CN111110262A - X-ray imaging system and X-ray imaging method - Google Patents
X-ray imaging system and X-ray imaging method Download PDFInfo
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- CN111110262A CN111110262A CN202010014060.4A CN202010014060A CN111110262A CN 111110262 A CN111110262 A CN 111110262A CN 202010014060 A CN202010014060 A CN 202010014060A CN 111110262 A CN111110262 A CN 111110262A
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Abstract
The invention discloses an X-ray imaging system and an X-ray imaging method. An X-ray imaging system includes: an emitting device for emitting collimated X-rays; the modulation device is arranged between the emission device and the object to be measured and is used for modulating the collimated X rays and forming a modulated light field; the single-pixel detection device is arranged on one side of the object to be detected, which is far away from the modulation device, and is used for collecting a measurement signal of the X-ray after passing through the modulation device and the object to be detected; and the processing device is connected with the single-pixel detection device and used for performing spatial correlation calculation on the measurement signal and a pre-stored reference signal to obtain an image of the object to be detected. According to the embodiment of the invention, the modulation device is arranged, so that the image of the object to be measured is obtained based on the spatial incidence relation of the reference signal and the measurement signal. The single-pixel detection device is adopted to collect the measurement signal, so that the sampling time of the object to be detected is reduced, the X-ray intensity is attenuated to the single-photon magnitude, and the damage to the living body is effectively reduced.
Description
Technical Field
The present invention relates to the field of X-ray imaging technologies, and in particular, to an X-ray imaging system and an X-ray imaging method.
Background
Since roentgen discovered in 1985 and applied to the medical imaging field, the medical X-ray imaging technology is rapidly developed and popularized, occupies the largest share of the medical imaging field at present, and has wide application in human disease diagnosis and health care. Since the object to be measured is a living body, the medical X-ray image develops toward low dose and high imaging quality.
The traditional X-ray imaging usually depends on a flat panel detection device with high imaging quality, such as amorphous silicon, Complementary Metal Oxide Semiconductor (CMOS), etc., the pixel size of the traditional X-ray imaging usually is about 100 μm, and taking a Varex4343R product as an example, the pixel number can reach more than 1024 × 1024. The production of the flat panel detection device relates to a plurality of mask (mask) processes such as photoetching, evaporation and the like, and the flat panel detection device has the advantages of complex process, high cost and low yield.
At present, in order to obtain a clear image, an X-ray imaging system needs to expose a living body to X-rays for a long enough time, which inevitably causes great damage to the living body.
Disclosure of Invention
The embodiment of the invention provides an X-ray imaging system, which is used for solving the problem that the existing X-ray imaging system causes great damage to a living body.
In order to solve the above problem, an embodiment of the present invention provides an X-ray imaging system, including:
an emitting device for emitting collimated X-rays;
the modulation device is arranged between the emission device and the object to be measured and is used for modulating the collimated X rays and forming a modulated light field;
the single-pixel detection device is arranged on one side of the object to be detected, which is far away from the modulation device, and is used for collecting a measurement signal of the X-ray after passing through the modulation device and the object to be detected;
and the processing device is connected with the single-pixel detection device and used for performing spatial correlation calculation on the measurement signal and a pre-stored reference signal to obtain an image of the object to be detected.
Optionally, the emitting device includes an X-ray emitting source and a collimator disposed in a light emitting direction of the X-ray emitting source, the collimator includes a collimating plate having a small hole, and the X-ray emitted from the X-ray emitting source forms a collimated X-ray through the small hole.
Alternatively, the X-ray emission source includes a monochromatic X-ray emission source or a non-monochromatic X-ray emission source.
Optionally, the modulation device comprises a modulator and a driver, the modulator is disposed on the driver, and the driver is configured to drive the modulator to move in a plane perpendicular to the collimated X-rays.
Optionally, the modulator includes a substrate and a plurality of modulation blocks arranged in an array on the substrate, and the shape of the modulation blocks in a plane perpendicular to the collimated X-rays includes a circle, an ellipse, a rectangle, a regular polygon, a trapezoid, or a triangle.
Optionally, the equivalent length of the modulation blocks is 5 μm to 20 μm, the equivalent width of the modulation blocks is 5 μm to 20 μm, and the gap between adjacent modulation blocks is less than or equal to 10 μm.
Optionally, the thickness of the modulation block is 50 μm-900 μm in a plane parallel to the collimated X-rays.
Optionally, the material of the modulation block comprises one or more of alumina, silica, silicon carbide and silicon nitride.
Optionally, the modulator further includes a buffer layer covering the modulation block and a protective layer disposed on the buffer layer.
Optionally, the system further comprises a flat panel detection device and a position exchange mechanism, wherein the flat panel detection device is arranged on the position exchange mechanism, and the position exchange mechanism is used for exchanging the flat panel detection device to a test position of an object to be tested, so that the flat panel detection device collects a reference signal of the X-ray modulated by the modulation device; the reference signal is a light intensity distribution signal of the modulated light field.
The embodiment of the invention also provides an X-ray imaging method, which comprises the following steps:
emitting collimated X-rays;
the modulation device modulates the collimated X-ray to form a modulated light field;
collecting a measuring signal of the X-ray after passing through a modulation device and an object to be measured;
and performing spatial correlation calculation on the measurement signal and a pre-stored reference signal to obtain an image of the object to be measured.
Optionally, the modulation device includes a modulator and a driver, and the modulation device modulates the collimated X-ray to form a modulated light field, including: the driver drives the modulator to move in a plane vertical to the collimated X rays to modulate the collimated X rays to form a modulated light field; wherein the movement comprises a rotational movement or a linear movement.
Optionally, the acquiring a measurement signal of the collimated X-ray after passing through the modulation device and the object to be measured includes: a single-pixel detection device is adopted to collect a measurement signal of collimated X-rays after passing through a modulation device and an object to be measured; the measurement signal is the total light intensity signal.
Optionally, the X-ray imaging method further includes: a flat panel detection device is adopted to collect a reference signal of the X-ray after passing through the modulation device; the reference signal is a light intensity distribution signal of the modulated light field.
According to the X-ray imaging system and the X-ray imaging method provided by the embodiment of the invention, the modulation device for forming the modulation light field is arranged, so that the purpose of obtaining the image of the object to be measured based on the spatial incidence relation of the reference signal and the measurement signal is realized. The single-pixel detection device is adopted to collect the measurement signal, so that the sampling time of the object to be detected is reduced, the X-ray intensity can be attenuated to a single photon magnitude, the radiation dose received by the living body is reduced, and the damage to the living body is effectively reduced.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the example serve to explain the principles of the invention and not to limit the invention.
FIG. 1 is a block diagram of an X-ray imaging system in accordance with an embodiment of the present invention;
FIG. 2 is a diagram of an X-ray imaging system according to an embodiment of the present invention;
FIG. 3 is a block diagram of a modulator according to an embodiment of the present invention;
FIG. 4 is a plan view of a modulator according to an embodiment of the present invention;
FIG. 5 is a block diagram after forming a modulation block pattern according to an embodiment of the present invention;
fig. 6 is a structural diagram of the buffer layer after being formed according to the embodiment of the invention.
Drawings
10-a transmitting device; 11-an X-ray emission source; 12-a collimator;
20-a modulation device; 21-a modulator; 22-a driver;
30-single pixel detection means; 40-a processing device; 50-flat panel detection device;
60-an object to be measured; 211-a substrate; 212-a modulation block;
213-a buffer layer; 214-protective layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that the embodiments and features of the embodiments in the present application may be arbitrarily combined with each other without conflict.
The ghost imaging technology is an indirect imaging technology based on intensity correlation, and comprises the steps of collecting light field distribution incident on an object through a flat panel detection device, collecting light transmitted or reflected from the object through a single-pixel detection device, and carrying out spatial correlation calculation on signals collected by the flat panel detection device and signals collected by the single-pixel detection device to obtain an image of the object to be detected. The image of the ghost imaging technology can have high resolution exceeding the diffraction limit of Rayleigh, is not influenced by the environment, is subjected to development of entangled two-photon ghost imaging, pseudo-thermophotoghost imaging, true-thermophotoghost imaging, emitted-light ghost imaging, computed ghost imaging and the like in sequence, and has high application potential in the aspects of microscopes, long-distance laser radars and the like. If the ghost imaging can be applied to medical X-ray imaging, the exposure dose of the object light can be greatly reduced and the damage to the living body can be reduced by separating the reference light from the object light. But the X-ray imaging is limited by the strong transmission capability of the X-ray, the common beam splitter does not have the light splitting effect, and the development of the X-ray ghost imaging is limited.
In order to solve the problem that the existing X-ray imaging system causes great damage to a living body, an embodiment of the present invention provides an X-ray imaging system, including:
an emitting device for emitting collimated X-rays;
the modulation device is arranged between the emission device and the object to be measured and is used for modulating the collimated X rays and forming a modulated light field;
the single-pixel detection device is arranged on one side of the object to be detected, which is far away from the modulation device, and is used for collecting a measurement signal of the X-ray after passing through the modulation device and the object to be detected;
and the processing device is connected with the single-pixel detection device and used for performing spatial correlation calculation on the measurement signal and a pre-stored reference signal to obtain an image of the object to be detected.
According to the X-ray imaging system provided by the embodiment of the invention, the modulation device for forming the modulation light field is arranged, so that the image of the object to be measured is obtained based on the spatial incidence relation of the reference signal and the measurement signal. The single-pixel detection device is adopted to collect the measurement signal, so that the sampling time of the object to be detected is reduced, the X-ray intensity can be attenuated to a single photon magnitude, the radiation dose received by the living body is reduced, and the damage to the living body is effectively reduced.
Fig. 1 is a block diagram of an X-ray imaging system according to an embodiment of the present invention. As shown in fig. 1:
the X-ray imaging system comprises an emitting device 10, a modulation device 20, a single-pixel detection device 30 and a processing device 40. The modulation device 20 is arranged between the emitting device 10 and the object 60 to be tested, and the single-pixel detection device 30 is arranged on the side of the object 60 to be tested, which is far away from the modulation device 20, and is connected with the processing device 40.
The emitting device 10 is used for generating collimated X-rays. The emitting device 10 includes an X-ray emitting source 11 and a collimator 12. The X-ray emission source 11 is used for emitting X-rays, and the collimator 12 is disposed in the light emitting direction of the X-ray emission source 11 for forming collimated X-rays. Specifically, the collimator 12 includes a collimating plate having a small hole, and the X-ray emitted from the X-ray emitting source 11 passes through the small hole to form a collimated X-ray. The X-ray emission source 11 may be a general X-ray emission source without monochromaticity, that is, the X-ray emission source 11 includes a monochromaticity X-ray emission source or a non-monochromaticity X-ray emission source. The collimation plates are made of a material that is opaque to X-rays, such as lead (Pb).
The modulation device 20 is used for modulating the collimated X-rays to form a modulated light field. The modulation device 20 comprises a modulator 21 and a driver 22. The modulator 21 is arranged on a driver 22, and the driver 22 can drive the modulator 21 to move in a plane perpendicular to the collimated X-rays. The motion comprises rotation motion or linear motion, and the linear motion comprises up-down movement, left-right movement and combination of the above motion modes. The driver 22 may employ a motor, such as a stepping motor.
The single-pixel detection device 30 is used for collecting the measurement signal of the X-ray after passing through the modulation device and the object to be measured. Specifically, the single-pixel detection device 30 collects a total light intensity signal of the transmitted and scattered X-rays through the object to be measured to form a measurement signal, and the measurement signal is a light intensity value. The single pixel detection device 30, also referred to as a bucket detection device, has no spatial resolution capability, and thus, compared to a flat panel detection device, the single pixel detection device is less expensive to manufacture, which in turn reduces the cost of the entire X-ray imaging system.
And the processing device 40 is used for performing spatial correlation calculation on the measurement signal and a prestored reference signal to obtain an image of the object to be measured. The reference signal is a light intensity distribution signal of the modulated light field. The processing device 40 performs spatial correlation calculation on the reference signal and the measurement signal to obtain an image of the object to be measured. For the spatial correlation calculation method, a ghost imaging technique spatial correlation calculation method may be adopted, and details are not repeated here.
In this embodiment, the diameter of the small hole is 8 μm-1000 μm, and the distance between the collimator and the object to be measured is 80mm-500 mm. Optionally, when the wavelength of the X-ray is 1nm, the diameter of the small hole is 10 small holes, and the distance between the collimator and the object to be measured is 100 mm.
Based on the ghost imaging technology theory, the imaging resolution, the visibility and the signal-to-noise ratio of the X-ray imaging system are independent of the X-ray light intensity, so that compared with the traditional X-ray imaging, under the condition of weak light, the signal-to-noise ratio higher than that of the traditional X-ray imaging can be obtained. Meanwhile, because the signal-to-noise ratio of the X-ray imaging system is positively correlated with the measurement times, when an image with the same definition as that of the traditional X-ray imaging is obtained, the X-ray intensity can be attenuated to a single photon magnitude by reducing the sampling time of the object to be measured each time, and the signal-to-noise ratio is increased by increasing the measurement times of the object to be measured, namely, when a reference signal is obtained, the light field information can be modulated by adopting X-ray measurement for many times and large dose, and when a measurement signal is obtained, the extremely low radiation dose (single photon level) can be selected.
Compared with the prior X-ray imaging system, the X-ray imaging system provided by the embodiment of the invention separates the acquisition of the reference signal from the acquisition of the measurement signal, and attenuates the X-ray intensity to a single photon magnitude by reducing the sampling time of an object to be detected each time under the condition of ensuring the definition of the X-ray imaging based on the spatial correlation relationship between the reference signal and the measurement signal, thereby reducing the radiation dose received by a living body and reducing the damage to the living body.
The technical solution of this embodiment is further explained by the working process of the X-ray imaging system of this embodiment, and fig. 2 is a working process diagram of the X-ray imaging system of this embodiment of the present invention, as shown in fig. 2:
(1) acquiring a reference signal of a modulated light field: the X-ray emission source 11 emits X-rays which form collimated X-rays through small holes in the collimating plate, the modulator 21 moves at a constant speed along the vertical direction and the horizontal direction in the plane under the driving of the driver 22 to modulate the collimated X-rays to form a modulated optical field, and the high-precision flat panel detection device 50 is used for collecting light intensity distribution signals, namely reference signals, of the X-rays after passing through the modulation device for multiple times. The data of the reference signal can be stored in the processing device of the X-ray imaging system for sale, and can also be stored in a storage medium such as a USB flash disk.
(2) Acquiring a measurement signal of an object: according to the test method and process of measuring the reference signal by the supplier of the X-ray imaging system, the user of the X-ray imaging system modulates the X-ray in the same way to form a modulated light field, the object to be measured 60 stands at the test position, the test position is the same as the placement position of the flat panel detection device in the process, and the single-pixel detection device 30 (also called barrel detection device) collects the total light intensity signal of the X-ray after passing through the modulation device and the object to be measured for many times, namely the measurement signal, wherein the total light intensity signal comprises the light intensity signal which penetrates through the object to be measured and is scattered by the object to be measured. In the step, under the condition of meeting the X-ray imaging definition, the single exposure time of the object to be detected can be reduced as much as possible, and further the radiation dose received by the object to be detected is reduced.
(3) And (3) spatial correlation calculation: and performing spatial correlation calculation on the measurement signal and the reference signal through a processing device to obtain an image of the object to be measured.
In the above process, when the reference signal of the modulated light field is obtained, the exposure time of the flat panel detection device can be increased as much as possible, so as to increase the intensity of the reference signal to obtain a clear modulated light field speckle pattern. The process of acquiring the reference signal of the modulated light field may be performed by an X-ray imaging system vendor.
Based on the inventive concept of the present invention, in order to ensure the reproducibility of the modulated light field, the present application provides a modulator, which includes a substrate and a plurality of modulation blocks arranged in an array on the substrate.
Fig. 3 and 4 show the structure of a modulator according to an embodiment of the present invention, fig. 3 is a structural diagram of the modulator according to the embodiment of the present invention, fig. 4 is a plan view of the modulator according to the embodiment of the present invention, and as shown in fig. 3 and 4, the modulator 21 includes:
a substrate 211;
a plurality of modulation blocks 212 arranged in an array on a substrate 211;
a buffer layer 213 covering the modulation block 212;
a protection layer 214 disposed on the buffer layer 213.
As shown in fig. 4, a plurality of rectangular arrays of modulation blocks 212. The modulation block 212 is rectangular in a plane perpendicular to the collimated X-rays.
It should be noted that the shape of the modulation block in the plane perpendicular to the collimated X-rays also includes a circle, a triangle, a regular polygon, or a trapezoid. The array mode of the modulation block also comprises a dislocation array. The staggered array refers to that a plurality of modulation blocks are arranged in a plurality of rows, arranged at equal intervals in the same row and arranged at staggered positions in adjacent rows, or a plurality of modulation blocks are arranged in a plurality of rows, arranged at equal intervals in the same row and arranged at staggered positions in adjacent rows.
In the present embodiment, the equivalent length of the modulation block is 5 μm to 20 μm, and the equivalent width of the modulation block is 5 μm to 20 μm. The gap between adjacent modulation blocks is 10 μm or less. The thickness of the modulation block is 50 μm-900 μm in a plane parallel to the collimated X-rays. Preferably, the thickness of the modulation block is 100 μm to 500 μm.
In this embodiment, the modulation block may have a single-layer structure or a multi-layer structure. The material of the modulation block comprises aluminum oxide (Al)2O3) Silicon oxide (SiO)x) Silicon carbide (SiC) and silicon nitride (SiN)x) One or more of (a). When the modulation block has a single-layer structure, it comprises aluminum oxide (Al)2O3) Silicon oxide (SiO)x) Silicon carbide (SiC) and silicon nitride (SiN)x) One of the above two methods; when the modulation block has a multilayer structure, it comprises aluminum oxide (Al)2O3) Silicon oxide (SiO)x) Silicon carbide (SiC) and silicon nitride (SiN)x) In combination of at least two kinds, e.g. silicon nitride (SiN)x) Silicon oxide (SiO)x) Or silicon carbide (SiC)/silicon nitride (SiN)x) Or aluminum oxide (Al)2O3) Silicon oxide (SiO)x) Silicon nitride (SiN)x) This is not exhaustive.
In the present embodiment, a glass substrate, a quartz substrate, a sapphire substrate, or a Polyimide (PI) substrate may be used as the substrate. The material of the buffer layer can adopt photoresist, and the photoresist comprises phenolic resin based photoresist, polymethacrylate based photoresist or epoxy resin based photoresist. The protective layer may be a glass layer, a polyimide layer, a sapphire layer, or a quartz layer.
The technical scheme of the modulator of this embodiment is further illustrated by the preparation process of the modulator of this embodiment. The "patterning process" in this embodiment includes processes of depositing a film, coating a photoresist, exposing a mask, developing, etching, and stripping the photoresist, and is a well-established manufacturing process in the related art. The deposition can be performed by known processes such as sputtering, evaporation, chemical vapor deposition, etc. The etching may be performed by a known method, and is not particularly limited. In the description of the present embodiment, it is to be understood that "thin film" refers to a layer of a material deposited or coated on a substrate. The "thin film" may also be referred to as a "layer" if it does not require a patterning process or a photolithography process throughout the fabrication process. If a patterning process or a photolithography process is required for the "thin film" in the entire manufacturing process, the "thin film" is referred to as a "thin film" before the patterning process, and the "layer" after the patterning process. The "layer" after the patterning process or the photolithography process includes at least one "pattern".
(1) A plurality of modulation block patterns are formed. Forming the plurality of modulation block patterns includes: depositing a modulation block film on a substrate 211, patterning the modulation block film by using a patterning process to form a plurality of modulation blocks 212 arranged in an array, as shown in fig. 5, where fig. 5 is a structural diagram after a plurality of modulation block patterns are formed according to an embodiment of the present invention;
(2) and forming a buffer layer. Forming the buffer layer includes: depositing or coating a buffer layer film on the substrate with the pattern, and then flattening the surface of the buffer layer film by etching or high-temperature baking to form a buffer layer 213, as shown in fig. 6, fig. 6 is a structural diagram after the buffer layer is formed according to the embodiment of the present invention;
(3) and forming a protective layer. The forming of the protective layer includes: a protective layer is covered on the substrate on which the buffer layer is formed, and the protective layer is laminated on the buffer layer to form the modulator structure shown in fig. 3.
As can be seen from the foregoing fabrication process of the modulator, embodiments of the present invention form a plurality of modulation blocks arranged in an array by depositing a modulation block thin film on a substrate and then patterning the modulation block thin film. Since the modulation block is capable of absorbing X-rays, differences in the amplitude and phase of X-rays passing through the gaps between the modulation block and the plurality of modulation blocks may occur, which may result in X-ray speckle. The modulator is driven by the driver to form a controllable modulated light field. Meanwhile, due to the arrangement of the modulation blocks, a clear X-ray speckle pattern can be formed, and the modulation method is beneficial to later-stage modulation light field reconstruction. In the actual X-ray imaging process, the modulated light field can be effectively controlled by controlling the movement of the modulator according to actual requirements, and the imaging quality of the X-ray imaging system is improved.
The embodiment of the invention provides an X-ray imaging system, which at least comprises the following beneficial effects:
1. compared with the prior X-ray imaging, the X-ray imaging system provided by the embodiment realizes the separation of reference signal acquisition and measurement signal acquisition, and can attenuate the X-ray intensity to a single photon magnitude by reducing the sampling time of an object to be detected each time under the condition of obtaining an X-ray image with the same definition based on the spatial correlation relationship of the reference signal and the measurement signal, thereby greatly reducing the radiation dosage borne by a living body;
2. the reference signal and the measurement signal can be acquired separately, so that the use of a beam splitter is omitted, the problem that no proper beam splitter is available at present due to strong penetrability of X-rays is solved, and the investment cost of an X-ray imaging system is reduced;
3. the reference signal in the pre-existing processing device of the X-ray imaging system can be measured and provided by an X-ray imaging system supplier, a flat panel detection device with high imaging quality is not needed, and the problems that the circuit design and the preparation process of the flat panel detection device with high imaging quality are complex, the cost is high and lower yield is easily caused are solved, so that the overall cost of the X-ray imaging system is reduced, and the reliability of the X-ray imaging system is improved;
4. the X-ray imaging system adopts the single-pixel detection device to detect the measurement signal, and avoids the situation that light energy similar to the traditional X-ray imaging light energy needs to be distributed on each pixel of the flat panel detection device, thereby improving the intensity of the measurement signal, reducing the influence of shot noise and improving the signal-to-noise ratio.
The embodiment of the invention also provides an X-ray imaging system, which comprises a flat panel detection device for acquiring the reference signal besides the technical scheme of the embodiment, wherein the flat panel detection device can be exchanged to the test position of the object to be tested, so that the flat panel detection device acquires the reference signal of the X-ray after passing through the adjustment device; the reference signal is a light intensity distribution signal of the modulated light field.
Specifically, the flat panel detection device is arranged on the position exchange mechanism, and the position exchange mechanism is used for exchanging the flat panel detection device to the test position of the object to be tested, so that the flat panel detection device collects a reference signal of the X-ray after passing through the adjustment device. The position exchanging mechanism may be a lifting mechanism, a translating mechanism or a rotating mechanism, and is not limited herein.
The X-ray imaging system provided by the embodiment of the invention avoids the imaging deviation of the X-ray imaging system caused by the possible difference between the modulation device and the emission device in the reference signal acquisition system and the measurement signal acquisition system, and can ensure the parallelism of the test. Meanwhile, the X-ray imaging system can adjust the exposure time of the measurement signal by adjusting the exposure time of the reference signal according to actual conditions, and has the characteristic of high flexibility.
Based on the inventive concept of the present invention, an embodiment of the present invention provides an X-ray imaging method, including:
(1) emitting collimated X-rays;
(2) the modulation device modulates the collimated X-ray to form a modulated light field;
(3) collecting a measuring signal of the collimated X-ray after passing through a modulation device and an object to be measured;
(4) and performing spatial correlation calculation on the measurement signal and a pre-stored reference signal to obtain an image of the object to be measured.
Wherein, emitter includes X ray emission source and collimator, and the collimator includes the collimation board that sets up the aperture.
Wherein, step (1) includes: x-rays emitted by the X-ray emission source pass through the small hole to form collimated X-rays.
The modulation device includes a modulator and a driver.
Wherein, step (2) includes:
the driver drives the modulator to move in a plane vertical to the collimated X rays to modulate the collimated X rays to form a modulated light field; wherein the movement comprises a rotational movement or a linear movement.
Wherein, step (3) includes:
a single-pixel detection device is adopted to collect a measurement signal of collimated X-rays after passing through a modulation device and an object to be measured; the measurement signal is the total light intensity signal.
The X-ray imaging method of the embodiment further includes:
a flat panel detection device is adopted to collect a reference signal of the X-ray after passing through the modulation device; the reference signal is a light intensity distribution signal of the modulated light field.
According to the X-ray imaging method provided by the embodiment of the invention, the modulation device for forming the modulated light field is arranged, so that the image of the object to be measured is obtained based on the spatial incidence relation between the reference signal and the measurement signal, the sampling time of the object to be measured can be reduced, the X-ray intensity is attenuated to the single photon magnitude, the radiation dose received by the living body is reduced, and the damage to the living body is effectively reduced.
In the description of the present invention, it should be noted that the terms "upper", "lower", "one side", "the other side", "one end", "the other end", "side", "opposite", "four corners", "periphery", "mouth" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the structures referred to have specific orientations, are configured and operated in specific orientations, and thus, are not to be construed as limiting the present invention.
In the description of the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "connected," "directly connected," "indirectly connected," "fixedly connected," "mounted," and "assembled" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; the terms "mounted," "connected," and "fixedly connected" may be directly connected or indirectly connected through intervening media, or may be connected through two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Although the embodiments of the present invention have been described above, the above description is only for the convenience of understanding the present invention, and is not intended to limit the present invention. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (14)
1. An X-ray imaging system, comprising:
an emitting device for emitting collimated X-rays;
the modulation device is arranged between the emitting device and the object to be measured and is used for modulating the collimated X rays and forming a modulated light field;
the single-pixel detection device is arranged on one side of the object to be detected, which is far away from the modulation device, and is used for collecting a measurement signal of the X-ray after passing through the modulation device and the object to be detected;
and the processing device is connected with the single-pixel detection device and used for performing spatial correlation calculation on the measurement signal and a pre-stored reference signal to obtain an image of the object to be detected.
2. The X-ray imaging system of claim 1, wherein: the emitting device comprises an X-ray emitting source and a collimator, wherein the collimator is arranged in the light emitting direction of the X-ray emitting source and comprises a collimating plate provided with a small hole, and X-rays emitted by the X-ray emitting source form collimated X-rays through the small hole.
3. The X-ray imaging system of claim 2, wherein: the X-ray emission source includes a monochromatic X-ray emission source or a non-monochromatic X-ray emission source.
4. The X-ray imaging system of any one of claims 1-3, wherein: the modulation device comprises a modulator and a driver, wherein the modulator is arranged on the driver, and the driver is used for driving the modulator to move in a plane perpendicular to the collimated X-rays.
5. The X-ray imaging system of claim 4, wherein: the modulator comprises a substrate and a plurality of modulation blocks arrayed on the substrate, and the shapes of the modulation blocks in a plane perpendicular to the collimated X-rays comprise a circle, an ellipse, a rectangle, a regular polygon, a trapezoid or a triangle.
6. The X-ray imaging system of claim 5, wherein: the modulation blocks have an equivalent length of 5-20 μm, an equivalent width of 5-20 μm, and a gap between adjacent modulation blocks is 10 μm or less.
7. The X-ray imaging system of claim 5, wherein: the thickness of the modulation block in a plane parallel to the collimated X-rays is 50 μm-900 μm.
8. The X-ray imaging system of claim 5, wherein: the material of the modulation block comprises one or more of aluminum oxide, silicon carbide and silicon nitride.
9. The X-ray imaging system of claim 5, wherein: the modulator also includes a buffer layer covering the modulation block and a protective layer disposed on the buffer layer.
10. The X-ray imaging system of any one of claims 1-3, wherein: the X-ray detector comprises a flat panel detection device and a position exchange mechanism, wherein the flat panel detection device is arranged on the position exchange mechanism, and the position exchange mechanism is used for exchanging the flat panel detection device to the test position of an object to be tested, so that the flat panel detection device collects a reference signal of the X-ray after passing through the position exchange mechanism; the reference signal is a light intensity distribution signal of the modulated light field.
11. An X-ray imaging method, comprising:
emitting collimated X-rays;
the modulation device modulates the collimated X-ray to form a modulated light field;
collecting a measuring signal of the collimated X-ray after passing through the modulation device and an object to be measured;
and performing spatial correlation calculation on the measurement signal and a pre-stored reference signal to obtain an image of the object to be measured.
12. The X-ray imaging method according to claim 11, characterized in that: the modulation device comprises a modulator and a driver, the modulation device modulates the collimated X-rays to form a modulated light field, and the modulation device comprises:
the driver drives the modulator to move in a plane vertical to the collimated X-ray, and the collimated X-ray is modulated to form a modulated light field; wherein the motion comprises a rotational motion or a linear motion.
13. The X-ray imaging method according to claim 11, characterized in that: the measurement signal after gathering X ray process modulating device and the object that awaits measuring includes:
a single-pixel detection device is adopted to collect a measurement signal of the X-ray after passing through the modulation device and the object to be measured; the measurement signal is a total light intensity signal.
14. The X-ray imaging method according to any one of claims 11 to 13, characterized in that: further comprising:
collecting a reference signal of the collimated X-ray after passing through the modulation device by adopting a flat panel detection device; the reference signal is a light intensity distribution signal of the modulated light field.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105676613A (en) * | 2016-03-29 | 2016-06-15 | 山东大学 | Digital holography ghost imaging system by adopting single-pixel or bucket detector and working method thereof |
| CN110308614A (en) * | 2018-03-20 | 2019-10-08 | 中国科学院物理研究所 | The method and apparatus of X-ray intensity relevance imaging |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105676613A (en) * | 2016-03-29 | 2016-06-15 | 山东大学 | Digital holography ghost imaging system by adopting single-pixel or bucket detector and working method thereof |
| CN110308614A (en) * | 2018-03-20 | 2019-10-08 | 中国科学院物理研究所 | The method and apparatus of X-ray intensity relevance imaging |
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|---|---|---|---|---|
| CN114563429A (en) * | 2022-03-25 | 2022-05-31 | 深圳技术大学 | Super-resolution X-ray shadow imaging system and imaging method thereof |
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