CN111123431B - Packaging method of laser waveguide chip - Google Patents
Packaging method of laser waveguide chip Download PDFInfo
- Publication number
- CN111123431B CN111123431B CN201811279126.1A CN201811279126A CN111123431B CN 111123431 B CN111123431 B CN 111123431B CN 201811279126 A CN201811279126 A CN 201811279126A CN 111123431 B CN111123431 B CN 111123431B
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- chip
- ceramic substrate
- waveguide chip
- laser
- optical waveguide
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12004—Combinations of two or more optical elements
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4271—Cooling with thermo electric cooling
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4295—Coupling light guides with opto-electronic elements coupling with semiconductor devices activated by light through the light guide, e.g. thyristors, phototransistors
Abstract
The invention discloses a packaging method of a laser waveguide chip, which comprises the following steps: welding a laser chip and a thermistor on a first ceramic substrate; welding the optical waveguide chip on the second ceramic substrate; fixing the first ceramic substrate on the second ceramic substrate; electrically interconnecting the optical waveguide chip, the laser chip, the thermistor and the first ceramic substrate; mounting an avalanche photodiode chip on a substrate; welding a reflector bracket for mounting a reflector, a semiconductor refrigerator, a second ceramic substrate and a substrate together in a tube shell, wherein the photosensitive surface of the avalanche photodiode chip is vertically aligned with the phase detection sheet of the optical waveguide chip; and the surface of the tube shell is packaged with a filter. The invention has the following advantages: the APD chip is arranged above the optical waveguide chip in an inverted mode, so that the loss of light in the transmission process is shortened as much as possible, and a weaker optical signal can be detected.
Description
Technical Field
The invention relates to the technical field of chip packaging, in particular to a packaging method of a laser waveguide chip.
Background
With the rapid development of laser radar technology, optical waveguide devices are widely used. In the application fields of intelligent identification, unmanned driving and the like, the laser radar becomes an indispensable core part, and the optical waveguide becomes the most core device in the laser radar due to small volume, high integration level, low loss and high reliability.
At present, in the packaging process of the optical waveguide chip, the high integration level of the optical waveguide chip cannot be realized due to the limitation of factors such as process, cost and the like. When a chip is packaged, it is difficult to ensure both functionality and reliability and high integration of a module. The traditional optical waveguide module cannot realize accurate regulation and control of a phased array, consumes a large amount of time for debugging chip light, and is not suitable for mass production of modules.
Disclosure of Invention
The present invention is directed to solving at least one of the above problems.
Therefore, the invention aims to provide a packaging method of a laser waveguide chip, which shortens the loss of light in the propagation process and can detect a weaker optical signal.
In order to achieve the above object, an embodiment of the present invention discloses a method for packaging a laser waveguide chip, including the following steps: welding a laser chip and a thermistor on a first ceramic substrate with one side coated with copper; welding the optical waveguide chip on a second ceramic substrate coated with copper on two sides; fixing the first ceramic substrate on the second ceramic substrate, and optically coupling the laser chip and the optical waveguide chip; electrically interconnecting the optical waveguide chip, the laser chip, the thermistor and a bonding pad on the first ceramic substrate; attaching an avalanche photodiode chip to a substrate of a printed circuit board with a circuit on the surface, and electrically connecting an electrode on the avalanche photodiode chip with an electrode of the printed circuit board; welding a reflector bracket for mounting a reflector, a semiconductor refrigerator, the second ceramic substrate and the substrate together in a tube shell, wherein one side of the substrate with the avalanche photodiode chip corresponds to the optical waveguide chip, and the photosensitive surface of the avalanche photodiode chip is vertically aligned with the phase detection area of the optical waveguide chip; connecting the semiconductor refrigerator with the pins on the tube shell; and a filter cover plate is packaged on the surface of the tube shell.
According to the packaging method of the laser waveguide chip, the APD chip is arranged above the optical waveguide chip in an inverted mode, so that the loss of light in the transmission process is reduced as much as possible, and therefore weaker optical signals can be detected.
In addition, the packaging method of the laser waveguide chip according to the above embodiment of the present invention may further have the following additional technical features:
optionally, the laser chip and the thermistor are soldered on the first ceramic substrate using solder SnAu.
Optionally, the optical waveguide chip is soldered on the second ceramic substrate using solder SnAu.
Optionally, the second ceramic substrate is an aluminum nitride ceramic substrate.
Optionally, the optical waveguide chip, the laser chip, the thermistor and the first ceramic substrate are electrically interconnected using a gold wire.
Optionally, the avalanche photodiode is mounted on a printed circuit board using a conductive paste.
Optionally, a gold wire is used to connect the electrode on the avalanche photodiode to the electrode of the printed circuit board.
Optionally, the mirror support, the semiconductor cooler, the second ceramic substrate and the substrate are soldered together in a package using a pre-formed solder tab SnInAg.
Alternatively, the semiconductor cooler is connected to the pins on the package by gold wire bonding.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a flow chart of a method of packaging a laser waveguide chip according to one embodiment of the present invention;
fig. 2-9 are schematic process diagrams of a packaging method of a laser waveguide chip according to an embodiment of the invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
These and other aspects of embodiments of the invention will be apparent with reference to the following description and attached drawings. In the description and drawings, particular embodiments of the invention have been disclosed in detail as being indicative of some of the ways in which the principles of the embodiments of the invention may be practiced, but it is understood that the scope of the embodiments of the invention is not limited correspondingly. On the contrary, the embodiments of the invention include all changes, modifications and equivalents coming within the spirit and terms of the claims appended hereto.
The packaging method of the laser waveguide chip of the present invention is described below with reference to the accompanying drawings.
Fig. 1 is a flowchart of a method for packaging a laser waveguide chip according to an embodiment of the present invention, and fig. 2 to 9 are schematic process diagrams of a method for packaging a laser waveguide chip according to an embodiment of the present invention. As shown in fig. 1 to 9, the method for packaging a laser waveguide chip according to an embodiment of the present invention includes the following steps:
s1: the laser chip 1 and the thermistor 2 are soldered on a first ceramic substrate 3 with one side coated with copper. The thermistor 2 is placed beside the laser chip 1 with the highest heating efficiency, and the temperature in the accurate monitoring module is the highest, so that temperature regulation and control are performed, and the chip is protected from being damaged by overheating.
In one embodiment of the invention, the laser chip and the thermistor are soldered onto the first ceramic substrate using solder SnAu (e.g., soldering peak temperature 340 ℃, peak temperature duration 20s) (as shown in fig. 2).
S2: the optical waveguide chip 4 is soldered to a second ceramic substrate 5 coated with copper on both sides.
In one embodiment of the present invention, the optical waveguide chip 4 is soldered on the second ceramic substrate 5 using solder SnAu (e.g., soldering peak temperature 340 ℃, peak temperature duration 20s) (as shown in fig. 3). In some examples, the second ceramic substrate is an aluminum nitride ceramic substrate.
S3: and fixing the first ceramic substrate on the second ceramic substrate, and optically coupling the laser chip and the optical waveguide chip.
Specifically, optical coupling is performed on a high-precision adjusting table, the second ceramic substrate 5 with the optical waveguide chip 4 is fixed on one section of an adjusting frame, the heat sink with the laser chip 1 is clamped at the other end of the adjusting frame for adjustment, and finally, the heat sink with the laser chip 1 is fixed on the second ceramic substrate 5 by using high-thermal-conductivity and high-electrical-conductivity adhesive (as shown in fig. 4).
S4: and electrically interconnecting the optical waveguide chip 4, the laser chip 1, the thermistor 2 and a bonding pad on the first ceramic substrate 3.
In one embodiment of the present invention, gold wires (25um/50um) are used to electrically interconnect the optical waveguide chip 4, the laser chip 1, the thermistor 2 and the bonding pad on the first ceramic substrate 3 (as shown in fig. 5).
S5: an Avalanche Photodiode (APD) chip 6 is attached to a substrate 7 of a printed circuit board having a circuit on a surface thereof, and electrodes on the APD chip 6 and the printed circuit board are electrically connected (see fig. 6).
In one embodiment of the present invention, the APD chip 6 is attached to the substrate 7 of a printed circuit board with circuitry on its surface using a conductive adhesive.
S6: the mirror holder 8 to which the mirror is attached, a Thermal Energy Converter (TEC) 9, the second ceramic substrate 5, and the substrate 7 are welded together in the package 10. Wherein, one side of the substrate 10 with the APD chip 6 corresponds to the optical waveguide chip 4, and the photo-sensitive surface of the APD chip 6 is vertically aligned with the phase detection area of the optical waveguide chip 4 (as shown in fig. 7). The APD chip is arranged above the optical waveguide chip in an inverted mode, so that the loss of light in the transmission process is shortened as much as possible, and a weaker optical signal can be detected.
In one embodiment of the invention, the mirror support 8, TEC9, the second ceramic substrate 5 and the substrate 7 are soldered together in a package 10 using low temperature preformed solder bumps SnInAg (e.g. solder peak temperature 187 ℃, peak temperature duration 30 s).
S7: the semiconductor cooler 9 is connected to pins on the package 10.
In one embodiment of the present invention, gold wire bonding is used to connect TEC9 to pins on the package 10 (as shown in fig. 8).
S8: a filter cover plate 11 (shown in fig. 9) is encapsulated on the surface of the package 10. The light output from the optical waveguide is reflected by the 45-degree reflector and output in the direction perpendicular to the module, and stray light is filtered by the filter plate to obtain light with stable wavelength.
In addition, other structures and functions of the laser waveguide chip according to the embodiment of the present invention are known to those skilled in the art, and are not described in detail in order to reduce redundancy.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (9)
1. A packaging method of a laser waveguide chip is characterized by comprising the following steps:
welding a laser chip and a thermistor on a first ceramic substrate with one side coated with copper;
welding the optical waveguide chip on a second ceramic substrate coated with copper on two sides;
fixing the first ceramic substrate on the second ceramic substrate, and optically coupling the laser chip and the optical waveguide chip;
electrically interconnecting the optical waveguide chip, the laser chip, the thermistor and a bonding pad on the first ceramic substrate;
attaching an avalanche photodiode chip to a substrate with a printed circuit board on the surface, and electrically connecting an electrode on the avalanche photodiode chip with an electrode of the printed circuit board;
welding a reflector bracket for mounting a reflector, the semiconductor refrigerator, the second ceramic substrate and the substrate with the printed circuit board on the surface into a tube shell together, wherein one side of the substrate with the printed circuit board on the surface, which is provided with the avalanche photodiode chip, corresponds to the optical waveguide chip, and the photosensitive surface of the avalanche photodiode chip is vertically aligned with the phase detection area of the optical waveguide chip;
connecting the semiconductor refrigerator with the pins on the tube shell;
and a filter cover plate is packaged on the surface of the tube shell.
2. The method of claim 1, wherein the laser waveguide chip and the thermistor are soldered on the first ceramic substrate using solder SnAu.
3. The method for packaging a laser waveguide chip as claimed in claim 1, wherein the optical waveguide chip is soldered on the second ceramic substrate using solder SnAu.
4. The method for packaging a laser waveguide chip as claimed in claim 1, wherein the second ceramic substrate is an aluminum nitride ceramic substrate.
5. The method of claim 1, wherein gold wires are used to electrically interconnect the optical waveguide chip, the laser chip, the thermistor and the first ceramic substrate.
6. The method of claim 1, wherein the avalanche photodiode is mounted on a printed circuit board using a conductive adhesive.
7. The method of claim 1, wherein gold wires are used to connect the electrodes on the avalanche photodiode to the electrodes on the printed circuit board.
8. The method for packaging a laser waveguide chip as claimed in claim 1, wherein the reflector holder, the semiconductor cooler, the second ceramic substrate and the substrate with the printed circuit board on the surface are soldered together in a package by using a pre-formed solder piece SnInAg.
9. The method of claim 1, wherein gold wire bonding is used to connect the semiconductor cooler to the pins on the package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811279126.1A CN111123431B (en) | 2018-10-30 | 2018-10-30 | Packaging method of laser waveguide chip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811279126.1A CN111123431B (en) | 2018-10-30 | 2018-10-30 | Packaging method of laser waveguide chip |
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| Publication Number | Publication Date |
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| CN111123431A CN111123431A (en) | 2020-05-08 |
| CN111123431B true CN111123431B (en) | 2021-08-24 |
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| CN201811279126.1A Active CN111123431B (en) | 2018-10-30 | 2018-10-30 | Packaging method of laser waveguide chip |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113193468B (en) * | 2021-05-27 | 2023-09-12 | 三序光学科技(苏州)有限公司 | Semiconductor laser light source module based on planar waveguide type combiner and manufacturing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001168449A (en) * | 1999-12-13 | 2001-06-22 | Mitsubishi Electric Corp | Optical transmitter-receptor module |
| KR100460703B1 (en) * | 2002-08-21 | 2004-12-09 | 한국전자통신연구원 | Electro-optical circuit board having unified optical transmission/receiving module and optical waveguide |
| US7200295B2 (en) * | 2004-12-07 | 2007-04-03 | Reflex Photonics, Inc. | Optically enabled hybrid semiconductor package |
| CN103217750A (en) * | 2012-01-19 | 2013-07-24 | 环隆科技股份有限公司 | Optical mechanical assembly and photoelectric packaging |
| US9976844B2 (en) * | 2015-02-06 | 2018-05-22 | Medlumics S.L. | Miniaturized OCT package and assembly thereof |
| CN106980159B (en) * | 2017-03-07 | 2019-01-22 | 中国科学院微电子研究所 | Optical-electric module encapsulating structure based on photoelectricity hybrid integrated |
| CN207133474U (en) * | 2017-08-24 | 2018-03-23 | 四川新易盛通信技术有限公司 | A kind of TO Can encapsulate high rate optical device |
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