CN111128824A - Device for feeding and conveying silicon wafers - Google Patents
Device for feeding and conveying silicon wafers Download PDFInfo
- Publication number
- CN111128824A CN111128824A CN202010013679.3A CN202010013679A CN111128824A CN 111128824 A CN111128824 A CN 111128824A CN 202010013679 A CN202010013679 A CN 202010013679A CN 111128824 A CN111128824 A CN 111128824A
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- CN
- China
- Prior art keywords
- workbench
- fixed
- link plate
- cylinder
- flange
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention provides a device for conveying silicon wafer feeding, which comprises a rack, a linear module, a drag chain, a connecting plate assembly and a bottom plate, wherein two groups of jigs are respectively arranged on the bottom plate, each jig comprises an air cylinder, a flange, a positioning pin, a limiting pin and a workbench assembly, the air cylinder and the positioning pin are vertically fixed on the bottom plate, a plurality of positioning pins are uniformly distributed around the air cylinder in the circumferential direction, the flange is provided with a central hole and a mounting hole, the mounting hole is tightly matched with the positioning pin, and the workbench assembly is fixed on a telescopic rod of the air cylinder and can penetrate through the central hole. The structure is stable and reliable, and the feeding speed is high; the automation degree is high, and manual operation is not needed in the whole process.
Description
Technical Field
The invention belongs to the technical field of silicon wafer polishing, and relates to a device for feeding and conveying silicon wafers.
Background
In a semiconductor manufacturing process, polishing of a wafer typically requires several steps: 1. double-side polishing, i.e. polishing both the front and back sides of the wafer. 2. Edge polishing, i.e., partially mirror polishing the edge portion of the wafer. 3. Final polishing, i.e., mirror polishing the front surface or both the front and back surfaces of the wafer, wafers having a diameter of 300mm or more usually have only the front surface subjected to final mirror polishing.
Wherein at final polishing material loading link, utilize material loading conveyer usually, but material loading conveyer on the market has not enough stably when polishing head material loading, still has structural rigidity not enough in addition, and the station switches not steady enough, easily causes the silicon chip vibrations in the data send process and even has the risk of damaging the silicon chip.
Disclosure of Invention
The invention aims to solve the problems in the prior art, and provides a device for feeding and conveying silicon wafers, which is stable and reliable in structure and high in feeding speed.
The purpose of the invention can be realized by the following technical scheme: the utility model provides a device for silicon wafer material loading conveying, includes frame, sharp module, tow chain, even board subassembly, bottom plate, is provided with two sets of tools on the bottom plate, and the tool includes cylinder, flange, locating pin, spacer pin, workstation subassembly, the equal vertical fixing of cylinder and locating pin is on the bottom plate, and a plurality of locating pin circumference equipartitions are around the cylinder, it has centre bore and mounting hole to open on the flange, mounting hole and locating pin tight fit, the workstation subassembly is fixed on the telescopic link of cylinder and can pass the centre bore, and cylinder drive workstation subassembly up-and-down motion leads to the gas circuit in the middle of the workstation subassembly.
Further, even the board subassembly includes connecting plate A, connecting plate B, connecting plate C, connecting plate D, connecting plate A is fixed with the tow chain, and connecting plate A is fixed with connecting plate B, and connecting plate B is fixed with connecting plate C, and connecting plate C is fixed with connecting plate D, and the bottom plate is fixed in connecting plate D upper end.
Furthermore, a rail is arranged on the rack, and the connecting plate assembly is buckled on the rail and can freely slide.
Further, the workbench assembly comprises a workbench A, a workbench B and a workbench C, the workbench A is fixed on a telescopic rod of the cylinder, the workbench B is fixed on the workbench A, the workbench C is fixed on the workbench B, a gas path is communicated among the workbench A, the workbench B and the workbench C, the gas path joint is fixedly locked on the workbench A, and the workbench C adsorbs a silicon wafer.
Further, workstation A on the terminal surface be connected with the enclosing cover down, be fixed with the inner cup on the bottom plate, the cylinder is located the inner cup, inner cup and enclosing cover all are cylindricly, the enclosing cover overlaps outside the inner cup.
Furthermore, a support is fixed on one side of the flange, a water pipe is fixed on the support, and a spray head of the water pipe faces towards the silicon wafer.
Furthermore, 4-6 positioning pins are fixed on the flange, and the cross section of each positioning pin is conical.
Furthermore, four sets of limit pins are connected to the flange and used for fixing the position of the polishing head when the polishing head takes materials.
The silicon wafer is conveyed to the positioning pin from the storage box by the manipulator, the electromagnetic valve starts the workbench C to adsorb the silicon wafer, the linear module driving device shifts to the polishing head after the optical fiber sensor senses the silicon wafer, the groove-shaped switch senses the silicon wafer, the electromagnetic valve at the water pipe is opened to spray water to the silicon wafer for moisture preservation, the polishing head above the silicon wafer descends and abuts against the limiting pin for fixation, the air cylinder electromagnetic valve is opened to jack up the silicon wafer, the workbench C breaks vacuum, the adsorption pad at the polishing head adsorbs the silicon wafer, the air cylinder descends, the electromagnetic valve at the water pipe is closed, the optical fiber sensor senses no silicon wafer, the linear module driving device returns, the groove-shaped switch.
Compared with the prior art, the device for conveying the silicon wafer feeding has the advantages that:
1, the structure is stable and reliable, and the feeding speed is high;
2, the automation degree is high, and manual operation is not needed in the whole process.
Drawings
FIG. 1 is a front view of a loading conveyor;
FIG. 2 is a left side sectional view of the feeding conveyor;
FIG. 3 is a top view of the infeed conveyor;
in the figure, 1-linear module, 2-drag chain, 3-connecting plate A, 4-connecting plate B, 5-connecting plate C, 6-connecting plate D, 7-bottom plate, 8-air cylinder, 9-workbench A, 10-workbench B, 11-workbench C, 12-inner cover, 13-outer cover, 14-silicon chip, 15-flange, 16-positioning pin, 17-limiting pin, 18-water pipe and 19-support.
Detailed Description
The following are specific embodiments of the present invention and are further described with reference to the drawings, but the present invention is not limited to these embodiments.
As shown in fig. 1-3, this a device for 14 material loading conveyances of silicon chip, including frame, sharp module 1, tow chain 2, even board subassembly, bottom plate 7, be provided with two sets of tools on bottom plate 7, the tool includes cylinder 8, flange 15, locating pin 16, spacer pin 17, workstation subassembly, cylinder 8 and locating pin 16 are all vertically fixed on bottom plate 7, and a plurality of locating pins 16 circumference equipartitions are around cylinder 8, it has centre bore and mounting hole to open on the flange 15, and the mounting hole is tight-fitting with locating pin 16, workstation subassembly is fixed on cylinder 8's telescopic link and can pass the centre bore, and cylinder 8 drive workstation subassembly up-and-down motion leads to the gas circuit in the middle of the workstation subassembly.
The connecting plate assembly comprises a connecting plate A3, a connecting plate B4, a connecting plate C5 and a connecting plate D6, wherein the connecting plate A3 is fixed with the drag chain 2, the connecting plate A3 is fixed with the connecting plate B4, the connecting plate B4 is fixed with the connecting plate C5, the connecting plate C5 is fixed with the connecting plate D6, and the bottom plate 7 is fixed at the upper end of the connecting plate D6.
The rack is provided with a rail, and the connecting plate assembly is buckled on the rail and can freely slide.
Workstation subassembly includes workstation A9, workstation B10 and workstation C11, workstation A9 fixes on cylinder 8's telescopic link, and workstation B10 fixes on workstation A9, and workstation C11 fixes on workstation B10, and it has the gas circuit to lead to between workstation A9, workstation B10 and workstation C11, and the gas circuit joint is fixed to be locked at workstation A9, and workstation C11 adsorbs silicon chip 14.
The lower end face of the workbench A9 is connected with an outer cover 13, the bottom plate 7 is fixed with an inner cover 12, the cylinder 8 is positioned in the inner cover 12, the inner cover 12 and the outer cover 13 are both cylindrical, and the outer cover 13 is sleeved outside the inner cover 12.
A bracket 19 is fixed on one side of the flange 15, a water pipe 18 is fixed on the bracket 19, and a spray head of the water pipe 18 faces the silicon wafer 14.
4-6 positioning pins 16 are fixed on the flange 15, and the section of each positioning pin 16 is conical. Four sets of limit pins 17 are connected to the flange 15 and used for fixing the position of the polishing head when the polishing head takes materials.
The silicon wafer 14 is conveyed to the positioning pin 16 from the storage box by the manipulator, the electromagnetic valve opening workbench C11 adsorbs the silicon wafer 14, the linear module 1 driving device shifts to the polishing head after the optical fiber sensor senses the silicon wafer 14, after the groove-shaped switch senses the silicon wafer, the electromagnetic valve at the water pipe 18 is opened to spray water to the silicon wafer 14 for moisture preservation, the polishing head above descends and abuts against the limiting pin 17 for fixation, the electromagnetic valve of the air cylinder 8 is opened to jack up the silicon wafer 14, the vacuum of the workbench C is broken, the adsorption pad at the polishing head adsorbs the silicon wafer 14, the air cylinder 8 descends, the electromagnetic valve at the water pipe 18 is closed, after the optical fiber sensor senses no silicon wafer 14, the linear module 1 driving device returns, the groove-.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or ambit of the invention as defined in the appended claims.
Claims (8)
1. The utility model provides a device for silicon wafer material loading conveying, includes frame, sharp module, tow chain, even board subassembly, bottom plate, is provided with two sets of tools on the bottom plate, and the tool includes cylinder, flange, locating pin, spacer pin, workstation subassembly, the equal vertical fixing of cylinder and locating pin is on the bottom plate, and a plurality of locating pin circumference equipartitions are around the cylinder, it has centre bore and mounting hole to open on the flange, mounting hole and locating pin tight fit, the workstation subassembly is fixed on the telescopic link of cylinder and can pass the centre bore, and cylinder drive workstation subassembly up-and-down motion leads to the gas circuit in the middle of the workstation subassembly.
2. The apparatus of claim 1, wherein the link assembly comprises a link plate A, a link plate B, a link plate C, and a link plate D, the link plate A is fixed to the drag chain, the link plate A is fixed to the link plate B, the link plate B is fixed to the link plate C, the link plate C is fixed to the link plate D, and the bottom plate is fixed to the upper end of the link plate D.
3. An apparatus as claimed in claim 2, wherein the frame has rails on which the tie plate assemblies are slidably mounted.
4. The device for conveying the silicon wafers as claimed in claim 3, wherein the workbench assembly comprises a workbench A, a workbench B and a workbench C, the workbench A is fixed on a telescopic rod of the cylinder, the workbench B is fixed on the workbench A, the workbench C is fixed on the workbench B, an air passage is communicated among the workbench A, the workbench B and the workbench C, the air passage joint is fixedly locked on the workbench A, and the workbench C adsorbs the silicon wafers.
5. The apparatus as claimed in claim 4, wherein the lower end surface of the worktable A is connected with an outer cover, an inner cover is fixed on the bottom plate, the air cylinder is located in the inner cover, the inner cover and the outer cover are both cylindrical, and the outer cover is sleeved outside the inner cover.
6. The apparatus as claimed in claim 5, wherein a support is fixed to one side of the flange, and a water pipe is fixed to the support, and a nozzle of the water pipe faces the silicon wafer.
7. The apparatus as claimed in claim 5, wherein 4-6 positioning pins are fixed on the flange, and the cross section of the positioning pins is conical.
8. The apparatus of claim 1, wherein four sets of limit pins are connected to the flange.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2019114088896 | 2019-12-31 | ||
| CN201911408889 | 2019-12-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111128824A true CN111128824A (en) | 2020-05-08 |
Family
ID=70488479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010013679.3A Pending CN111128824A (en) | 2019-12-31 | 2020-01-07 | Device for feeding and conveying silicon wafers |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111128824A (en) |
-
2020
- 2020-01-07 CN CN202010013679.3A patent/CN111128824A/en active Pending
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