CN111122621A - Method for detecting defect position of workpiece by adopting ray double-wall transillumination technology - Google Patents
Method for detecting defect position of workpiece by adopting ray double-wall transillumination technology Download PDFInfo
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Abstract
The invention provides a method for detecting the defect position of a workpiece by adopting a ray double-wall transillumination technology, which comprises the following steps: performing double-wall transillumination on the workpiece, and projecting the three-dimensional workpiece on a two-dimensional detector plane by rotating the workpiece for multiple transillumination imaging; establishing a ray imaging system coordinate according to the projection on the detector plane; constructing a mapping relation from a three-dimensional coordinate point on a workpiece to a pixel coordinate of a detector; and reversely solving the three-dimensional coordinates of the defect position according to the mapping relation. According to the scheme, the positions of the defects in the front and the back of the workpiece can be accurately distinguished, the method is accurate and efficient, detection personnel do not need to repeatedly transilluminate, and the work efficiency of ray detection for determining the positions of the defects is improved.
Description
Technical Field
The invention relates to a ray detection technology, in particular to a method for detecting the defect position of a workpiece by adopting a ray double-wall transillumination technology.
Background
During ray detection, three-dimensional information of a workpiece is imaged on a two-dimensional detector plane after being subjected to ray perspective. Therefore, it is not possible in principle to back-project a point in the two-dimensional radiographic image to a corresponding location on the workpiece, because the location where the point on the image is back-projected to the workpiece is not unique.
The problem that the position of the defect in the ray transillumination direction cannot be solved can be solved through a parallax method. At present, the parallax method can be used for quantitative analysis of the depth position of the defect in the welding seam or the casting. The parallax method includes two modes: a translation method and a rotation method, wherein after translation or rotation movement, the defects are projected at different image positions; and analyzing the change of the projection position of the defect, and determining the position information of the defect in the transillumination direction by means of a triangular similarity relation or a specific function relation.
For radiographic inspection of thin-walled cylindrical parts, the depth position of the defect in the radiographic direction does not need to be determined. Manufacturers are more concerned with the two-dimensional distribution of defects on the workpiece surface, and parallax methods cannot solve this problem. Although a system for marking the position of the defect exists at present, the system has the problems of complex structure and inconvenient operation, and cannot be applied to marking the two-dimensional distribution position of the defect in the thin-wall cylindrical part.
The method realizes the determination of the detection defect position of the thin-wall cylindrical part, and the prior art has the following technical defects:
1. since the images before and after the radiographic transillumination are overlapped, the positions of the defects before and after the workpiece are difficult to distinguish, and the defect positioning is easy to make mistakes, as shown in fig. 1.
2. The workpiece is a curved surface member, and the position of the defect on the curved surface is determined based on the plane projection information, so that a large positioning deviation exists, as shown in fig. 2.
3. The detection personnel need to perform a plurality of attempts and repeated transillumination when positioning the defects, and the working efficiency is low.
Disclosure of Invention
The invention aims to provide a technical scheme of a method for detecting the position of a defect of a workpiece by adopting a ray double-wall transillumination technology, the scheme adopts the double-wall transillumination method in the prior art to image without adding extra links, and the accurate positioning of the defect of the workpiece is realized by constructing a mapping model from a spatial position point of the workpiece to a pixel coordinate position of a detection image, so that the defect can be accurately distinguished from the front position and the rear position of the workpiece, the method is accurate and efficient, the detection personnel do not need to transilluminate repeatedly, and the working efficiency of ray detection for determining the position of the defect is improved.
The scheme is realized by the following technical measures:
a method for detecting the defect position of a workpiece by adopting a ray double-wall transillumination technology comprises the following steps:
a. performing double-wall transillumination on the workpiece, and projecting the three-dimensional workpiece on a two-dimensional detector plane by rotating the workpiece for multiple transillumination imaging;
b. establishing a ray imaging system coordinate according to the projection on the detector plane;
c. constructing a mapping relation from a three-dimensional coordinate point on a workpiece to a pixel coordinate of a detector;
d. and reversely solving the three-dimensional coordinates of the defect position according to the mapping relation.
The scheme is preferably as follows: the method for establishing the coordinates of the ray imaging system in the step b comprises the following steps: because the three-dimensional object is projected and imaged on a two-dimensional detector plane, Z-axis information is lost in the projection imaging process, and the distance between a ray source and the center of a workpiece is set as l1The distance between the center of the workpiece and the detector is l2And the image obtained by the ray detection is amplified by 1+ l1/l2；
Coordinate positioning is carried out on the ray source and the workpiece by taking the center of the detector as the origin of system coordinates, and the deviation delta x exists between the center of the workpiece and the center of the detector on the x axis and the y axis1,Δy1The coordinate of the center of the workpiece is (Δ x)1,Δy1,l2)；
In determining the center of the workpieceAfter the coordinates are obtained, all points on the workpiece are positioned, and the deviation deltax exists between the center of the ray source and the center of the detector on the x axis and the y axis2,Δy2Then the coordinates of the source center are (Δ x)2,Δy2,l1+l2)。
The scheme is preferably as follows: in step c, according to the coordinates of the ray imaging system established in step b, the mapping relation from the three-dimensional coordinate points on the workpiece to the pixel coordinates of the detector is expressed as:
let the coordinate of a certain point on the workpiece be (r, theta, h), and use P0＝[r h θ 1]Represents;
corresponding to a coordinate point P on the detector6There is the following expression:
P6＝P0×M1×M2×M3×M4×M5×M6
after calculation, the coordinate on the detector is
P6x＝[Δx2-(l1+l2)×(Δx1+Δx2-r×sinθ)/(l1-r×cosθ)+0.5×Wx]/Srb
P6y＝[Δy2-(l1+l2)×(Δy1+Δy2-h)/(l1-r×cosθ)+0.5×Wy]/Srb
Wherein, Wx、WyRespectively representing the dimensions of the detector in the x-direction and y-direction, SrbRepresenting the spatial resolution of the detector.
The scheme is preferably as follows: in step d, a certain coordinate point P on the workpiece is set0＝[r h θ 1]After the workpiece rotates by an angle delta theta, the corresponding coordinate on the plane of the detector changes, P0After rotation, its seating mark on the workpiece is marked P0_2＝[r h θ+Δθ 1]Finding P according to the mapping relation in step c0And P0_2Projection coordinates (P) on the detector plane6xP6y)、(P6x_2、P6y_2) Comprises the following steps:
P6x＝[Δx2-(l1+l2)×(Δx1+Δx2-r×sinθ)/(l1-r×cosθ)+0.5×Wx]/Srb
P6y＝[Δy2-(l1+l2)×(Δy1+Δy2-h)/(l1-r×cosθ)+0.5×Wy]/Srb
P6x_2＝[Δx2-(l1+l2)×(Δx1+Δx2-r×sin(θ+Δθ))/(l1-r×cos(θ+Δθ))+0.5×wx]/Srb
P6y_2＝[Δy2-(l1+l2)×(Δy1+Δy2-h)/(l1-r×cos(θ+Δθ))+0.5×wy]/Srb
from the detector detected image, P is known6、P6_2By substituting the equation to solve for the parameterh,θ，Δθ；
In solving, the workpiece coordinate points are discretized into a series of points [ r h ]dθd1]Setting the rotation angle delta theta of the workpiece to change within a certain range, and respectively calculating the coordinate positions (P) of the workpiece on the detector plane before and after the rotation delta theta is applied to the workpiece for all discrete pointsd 6x，Pd 6y)、(Pd 6x_2、Pd 6y_2) The calculated coordinate position is compared with the defect coordinate position (P) obtained on the inspection image6xP6y)、(P6x_2、P6y_2) Distance analysis was performed to find discrete points satisfying the following conditions [ r hdθd1]Namely defect coordinate points:
the method has the advantages that the method combines the graphic analysis technology and the image processing technology to construct a detailed three-dimensional motion model and accurately calculate the position of the defect on the thin-wall cylindrical workpiece instead of using simple triangular relation to complete calculation analysis.
By appointing a ray transillumination process and selecting ray transillumination parameters, the position of the defect is reversely solved and is associated with the parameters of the detection system, and the defect positioning analysis is independent of additional detection marks.
The detection and defect positioning processes are combined into a whole, the process of finding defects and then detecting and analyzing the defects after the detection is finished is avoided, and the defects are accurately and efficiently positioned.
Therefore, compared with the prior art, the invention has prominent substantive features and remarkable progress, and the beneficial effects of the implementation are also obvious.
Drawings
FIG. 1 is a diagram illustrating the error susceptibility before and after defect localization in the prior art.
Fig. 2 is a schematic diagram illustrating a defect location in the prior art is prone to deviation.
Fig. 3 is a schematic diagram of the relationship between the coordinates of the radiographic imaging system and the three-dimensional position of the workpiece, which is established in step b.
FIG. 4 is a schematic diagram of a mapping of a coordinate point on a workpiece to a detector plane.
Detailed Description
All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.
Any feature disclosed in this specification (including any accompanying claims, abstract and drawings), may be replaced by alternative features serving equivalent or similar purposes, unless expressly stated otherwise. That is, unless expressly stated otherwise, each feature is only an example of a generic series of equivalent or similar features.
The scheme comprises the following steps:
a. performing double-wall transillumination on the workpiece, and projecting the three-dimensional workpiece on a two-dimensional detector plane by rotating the workpiece for multiple transillumination imaging;
b. establishing a ray imaging system coordinate according to the projection on the detector plane;
c. constructing a mapping relation from a three-dimensional coordinate point on a workpiece to a pixel coordinate of a detector;
d. and reversely solving the three-dimensional coordinates of the defect position according to the mapping relation.
The method for establishing the coordinates of the ray imaging system in the step b comprises the following steps: because the three-dimensional object is projected and imaged on a two-dimensional detector plane, Z-axis information is lost in the projection imaging process, and the distance between a ray source and the center of a workpiece is set as l1The distance between the center of the workpiece and the detector is l2And the image obtained by the ray detection is amplified by 1+ l1/l2；
Coordinate positioning is carried out on the ray source and the workpiece by taking the center of the detector as the origin of system coordinates, and the deviation delta x exists between the center of the workpiece and the center of the detector on the x axis and the y axis1,Δy1The coordinate of the center of the workpiece is (Δ x)1,Δy1,l2)；
In determining the workpieceAfter the central coordinates, all points on the workpiece are positioned, and the deviation Deltax existing between the center of the ray source and the center of the detector on the x axis and the y axis is set2,Δy2Then the coordinates of the source center are (Δ x)2,Δy2,l1+l2) As shown in fig. 3.
In step c, according to the coordinates of the ray imaging system established in step b, the mapping relationship from the three-dimensional coordinate points on the workpiece to the pixel coordinates of the detector can be expressed as:
let the coordinate of a certain point on the workpiece be (r, theta, h), and use P0＝[r h θ 1]Represents;
corresponding to a coordinate point P on the detector6There is the following expression:
P6＝P0×M1×M2×M3×M4×M5×M6
after calculation, the coordinate on the detector is
P6x＝[Δx2-(l1+l2)×(Δx1+Δx2-r×sinθ)/(l1-r×cosθ)+0.5×Wx]/Srb
P6y＝[Δy2-(l1+l2)×(Δy1+Δy2-h)/(l1-r×cosθ)+0.5×Wy]/Srb
Wherein, Wx、WyRespectively representing the dimensions of the detector in the x-direction and y-direction, SrbRepresenting the spatial resolution of the detector, as shown in fig. 4.
The scheme is preferably as follows: in step d, a certain coordinate point P on the workpiece is set0＝[r h θ 1]After the workpiece rotates by an angle delta theta, the corresponding coordinate on the plane of the detector changes, P0After rotation, its seating mark on the workpiece is marked P0_2＝[r h θ+Δθ 1]Finding P according to the mapping relation in step c0And P0_2Projection coordinates (P) on the detector plane6xP6y)、(P6x_2、P6y_2) Comprises the following steps:
P6x＝[Δx2-(l1+l2)×(Δx1+Δx2-r×sinθ)/(l1-r×cosθ)+0.5×Wx]/Srb
P6y＝[Δy2-(l1+l2)×(Δy1+Δy2-h)/(l1-r×cosθ)+0.5×Wy]/Srb
P6x_2＝[Δx2-(l1+l2)×(Δx1+Δx2-r×sin(θ+Δθ))/(l1-r×cos(θ+Δθ))+0.5×wx]/Srb
P6y_2＝[Δy2-(l1+l2)×(Δy1+Δy2-h)/(l1-r×cos(θ+Δθ))+0.5×wy]/Srb
from the detector detected image, P is known6、P6_2By substituting the equation intoSolving parameters h, theta and delta theta;
in solving, the workpiece coordinate points are discretized into a series of points [ r h ]dθd1]Setting the rotation angle delta theta of the workpiece to change within a certain range, and respectively calculating the coordinate positions (P) of the workpiece on the detector plane before and after the rotation delta theta is applied to the workpiece for all discrete pointsd 6x，Pd 6y)、(Pd 6x_2、Pd 6y_2) The calculated coordinate position is compared with the defect coordinate position (P) obtained on the inspection image6xP6y)、(P6x_2、P6y_2) Distance analysis was performed to find discrete points satisfying the following conditions [ r hdθd1]Namely defect coordinate points:
when workpiece defect detection is carried out, defect positioning analysis software is opened, and image position extraction is carried out on the found defects in an automatic or manual mode; then, according to the method, the position of the defect on the workpiece is calculated reversely; after the calculation is finished, an angle increment value and a height increment value required by indicating the defect are given according to the angle of the current rotary table and the current detection height; and finally, rotating the workpiece according to the angle increment, moving the ray source according to the height increment, and marking the defect position according to the light point indication of the laser.
The invention combines the defect positioning process and the ray detection process into a whole, and can mark the defect in the workpiece in the direction after the ray detection is finished; when the position of the defect is marked, an additional ray detection process is not needed, so that the detection time and the working intensity are greatly reduced.
When the position of the defect is determined, some complex processing (such as repeatedly adjusting the position of the workpiece, pasting a mark point on the workpiece and the like) is avoided, so that the positioning analysis of the defect is realized by the analysis of a computer program, the working efficiency is improved to a great extent, the working intensity of a detector is reduced, and the accuracy of defect positioning is improved.
The invention is not limited to the foregoing embodiments. The invention extends to any novel feature or any novel combination of features disclosed in this specification and any novel method or process steps or any novel combination of features disclosed.
Claims (4)
1. A method for detecting the defect position of a workpiece by adopting a ray double-wall transillumination technology is characterized by comprising the following steps: the method comprises the following steps:
a. performing double-wall transillumination on the workpiece, and projecting the three-dimensional workpiece on a two-dimensional detector plane by rotating the workpiece for multiple transillumination imaging;
b. establishing a ray imaging system coordinate according to the projection on the detector plane;
c. constructing a mapping relation from a three-dimensional coordinate point on a workpiece to a pixel coordinate of a detector;
d. and reversely solving the three-dimensional coordinates of the defect position according to the mapping relation.
2. The method for detecting the defect position of the workpiece by using the ray double-wall transillumination technology as claimed in claim 1, which is characterized in that: the method for establishing the coordinates of the ray imaging system in the step b comprises the following steps: because the three-dimensional object is projected and imaged on a two-dimensional detector plane, Z-axis information is lost in the projection imaging process, and the distance between a ray source and the center of a workpiece is set as l1The distance between the center of the workpiece and the detector is l2And the image obtained by the ray detection is amplified by 1+ l1/l2；
Coordinate positioning is carried out on the ray source and the workpiece by taking the center of the detector as the origin of system coordinates, and the deviation delta x exists between the center of the workpiece and the center of the detector on the x axis and the y axis1,Δy1The coordinate of the center of the workpiece is (Δ x)1,Δy1,l2)；
After the central coordinates of the workpiece are determined, all points on the workpiece are positioned, and the deviation deltax between the center of the ray source and the center of the detector on the x axis and the y axis is set2,Δy2Then the coordinates of the source center are (Δ x)2,Δy2,l1+l2)。
3. The method for detecting the defect position of the workpiece by using the ray double-wall transillumination technology as claimed in claim 1, which is characterized in that: in the step c, according to the coordinates of the ray imaging system established in the step b, the mapping relationship from the three-dimensional coordinate point on the workpiece to the pixel coordinates of the detector is expressed as follows:
let the coordinate of a certain point on the workpiece be (r, theta, h), and use P0＝[r h θ 1]Represents;
corresponding to a coordinate point P on the detector6There is the following expression:
P6＝P0×M1×M2×M3×M4×M5×M6
after calculation, the coordinate on the detector is
P6x＝[Δx2-(l1+l2)×(Δx1+Δx2-r×sinθ)/(l1-r×cosθ)+0.5×Wx]/Srb
P6y＝[Δy2-(l1+l2)×(Δy1+Δy2-h)/(l1-r×cosθ)+0.5×Wy]/Srb
Wherein, Wx、WyRespectively representing the dimensions of the detector in the x-direction and y-direction, SrbRepresenting the spatial resolution of the detector.
4. The method for detecting the defect position of the workpiece by using the ray double-wall transillumination technology as claimed in claim 1, which is characterized in that: in the step d, a certain coordinate point P on the workpiece is set0＝[r h θ 1]After the workpiece rotates by an angle delta theta, the corresponding coordinate on the plane of the detector changes, P0After rotation, its seating mark on the workpiece is marked P0_2＝[r h θ+Δθ 1]Finding P according to the mapping relation in step c0And P0_2Projection coordinates (P) on the detector plane6xP6y)、(P6x_2、P6y_2) Comprises the following steps:
P6x＝[Δx2-(l1+l2)×(Δx1+Δx2-r×sinθ)/(l1-r×cosθ)+0.5×Wx]/Srb
P6y＝[Δy2-(l1+l2)×(Δy1+Δy2-h)/(l1-r×cosθ)+0.5×Wy]/Srb
P6x_2＝[Δx2-(l1+l2)×(Δx1+Δx2-r×sin(θ+Δθ))/(l1-r×cos(θ+Δθ))+0.5×wx]/Srb
P6y_2＝[Δy2-(l1+l2)×(Δy1+Δy2-h)/(l1-r×cos(θ+Δθ))+0.5×wy]/Srb
slave probeThe detector detects P on the image6、P6_2Substituting the coordinates into an equation to solve parameters h, theta and delta theta;
in solving, the workpiece coordinate points are discretized into a series of points [ r h ]dθd1]Setting the rotation angle delta theta of the workpiece to change within a certain range, and respectively calculating the coordinate positions (P) of the workpiece on the detector plane before and after the rotation delta theta is applied to the workpiece for all discrete pointsd 6x，Pd 6y)、(Pd 6x_2、Pd 6y_2) The calculated coordinate position is compared with the defect coordinate position (P) obtained on the inspection image6xP6y)、(P6x_2、P6y_2) Distance analysis was performed to find discrete points satisfying the following conditions [ r hdθd1]Namely defect coordinate points:
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| CN114199905B (en) * | 2021-12-13 | 2024-02-20 | 中国航发南方工业有限公司 | Space positioning method and system for internal defects of casing |
| CN114200532A (en) * | 2021-12-14 | 2022-03-18 | 中国航发南方工业有限公司 | Device and method for detecting excess in casting case of aero-engine |
| CN114200532B (en) * | 2021-12-14 | 2024-05-14 | 中国航发南方工业有限公司 | Device and method for detecting residues in casting case of aero-engine |
| CN114152637A (en) * | 2022-02-07 | 2022-03-08 | 东莞市志橙半导体材料有限公司 | Hard silicon carbide material punching detection device and method |
| CN114152637B (en) * | 2022-02-07 | 2022-04-26 | 东莞市志橙半导体材料有限公司 | Hard silicon carbide material punching detection device and method |
| CN116485739A (en) * | 2023-04-13 | 2023-07-25 | 华中科技大学 | Casting defect three-dimensional intelligent positioning method and system based on multi-angle flaw detection image |
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