CN111113225A - Semiconductor material polishing and grinding device - Google Patents
Semiconductor material polishing and grinding device Download PDFInfo
- Publication number
- CN111113225A CN111113225A CN201911402993.4A CN201911402993A CN111113225A CN 111113225 A CN111113225 A CN 111113225A CN 201911402993 A CN201911402993 A CN 201911402993A CN 111113225 A CN111113225 A CN 111113225A
- Authority
- CN
- China
- Prior art keywords
- frame
- sliding
- semiconductor material
- material conveying
- conveying clamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
The invention discloses a semiconductor material polishing and grinding device which comprises a frame, wherein a material conveying clamp is arranged in the middle of the vertical end of the frame, the material conveying clamp is connected with the frame in a sliding mode through a rotating sleeve, the rotating sleeve is connected with the frame in a rotating mode through a bearing sleeve, clamping plates are symmetrically arranged on two sides of the inner surface wall of the material conveying clamp, the outer sides of the two clamping plates are elastically connected with the material conveying clamp through an extrusion spring, two groups of sliding rods are symmetrically welded on two sides of the vertical end of the frame through fixing blocks, two sliding rods are arranged on each group of sliding rods, the two sliding rods are respectively located on two sides of the horizontal end of the inner surface wall of the frame, sliding sleeves are sleeved on the four sliding rods, and a second driving motor is fixedly connected between the two sliding sleeves located at the bottom through a. The invention is suitable for the semiconductor material polishing and grinding device for improving the processing quality and efficiency.
Description
Technical Field
The invention belongs to the technical field of semiconductor processing equipment, and particularly relates to a semiconductor material polishing and grinding device.
Background
The semiconductor material is a kind of electronic material with semiconductor performance (the conductivity is between conductor and insulator, the resistivity is in the range of about 1m omega cm-1G omega cm), can be used for making semiconductor device and integrated circuit, the semiconductor material needs to polish and grind before processing and using, will need to use the polishing and grinding device of semiconductor material while polishing and grinding, however the existing polishing and grinding device still has the deficiency in the course of using, first of all, the existing semiconductor material is often fixed by fixing way of clamp in the course of processing, such fixed way makes the semiconductor material very apt to lead to the fracture or bending of the semiconductor because of receiving the pressure in the course of polishing or grinding, has reduced the quality processed; secondly, the semiconductor often polishes and the separation of grinding apparatus in the course of working for the course of working is gathered and is needed to remove the semiconductor, and the in-process of removing will need carry out the secondary and fix, has increased manufacturing procedure, has reduced machining efficiency.
Disclosure of Invention
The invention aims to: in order to solve the problems of low quality and low efficiency in the polishing and grinding production process, a semiconductor material polishing and grinding device is provided.
The technical scheme adopted by the invention is as follows:
the semiconductor material polishing and grinding device comprises a frame, wherein a material conveying clamp is arranged in the middle position of the vertical end of the frame, the material conveying clamp is connected with the frame in a sliding mode through a rotating sleeve, the rotating sleeve is connected with the frame in a rotating mode through a bearing sleeve, clamping plates are symmetrically arranged on two sides of the inner surface wall of the material conveying clamp, the outer sides of the two clamping plates are elastically connected with the material conveying clamp through an extrusion spring, two groups of sliding rods are symmetrically welded on two sides of the vertical end of the frame through fixing blocks, each group of sliding rods is provided with two sliding rods, the two sliding rods are respectively located on two sides of the horizontal end of the inner surface wall of the frame, sliding sleeves are sleeved on the four sliding rods, a second driving motor is fixedly connected between the two sliding sleeves located at the bottom through a connecting rod bolt, a polishing barrel is arranged between the two sliding sleeves at the top, and a grinding plate, one side of the horizontal end of the polishing barrel is rotatably connected with the corresponding sliding sleeve through a rotating shaft, the other side of the horizontal end of the polishing barrel is fixedly connected with the corresponding sliding sleeve through a first driving motor and a corresponding sliding sleeve bolt, and the polishing barrel is in transmission connection with an output shaft of the first driving motor.
Wherein, defeated material anchor clamps and rotate and overlap between pass through spout sliding connection.
Wherein, the length of defeated material anchor clamps is greater than the twice of frame internal width.
Wherein, the vertical end both sides of sliding sleeve all pass through extension spring and fixed block elastic connection.
Wherein the top of the grinding plate is provided with grinding paint.
The extrusion springs are arranged in a plurality of numbers, and two adjacent intervals in the extrusion springs are equal.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:
1. according to the semiconductor material conveying clamp, the material conveying clamp is of an annular structure, a semiconductor material can be clamped in the middle position through the clamping plate, two sides of the clamping plate are attached to the semiconductor material through the extrusion springs, the clamping plate can guarantee uniform stress of the semiconductor material in the processing process, the semiconductor material is prevented from being bent and damaged, and the processing quality is improved.
2. According to the invention, the top of the frame is provided with the polishing barrel, the bottom of the frame is provided with the grinding plate, the polishing barrel is driven by the first driving motor to rotate, the grinding plate is driven by the second driving motor to rotate, the semiconductor material can be polished and ground simultaneously in the processing process, and the semiconductor material can be rotated at two ends of the material conveying clamp through the rotation of the bearing sleeve, so that the semiconductor material can be processed comprehensively, the semiconductor material does not need to be fixed again, the processing procedures are reduced, and the processing efficiency is improved.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic view of the internal structure of the bearing housing of the present invention;
FIG. 3 is a top view of a part of the structure of a feeding jig of the present invention.
The labels in the figure are: 1. a grinding plate; 2. a material conveying clamp; 3. a first drive motor; 4. a frame; 5. a slide bar; 6. an extension spring; 7. a sliding sleeve; 8. a polishing cartridge; 9. a bearing housing; 10. rotating the sleeve; 11. a connecting rod; 12. a second drive motor; 13. a clamping plate; 14. compressing the spring.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1-3, a semiconductor material polishing and grinding device comprises a frame 4, a material conveying clamp 2 is arranged at the middle position of the vertical end of the frame 4, the material conveying clamp 2 is connected with the frame 4 in a sliding manner through a rotating sleeve 10, the rotating sleeve 10 is connected with the frame 4 in a rotating manner through a bearing sleeve 9, clamping plates 13 are symmetrically arranged on two sides of the inner surface wall of the material conveying clamp 2, the outer sides of the two clamping plates 13 are elastically connected with the material conveying clamp 2 through extrusion springs 14, two groups of sliding rods 5 are symmetrically welded on two sides of the vertical end of the frame 4 through fixing blocks, each group of sliding rods 5 is provided with two, the two sliding rods 5 are respectively arranged on two sides of the horizontal end of the inner surface wall of the frame 4, sliding sleeves 7 are sleeved on the four sliding rods 5, a second driving motor 12 is fixedly connected between the two sliding sleeves 7 at the bottom through connecting rods 11 by bolts, the top of the second driving motor 12 is connected with the grinding plate 1 through an output shaft in a transmission manner, one side of the horizontal end of the polishing barrel 8 is rotatably connected with the corresponding sliding sleeve 7 through a rotating shaft, the other side of the horizontal end of the polishing barrel is fixedly connected with the corresponding sliding sleeve 7 through a first driving motor 3 and a bolt, and the polishing barrel 8 is connected with the output shaft of the first driving motor 3 in a transmission manner.
Defeated material anchor clamps 2 and rotate and overlap 10 between through spout sliding connection, the length of defeated material anchor clamps 2 is greater than the twice of frame 4 internal width, and extension spring 6 and fixed block elastic connection are all passed through to the vertical end both sides of sliding sleeve 7, and the top of lapping plate 1 is provided with the grinding coating, and extrusion spring 14 is provided with a plurality ofly altogether, and two adjacent intervals in a plurality of extrusion springs 14 equal.
The vertical end both sides of sliding sleeve 7 all are connected with the fixed block spring through extension spring 6, and extension spring 6 will keep sliding sleeve 7's stability when can make sliding sleeve 7 move on slide bar 5 for polishing barrel 8 and abrasive disc 1 all can adapt to the not semiconductor material of equidimension and process, have improved the application range of device.
The working principle is as follows: when the polishing device is used, the material conveying clamp 2 is moved to one side outside the frame 4, then a semiconductor material is placed between the two clamping plates 13, the two clamping plates 13 are attached to the outer surface of the semiconductor material under the action of the extrusion spring 14, so that the semiconductor material is fixed, the semiconductor material is prevented from being bent due to stress in the processing process, the processing quality is improved, then the material conveying clamp 2 is slid through the chute in the rotating sleeve 10, the semiconductor material is moved into the frame 4, the first driving motor 3 and the second driving motor 12 are started, the first driving motor 3 drives the polishing barrel 8 to rotate, the second driving motor 12 drives the grinding plate 1 to rotate, and the polishing barrel 8 and the grinding plate 1 are both contacted with the surface of the semiconductor material through the sliding sleeve 7, so that the semiconductor material is polished and ground simultaneously, the processing efficiency is improved.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (6)
1. Semiconductor material polishing grinder, including frame (4), characterized by: the material conveying device is characterized in that a material conveying clamp (2) is arranged in the middle of the vertical end of the frame (4), the material conveying clamp (2) is connected with the frame (4) in a sliding mode through a rotating sleeve (10), the rotating sleeve (10) is connected with the frame (4) in a rotating mode through a bearing sleeve (9), clamping plates (13) are symmetrically arranged on two sides of the inner surface wall of the material conveying clamp (2), the outer sides of the two clamping plates (13) are elastically connected with the material conveying clamp (2) through extrusion springs (14), two groups of sliding rods (5) are symmetrically welded on two sides of the vertical end of the frame (4) through fixing blocks, two groups of sliding rods (5) are arranged on each group of the sliding rods (5), the two sliding rods (5) are respectively located on two sides of the horizontal end of the inner surface wall of the frame (4), sliding sleeves (7) are sleeved on the four sliding rods (5), and a second driving motor (12) is fixedly connected between the two sliding sleeves (7) located at, be provided with polishing barrel (8) between two at top, the top of second driving motor (12) is connected with abrasive disc (1) through output shaft transmission, the horizontal end one side of polishing barrel (8) is connected through the pivot rotation with corresponding sliding sleeve (7), and the opposite side is through first driving motor (3) and corresponding sliding sleeve (7) bolt fixed connection, and wherein polishing barrel (8) is connected with the output shaft transmission of first driving motor (3).
2. The semiconductor material polishing abrasive device according to claim 1, characterized in that: the material conveying clamp (2) is connected with the rotating sleeve (10) in a sliding mode through a sliding groove.
3. The semiconductor material polishing abrasive device according to claim 1, characterized in that: the length of the material conveying clamp (2) is more than twice of the inner width of the frame (4).
4. The semiconductor material polishing abrasive device according to claim 1, characterized in that: and both sides of the vertical end of the sliding sleeve (7) are elastically connected with the fixed block through extension springs (6).
5. The semiconductor material polishing abrasive device according to claim 1, characterized in that: the top of the grinding plate (1) is provided with grinding paint.
6. The semiconductor material polishing abrasive device according to claim 1, characterized in that: the extrusion springs (14) are arranged in a plurality, and two adjacent extrusion springs (14) are equal in distance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911402993.4A CN111113225A (en) | 2019-12-31 | 2019-12-31 | Semiconductor material polishing and grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911402993.4A CN111113225A (en) | 2019-12-31 | 2019-12-31 | Semiconductor material polishing and grinding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111113225A true CN111113225A (en) | 2020-05-08 |
Family
ID=70505831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911402993.4A Pending CN111113225A (en) | 2019-12-31 | 2019-12-31 | Semiconductor material polishing and grinding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111113225A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117309598A (en) * | 2023-10-17 | 2023-12-29 | 徐州新兴达克罗科技有限公司 | Bolt detection equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105291213A (en) * | 2015-11-25 | 2016-02-03 | 南京林业大学 | Intelligent excavating and repairing device for wood surface defects |
| CN205552159U (en) * | 2016-02-18 | 2016-09-07 | 东莞市顺怡隆机械科技有限公司 | Planer -type twin polishing machine |
| CN107617907A (en) * | 2017-11-13 | 2018-01-23 | 深圳科易设计服务有限公司 | A kind of novel steel tube punches positioner |
| CN209207159U (en) * | 2018-12-16 | 2019-08-06 | 泰州鼎鑫齿轮有限公司 | A kind of mechanical gear processing unit (plant) |
-
2019
- 2019-12-31 CN CN201911402993.4A patent/CN111113225A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105291213A (en) * | 2015-11-25 | 2016-02-03 | 南京林业大学 | Intelligent excavating and repairing device for wood surface defects |
| CN205552159U (en) * | 2016-02-18 | 2016-09-07 | 东莞市顺怡隆机械科技有限公司 | Planer -type twin polishing machine |
| CN107617907A (en) * | 2017-11-13 | 2018-01-23 | 深圳科易设计服务有限公司 | A kind of novel steel tube punches positioner |
| CN209207159U (en) * | 2018-12-16 | 2019-08-06 | 泰州鼎鑫齿轮有限公司 | A kind of mechanical gear processing unit (plant) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117309598A (en) * | 2023-10-17 | 2023-12-29 | 徐州新兴达克罗科技有限公司 | Bolt detection equipment |
| CN117309598B (en) * | 2023-10-17 | 2024-04-12 | 徐州新兴达克罗科技有限公司 | Bolt detection equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200508 |
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| RJ01 | Rejection of invention patent application after publication |