into the chamber body, and the space in the chamber body is effectively utilized, so that the installation position of the main board 100 on the core 200 can be properly determined according to the size of an external installation space during assembly, and further, after the core 200, the main board 100 and the chamber body are assembled into the intercooler, the intercooler can adapt to the size of the external installation space, and meanwhile, the size of the core 200 does not need to be changed when the whole size of the intercooler is reduced, so that the heat exchange performance is also ensured; moreover, also because the core 200 can run through the main board 100 and extend into the chamber, when assembling the intercooler, the core 200 with a larger length can be adopted, and the heat exchange performance of the intercooler can be improved under the condition that the volume of the whole intercooler is not changed. In the intercooler provided by the embodiment of the present disclosure, after the relative positions of the main plate 100, the core 200 and the chamber body are determined, the main plate, the core 200 and the chamber body may be connected into a whole by using processes such as brazing.

Optionally, the inner wall 111 of the through channel 110 is a plane for fitting and sealing connection with the outer wall of the core 200. The core body 200 is generally a cuboid or a cube, the through channel 110 is correspondingly provided with four inner walls 111, and the four inner walls 111 are all attached to the core body 200; by making the inner wall 111 of the through-passage 110 a flat surface, the area covered by the main plate 100 on the core 200 can be increased, and further, the connection strength between the main plate 100 and the core 200 and the overall strength of the core 200 itself can be increased, and at the same time, in the process of the core 200 penetrating through the through-passage 110, the inner wall 111 of the through-passage 110 can also play a role of guiding the relative movement between the core 200 and the main plate 100.

The intercooler provided by the embodiment of the disclosure adopts the main board 100 of the intercooler provided by the embodiment of the disclosure, when the intercooler is assembled, the core body 200 can penetrate through the main board 100 and extend into the chamber body, so that the space of the chamber body is effectively utilized, the installation position of the main board 100 on the core body 200 can be properly determined according to the size of the external installation space during the assembly, and then after the core body 200, the main board 100 and the chamber body are assembled into the intercooler, the intercooler can adapt to the size of the external installation space, and meanwhile, the volume of the core body 200 is not required to be changed when the overall volume of the intercooler is reduced, so that the heat exchange performance is also ensured; moreover, also because the core 200 can run through the main board 100 and extend into the chamber, when assembling the intercooler, the core 200 with a larger length can be adopted, and the heat exchange performance of the intercooler can be improved under the condition that the volume of the whole intercooler is not changed.

Optionally, the intercooler provided by the embodiment of the present disclosure includes a core 200 and a chamber body connected by the main plate 100, wherein the core 200 penetrates the main plate 100 through the through channel 110 and extends into the chamber body. The core body 200 penetrates through the through channel 110 and extends into the chamber body, so that the space in the chamber body can be fully utilized, and compared with an intercooler which has the same volume and is provided with the core body 200 and the chamber body in the prior art, the intercooler provided by the embodiment of the disclosure has the core body 200 with the larger volume, and the heat exchange performance is better. Of course, although the core 200 can penetrate the main plate 100, when the intercooler is assembled, the position where the main plate 100 is fitted over the core 200 may be appropriately selected according to the external installation space or other reasons, for example, the core 200 may be fixedly connected to the main plate 100 instead of penetrating the main plate 100.

As shown in fig. 12, optionally, the core 200 penetrates the main plate 100 in a first direction, and a connection hole 250 for connecting with an external pipe is formed on the core 200, and the connection hole 250 is disposed away from both side edges of the core 200 in the first direction. That is, the position of the connection hole 250 in the first direction is located at the middle of the core 200 or near the middle of the core 200, and since the connection hole 250 is to be connected to a pipe for conveying a medium, when the main board 100 is mounted on the core 200, the position of the pipe limits the range of the mounting position of the main board 100 on the core 200, and when the connection hole 250 is located as far as possible from both side edges of the core 200 in the first direction, the mounting position of the main board 100 can have a wide range of options, and further, the positional relationship among the core 200, the main board 100, and the chamber body can be more flexibly selected according to the size of the external mounting space of the intercooler.

As shown in fig. 1 and 3 to 9, optionally, the core 200 penetrates the main plate 100 in a first direction, the core 200 includes a housing 210 having a first shell 211 and a second shell 212, a seam 213 extending in the first direction is formed at a joint of the first shell 211 and the second shell 212, an air blocking portion 214 penetrating the seam 213 is formed on the first shell 211, a groove portion for accommodating the air blocking portion 214 is formed on the second shell 212, and the main plate 100 covers the air blocking portion 214. When the air leakage problem occurs at the seam 213 of the housing 210, the air blocking portion 214 can block the leaked air flow in the first direction due to the air blocking portion 214 penetrating the seam 213, and when the leaked air flow flows into the gap 215 between the air blocking portion 214 and the groove portion, the main plate 100 covers the gap 215 due to the main plate 100 covering the air blocking portion 214, so that the air flow is difficult to leak from the gap 215.

Optionally, the first shell 211, the seam 213 and the second shell 212 are arranged in sequence in a third direction; the air blocking portion 214 extends in the third direction, or the extending direction of the air blocking portion 214 is inclined with respect to the third direction. On the outer shell 210, a seam 213 formed by the mutual butt joint of the first shell 211 and the second shell 212 is a seam 213 with a large length on the outer shell 210, the seam 213 has a relatively large risk of leakage, and the air blocking part 214 is arranged at the seam 213 formed by the mutual butt joint of the first shell 211 and the second shell 212, so that the air blocking effect can be better exerted, and the effect of relieving air leakage is more obvious; optionally, the third direction is perpendicular to the first direction; of course, there may be other seam 213 structures on the housing 210 that may be present.

Optionally, there are at least two air blocking portions 214, and each air blocking portion 214 is distributed in the first direction. When gas leaks from the seam 213, the gas blocking portion 214 can effectively block the leaked gas flow in both the first direction and the direction perpendicular to the first direction, and at least two gas blocking portions 214 have better blocking effect on the gas flow. The number of the air blocking portions 214 may be 2 to 5, for example, 2 or 3; of course, there may be one air blocking portion 214.

Optionally, the air blocking portion 214 is integrally formed with the first housing 211. When the gas blocking part 214 is integrally formed with the first housing 211, a connection trace can be generated at a position where the gas blocking part 214 is connected with the first housing 211, thereby avoiding the possibility that gas may leak from the connection trace; the integrated molding makes the strength of the position where the air blocking part 214 is molded on the first shell 211 higher, and reduces the risk that the air blocking part 214 may be broken at the molding position; in addition, the step of installing the air blocking part 214 is reduced by integral molding, so that the production process is simplified, and the production efficiency is improved. The air blocking portion 214 may be a protrusion structure 222k formed on the first housing 211, and the protrusion structure 222k may be a sheet, a plate, or a block. Of course, the gas blocking portion 214, the first housing 211 and the second housing 212 may be formed separately and then connected, for example, a separately produced gas blocking portion 214 may be welded to the corresponding first housing 211 and second housing 212 at the seam 213, or the gas blocking portion 214 may be fixed to the corresponding first housing 211 and second housing 212 at the seam 213 by means of a screw connection.

Optionally, two side edges of the air blocking portion 214 in the first direction are attached to the inner wall 111 of the groove portion. This makes it difficult for air flow (especially air flow flowing along the length direction of the seam 213) to leak from between the air blocking portion 214 and the groove portion after the first housing 211 and the second housing 212 are spliced, thereby reducing the risk of air leakage in the intercooler; of course, the two side edges of the air blocking portion 214 in the first direction may not be attached to the inner wall 111 of the groove portion, so that a gap 215 is left between the air blocking portion 214 and the inner wall 111 of the groove portion, and the gap 215 is sealed by solder or other sealing structure.

Alternatively, both side edges of the air blocking portion 214 extend straight in the third direction. When a gap 216, which may cause gas leakage, occurs at the seam 213 between the first housing 211 and the second housing 212, indicating that relative movement between the first housing 211 and the second housing 212 is generated in the third direction, since both side edges 214a of the air blocking portion 214 in the first direction are attached to the inner wall 111 of the groove portion and both side edges 214a of the air blocking portion 214 extend linearly in the third direction, when relative movement between the first housing 211 and the second housing 212 is generated in the third direction, both side edges 214a of the air blocking portion 214 in the first direction are always attached to the inner wall 111 of the groove portion, which makes it difficult for gas flow (especially gas flow flowing along the length direction of the seam 213) to leak from between the air blocking portion 214 and the groove portion, and improves the blocking effect of the leaked gas. Of course, the two side edges 214a of the air blocking portion 214 in the first direction may be inclined with respect to each other.

Optionally, an end surface of the air blocking portion 214 away from the first housing 211 in the third direction is an arc-shaped guide surface 214 b. When the air blocking portion 214 is inserted into the groove portion, the assembly efficiency is improved by guiding the arc-shaped guiding surface 214b, and in order to realize the guiding function of the arc-shaped guiding surface 214b, the arc-shaped guiding surface 214b protrudes in a direction away from the first housing 211 in the third direction; of course, the arc-shaped guide surface 214b may be formed of an inclined surface disposed obliquely to the third direction.

Optionally, the core 200 includes a seal on the inside of the outer shell 210, the seal covering the seam 213 and the air dam 214, and the seal being sealingly connected to the outer shell 210 at the seam 213. The sealing member makes it difficult for the air flow to leak at the joint 213, especially at the position where the air blocking portion 214 is engaged with the groove portion, the main board 100 and the sealing member simultaneously seal the gap 215 between the air blocking portion 214 and the groove portion, so that the possibility of the air flow leaking in the direction perpendicular to the joint 213 is reduced, and the air flow is blocked by the protrusion portion and the groove portion when flowing along the joint 213, thereby reducing the possibility of the air leakage.

Optionally, the core 200 has a core piece located inside the outer shell 210, the seal is the core piece, and the core piece has a flange, and the flange is connected with the outer shell 210 in a sealing manner at the seam 213. In the core 200, the chip is an essential component, and the cost caused by additionally providing other components as the sealing member can be avoided by using the chip as the sealing member; specifically, the flanges may be welded to the first and

second housings

211 and 212 and the air blocking portion 214 to achieve sealing; the cuff may be the first cuff 221g or the second cuff 222b provided by the present disclosure.

Optionally, the core 200 has a side plate located inside the outer shell 210, and the seal is the side plate 260. When adopting above-mentioned chip as the sealing member, although can reduce cost, but need guarantee that the turn-ups of chip have certain size in the third direction, in order to guarantee that the turn-ups can cover seam 213 and gas blocking portion 214, this has increased the size of chip in the third direction, after a plurality of chips stack into core 200, also increased the size of core 200 in the third direction to a certain extent, and through making above-mentioned curb plate 260 be the sealing member, then need not turn-ups and cover seam 213 and gas blocking portion 214, the size of turn-ups in the third direction that can be appropriate reduces, and then reduce the size of core 200 in the third direction, be favorable to the miniaturization of intercooler.

Optionally, the core 200 includes a shell 210, and an outer wall of the shell 210 is a plane. Can make core 200 be cuboid or square structure, shell 210 is corresponding to have four outer walls, and the outer wall then can increase shell 210 and mainboard 100 area of contact for the plane, and then increases the joint strength between mainboard 100 and the core 200, and simultaneously, runs through the in-process of through channel 110 at core 200, and the outer wall of shell 210 can also play the effect of leading to the relative motion of core 200 and mainboard 100.

In the intercooler provided by the embodiment of the disclosure, the main board 100 is sleeved on the core body 200 through the through channel 110, the chamber body is connected with the core body 200 through the main board 100, in order to avoid leakage of air flow from between the main board 100 and the core body 200, the main board 100 and the housing 210 of the core body 200 need to be sealed, when the main board 100 covers the air blocking part 214 from the outer side of the housing 210, the first housing 211, the second housing 212 and the air blocking part 214 can be tightly connected into a whole, so that the first housing 211 and the second housing 212 are difficult to move relatively, further, a gap 216 causing air leakage is not easy to appear at a seam 213, and the possibility of air leakage of the intercooler is reduced; when the core 200 provided by the embodiment of the present disclosure adopts the above-mentioned sealing member, that is, the sealing member covers the air blocking portion 214 from the inner side of the outer shell 210, and the main plate 100 covers the air blocking portion 214 from the outer side of the outer shell 210, if the first shell 211 and the second shell 212 generate relative motion and a gap 216 is generated at the seam 213, in a direction perpendicular to the seam 213, the air is blocked by the sealing member, the main plate 100 and the air blocking portion 214, so that the air flow cannot flow in the direction, and the air flow flowing along the seam 213 is blocked by the air blocking portion 214, so that through the structure formed by the main plate 100, the sealing member and the air blocking portion 214, the air in the intercooler is blocked when the gap 216 is generated at the seam 213, so that the air is difficult to leak from the intercooler; when the sealing member is used together and the groove portion is formed on the housing 210, if a gap 216 is formed at the seam 213 and a gap 215 is formed between the air blocking portion 214 and the groove portion, the flow velocity of the air current flowing in the gap 216 and the gap 215 is gradually reduced due to the blocking of the air blocking portion 214 and the groove portion and is finally difficult to leak from the gap 215, particularly when at least two of the air blocking portion 214 and the groove portion are provided, the gaps 215 communicate with each other through the gap 216, a fine passage is formed between the main plate 100 and the sealing member, the air current is required to flow for a long distance in the fine passage to be possibly flowed out from the intercooler, and the air current is blocked by the air blocking portion 214 and the groove portion during the flow of the air current, the flow velocity is gradually reduced and is finally difficult to be flowed out from the intercooler, if both side edges 214a of the air blocking portion in the first direction are simultaneously attached to the inner wall 111 of the groove portion, the possibility of the above-mentioned gap 215 between the air blocking portion 214 and the groove portion is avoided, so that it is more difficult for gas to leak from the joint 213, and the effect of sealing the gas is achieved.

As shown in fig. 17 to 19 and 22 to 29, in one embodiment of the present disclosure, the chip has a first flange 221g and a first plate surface 221j for contacting with a cooled medium, the first flange 221g being formed on the first plate surface 221j and extending in a first direction;

a convex part 221e and a cooled medium flow passage are formed on the first plate surface 221j, the convex part 221e is located between the first flange 221g and the cooled medium flow passage in the second direction, and a blocking part 221f for blocking the cooled medium is formed between the first flange 221g and the convex part 221 e;

the first direction is an extending direction of the coolant flow field, and the second direction is parallel to the first plate surface 221j and perpendicular to the first direction.

The cooling medium and the cooled medium in the embodiments of the present disclosure may be liquid or gas; the convex part 221e can be used for being fixedly connected with the convex part 221e on the adjacent chip and also can be used for being matched with the group of inner positioning parts on the adjacent chip; the projections 221e may be formed at both ends of the chip in the second direction, and a cooling target medium flow path may be formed between two projections 221e arranged in the second direction, and the cooling target medium is generally a high-temperature gas, and thus the cooling target medium flow path is generally a gas flow channel 240.

According to the chip provided by the embodiment of the disclosure, the blocking portion 221f is formed between the first flange 221g and the boss 221e, the cooled medium which deviates from the cooled medium channel and winds between the first flange 221g and the boss 221e is blocked, and therefore the proportion of the cooled medium which deviates from the cooled medium channel and flows is reduced, the cooled medium and the cooling medium can exchange heat more sufficiently, and the heat exchange performance of the intercooler is improved.

Alternatively, one end of the blocking portion 221f is connected to the first flange 221g, and the other end is connected to the protruding portion 221e in the second direction. In this way, most of the cooled medium flowing between the first turned edge 221g and the protruding portion 221e can be blocked by the blocking portion 221f, and the proportion of the cooled medium flowing out of the cooled medium flow passage is further reduced.

Optionally, the blocking portion 221f is formed on the first flange 221 g. This makes the blocking portion 221f and the first flange 221g be an integrally formed structure, thereby avoiding connection marks between the blocking portion 221f and the first flange 221g, further avoiding the influence of the connection marks on the connection strength, and reducing the possibility of fracture between the blocking portion 221f and the first flange 221g under the impact of the cooling medium.

Optionally, the blocking portion 221f is a strip-shaped structure perpendicular to the first plate surface 221j, or the blocking portion 221f is a strip-shaped structure disposed obliquely with respect to the first plate surface 221 j. During processing, the outline of the plate-shaped structure can be cut on the first turned edge 221g, and then the plate-shaped structure is bent between the first turned edge 221g and the protruding portion 221e during stamping, so that the processing difficulty is relatively low.

Optionally, the blocking portion 221f is a groove, a notch of the groove is formed in the first flange 221g, and a groove bottom of the groove extends to the protrusion 221 e. The groove body can be formed by stamping on the first flanging 221g, and the flow of a cooled medium is blocked by the outer wall of the groove body; the groove body can be in multi-point contact with the first flanging 221g at the groove opening, so that the connecting strength between the blocking part 221f and the first flanging 221g is high, the blocking part 221f is not easy to deform under the impact of a cooled medium, the blocking capacity of the blocking part 221f on the cooled medium is improved, and the proportion of the cooled medium deviating from the flow of the cooled medium flow channel is further reduced; and the groove body can be formed by punching, and the manufacturing process is relatively simple.

Optionally, the slot is a V-shaped slot or a U-shaped slot.

Optionally, there are at least two blocking portions 221f, and each of the blocking portions 221f is distributed in the first direction. This can form a multi-stage block to the cooled medium flowing between the protruding portion 221e and the first flange 221g, effectively reducing the proportion of the cooled medium deviating from the cooled medium flow passage, and when a plurality of blocking portions 221f are arranged in the first direction, each protruding portion 221e can correspond to at least one blocking portion 221 f.

Optionally, the chip has a third flange 221h extending in the second direction, the third flange 221h is formed on the first plate surface 221j, and the third flange 221h is located between the first flange 221g and the cooled medium flow passage in the first direction. The third turned-over edge 221h can block the cooled medium to flow between the protruding portion 221e and the first turned-over edge 221g before the cooled medium flows into the core 200, so that the proportion of the cooled medium flowing between the protruding portion 221e and the first turned-over edge 221g is reduced, and the proportion of the cooled medium deviating from the flow path of the cooled medium is correspondingly reduced; the third flange 221h provided in the embodiment of the present disclosure may further overlap the third flange 221h of the first chip and the third flange 221h of the other chip when the core body 200 is mounted, so as to position the assembly between the chips.

Optionally, a projection of the third turned edge 221h in the first direction covers the protruding portion 221e and the blocking portion 221 f. This greatly increases the area of the third bead 221h, further increases the resistance to the cooled medium that is going to flow between the boss 221e and the first bead 221g, and reduces the proportion of the cooled medium that deviates from the cooled medium flow passage.

Optionally, the third flange 221h is connected to the first flange 221g in a sealing manner. This makes it difficult for the cooled medium to flow between the boss 221e and the first bead 221g from between the first bead 221g and the third bead 221h, thereby reducing the proportion of the cooled medium that deviates from the cooled medium flow passage.

Optionally, the intercooler has a chip assembly 220, the chip assembly 220 includes a first chip 221 and a second chip 222 stacked on each other, the first chip 221 is the above chip, and the first chip 221 and the second chip 222 are overlapped by the first flange 221 g.

The chip assembly 220 provided by the embodiment of the disclosure adopts the chip provided by the embodiment of the disclosure, and the blocking portion 221f is formed between the first flange 221g and the boss 221e, so that the cooled medium deviated from the cooled medium channel and wound between the first flange 221g and the boss 221e is blocked, and the proportion of the cooled medium deviated from the cooled medium channel and flowing is reduced, so that the cooled medium and the cooling medium can exchange heat more sufficiently, and the heat exchange performance of the intercooler is improved.

As shown in fig. 25 and 28, optionally, the second chip 222 has a second flange 222b overlapping the first flange 221g, the second flange 222b is located on a side of the first flange 221g facing the protrusion 221e in the second direction, and a through hole 221l through which the blocking portion 221f passes is formed in the second flange 222 b. This not only allows the protruding portion 221e to block the cooling medium, but also positions the relative position between the first chip 221 and the second chip 222 when the chip assembly 220 is assembled, thereby improving the assembly accuracy and efficiency.

Optionally, the second core 222 has a second flange 222b overlapping the first flange 221g, and the second flange 222b is located on a side of the first flange 221g facing away from the protruding portion 221e in the second direction. This makes the protruding portion 221e not only function to block the cooled medium, but also eliminates the need to form the through hole 221l on the second flange 222b for the blocking portion 221f to pass through, thereby simplifying the processing steps of the through hole 221l and improving the production efficiency.

Optionally, the blocking portion 221f is a slot, a notch of the slot is formed in the first flange 221g, a slot bottom of the slot extends to the protrusion 221e, and a support portion 222i extending into the slot is formed on the second flange 222 b. This enables the blocking portion 221f to be strongly supported by the support portion 222i when the blocking portion 221f is impacted by the cooling target medium, so as to reduce the deformation degree of the blocking portion 221f under the impact, and further to better block the cooling target medium flowing between the protruding portion 221e and the first flange 221g, and reduce the proportion of the cooling target medium flowing deviating from the cooling target medium flow passage.

Optionally, the first chip 221 has a third flange 221h extending in the second direction, the third flange 221h is formed on the first plate 221j, and a fourth flange 222a overlapping with the third flange 221h is formed on the second chip 222. The fourth flange 222a is connected with the third flange 221h, so that the bearing capacity of the third flange 221h under the impact of a cooling medium can be increased, and the probability of deformation of the third flange 221h under the impact is reduced; moreover, the fourth flange 222a and the third flange 221h are overlapped, so that the relative positions of the first chip 221 and the second chip 222 can be positioned when the chip assembly 220 is assembled, and the assembly precision and efficiency are improved.

Optionally, the first chip 221 has a second plate surface 221a disposed away from the second chip 222, and the first chip 221 has a first inter-group positioning portion formed on the second plate surface 221 a.

Alternatively, the first inter-block positioning portion is an inter-block positioning protrusion 221b protruding from the second plate surface 221 a. When assembling the core body 200, the inter-group positioning protrusions 221b on the chip components 220 can be positioned in cooperation with the adjacent chip components 220 to improve the assembling efficiency and the assembling accuracy of the core body 200.

Optionally, the second chip 222 has a third plate surface 222c disposed away from the first chip 221, and a second inter-group positioning portion 222d for matching with the inter-group positioning protrusion 221b of the adjacent chip assembly 220 is formed on the third plate surface 222 c. The assembly efficiency and the assembly accuracy of the core body 200 are further improved by the second inter-group positioning portion 222 d. Of course, as shown in fig. 18, the second inter-positioning portion 222d may also be a protrusion structure 222k, and the first inter-positioning portion is a through hole structure, so that the protrusion structure 222k is matched with the through hole structure to perform positioning between two adjacent chip assemblies 220.

Alternatively, the inter-group positioning projections 221b are formed on the projection portion 221 e. This improves the utilization of the positions occupied by the protruding portions 221e, and provides more sufficient space for arranging other structures on the first chip 221.

Alternatively, the inter-group positioning protrusion 221b has a port disposed facing the second chip 222, the port forms an intra-group positioning portion 221i, and an intra-group positioning protrusion 222h that mates with the intra-group positioning portion 221i is formed on the second chip 222. The assembly efficiency of the chip assembly 220 can be improved by the cooperation of the set of inner positioning portions 221i and the set of inner positioning protrusions 222 h. The inter-group positioning projections 221b can be groove bodies with notches located on the projections 221e, and the inter-group positioning portions 221i are formed at the notches, so that the inter-group positioning portions 221i can be formed while the inter-group positioning projections 221b are machined, and production efficiency is improved.

In one embodiment of the present disclosure, the chip has a first flow channel and a second flow channel distributed in a first direction and extending in a second direction;

a heat insulating portion for thermally insulating the first flow path and the second flow path is formed between the first flow path and the second flow path in the first direction, and the first direction is perpendicular to the second direction. The thermal insulation portion is a first thermal insulation hole 221k when the thermal insulation portion is positioned on the first chip, and a second thermal insulation hole 222j when the thermal insulation portion is positioned on the second chip.

Specifically, the first flow channel and the second flow channel may extend linearly or in a zigzag manner; the chip provided by the embodiment of the disclosure is a plate, and the first direction and the second direction are two extending directions which are perpendicular to each other; when the chip is the first chip 221, the first flow path may be the first high-temperature coolant flow path 221c, and the second flow path may be the first low-temperature coolant flow path 221d, and when the chip is the second chip 222, the first flow path may be the second high-temperature coolant flow path 222e, and the second flow path may be the second low-temperature coolant flow path 222f, and it is preferable that the first chip 221 and the second chip 222 are both formed with the heat insulating portions. The low temperature in the low temperature cooling liquid flow passage is relative to the high temperature in the high temperature cooling flow passage, and similarly, the high temperature in the high temperature cooling flow passage is relative to the low temperature in the low temperature cooling flow passage.

According to the chip provided by the disclosure, the heat insulation part is arranged between the first flow channel and the second flow channel, so that the first flow channel and the second flow channel can be effectively thermally isolated, the degree of heat exchange among cooling liquids in different flow channels is further reduced, and the problem that the cooling liquids in the cooling liquid flow channels in the multi-stage intercooler are easy to generate strong heat exchange is solved; moreover, the existing engine front-end heat dissipation module generally comprises a low-temperature radiator, a high-temperature radiator and a condenser, and because the low-temperature radiator has a large volume, the low-temperature radiator, the high-temperature radiator and the condenser have to be arranged in a laminated manner in the flowing direction of ambient air to perform heat dissipation in order to adapt to an installation space, so that the wind resistance of the front-end module is increased, and the heat exchange capacity of the front-end module is influenced; after the multistage intercooler adopts the chip provided by the embodiment of the disclosure, because the heat exchange degree between cooling liquids in different flow channels is reduced, the heat load of the low-temperature radiator is reduced, and further the volume of the low-temperature radiator is effectively reduced, after the low-temperature radiator and the condenser can be arranged in parallel in a certain installation space, the low-temperature radiator and the high-temperature radiator are arranged in a stacked manner in the flowing direction of ambient air, the original three-layer arrangement structure of the front-end module is changed into a two-layer arrangement structure, the wind resistance is effectively reduced, and the heat exchange capacity of the front-end module is improved. The multi-stage intercooler described in the embodiments of the present disclosure includes a two-stage intercooler, a three-stage intercooler, and even more multi-stage intercoolers.

Optionally, the thermal insulation portion is a through hole. The first flow channel is separated from the second flow channel through the through hole, so that heat exchange between the first flow channel and the second flow channel through the material of the chip is reduced as much as possible, and the degree of heat exchange is further reduced. Of course, the heat insulation part can be made of a material with poor heat conduction performance besides the through hole, and particularly, compared with a material used for manufacturing the chip, the heat conduction performance of the heat insulation part is poorer, and the heat exchange degree among cooling liquids in different flow channels can be reduced.

Optionally, the thermal insulation portion is a bar-shaped hole extending in the second direction. This can reduce the size of the heat insulating portion in the first direction as much as possible, and on the premise that the heat insulating portion has a good heat insulating effect, the increase in the width of the chip due to the heat insulating portion is reduced, so that the chip and the core 200 formed by the chip can maintain a small body size. Of course, the insulation may also be square, circular or other shapes.

Optionally, there are at least two of the thermal insulation portions, each of the thermal insulation portions being distributed in the second direction. Thus, partial chip materials can be reserved between two adjacent heat insulation parts, the chips can still keep better integrity and strength after the heat insulation parts are additionally arranged, and the problem that the chips are easy to break in the heat insulation parts and the strength of the chips is reduced due to the fact that the heat insulation parts are additionally arranged is avoided as much as possible.

Optionally, a first liquid inlet and a first liquid outlet are formed at one end of the chip in the second direction, and the first flow channel is a U-shaped flow channel to communicate the first liquid inlet and the first liquid outlet. The first flow channel is a U-shaped flow channel, so that the space on the chip can be fully utilized, the length of the first flow channel is increased, the flowing time of the cooling liquid is further increased, the cooling liquid fully absorbs heat, and the heat exchange efficiency is improved.

Optionally, a second liquid inlet and a second liquid outlet are formed at the other end of the chip in the second direction, and the second flow channel is a U-shaped flow channel to communicate the second liquid inlet and the second liquid outlet. On the basis of enabling the first runner to be the U-shaped runner, make the second runner also be the U-shaped runner, space on can the more make full use of chip increases the length of second runner, and then increases the time that the coolant liquid flows in the second runner, makes the coolant liquid fully absorb the heat, further improves heat exchange efficiency.

Optionally, an end of the first flow channel away from the first liquid inlet in the second direction is a first end 221ca, and a position of the first end 221ca corresponds to a position of the second liquid inlet and/or the second liquid outlet. The length of the first flow channel is further prolonged, the flowing time of the cooling liquid in the first flow channel is prolonged, the cooling liquid absorbs more heat, and the heat exchange efficiency is further improved; and the first flow channel extends to the position corresponding to the second liquid inlet and/or the second liquid outlet in the second direction, so that the chip is covered by the flow channel as much as possible and exchanges heat with the cooling liquid, and the possibility of the chip having a high material thermal stress due to a high local temperature is reduced.

Optionally, an end of the second flow channel away from the second liquid inlet in the second direction is a second end 221da, and a position of the second end 221da corresponds to a position of the first liquid inlet and/or the first liquid outlet. The length of the second flow channel is prolonged, the flowing time of the cooling liquid in the second flow channel is prolonged, and the heat exchange efficiency is further improved; meanwhile, the chip can be further covered by the flow channel as much as possible, and the possibility that the chip has a problem of large thermal stress of the material due to high local temperature is further reduced.

Optionally, at the junction of the first flow channel and the first liquid inlet, the dimension of the first flow channel in the first direction is equal to the dimension of the first liquid inlet in the first direction;

and/or the size of the second flow channel in the first direction is equal to the size of the second liquid inlet in the first direction at the joint of the second flow channel and the second liquid inlet.

If the size of the first flow channel in the first direction is smaller than that of the first liquid inlet at the joint of the first flow channel and the first liquid inlet, when cooling liquid flows into the first flow channel from the first liquid inlet, the flow field is unevenly distributed, so that a vortex is generated in the first flow channel, and an unstable pressure difference is generated inside and outside the vortex, so that pressure pulses are continuously generated when the vortex acts on a chip, and the chip is possibly eroded and failed; and at the joint of the first flow channel and the first liquid inlet, the size of the first flow channel in the first direction is equal to the size of the first liquid inlet in the first direction, so that the possibility of uneven flow field distribution when cooling liquid flows into the first flow channel from the first liquid inlet can be reduced as much as possible, and the risk of erosion failure of the chip is further reduced. The size of the second liquid inlet in the first direction at the joint of the second liquid inlet and the second flow channel is equal to the size of the second liquid inlet in the first direction, so that the risk of chip erosion failure can be reduced. Of course, it is also possible that at the junction of the first channel and the first liquid inlet, the dimension of the first channel in the first direction is larger or smaller than the dimension of the first liquid inlet in the first direction, and/or that at the junction of the second channel and the second liquid inlet, the dimension of the second channel in the first direction is larger or smaller than the dimension of the second liquid inlet in the first direction.

Optionally, the size of the first flow channel is the same as the size of the second flow channel in the first direction. In the multi-stage intercooler, the low-temperature radiator is sensitive to the heat load, the heat load of the low-temperature radiator is increased by increasing the width of a low-temperature cooling liquid flow passage, therefore, a large-volume low-temperature radiator is needed, if the volume of the low-temperature radiator exceeds a certain limit, the front-end module is difficult to arrange, meanwhile, the high-temperature radiator is sensitive to the resistance of the cooling liquid, and the width of the high-temperature cooling liquid flow channel needs to be increased as much as possible to reduce the resistance of the high-temperature cooling liquid flow channel to the cooling liquid, but theoretically, the high-temperature cooling liquid flow channel cannot be widened infinitely, the size of the first flow channel in the first direction is made the same as the size of the second flow channel in the disclosed embodiment, the size of the first flow passage and the second flow passage meets certain heat exchange requirements, and meanwhile, the heat load of the low-temperature radiator and the resistance of the high-temperature cooling liquid in the flow passage to the cooling liquid are limited to a lower level. One of the first flow passage and the second flow passage is a high-temperature cooling liquid flow passage, and the other one is a low-temperature cooling liquid flow passage.

Alternatively, the core 200 includes a chip unit including at least two of the chip assemblies 220 stacked in a third direction in which one end of the chip unit is mounted with the first cover plate 230 and the other end is mounted with the second cover plate to cover and seal the thermal insulation portion, a first cover plate 230, and a second cover plate. In the core 200, a gas flow channel 240 is formed between two adjacent chip assemblies 220, that is, a gas flow channel 240 and a cooling liquid flow channel are respectively formed on two sides of the same chip in the third direction, so as to realize heat exchange between gas and cooling liquid in the core 200, when a heat insulation part is formed on the chip, especially when the heat insulation part is a through hole, the gas flow channels 240 in the core 200 can be communicated through the heat insulation part, and the heat insulation part is covered by the sealing member, so that a sealing effect can be achieved, and the risk that gas flows out of the core 200 from the heat insulation part is reduced. The sealing member may preferably be a plate member, and may also be a bar or block.

The present disclosure provides a method of manufacturing an intercooler, the intercooler including a core 200 and a main plate 100, a through passage 110 being formed in the main plate 100, the through passage 110 penetrating the main plate 100, the method including:

the main plate 100 is fitted over the core 200 through the through-passage 110, and the core 200 penetrates the main plate 100 through the through-passage 110.

According to the manufacturing method of the intercooler provided by the disclosure, the core body 200 penetrates through the main board 100 through the penetrating channel when the intercooler is manufactured, the core body 200 can penetrate through the main board 100 and extend into the chamber body, the space of the chamber body is effectively utilized, the mounting position of the main board 100 on the core body 200 can be determined properly according to the size of the external mounting space during assembly, and then the intercooler can adapt to the size of the external mounting space after the core body 200, the main board 100 and the chamber body are assembled into the intercooler; moreover, because the core 200 penetrates the main plate 100 and extends into the chamber, and the space in the chamber is utilized, when the intercooler is assembled, the core 200 with a larger length can be adopted, and the heat exchange performance of the intercooler is improved under the condition that the volume of the whole intercooler is not changed.

Optionally, the core 200 has a casing 210 and a plurality of chip components 220 mounted on the inner side of the casing 210, the casing 210 including a first shell 211 and a second shell 212;

before the main plate 100 is sleeved on the core 200 through the through channel 110, and the core 200 is made to penetrate the main plate 100 through the through channel 110, the method includes:

stacking each of the chip components 220 within the first housing 211;

the first housing 211 is mated with the second housing 212 to form the enclosure 210.

This enables the chip components 220 and the housing 210 to be first formed as one body through which the main board 100 is assembled, facilitating assembly. Here, the plurality of chip components 220 may be at least two chip components 220, such as two chip components 220, three chip components 220, four chip components 220, and so on. The first housing 211 and the second housing 212 provided by the embodiment of the present disclosure are U-shaped housings, and the first housing 211 and the second housing 212 are butted to form a housing 210 having a rectangular cylinder or a square cylinder structure.

Optionally, the first housing 211 has a first edge, the second housing 212 has a second edge, the first housing 211 and the second housing 212 are butted by the first edge and the second edge, an air blocking portion 214 is formed on one of the first edge and the second edge, and a groove portion is formed on the other;

the docking the first housing 211 with the second housing 212 to form the outer shell 210 includes:

the air blocking portion 214 and the groove portion are positioned and matched, so that the first shell 211 and the second shell 212 are butted to form the outer shell 210.

When the first shell 211 is butted with the second shell 212, the air blocking part 214 is matched with the groove part for positioning, so that the assembly precision and the assembly efficiency of the intercooler are improved; moreover, because the joint seam 213 is formed between the first edge and the second edge after the first edge and the second edge are butted, and the air blocking portion 214 penetrates through the joint seam 213 to be matched with the groove portion, when air leakage occurs at the joint seam 213, the air blocking portion 214 and the groove portion can block air flow in the extending direction of the joint seam 213, and further the degree of air leakage is relieved.

Optionally, the intercooler includes a sealing member located inside the outer shell 210, and the first shell 211 and the second shell 212 are butted to form a seam 213 between the first edge and the second edge;

after the docking the first housing 211 with the second housing 212 to form the outer shell 210, the method further includes:

the housing 210 is sealingly connected to the seal at the seam 213.

This reduces the possibility of air leakage at the joint 213 after the intercooler is assembled.

Optionally, the sealing member is one of the chip assemblies 220.

This reduces the possibility of air leakage at seam 213 after the intercooler is assembled, and since chip assembly 220 is an indispensable component in core body 200, sealing seam 213 by hermetically connecting case 210 and chip assembly 220 at seam 213 is less costly than sealing seam 213 by exclusively providing other components.

Optionally, the seal is a side plate 260;

before the stacking of each of the chip assemblies 220 in the first housing 211, further comprising:

mounting a side plate 260 within the first housing 211;

the housing 210 is sealingly connected to the side plate 260 at the seam 213.

When adopting chip subassembly 220 to do sealed seam 213, although can reduce cost, but need guarantee that the turn-ups of chip have certain width to guarantee that the turn-ups can cover seam 213, this has increased the size of chip, and after a plurality of chips stacked into core 200, also increased the size of core 200 to a certain extent, and through adopting curb plate 260, sealed seam 213, the size of turn-ups can be suitable reduced, and then reduce the size of core 200, be favorable to the miniaturization of intercooler.

Optionally, after the main plate 100 is sleeved on the core 200 through the through channel 110, and the core 200 is made to penetrate through the main plate 100 through the through channel 110, the method further includes:

the main plate 100 is covered on the air blocking portion 214 and the groove portion.

When the main board 100 covers the air blocking portion 214 from the outer side of the housing 210, the first housing 211, the second housing 212, the air blocking portion 214 and the groove portion can be tightly connected into a whole, so that the first housing 211 and the second housing 212 are difficult to move relatively, a gap 216 causing gas leakage is difficult to occur at the joint 213, and the possibility of gas leakage of the intercooler is reduced; when the core 200 provided by the embodiment of the present disclosure uses the chip assembly 220 or the side plate 260 to seal the seam 213, that is, the sealing member covers the air blocking portion 214 from the inner side of the housing 210, and the main board 100 covers the air blocking portion 214 from the outer side of the housing 210, if the first housing 211 and the second housing 212 move relatively and the seam 213 generates the gap 216, the air is blocked by the sealing member, the main board 100 and the air blocking portion 214 in a direction perpendicular to the seam 213, so that the air cannot flow in the direction, and the air flowing along the seam 213 is blocked by the air blocking portion 214 and the groove portion, so that the air in the intercooler is blocked when the gap 216 occurs at the seam 213, so that the air is difficult to leak from the intercooler; when the sealing member is used together and the groove portion is formed on the housing 210, if the gap 216 is formed at the seam 213 and the gap 215 is formed between the air blocking portion 214 and the groove portion, the flow speed of the air current flowing in the gap 216 and the gap 215 is gradually reduced due to the blocking of the air blocking portion 214 and the groove portion, and is finally difficult to leak from the gap 215, particularly when at least two of the air blocking portion 214 and the groove portion are provided, the gaps 215 are communicated through the gap 216, a fine passage is formed between the main plate 100 and the sealing member, the air current is required to flow for a long distance in the fine passage to be possibly flowed out from the intercooler, and the flow speed is gradually reduced due to the blocking of the air blocking portion 214 and the groove portion during the flow of the air current, and is finally difficult to be flowed out from the intercooler.

Optionally, the chip assembly 220 includes a first chip 221 and a second chip 222, the first chip 221 has a first board 221j and a first flange 221g formed on the first board 221j, and the second chip 222 has a fourth board 222g and a second flange 222b formed on the fourth board 222 g;

the first plate surface 221j and the fourth plate surface 222g are arranged to face each other, and the first flange 221g is overlapped with the second flange 222b, so that the extending direction of the first flange 221g and the extending direction of the second flange 222b are the flow direction of the cooling target medium flowing through the first chip 221.

The first flange 221g and the second flange 222b are overlapped, so that the first chip 221 and the second chip 222 can be connected, the relative position between the first chip 221 and the second chip 222 can be positioned in the process of connecting the first chip 221 and the second chip 222, and the assembly precision and the assembly efficiency are improved.

Optionally, a seam 213 is formed after the first housing 211 is abutted with the second housing 212;

the outer shell 210 is sealingly connected to the first flange 221g or the second flange 222b at the seam 213.

By sealing seam 213 with either first cuff 221g or second cuff 222b, the construction of chip assembly 220 itself is utilized at a lower cost relative to sealing seam 213 with other components in addition.

Optionally, a protruding portion 221e is formed on the first board surface 221j, an intra-group positioning portion 221i is formed at the protruding portion 221e, the second chip 222 has a fourth board surface 222g, and an intra-group positioning protrusion 222h is formed on the fourth board surface 222 g;

the first plate surface 221j and the fourth plate surface 222g are arranged oppositely, and the positioning protrusions 222h in group are matched with the positioning portions 221i in group for positioning.

When the chip assembly 220 is assembled, the intra-group positioning portion 221i and the intra-group positioning protrusion 222h are positioned in a matched manner, so that the assembly accuracy and the assembly efficiency are improved.

Optionally, before the oppositely disposing the first panel 221j and the fourth panel 222g and overlapping the first flange 221g and the second flange 222b, the method further includes:

a blocking portion 221f is formed on the first turned edge 221g such that the blocking portion 221f protrudes toward the middle of the first plate surface 221j in a direction perpendicular to the first turned edge 221 g.

The intercooler after the completion of the assembly is when using, because the chip both sides are mostly cooling medium import and export, by the middle part of cooling medium and the main concentration of cooling medium at the chip, but when being flowed through core 200 by cooling medium, often some by the cooling medium stream from the cooling medium import and export with first turn-ups 221g between the position flow, lead to this part by the unable heat transfer of cooling medium, the heat transfer performance of intercooler has been reduced, and above-mentioned block portion 221f of shaping on first turn-ups 221g, make the block portion 221f after the shaping can block to being formed by cooling medium to a certain extent, reduce the volume of flowing into the cooling medium between cooling medium import and export and first turn-ups 221g by cooling medium, and then improve the heat transfer performance of intercooler.

Optionally, the first chip 221 has a third flange 221h formed on the first plate 221j and extending perpendicularly to the first flange 221g, and the second chip 222 has a fourth flange 222a formed on the fourth plate 222g and extending perpendicularly to the second flange 222 b;

the third flange 221h is overlapped with the fourth flange 222 a.

Through the overlapping between the third flange 221h and the fourth flange 222a, the first chip 221 and the second chip 222 can be connected conveniently, and the first chip 221 and the second chip 222 can be positioned during assembly, so that the assembly efficiency and the assembly precision are improved; and the third flange 221h and the fourth flange 222a can also form a certain barrier to the cooled medium which is about to flow into the first flange 221g and the cooling medium inlet and outlet, so that the heat exchange performance of the intercooler is improved.

Optionally, the chip assembly 220 includes a first chip 221 and a second chip 222 stacked, the first chip 221 has a second plate surface 221a disposed away from the second chip 222, the second chip 222 has a third plate surface 222c disposed away from the first chip 221, a first inter-group positioning portion is formed on the second plate surface 221a, and a second inter-group positioning portion 222d is formed on the third plate surface 222 c;

the stacking of each of the chip components 220 in the first housing 211 includes:

the two adjacent chip assemblies 220 are positioned by the first inter-positioning portion on one of the chip assemblies 220 being matched with the second inter-positioning portion 222d on the other chip assembly 220, so as to stack each chip assembly 220 in the first housing 211.

The stacking between the chip assemblies 220 is positioned by the cooperation of the first inter-group positioning portions and the second inter-group positioning portions 222d, thereby improving the efficiency and accuracy of assembly.

Alternatively, the first inter-group positioning portion is an inter-group positioning projection 221 b. Of course, as shown in fig. 23, the second inter-positioning portion 222d may also be a protrusion structure 222k, and the first inter-positioning portion is a through hole structure, so that the protrusion structure 222k is matched with the through hole structure to perform positioning between two adjacent chip assemblies 220.

Optionally, the chip assembly 220 includes a first chip 221 and a second chip 222, which are stacked, the first chip 221 has a second plate surface 221a disposed away from the second chip 222, the second chip 222 has a third plate surface 222c disposed away from the first chip 221, a first high-temperature coolant flow channel 221c and a first low-temperature coolant flow channel 221d recessed into the second plate surface 221a are formed on the second plate surface 221a, and a second high-temperature coolant flow channel 222e and a second low-temperature coolant flow channel 222f recessed into the third plate surface 222c are formed on the third plate surface 222 c;

the first high temperature coolant flow path 221c of one of the chip assemblies 220 is overlapped with the second high temperature coolant flow path 222e of the other chip assembly 220 between the adjacent two chip assemblies 220, and the first low temperature coolant flow path 221d of one of the chip assemblies 220 is overlapped with the second low temperature coolant flow path 222f of the other chip assembly 220.

This enables the first high-temperature coolant flow passage 221c and the second high-temperature coolant flow passage 222e to form a closed high-temperature coolant flow passage, and a closed low-temperature coolant flow passage is formed between the first low-temperature coolant flow passage 221d and the second low-temperature coolant flow passage 222 f. The low temperature in the low temperature cooling liquid flow passage is relative to the high temperature in the high temperature cooling flow passage, and similarly, the high temperature in the high temperature cooling flow passage is relative to the low temperature in the low temperature cooling flow passage.

Optionally, the first high-temperature coolant flow passage 221c, the first low-temperature coolant flow passage 221d, the second high-temperature coolant flow passage 222e and the second low-temperature coolant flow passage 222f have the same width.

In the multi-stage intercooler, the low temperature radiator is sensitive to the heat load, increasing the width of the low temperature coolant flow channel increases the heat load of the low temperature radiator, so that a large-volume low temperature radiator is needed, if the volume of the low temperature radiator exceeds a certain limit, the front end module is difficult to arrange, and at the same time, the high temperature radiator is sensitive to the resistance of the coolant, and the width of the high temperature coolant flow channel needs to be increased as much as possible to reduce the resistance of the high temperature coolant flow channel to the coolant, but theoretically, the high temperature coolant flow channel cannot be widened infinitely, in the embodiment of the disclosure, the width dimensions of the first high temperature coolant flow channel 221c, the first low temperature coolant flow channel 221d, the second high temperature coolant flow channel 222e and the second low temperature coolant flow channel 222f are the same, so that while the dimensions of the high temperature coolant flow channel and the low temperature coolant flow channel meet a certain heat, the heat load of the low-temperature radiator and the resistance to the cooling liquid in the high-temperature cooling liquid flow passage are limited to a low level.

Optionally, a first heat insulation hole is formed between the first high-temperature coolant channel 221c and the first low-temperature coolant channel 221d on the first chip 221, and a second heat insulation hole 222j is formed between the second high-temperature coolant channel 222e and the second low-temperature coolant channel 222f on the second chip 222;

the stacking of each of the chip assemblies 220 in the first housing 211 further comprises:

the first thermal insulation hole of one of the chip assemblies 220 is overlapped with the second thermal insulation hole 222j of the other chip assembly 220 between two adjacent chip assemblies 220.

This makes first thermal-insulated hole and second thermal-insulated hole 222j all uncovered, has avoided on one chip subassembly 220 between high temperature coolant runner and the low temperature coolant runner though through thermal-insulated hole thermal insulation, but through the problem that another chip subassembly 220 connection leads to thermal-insulated effect to descend, and then makes the thermal-insulated hole to the certain assurance of the effect of low temperature coolant runner and high temperature coolant runner thermal insulation.

Optionally, the core 200 includes a first cover plate 230 and a second cover plate;

mounting the first cover plate 230 within the first housing;

after the stacking of the chip components 220 in the first housing 211, the method further comprises:

after stacking each of the chip components 220 on the first cover plate 230, the second cover plate is stacked on the chip components 220 such that each of the chip components 220 is located between the first cover plate 230 and the second cover plate.

This realizes that when each chip module 220 is mounted between the first cover plate 230 and the second cover plate and each chip module 220 is mounted between the first cover plate 230 and the second cover plate, the first heat insulating hole and the second heat insulating hole 222j can be covered by the first cover plate 230 and the second cover plate, and the possibility of air leakage through the first heat insulating hole and the second heat insulating hole 222j can be reduced.

Optionally, the intercooler includes:

a first liquid inlet connecting pipe 400, a second liquid inlet connecting pipe 600, a first liquid outlet connecting pipe, a second liquid outlet connecting pipe 500, a first water chamber 300 and a second water chamber, wherein a first liquid inlet pipe mounting hole and a first liquid outlet pipe mounting hole are formed on the first shell 211, a second liquid inlet pipe mounting hole and a second liquid outlet pipe mounting hole are formed on the second shell 212, and the first liquid inlet mounting hole and the second liquid inlet mounting hole are both arranged on a plane of the shell 210 parallel to the first cover plate 230;

the manufacturing method of the intercooler, before the stacking each of the chip assemblies 220 in the first housing 211, further includes:

connecting a first liquid inlet connecting pipe 400 with a first water chamber 300, installing the first water chamber 300 at the first liquid inlet pipe installation hole, and forming an L-shaped cavity in the first water chamber 300, so that the extending direction of the first liquid inlet connecting pipe 400 is parallel to the first cover plate 230;

connecting a second liquid inlet connecting pipe 600 with a second water chamber, installing the second water chamber at the second liquid inlet pipe installation hole, and forming an L-shaped cavity in the second water chamber, so that the extending direction of the second liquid inlet connecting pipe 600 is parallel to the first cover plate 230;

and connecting the first liquid outlet connecting pipe with the first liquid outlet pipe mounting hole, and connecting the second liquid outlet pipe with the second liquid outlet pipe mounting hole.

In order to further explain the scheme of the manufacturing method of the intercooler in detail, the disclosure also provides a specific application example of the manufacturing method of the intercooler, which specifically comprises the following steps:

assembly of casing

In the assembling process of the shell, the liquid inlet pipe and the corresponding water chamber need to be assembled, and the liquid outlet connecting pipe and the corresponding liquid outlet pipe mounting hole are connected, and the assembling method specifically includes the following three steps from S11 to S13:

s11: the first liquid inlet connection pipe 400 is connected to the first water chamber 300, the first water chamber 300 is installed at the first liquid inlet pipe installation hole, and an L-shaped cavity is formed in the first water chamber 300, so that the extending direction of the first liquid inlet connection pipe 400 is parallel to the first cover plate 230.

S12: the second liquid inlet connection pipe 600 is connected to the second water chamber, the second water chamber is installed at the second liquid inlet pipe installation hole, and an L-shaped cavity is formed in the second water chamber, so that the extending direction of the second liquid inlet connection pipe 600 is parallel to the first cover plate 230.

S13: and connecting the first liquid outlet connecting pipe with the first liquid outlet pipe mounting hole, and connecting the second liquid outlet pipe with the second liquid outlet pipe mounting hole.

It should be understood that the execution sequence of S11 to S13 is only an example, and the execution sequence between the three steps is arbitrary and may be executed at the same time, which is not limited by the present disclosure.

Based on the above description, after S13, the housing assembling process may further include S14, the content of S14 may be saved, and whether to perform S14 may depend on whether to perform S342 subsequently, and the content of S14 may be:

s14: a side plate 260 is installed in the first housing 211.

Chip assembly 220 assembly

In order to ensure the smooth assembly of the core 200, the assembly of the chip assembly 220 needs to be performed in advance after the housing is assembled, and the assembly process of the chip assembly 220 can be divided into the following five steps S21 to S25:

s21: a blocking portion 221f is formed on the first turned edge 221g such that the blocking portion 221f protrudes toward the middle of the first plate surface 221j in a direction perpendicular to the first turned edge 221 g.

S22: the first plate surface 221j and the fourth plate surface 222g are arranged oppositely, and the positioning protrusions 222h in the group are matched with the positioning portions 221i in the group for positioning;

s23, overlapping the first flange 221g and the second flange 222b, so that the extending direction of the first flange 221g and the extending direction of the second flange 222b are the flow direction of the cooled medium flowing through the first chip 221.

S24: the third flange 221h is overlapped with the fourth flange 222 a.

S25: the first cover plate 230 is installed in the first housing 211.

Core body 200 Assembly

The process of assembling the core 200 may be divided into the following four steps S31 to S34:

s31: each of the chip components 220 is stacked in the first case 211.

Based on the above description, S31 can be specifically realized by the following three subdivision steps S311 to S313:

s311: the two adjacent chip assemblies 220 are positioned by the inter-group positioning protrusion 221b on one of the chip assemblies 220 being matched with the second inter-group positioning portion 222d on the other chip assembly 220, so that each chip assembly 220 is stacked in the first housing 211.

S312: the first high temperature coolant flow path 221c of one of the chip assemblies 220 is overlapped with the second high temperature coolant flow path 222e of the other chip assembly 220 between the adjacent two chip assemblies 220, and the first low temperature coolant flow path 221d of one of the chip assemblies 220 is overlapped with the second low temperature coolant flow path 222f of the other chip assembly 220.

S313: the first thermal insulation hole of one of the chip assemblies 220 is overlapped with the second thermal insulation hole 222j of the other chip assembly 220 between two adjacent chip assemblies 220.

S32: after stacking each of the chip components 220 on the first cover plate 230, the second cover plate is stacked on the chip components 220 such that each of the chip components 220 is located between the first cover plate 230 and the second cover plate.

S33: the first housing 211 is mated with the second housing 212 to form the enclosure 210.

Specifically, the specific implementation manner of step 33 may be: the air blocking portion 214 and the groove portion are positioned and matched, so that the first shell 211 and the second shell 212 are butted to form the outer shell 210.

S34: the housing 210 is sealingly connected to the seal at the seam 213.

In S34, if the sealing member is located inside the casing 210, and the sealing member is one of the chip assemblies 220, the specific implementation procedure of S34 is as follows: s341: the outer shell 210 is sealingly connected to the first flange 221g or the second flange 222b at the seam 213.

And if the sealing member is the side plate 260, the specific implementation process of S34 is as follows: s342: the housing 210 is sealingly connected to the side plate 260 at the seam 213. Namely: if the sealing member is the side plate 260, S14 needs to be executed in the process of assembling the housing to ensure that the sealing connection between the housing 210 and the side plate 260 can be smoothly achieved.

(IV) motherboard 100 and Chamber mounting

After the core 200 is assembled, the main board 100 is required to be sleeved on the core 200, and the chamber body is required to be connected to the main board 100, so as to finally manufacture the intercooler, and the process of installing the main board 100 and the chamber body can be specifically realized by the following steps:

s41: the main plate 100 is fitted over the core 200 through the through-passage 110, and the core 200 penetrates the main plate 100 through the through-passage 110.

S42: the main plate 100 is covered on the air blocking portion 214 and the groove portion.

S43: the chamber body is mounted on the main board 100.

Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present disclosure, and not for limiting the same; while the present disclosure has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present disclosure.

Furthermore, those skilled in the art will appreciate that while some of the embodiments described above include some features included in other embodiments, rather than others, combinations of features of different embodiments are meant to be within the scope of the disclosure and form different embodiments. For example, in the claims above, any of the claimed embodiments may be used in any combination. Additionally, the information disclosed in this background section is only for enhancement of understanding of the general background of the disclosure and should not be taken as an acknowledgement or any form of suggestion that this information constitutes prior art that is already known to a person skilled in the art.

Claims

1. The main board of intercooler, the main board is used for connecting the core and the room body of intercooler, its characterized in that be formed with on the main board and supply the core runs through the main board is in order to stretch into the through passage in the room body.

2. A main plate of an intercooler as set forth in claim 1, wherein an inner wall of the through-passage is a flat surface for fitting and sealing connection with an outer wall of the core.

3. An intercooler, comprising the main plate according to claim 1 or 2.

4. An intercooler according to claim 3, comprising a core and a chamber connected by the main plate, the core extending through the main plate and into the chamber through the through passage.

5. The intercooler as claimed in claim 4, wherein the core penetrates the main plate in a first direction, and connection holes for connection with an external pipe are formed in the core, the connection holes being provided away from both side edges of the core in the first direction.

6. The intercooler of claim 4, wherein the core penetrates the main plate in a first direction, the core includes a housing having a first case and a second case, a joint extending in the first direction is formed at a joint where the first case and the second case are joined, an air blocking portion penetrating the joint is formed on the first case, a groove portion for accommodating the air blocking portion is formed on the second case, and the main plate covers the air blocking portion.

7. The intercooler of claim 6, wherein the core includes a seal on an inner side of the housing, the seal covering the seam and the air dam, and the seal being sealingly connected to the housing at the seam.

8. The intercooler of claim 7, wherein the core has a core piece located inside the housing, the seal is the core piece, and the core piece has a flange that is sealingly connected to the housing at the seam.

9. An intercooler as claimed in claim 7, wherein the core has a side plate located inside the housing, and the seal is the side plate.

10. An intercooler according to any one of claims 4-9, wherein the core comprises a shell, the outer wall of which is planar.

11. A method of manufacturing an intercooler, the intercooler including a core and a main plate, wherein a through-passage is formed in the main plate, the through-passage penetrating the main plate, the method comprising:

12. The manufacturing method for the intercooler as claimed in claim 11, wherein the core has a case and a plurality of chip assemblies mounted on an inner side of the case, the case including a first case and a second case;

stacking each of the chip assemblies within the first housing;

docking the first housing with the second housing to form the enclosure.

13. The manufacturing method of an intercooler as recited in claim 12, wherein the first housing has a first edge, the second housing has a second edge, the first housing and the second housing are butted by the first edge and the second edge, a gas blocking portion is formed on one of the first edge and the second edge, and a groove portion is formed on the other one;

14. The intercooler manufacturing method according to claim 13, wherein the intercooler includes a seal member on an inner side of the housing, and the first case and the second case are butted to form a seam between the first edge and the second edge;

sealingly connecting the housing to the seal at the seam.

15. The intercooler manufacturing method according to claim 14, wherein the sealing member is one of the chip assemblies.

16. The method of manufacturing an intercooler as recited in claim 14, wherein the seal is a side plate;

mounting a side plate within the first housing;

sealingly connecting the housing to the side panel at the seam.

17. The intercooler manufacturing method according to claim 13,

after the main plate is sleeved on the core through the through channel and the core penetrates the main plate through the through channel, the method further comprises the following steps:

covering the main board on the air blocking part and the groove part.

18. The intercooler manufacturing method according to claim 12, wherein the chip assembly includes a first chip having a first plate surface and a first flange formed on the first plate surface, and a second chip having a fourth plate surface and a second flange formed on the fourth plate surface;

19. The intercooler manufacturing method according to claim 18, wherein the first housing and the second housing are butted to form a seam;

20. The intercooler manufacturing method according to claim 18, wherein a boss portion is formed on the first plate surface, an intra-group positioning portion is formed at the boss portion, the second chip has a fourth plate surface, and an intra-group positioning protrusion is formed on the fourth plate surface;

21. The method for manufacturing an intercooler of claim 18, wherein before the disposing the first plate surface and the fourth plate surface opposite to each other to overlap the first flange and the second flange, the method further comprises:

22. The intercooler manufacturing method according to claim 18, wherein the first core piece has a third flange formed on the first plate surface and extending perpendicularly to the first flange, and the second core piece has a fourth flange formed on the fourth plate surface and extending perpendicularly to the second flange;

and overlapping the third flanging with the fourth flanging.

23. The intercooler manufacturing method according to claim 12, wherein the chip assembly includes a first chip and a second chip that are stacked, the first chip having a second plate surface that is disposed away from the second chip, the second chip having a third plate surface that is disposed away from the first chip, the second plate surface having a first inter-group positioning portion formed thereon, the third plate surface having a second inter-group positioning portion formed thereon;

24. The manufacturing method for an intercooler as claimed in claim 23, wherein the first inter-group positioning portion is an inter-group positioning projection.

25. The intercooler manufacturing method according to any one of claims 12-24, wherein the chip assembly includes a first chip and a second chip stacked, the first chip having a second plate surface disposed away from the second chip, the second chip having a third plate surface disposed away from the first chip, the second plate surface having a first high-temperature coolant flow passage and a first low-temperature coolant flow passage recessed in the second plate surface, the third plate surface having a second high-temperature coolant flow passage and a second low-temperature coolant flow passage recessed in the third plate surface;

26. The intercooler manufacturing method of claim 25, wherein the first high-temperature coolant flow passage, the first low-temperature coolant flow passage, the second high-temperature coolant flow passage and the second low-temperature coolant flow passage have the same width dimension.

27. The intercooler manufacturing method of claim 25, wherein a first insulation hole is formed between the first high-temperature coolant flow passage and the first low-temperature coolant flow passage on the first chip, and a second insulation hole is formed between the second high-temperature coolant flow passage and the second low-temperature coolant flow passage on the second chip;

28. The method of manufacturing an intercooler of claim 27, wherein the core includes a first cover plate and a second cover plate;

mounting the first cover plate within the first housing;