CN111132506A - Heat dissipation control method, device and equipment for high-power electronic device and storage medium - Google Patents
Heat dissipation control method, device and equipment for high-power electronic device and storage medium Download PDFInfo
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- CN111132506A CN111132506A CN201910980718.4A CN201910980718A CN111132506A CN 111132506 A CN111132506 A CN 111132506A CN 201910980718 A CN201910980718 A CN 201910980718A CN 111132506 A CN111132506 A CN 111132506A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20945—Thermal management, e.g. inverter temperature control
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
Abstract
The invention discloses a heat dissipation control method, a heat dissipation control device, heat dissipation control equipment and a storage medium for a high-power electronic device. The method comprises the steps of acquiring first temperature information of the high-power electronic device during working; acquiring second temperature information of the high-power electronic device during working; acquiring a first temperature information average value according to the first temperature information and the second temperature information; comparing the first temperature information average value with a preset first temperature threshold value; adjusting the heat dissipation mechanism according to the comparison result of the first temperature information average value and the first temperature threshold value; comparing the first temperature information average value with a preset second temperature threshold value; and if the average value of the first temperature information is higher than the second temperature threshold value, sending an alarm signal. The invention improves the accuracy and stability of heat dissipation adjustment of the high-power electronic device.
Description
Technical Field
The invention relates to the technical field of heat dissipation control of high-power electronic devices, in particular to a heat dissipation control method, device, equipment and storage medium for a high-power electronic device.
Background
Along with in most cooling systems, use forced cold wind to replace natural cold wind more, forced cold wind's radiating effect, its complexity is littleer than the complexity of water-cooling heat dissipation, and the reliability is higher than the reliability of water-cooling heat dissipation. For this reason, forced cooling air with a power of several hundreds watts or even several kilowatts is currently used as a main heat dissipation method for power electronic devices. Under the normal condition, the heat resistance of the radiator can be effectively reduced by using a large-area heat dissipation device, so that the heat dissipation effect is improved. However, as the area of the current device required for heat dissipation increases, it is easily limited by the manufacturing process and volume of the heat sink.
The traditional heat dissipation system enables the air quantity to adapt to the temperature change by adjusting the size of the air door, so that the heat dissipation effect of the high-power electronic device is improved. However, the system has the problems of low adjustment accuracy, poor stability and the like, so that the heat dissipation effect is not ideal. In addition, in the process of adopting the system to carry out heat dissipation treatment, the energy absorbed from the power grid is not reduced, so that the output power is basically kept unchanged. Therefore, the invention of a heat dissipation control method for a high-power electronic device with high adjustment accuracy and good stability has become an urgent problem to be solved by those skilled in the art.
Disclosure of Invention
The embodiment of the invention provides a heat dissipation control method, a heat dissipation control device, heat dissipation control equipment and a storage medium of a high-power electronic device, and aims to solve the problems that in the prior art, a heat dissipation system is low in adjustment accuracy, poor in stability and the like, and the heat dissipation effect is not ideal.
In a first aspect, an embodiment of the present invention provides a method for controlling heat dissipation of a high-power electronic device, where the method includes:
acquiring first temperature information of a high-power electronic device during working;
acquiring second temperature information of the high-power electronic device during working;
acquiring a first temperature information average value according to the first temperature information and the second temperature information;
comparing the first temperature information average value with a preset first temperature threshold value;
adjusting the heat dissipation mechanism according to the comparison result of the first temperature information average value and the first temperature threshold value;
comparing the first temperature information average value with a preset second temperature threshold value;
and if the average value of the first temperature information is higher than the second temperature threshold value, sending an alarm signal.
Preferably, the heat dissipation mechanism includes a frequency converter and a fan, and adjusting the heat dissipation mechanism according to the comparison result between the first temperature information average value and the first temperature threshold includes:
if the first temperature information average value is higher than the first temperature threshold value, controlling the frequency of the frequency converter to be adjusted upwards and controlling the rotating speed of the fan to be increased;
and if the first temperature information average value is lower than the first temperature threshold value, controlling the frequency of the frequency converter to be adjusted downwards and controlling the rotating speed of the fan to be reduced.
Preferably, the method further comprises:
acquiring third temperature information of the high-power electronic device during working;
and acquiring a second temperature information average value according to the first temperature information, the second temperature information and the third temperature information.
Preferably, the method further comprises:
and if the first temperature information is equal to the first temperature threshold value, carrying out interrupt processing on the high-power electronic device.
Preferably, the formula of the hot and cold air flow exchange from the surface of the high-power electronic device to the environment is as follows:
Q＝kS(T0-T1)
wherein Q represents the heat transferred from the surface of the high-power electronic device to the environment; k represents a cold-hot gas flow exchange coefficient; s represents the surface area of the high-power electronic device; t is0Representing the surface temperature of the high-power electronic device; t is1Representing the ambient temperature.
Preferably, the heat dissipation degree of the high-power electronic device is expressed as:
R＝(T0-T1)/Q
wherein, T0Representing the surface temperature of the high-power electronic device; t is1Indicating ambient temperatureAnd Q represents the heat transferred from the surface of the high-power electronic device to the environment.
Preferably, the method further comprises:
and filtering the first temperature information, the second temperature information and the third temperature information.
In a second aspect, an embodiment of the present invention provides a heat dissipation control device for a high power electronic device, where the device includes:
the first acquisition module is used for acquiring first temperature information of the high-power electronic device during working;
the second acquisition module is used for acquiring second temperature information of the high-power electronic device during working;
the third obtaining module is used for obtaining a first temperature information average value according to the first temperature information and the second temperature information;
the first comparison module is used for comparing the first temperature information average value with a preset first temperature threshold value;
the adjusting module is used for adjusting the heat dissipation mechanism according to the comparison result of the first temperature information average value and the first temperature threshold value;
the second comparison module is used for comparing the first temperature information average value with a preset second temperature threshold value;
and the alarm output module is used for sending an alarm signal if the first temperature information average value is higher than the second temperature threshold value.
In a third aspect, an embodiment of the present invention provides a heat dissipation control apparatus for a high-power electronic device, including: at least one processor, at least one memory, and computer program instructions stored in the memory, which when executed by the processor, implement the method of the first aspect of the embodiments described above.
In a fourth aspect, embodiments of the present invention provide a storage medium having stored thereon computer program instructions, which when executed by a processor, implement the method of the first aspect in the above embodiments.
In summary, the printing control method, apparatus, device and storage medium provided in the embodiments of the present invention obtain first temperature information of a high-power electronic device during operation; acquiring second temperature information of the high-power electronic device during working; and acquiring a first temperature information average value according to the first temperature information and the second temperature information. The average value of the first temperature information is close to the real-time working temperature of the high-power electronic device, and the accuracy of data acquisition is improved. Comparing the first temperature information average value with a preset first temperature threshold value; and adjusting the heat dissipation mechanism according to the comparison result of the first temperature information average value and the first temperature threshold value, so that the heat dissipation effect is improved. Comparing the first temperature information average value with a preset second temperature threshold value; and if the average value of the first temperature information is higher than the second temperature threshold value, an alarm signal is sent out, so that the high-power electronic device stops working and is prevented from being damaged. The invention improves the accuracy and stability of heat dissipation adjustment of the high-power electronic device.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments of the present invention will be briefly described below, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a flow chart of a method for controlling heat dissipation of a high-power electronic device according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a heat dissipation control device of a high-power electronic device according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a heat dissipation control apparatus of a high-power electronic device according to an embodiment of the present invention.
Detailed Description
Features and exemplary embodiments of various aspects of the present invention will be described in detail below, and in order to make objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not to be construed as limiting the invention. It will be apparent to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present invention by illustrating examples of the present invention.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Referring to fig. 1, an embodiment of the present invention provides a method for controlling heat dissipation of a high-power electronic device, which is applicable to heat dissipation systems of different high-power electronic devices, and obtains first temperature information of the high-power electronic device during operation; acquiring second temperature information of the high-power electronic device during working; and acquiring a first temperature information average value according to the first temperature information and the second temperature information. The average value of the first temperature information is close to the real-time working temperature of the high-power electronic device, and the accuracy of data acquisition is improved. Comparing the first temperature information average value with a preset first temperature threshold value; and adjusting the heat dissipation mechanism according to the comparison result of the first temperature information average value and the first temperature threshold value, so that the heat dissipation effect is improved. Comparing the first temperature information average value with a preset second temperature threshold value; and if the average value of the first temperature information is higher than the second temperature threshold value, an alarm signal is sent out, so that the high-power electronic device stops working and is prevented from being damaged. The invention improves the accuracy and stability of heat dissipation adjustment of the high-power electronic device. The method comprises the following steps:
s1, acquiring first temperature information of the high-power electronic device during working;
s2, acquiring second temperature information of the high-power electronic device during working;
specifically, the first temperature information of the high-power electronic device during operation and the second temperature information of the high-power electronic device during operation are represented as operating temperatures of the high-power electronic device at different time points within a preset time period. Specifically, in the present embodiment, the preset time period is 30 seconds. And acquiring first temperature information of the high-power electronic device in 0 second, and acquiring second temperature information of the high-power electronic device in working after 15 seconds. It is understood that, in another preferred embodiment, the preset time period may be set to 20 seconds, and the preset time period is not particularly limited herein.
S3, obtaining a first temperature information average value according to the first temperature information and the second temperature information;
specifically, in this embodiment, the first temperature information and the second temperature information are weighted and averaged to obtain the first temperature information average value.
Preferably, the method further comprises: acquiring third temperature information of the high-power electronic device during working; and acquiring a second temperature information average value according to the first temperature information, the second temperature information and the third temperature information. It is understood that, in another preferred embodiment, the fourth temperature information and the fifth temperature information of the high-power electronic device during operation can also be obtained. The temperature information of the high-power electronic device is acquired and weighted average is carried out on the temperature information, so that the power of the frequency converter is accurately adjusted when the high-power electronic device is radiated, the accuracy of data processing and radiation adjustment is improved, and resources are fully utilized.
Preferably, in this embodiment, the obtaining and calculating of the first temperature information, the second temperature information, the third temperature information, the fourth temperature information, and the fifth temperature information are controlled by a controller MCU (micro control Unit, which is called micro control Unit, and is also called Single chip microcomputer (or Single chip microcomputer), or a Single chip microcomputer).
S4, comparing the first temperature information average value with a preset first temperature threshold value;
s5, adjusting the heat dissipation mechanism according to the comparison result of the first temperature information average value and the first temperature threshold value;
preferably, the heat dissipation mechanism includes a frequency converter and a fan, and adjusting the heat dissipation mechanism according to the comparison result between the first temperature information average value and the first temperature threshold includes:
and if the first temperature information average value is higher than the first temperature threshold value, controlling the frequency of the frequency converter to be adjusted upwards and controlling the rotating speed of the fan to be increased so as to increase the air output.
And if the first temperature information average value is lower than the first temperature threshold value, controlling the frequency of the frequency converter to be adjusted downwards and controlling the rotating speed of the fan to be reduced, so that the air output is reduced.
S6, comparing the first temperature information average value with a preset second temperature threshold value;
and S7, if the average value of the first temperature information is higher than the second temperature threshold value, sending an alarm signal. Specifically, the controller compares the first temperature information average value with a preset second temperature threshold value, and when the first temperature information average value is higher than the second temperature threshold value, the controller sends an alarm signal to control the high-power electronic device to stop working, so that damage is prevented.
Preferably, the method further comprises:
and if the first temperature information is equal to the first temperature threshold value, carrying out interrupt processing on the high-power electronic device.
Preferably, the hot and cold air flow from the surface of the high-power electronic device to the environment is subjected to the following processes: 1) from the surface of the heat source of the high-power electronic device to the heat sink; 2) a surface from the heat sink mesa to a heat sink; (3) from the radiator surface to the environment. It is understood that processes 1) and 2) are primarily heat transfer principles, and that process 3) includes heat transfer between the heat sink surface and the environment. The heat dissipation surface of the high-power electronic device is flowed by the strong cooling airflow, so that the convection transmission mode of the airflow becomes a heat transfer mechanism.
Preferably, the formula of the hot and cold air flow exchange from the surface of the high-power electronic device to the environment is as follows:
Q＝kS(T0-T1)
wherein Q represents the heat transferred from the surface of the high-power electronic device to the environment; k represents a cold-hot gas flow exchange coefficient; s represents the surface area of the high-power electronic device; t is0Representing the surface temperature of the high-power electronic device; t is1Representing the ambient temperature.
Preferably, the heat dissipation degree of the high-power electronic device is expressed as:
R＝(T0-T1)/Q
wherein, T0Representing the surface temperature of the high-power electronic device; t is1Representing the ambient temperature and Q representing the amount of heat transferred to the environment from the surface of the high power electronic device.
Preferably, the method further comprises:
and filtering the first temperature information, the second temperature information and the third temperature information.
Referring to fig. 2, an embodiment of the present invention provides a heat dissipation control device for a high power electronic device, the device including:
the first acquisition module 1 is used for acquiring first temperature information of the high-power electronic device during working;
the second acquisition module 2 is used for acquiring second temperature information of the high-power electronic device during working;
the third obtaining module 3 is configured to obtain an average value of the first temperature information according to the first temperature information and the second temperature information;
the first comparison module 4 is used for comparing the first temperature information average value with a preset first temperature threshold value;
the adjusting module 5 is used for adjusting the heat dissipation mechanism according to the comparison result of the first temperature information average value and the first temperature threshold value;
the second comparison module 6 is used for comparing the first temperature information average value with a preset second temperature threshold value;
and the alarm output module 7 is used for sending an alarm signal if the first temperature information average value is higher than the second temperature threshold value.
In addition, the heat dissipation control method for the high-power electronic device according to the embodiment of the invention described in conjunction with fig. 1 can be implemented by the heat dissipation control device for the high-power electronic device. Fig. 3 is a schematic diagram of a hardware structure of a method and apparatus for controlling heat dissipation of a high-power electronic device according to an embodiment of the present invention.
The high power electronics heat dissipation control apparatus may include a processor 401 and a memory 402 storing computer program instructions.
Specifically, the processor 401 may include a Central Processing Unit (CPU), or an Application Specific Integrated Circuit (ASIC), or may be configured as one or more Integrated circuits implementing embodiments of the present invention.
The processor 401 realizes any one of the print control methods in the above-described embodiments by reading and executing computer program instructions stored in the memory 402.
In one example, the print control method apparatus may further include a communication interface 403 and a bus 410. As shown in fig. 3, the processor 401, the memory 402, and the communication interface 403 are connected via a bus 410 to complete communication therebetween.
The communication interface 403 is mainly used for implementing communication between modules, apparatuses, units and/or devices in the embodiments of the present invention.
The bus 410 includes hardware, software, or both to couple the components of the print control method apparatus to each other. By way of example, and not limitation, a bus may include an Accelerated Graphics Port (AGP) or other graphics bus, an Enhanced Industry Standard Architecture (EISA) bus, a Front Side Bus (FSB), a Hypertransport (HT) interconnect, an Industry Standard Architecture (ISA) bus, an infiniband interconnect, a Low Pin Count (LPC) bus, a memory bus, a Micro Channel Architecture (MCA) bus, a Peripheral Component Interconnect (PCI) bus, a PCI-Express (PCI-X) bus, a Serial Advanced Technology Attachment (SATA) bus, a video electronics standards association local (VLB) bus, or other suitable bus or a combination of two or more of these. Bus 410 may include one or more buses, where appropriate. Although specific buses have been described and shown in the embodiments of the invention, any suitable buses or interconnects are contemplated by the invention.
In addition, in combination with the heat dissipation control method of the high-power electronic device in the above embodiments, the embodiments of the present invention can provide a computer-readable storage medium to implement. The computer readable storage medium having stored thereon computer program instructions; the computer program instructions, when executed by a processor, implement any of the print control methods in the above embodiments.
In summary, embodiments of the present invention provide a method, an apparatus, a device, and a storage medium for controlling heat dissipation of a high-power electronic apparatus. The method comprises the steps of obtaining first temperature information of the high-power electronic device during working; acquiring second temperature information of the high-power electronic device during working; and acquiring a first temperature information average value according to the first temperature information and the second temperature information. The average value of the first temperature information is close to the real-time working temperature of the high-power electronic device, and the accuracy of data acquisition is improved. Comparing the first temperature information average value with a preset first temperature threshold value; and adjusting the heat dissipation mechanism according to the comparison result of the first temperature information average value and the first temperature threshold value, so that the heat dissipation effect is improved. Comparing the first temperature information average value with a preset second temperature threshold value; and if the average value of the first temperature information is higher than the second temperature threshold value, an alarm signal is sent out, so that the high-power electronic device stops working and is prevented from being damaged. The invention improves the accuracy and stability of heat dissipation adjustment of the high-power electronic device.
It should also be noted that the exemplary embodiments mentioned in this patent describe some methods or systems based on a series of steps or devices. However, the present invention is not limited to the order of the above-described steps, that is, the steps may be performed in the order mentioned in the embodiments, may be performed in an order different from the order in the embodiments, or may be performed simultaneously.
As described above, only the specific embodiments of the present invention are provided, and it can be clearly understood by those skilled in the art that, for convenience and brevity of description, the specific working processes of the system, the module and the unit described above may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again. It should be understood that the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the present invention, and these modifications or substitutions should be covered within the scope of the present invention.
Claims (10)
1. A heat dissipation control method for a high-power electronic device is characterized by comprising the following steps:
acquiring first temperature information of a high-power electronic device during working;
acquiring second temperature information of the high-power electronic device during working;
acquiring a first temperature information average value according to the first temperature information and the second temperature information;
comparing the first temperature information average value with a preset first temperature threshold value;
adjusting the heat dissipation mechanism according to the comparison result of the first temperature information average value and the first temperature threshold value;
comparing the first temperature information average value with a preset second temperature threshold value;
and if the average value of the first temperature information is higher than the second temperature threshold value, sending an alarm signal.
2. The method according to claim 1, wherein the heat dissipation mechanism comprises a frequency converter and a fan, and the adjusting the heat dissipation mechanism according to the comparison result between the average value of the first temperature information and the first temperature threshold comprises:
if the first temperature information average value is higher than the first temperature threshold value, controlling the frequency of the frequency converter to be adjusted upwards and controlling the rotating speed of the fan to be increased;
and if the first temperature information average value is lower than the first temperature threshold value, controlling the frequency of the frequency converter to be adjusted downwards and controlling the rotating speed of the fan to be reduced.
3. The method according to claim 2, wherein the method further comprises:
acquiring third temperature information of the high-power electronic device during working;
and acquiring a second temperature information average value according to the first temperature information, the second temperature information and the third temperature information.
4. The method according to claim 3, wherein the method further comprises:
and if the first temperature information is equal to the first temperature threshold value, carrying out interrupt processing on the high-power electronic device.
5. The method for controlling heat dissipation of high-power electronic device according to claim 4, wherein the formula of the heat and cold air flow exchange from the surface of the high-power electronic device to the environment is as follows:
Q＝kS(T0-T1)
wherein Q represents the heat transferred from the surface of the high-power electronic device to the environment; k represents a cold-hot gas flow exchange coefficient; s represents the surface area of the high-power electronic device; t is0Representing the surface temperature of the high-power electronic device; t is1Representing the ambient temperature.
6. The method for controlling heat dissipation of high-power electronic device according to claim 5, wherein the heat dissipation degree of the high-power electronic device is expressed as:
R＝(T0-T1)/Q
wherein, T0Representing the surface temperature of the high-power electronic device; t is1Representing the ambient temperature and Q representing the amount of heat transferred to the environment from the surface of the high power electronic device.
7. The method according to claim 6, wherein the method further comprises:
and filtering the first temperature information, the second temperature information and the third temperature information.
8. A heat dissipation control device for a high power electronic device, the device comprising:
the first acquisition module is used for acquiring first temperature information of the high-power electronic device during working;
the second acquisition module is used for acquiring second temperature information of the high-power electronic device during working;
the third obtaining module is used for obtaining a first temperature information average value according to the first temperature information and the second temperature information;
the first comparison module is used for comparing the first temperature information average value with a preset first temperature threshold value;
the adjusting module is used for adjusting the heat dissipation mechanism according to the comparison result of the first temperature information average value and the first temperature threshold value;
the second comparison module is used for comparing the first temperature information average value with a preset second temperature threshold value;
and the alarm output module is used for sending an alarm signal if the first temperature information average value is higher than the second temperature threshold value.
9. A heat dissipation control apparatus for a high power electronic device, comprising: at least one processor, at least one memory, and computer program instructions stored in the memory that, when executed by the processor, implement the method of any of claims 1-7.
10. A storage medium having computer program instructions stored thereon, which when executed by a processor implement the method of any one of claims 1-7.
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| CN111524307A (en) * | 2020-05-25 | 2020-08-11 | 安徽诚诚机械有限公司 | Textile machine control method and system and textile machine |
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