CN111128814A - Crystal boat - Google Patents
Crystal boat Download PDFInfo
- Publication number
- CN111128814A CN111128814A CN201811291681.6A CN201811291681A CN111128814A CN 111128814 A CN111128814 A CN 111128814A CN 201811291681 A CN201811291681 A CN 201811291681A CN 111128814 A CN111128814 A CN 111128814A
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- Prior art keywords
- support
- supporting
- wafer boat
- wafer
- disclosure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
- H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a wafer boat, including the first support column of predetermineeing a quantity, every be fixed with the second support piece of predetermineeing a quantity on the support column, support piece includes: a first support part having a first length; and the upper surface of the second supporting parts is a curved surface with only one vertex, and the lower surface of the second supporting parts is connected with the first supporting parts and has a second length which is smaller than the first length. The wafer boat provided by the disclosure can effectively improve the problems of abrasion and falling of the wafer boat supporting piece and the wafer, and simultaneously avoids reducing the supporting strength of the supporting piece.
Description
Technical Field
The disclosure relates to the technical field of semiconductor manufacturing, in particular to an island-type wafer boat for a diffusion furnace tube.
Background
The wafer boat is widely used in diffusion furnace tube process systems, and is mainly used for bearing wafers, so that products can enter a reaction chamber for subsequent processes.
Fig. 1 is a schematic structural diagram of a boat in the related art. Referring to fig. 1, under different conditions of the process, the product wafers may generate vibration friction between the quartz boat and the thermal expansion mismatch, which may cause the defect of rod marks and dust particles on the wafer surface, thus the throughput performance of the machine is unstable and the yield of the product is reduced. Therefore, there is a need for a wafer boat that avoids such defects.
It is to be noted that the information disclosed in the above background section is only for enhancement of understanding of the background of the present disclosure, and thus may include information that does not constitute prior art known to those of ordinary skill in the art.
Disclosure of Invention
The present disclosure is directed to an island-type wafer boat for a diffusion furnace, which is used to overcome, at least to some extent, the problems that the utilization rate of a machine is affected due to the marks generated on the surface of a wafer and the drifting of friction particles caused by the friction between the wafer and a quartz wafer boat due to the limitations and defects of the related art.
According to a first aspect of the present disclosure, there is provided a wafer boat, comprising a first predetermined number of support columns, each of the support columns having a second predetermined number of support members fixed thereon, the support members comprising:
a first support part having a first length;
the upper surface of the second supporting part is a curved surface with only one vertex, the lower surface of the second supporting part is connected with the first supporting part, the lower surface of the second supporting part has a second length, and the second length is smaller than the first length.
In an exemplary embodiment of the present disclosure, the second support part is a part of a sphere or a part of an ellipsoid.
In an exemplary embodiment of the present disclosure, a shielding edge is disposed at an outer edge of the first supporting portion, and a height of the shielding edge is not greater than a height of the second supporting portion.
In an exemplary embodiment of the disclosure, a shielding edge is disposed on a side of the first supporting portion away from the supporting column.
In an exemplary embodiment of the present disclosure, the third preset number is equal to 1.
In an exemplary embodiment of the present disclosure, further comprising:
the tie-beam, with first supporting part, the second supporting part the support column is connected, and thickness is not more than the height of second supporting part.
In an exemplary embodiment of the present disclosure, a sum of a thickness of the connection beam and a thickness of the first support portion is not less than 2 mm.
In an exemplary embodiment of the present disclosure, a lower surface of the first support part is inclined upward, and an upper surface thereof is in a horizontal direction.
In an exemplary embodiment of the disclosure, the upper surface of the first supporting portion is inclined upward, and the second supporting portion is a hemisphere disposed on a side of the first supporting portion away from the supporting pillar.
In an exemplary embodiment of the present disclosure, the third preset number is greater than 1.
The embodiment of the disclosure improves the bearing contact area of the wafer and the quartz Boat by using the Island Boat and the curved surface support (Island Boat), and reduces the friction; the falling particles are received by enlarging the bearing sheet, so that the defect of rod mark particles on the surface of the wafer is improved; the influence of the structure on the reduction of the bending strength of the wafer boat supporting part is avoided through the structural improvement of the bearing sheet, the reduction of the product yield can be effectively avoided, and the yield utilization rate of the machine table is improved.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure. It is to be understood that the drawings in the following description are merely exemplary of the disclosure, and that other drawings may be derived from those drawings by one of ordinary skill in the art without the exercise of inventive faculty.
Fig. 1A and 1B are schematic views of a boat in the related art.
Fig. 2A to 2C are schematic views of a substrate boat and a substrate boat support according to a first embodiment of the disclosure.
Fig. 3A to 3D are schematic views of the supporting member according to the second and third embodiments of the present disclosure.
Fig. 4A to 4B are schematic views of a support member according to a fourth embodiment of the present disclosure.
Fig. 5A to 5B are schematic views of a support member according to a fifth embodiment of the present disclosure.
Fig. 6A to 6B are schematic views of a support member in a sixth embodiment of the present disclosure.
Fig. 7 is a schematic view of a support in a seventh embodiment of the present disclosure.
Fig. 8A to 8D are schematic views of a support member in an eighth embodiment of the present disclosure.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the disclosure. One skilled in the relevant art will recognize, however, that the subject matter of the present disclosure can be practiced without one or more of the specific details, or with other methods, components, devices, steps, and the like. In other instances, well-known technical solutions have not been shown or described in detail to avoid obscuring aspects of the present disclosure.
The following detailed description of exemplary embodiments of the disclosure refers to the accompanying drawings.
Fig. 2 is a schematic view of a boat support according to a first embodiment of the disclosure.
Referring to fig. 2, the support 1 is connected to the support column 2, and the support 1 may include:
a first support 11 having a first length L1;
a third predetermined number of second support parts 12, the upper surface of which is a curved surface having only one vertex D, the lower surface of which is connected to the first support part 11, the lower surface of which has a second length L2 less than the first length L1.
In the embodiment shown in fig. 2, the number of the second supports may be 1, and the shape thereof may be, for example, a portion including a hemisphere or an ellipsoid. Since the second supporting part is contacted with the wafer through only one vertex D, the friction between the wafer and the wafer boat supporting part can be reduced to the minimum; in addition, because the length of the first supporting part is greater than that of the second supporting part, even if friction is generated and particles fall, the first supporting part can also play a role in supporting the particles.
The second supporting portion 12 may be disposed on the side of the first supporting portion 11 close to the supporting pillar 2, as shown in fig. 2, to increase the distance between the supporting point and the center of the wafer, or may be disposed on other portions of the first supporting portion 11 as needed, as long as the distance from the first supporting portion 11 to the side far away from the supporting pillar 2 is greater than a preset value, so as to leave a space for receiving the falling particles for the first supporting portion 11.
Fig. 3A and 3B are schematic views of a boat support according to second and third embodiments of the present disclosure. Fig. 3C and 3D are top views of the embodiment shown in fig. 3A and 3B.
In the embodiment shown in fig. 3A to 3D, the edge of the first support part 11 may have a blocking edge 13 for blocking the falling particles. One case is that the shield leaves only openings for cleaning particles in three directions distributed on the first support 11 (fig. 3A); alternatively, the blocking edge 13 may be provided only on the side of the first support part 11 away from the supporting post 2. It should be noted that the height H2 of the shielding edge 13 needs to be lower than the height H1 of the second supporting portion 12 to expose the vertex D.
Fig. 4A and 4B are schematic views of a boat support according to a fourth embodiment of the disclosure.
Referring to fig. 4A, since the height that the supporting member 1 can occupy in the actual configuration is limited, when the second supporting portion is provided, the connection area of the first supporting portion 11 and the supporting column 2 is reduced, thereby affecting the bending strength of the supporting member 1. Therefore, a connection beam 14 may be provided between the first support portion, the second support portion, and the support column to enhance the connection strength of the support 1. The connection beam 14 has a height H3, and H3 is smaller than the height H1 of the second support portion 12 to expose the vertex D. In the case where the support 1 occupies a limited height, the sum of the height H3 of the connection beam 14 and the height H4 of the first support part 11 may not be greater than the limited height. This structure not only retains the advantage of the first embodiment of reducing the wafer contact area, but also avoids the disadvantage of reducing the bending strength. The support 1 of this construction may likewise be provided with a screening edge 13, as shown in fig. 4B.
Fig. 5A to 5B are schematic views of a boat support according to a fifth embodiment of the disclosure.
Referring to fig. 5A, also in view of maintaining the bending strength of the supporting member 1, the lower surface 111 of the first supporting member may be arranged to be inclined upward to form a triangular supporting structure with higher connection strength. The support 1 of this construction may likewise be provided with a screening edge 13, as shown in fig. 5B.
Fig. 6A to 6B are schematic views of a boat support according to a sixth embodiment of the disclosure.
Referring to fig. 6A, in some embodiments, the first support 11 may also be arranged to have an upward angle of inclination α in order to prevent particles from falling fig. 6B is a top view of fig. 6A. in this configuration, falling particles may fall around the second support 12 towards the corners, most likely avoiding drift, the support 1 of this configuration may also be provided with a blocking edge 13, as shown in fig. 6B.
Fig. 7 is a schematic view of a boat support according to a seventh embodiment of the disclosure.
Referring to fig. 7, on the basis of the fourth embodiment, a connection beam 14 may be added to the sixth embodiment to increase the bending strength of the support 1.
Fig. 8A to 8D are schematic views of a boat support according to an eighth embodiment of the disclosure.
In some embodiments, in order to make the wafer not easy to slide, the third preset number may be greater than 1. For example, a plurality of second supporting portions 12 are linearly disposed in a direction away from the supporting column (see fig. 8A, 8B, and 8D), or a plurality of second supporting portions 12 may be disposed in an array to fix the wafer (see fig. 8C). At this time, since the upper surface of the second supporting portion 12 is a smooth curved surface, the friction of the single second supporting portion 12 against the wafer will be reduced to the minimum; due to the arrangement of the plurality of second support parts 12, the wafer is supported on the support 1 at multiple points, and the sliding can be reduced as much as possible.
When a plurality of second supporting portions 12 are provided, the first supporting portion 11 may also have a shielding edge 13 (see fig. 8B-8D), and the lower surface of the first supporting portion 11 may also have an upward-inclined angle, and those skilled in the art can combine themselves according to the foregoing embodiments to realize a technical solution having advantages of all embodiments.
The wafer boat provided by the embodiment of the disclosure can effectively reduce the abrasion of the wafer supported by the wafer boat through the supporting piece provided with the curved surface and the bearing position, and reduce the influence of the falling of abrasion particles on production. The reduction of the bending strength of the supporting piece due to the arrangement of the curved surface can be overcome by adding the connecting beam and improving the inclination angles of the upper surface and the lower surface of the supporting piece; by adding a curved surface for support, the influence of the reduction of the support area on the wafer fixation can be overcome.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
Claims (10)
1. A wafer boat comprises a first preset number of support columns, and a second preset number of support pieces are fixed on each support column, and is characterized in that the support pieces comprise:
a first support part having a first length;
the upper surface of the second supporting part is a curved surface with only one vertex, the lower surface of the second supporting part is connected with the first supporting part, the lower surface of the second supporting part has a second length, and the second length is smaller than the first length.
2. The substrate boat of claim 1, wherein the second support is a portion of a sphere or a portion of an ellipsoid.
3. The wafer boat according to claim 1, wherein the outer edge of the first support portion is provided with a shielding edge, and the height of the shielding edge is not greater than the height of the second support portion.
4. The wafer boat according to claim 1, wherein a shielding edge is provided on a side of the first support section away from the support columns.
5. The wafer boat of any of claims 1 to 4, wherein the third predetermined number is equal to 1.
6. The substrate boat of claim 5, further comprising:
the tie-beam, with first supporting part, the second supporting part the support column is connected, and thickness is not more than the height of second supporting part.
7. The wafer boat according to claim 6, wherein a sum of a thickness of the connection beam and a thickness of the first support portion is not less than 2 mm.
8. The wafer boat according to claim 5, wherein the lower surface of the first support part is inclined upward and the upper surface is horizontal.
9. The wafer boat according to claim 5, wherein the upper surface of the first support portion is inclined upward, and the second support portion is a hemisphere provided on a side of the first support portion away from the support column.
10. The wafer boat of any one of claims 1 to 4, wherein the third predetermined number is greater than 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811291681.6A CN111128814A (en) | 2018-10-31 | 2018-10-31 | Crystal boat |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811291681.6A CN111128814A (en) | 2018-10-31 | 2018-10-31 | Crystal boat |
Publications (1)
Publication Number | Publication Date |
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CN111128814A true CN111128814A (en) | 2020-05-08 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201811291681.6A Pending CN111128814A (en) | 2018-10-31 | 2018-10-31 | Crystal boat |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD981971S1 (en) * | 2021-03-15 | 2023-03-28 | Kokusai Electric Corporation | Boat of substrate processing apparatus |
-
2018
- 2018-10-31 CN CN201811291681.6A patent/CN111128814A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD981971S1 (en) * | 2021-03-15 | 2023-03-28 | Kokusai Electric Corporation | Boat of substrate processing apparatus |
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