CN111103958A - Circulation cooling device for improving heat dissipation efficiency of computer - Google Patents
Circulation cooling device for improving heat dissipation efficiency of computer Download PDFInfo
- Publication number
- CN111103958A CN111103958A CN202010118870.4A CN202010118870A CN111103958A CN 111103958 A CN111103958 A CN 111103958A CN 202010118870 A CN202010118870 A CN 202010118870A CN 111103958 A CN111103958 A CN 111103958A
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- Prior art keywords
- heat
- heat dissipation
- heat absorption
- circulating
- computer
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 40
- 238000001816 cooling Methods 0.000 title claims abstract description 23
- 238000010521 absorption reaction Methods 0.000 claims abstract description 52
- 239000007788 liquid Substances 0.000 claims abstract description 43
- 239000000110 cooling liquid Substances 0.000 claims abstract description 15
- 238000005086 pumping Methods 0.000 claims description 5
- 239000000428 dust Substances 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 7
- 208000032825 Ring chromosome 2 syndrome Diseases 0.000 description 5
- 239000003921 oil Substances 0.000 description 5
- 239000010687 lubricating oil Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000002918 waste heat Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000003254 anti-foaming effect Effects 0.000 description 1
- 239000002199 base oil Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004939 coking Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000010725 compressor oil Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004945 emulsification Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000012208 gear oil Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000010720 hydraulic oil Substances 0.000 description 1
- 230000007794 irritation Effects 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 239000010721 machine oil Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000005555 metalworking Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000010705 motor oil Substances 0.000 description 1
- 231100000956 nontoxicity Toxicity 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a circulating cooling device for improving the heat dissipation efficiency of a computer, which comprises: the heat sink comprises a circulating heat absorption device, a heat conduction block and a heat dissipation device; the circulating heat absorbing device comprises: the heat absorption device comprises a table-shaped heat absorption sleeve and a heat absorption fan arranged in the table-shaped heat absorption sleeve; the mesa heat absorption sleeve includes: the device comprises a plurality of lantern rings which are sequentially arranged and have unequal diameters, wherein a medium air cooling liquid cavity is arranged inside each lantern ring, a plurality of fins communicated with the hollow air cooling liquid cavity are circumferentially distributed on the inner wall of each lantern ring, and the hollow air cooling liquid cavities are connected with a pump liquid assembly for circulating PAO liquid; the heat conducting block is connected with the conical end of the table-shaped heat absorption sleeve, and a Laval nozzle is connected between the heat conducting block and the heat dissipation device. In the invention, the table-shaped heat absorption sleeve is adopted to absorb the heat generated by the CPU into the sleeve for cooling, the heat in the residual heat gas is guided to the heat conduction block, and the heat dissipation device quickly discharges the heat on the heat conduction block to the outside through the Laval nozzle, thereby ensuring the stable operation of the CPU.
Description
Technical Field
The invention relates to the technical field of computer heat dissipation, in particular to a circulating cooling device for improving the heat dissipation efficiency of a computer.
Background
The CPU in the computer can generate a large amount of heat when working, if the heat is not dissipated in time, the heat is easy to crash, the CPU can be burnt out, and the CPU radiator is used for dissipating the heat of the CPU. The radiator plays a decisive role in the stable operation of the CPU, and it is very important to choose a good radiator when assembling the computer.
However, most of the existing radiators are rectangular or circular, heat is absorbed through fins on the radiators, the heat absorption effect is not ideal, and if the heat conduction blocks on the radiators cannot rapidly discharge the collected heat to the outside of the computer case, the overall temperature inside the case is increased, and the damage to the electrical components of other components in the case is caused.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a circulating cooling device for improving the heat dissipation efficiency of a computer.
The invention is realized by the following technical scheme:
the invention provides a circulating cooling device for improving the heat dissipation efficiency of a computer, which comprises: the heat sink comprises a circulating heat absorption device, a heat conduction block and a heat dissipation device; wherein the content of the first and second substances,
the cyclical heat sink includes: the heat absorption device comprises a table-shaped heat absorption sleeve and a heat absorption fan arranged in the table-shaped heat absorption sleeve; the mesa shaped heat absorbing sleeve includes: the device comprises a plurality of lantern rings which are sequentially arranged and have unequal diameters, wherein an annular hollow cold liquid cavity is formed in each lantern ring, a plurality of fins communicated with the hollow cold liquid cavity are circumferentially distributed on the inner wall of each lantern ring, and the hollow cold liquid cavities are connected with a pump liquid assembly for circulating PAO liquid;
the heat conducting block is connected with the conical end of the table-shaped heat absorption sleeve, and a Laval nozzle is connected between the heat conducting block and the heat dissipation device.
Preferably, the heat absorbing fan is fixedly sleeved on one of the lantern rings in the middle of the table-shaped heat absorbing sleeve.
Preferably, the outer wall of the table-shaped heat absorption sleeve is circumferentially provided with a plurality of conduits communicated with the medium air cooling liquid cavities.
Preferably, the pumping assembly comprises: the circulating pump is arranged in the liquid storage tank; the circulating pump is communicated with the medium air cooling liquid cavity with the minimum diameter, and the medium air cooling liquid cavity with the maximum diameter is communicated with the top of the liquid storage box through a return pipe.
Preferably, the outer surface of the liquid storage tank is wrapped with a heat insulation layer.
Preferably, the heat dissipation device is a heat dissipation fan connected to one end of the laval nozzle, which is far away from the temperature conduction block.
Preferably, the radiating fan is covered with a dust cover.
The invention has the beneficial effects that: the heat absorption fan absorbs high temperature generated by the CPU to the inside of the table-shaped heat absorption sleeve, low-temperature PAO liquid circulates on the hollow cold liquid cavities and the fins of the plurality of lantern rings, the scales primarily cool absorbed hot gas, waste heat temperature in the gas is released when contacting the heat conduction block, the temperature of the heat conduction block rises after absorbing the temperature, the heat dissipation fan is connected with the heat conduction block through the Laval nozzle, exhaust airflow on the heat conduction block is accelerated to supersonic speed, the temperature on the heat conduction block is rapidly absorbed by the heat dissipation fan and then is discharged to the outside of a case, stable operation of the CPU is ensured, and the heat absorption fan has high circulating heat dissipation effect.
Drawings
FIG. 1 is a schematic structural diagram of a circulating cooling device for improving the heat dissipation efficiency of a computer according to an embodiment of the present invention;
FIG. 2 is a schematic front view of a mesa shaped heat absorption sleeve provided by an embodiment of the present invention;
FIG. 3 is a cross-sectional view of a collar provided by an embodiment of the present invention;
fig. 4 is a cross-sectional view of a pumping assembly provided by an embodiment of the present invention.
Reference numerals: the heat-absorbing device comprises a table-shaped heat-absorbing sleeve-1, a lantern ring-2, a conduit-3, a heat-conducting block-4, a Laval nozzle-5, a heat-radiating fan-6, a dust-proof cover-7, a liquid storage tank-8, a return pipe-9, a heat-absorbing fan-10, fins-11, a hollow cold liquid cavity-12, a circulating pump-13, a heat-insulating layer-14 and PAO liquid-15.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1-2, fig. 1 is a schematic structural diagram of a circulating cooling device for improving heat dissipation efficiency of a computer according to an embodiment of the present invention; the embodiment of the invention provides a circulating cooling device for improving the heat dissipation efficiency of a computer, which comprises: a circulating heat sink; the circulation heat absorbing device is used as a heat absorbing component in the embodiment of the application and used for absorbing the heat generated by the CPU, and the circulation heat absorbing device comprises: a table-shaped heat absorbing sleeve 1 and a heat absorbing fan 10 disposed inside the table-shaped heat absorbing sleeve 1.
The open end of the table-shaped heat absorption sleeve 1 faces towards the CPU, and the heat generated by the CPU is absorbed into the sleeve by the heat absorption fan 10 to be cooled, so that the heat absorption area of the open end of the table-shaped heat absorption sleeve 1 is larger, and the heat is converged on the heat conduction block 4 after the temperature is reduced in the table-shaped heat absorption sleeve 1.
When specifically setting up platform shape heat absorption sleeve 1, platform shape heat absorption sleeve 1 includes: a plurality of lantern rings 2 with different diameters are arranged in sequence; the heat absorption fan 10 is fixedly sleeved on one lantern ring 2 in the middle of the table-shaped heat absorption sleeve 1. The heat absorbing fan 10 is a CPU fan, and after absorbing heat generated by the CPU, each of the collars 2 has an independent circulating cooling cavity, so that the internal temperature of the table-shaped heat absorbing sleeve 1 is low.
As shown in fig. 3, an annular hollow cold liquid cavity 12 is arranged inside each lantern ring 2, a plurality of fins 11 communicated with the hollow cold liquid cavity 12 are circumferentially distributed on the inner wall of each lantern ring 2, and a conduit 3 for communicating the plurality of hollow cold liquid cavities 12 is circumferentially distributed on the outer wall of the table-shaped heat absorption sleeve 1. The plurality of medium air-cooling liquid cavities 12 are connected with a pump liquid assembly for circulating PAO liquid 15;
it can be seen from the above structure that under the heat absorption action of the heat absorption fan 10, the heat generated by the CPU is absorbed into the mesa heat absorption sleeve 1, the middle air cooling liquid cavities 12 on the plurality of lantern rings 2 are communicated with each other, and the middle air cooling liquid cavities 12 supply the PAO liquid 15 pumped by the pump liquid assembly to the fins 11 for direct contact with the hot gas, so as to absorb the heat in the hot gas and achieve a better initial cooling effect.
In particular, when the pumping unit pumps the PAO liquid 15 into the middle air-cooling liquid chamber 12 and forms a circulation loop, as shown in fig. 4, the pumping unit includes: a liquid storage tank 8 and a circulation pump 13 disposed inside the liquid storage tank 8; wherein, the circulating pump 13 is communicated with the middle air-cooling liquid cavity 12 with the smallest diameter, the middle air-cooling liquid cavity 12 with the largest diameter is communicated with the top of the liquid storage box 8 through the return pipe 9, and the outer surface of the liquid storage box 8 is wrapped with the heat insulation layer 14.
In the structure, the liquid storage tank 8 is filled with the PAO liquid 15, the PAO has good high-temperature and low-temperature performances, a large working temperature range, a high flash point and a high ignition point, safety in use, low evaporation rate, less coking, a long service life, a high viscosity index, good viscosity-temperature performance, excellent emulsification resistance and anti-foaming performance, good electrical performance, thermal stability and chemical stability, and no toxicity or irritation; the lubricating oil is suitable for preparing high-low temperature aviation lubricating oil, high-low temperature lubricating grease base oil, internal combustion engine oil in cold regions and severe cold regions, gear oil, hydraulic oil, refrigerating machine oil, automatic transmission fluid, high-viscosity aviation lubricating oil, oil for numerical control machines, air compressor oil, long-life lubricating oil, transformer oil, insulating oil, high-voltage switch oil, metal working fluid, heat conducting oil and the like. Thereby absorb the heat to the high temperature gas in the platform shape heat absorption sleeve 1, and at the liquid reserve tank 8 for the surface sets up thermal-insulated layer 14, guarantee the low temperature performance of PAO liquid 15, under the work of circulating pump 13, PAO liquid 15 gets into by the cone end of platform shape heat absorption sleeve 1, and flow in a plurality of well air cooling sap cavity 12 and fin 11 inner loop in proper order through pipe 3, finally flow back to in the liquid reserve tank 8, accomplish the work that whole set of circulation absorbed the high temperature, equipment is simple to operate reliably.
With continued reference to fig. 1, the circulating cooling device further includes a heat conducting block 4 and a heat dissipating device; the heat conducting block 4 is used for absorbing heat in the table-shaped heat absorption sleeve 1 for the whole absorption of gas again, and the temperature conducting block is a metal block with good heat conducting performance, such as a copper block and the like; specifically, heat conduction piece 4 is connected with the conical end of platform shape heat absorption sleeve 1, and heat conduction piece 4 shutoff platform shape heat absorption sleeve 1's conical end to carry out fixed connection with the lantern ring 2 that the diameter is the minimum, when heat conduction piece 4 constantly absorbs the heat, if arrange heat conduction ability then can cause quick-witted incasement portion bulk temperature higher rapidly, for this, adopt heat abstractor to carry out rapid cooling to heat conduction piece 4 in this embodiment.
When specifically making heat abstractor to heat conduction piece 4 cooling, heat abstractor passes through Laval nozzle 5 and connects heat conduction piece 4, and heat abstractor is the heat dissipation fan 6 of connecting in the one end of keeping away from the heat conduction piece of Laval nozzle 5, and heat dissipation fan 6 upper shield is equipped with dust cover 7. The heat radiation fan 6 is located outside the computer case so as to discharge high temperature gas to the outside, and for this reason, the dust cover 7 is provided to be effectively placed inside the case when the heat radiation fan 6 is not operated.
In the invention, the front half part of the laval nozzle 5 is contracted from big to small to a narrow throat from the middle. The narrow throat is expanded from small to large to the arrow bottom. The gas in the arrow body flows into the front half of the nozzle under high pressure, passes through the narrow throat and escapes from the rear half. The structure can change the speed of the airflow due to the change of the spray cross section area, so that the airflow is accelerated from subsonic speed to sonic speed to supersonic speed. Therefore, under the effect of the heat dissipation fan 6, the heat on the heat conduction block 4 is discharged at a high speed, so that the heat conduction block 4 is always in a low-temperature state, the heat absorption effect is better, the power of the heat dissipation fan 6 does not need to be increased, and the best cooling and heat dissipation effect is achieved.
According to the invention, the open end of the table-shaped heat absorption sleeve 1 faces to the CPU, the heat absorption fan 10 absorbs high temperature generated by the CPU into the table-shaped heat absorption sleeve 1, the low-temperature PAO liquid 15 circulates on the hollow cold liquid cavity 12 and the fins 11 of the plurality of lantern rings 2, the fins primarily cool absorbed hot gas, the waste heat temperature in the gas is released when contacting the heat conduction block 4, the temperature of the heat conduction block 4 rises after absorbing the temperature, the heat dissipation fan 6 is connected with the heat conduction block 4 through the Laval nozzle 5, so that the exhaust airflow discharged from the heat conduction block 4 is accelerated to supersonic speed, the temperature on the heat conduction block 4 is rapidly absorbed by the heat dissipation fan 6 and then discharged to the outside of a case, the stable operation of the CPU is ensured, and the high circulating heat dissipation effect is achieved.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. The utility model provides an improve computer heat dissipation efficiency's circulation heat sink which characterized in that includes: the heat sink comprises a circulating heat absorption device, a heat conduction block and a heat dissipation device; wherein the content of the first and second substances,
the cyclical heat sink includes: the heat absorption device comprises a table-shaped heat absorption sleeve and a heat absorption fan arranged in the table-shaped heat absorption sleeve; the mesa shaped heat absorbing sleeve includes: the device comprises a plurality of lantern rings which are sequentially arranged and have unequal diameters, wherein an annular hollow cold liquid cavity is formed in each lantern ring, a plurality of fins communicated with the hollow cold liquid cavity are circumferentially distributed on the inner wall of each lantern ring, and the hollow cold liquid cavities are connected with a pump liquid assembly for circulating PAO liquid;
the heat conducting block is connected with the conical end of the table-shaped heat absorption sleeve, and a Laval nozzle is connected between the heat conducting block and the heat dissipation device.
2. The circulating cooling device for improving the heat dissipation efficiency of the computer as claimed in claim 1, wherein the heat absorption fan is fixedly sleeved on one of the lantern rings located in the middle of the table-shaped heat absorption sleeve.
3. The circulating cooling device for improving the heat dissipation efficiency of the computer as claimed in claim 1, wherein the outer wall of the table-shaped heat absorption sleeve is circumferentially distributed with conduits for communicating the plurality of medium air-cooling liquid cavities.
4. The circulating cooling device for improving the heat dissipation efficiency of the computer according to claim 1, wherein the liquid pumping assembly comprises: the circulating pump is arranged in the liquid storage tank; the circulating pump is communicated with the medium air cooling liquid cavity with the minimum diameter, and the medium air cooling liquid cavity with the maximum diameter is communicated with the top of the liquid storage box through a return pipe.
5. The circulating cooling device for improving the heat dissipation efficiency of the computer as claimed in claim 4, wherein the outer surface of the liquid storage tank is wrapped with a thermal insulation layer.
6. The circulating cooling device for improving the heat dissipation efficiency of the computer as claimed in claim 1, wherein the heat dissipation device is a heat dissipation fan connected to an end of the laval nozzle away from the thermal block.
7. The circulating cooling device for improving the heat dissipation efficiency of the computer as claimed in claim 6, wherein the heat dissipation fan is covered with a dust cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010118870.4A CN111103958B (en) | 2020-02-26 | 2020-02-26 | Circulation cooling device for improving heat dissipation efficiency of computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010118870.4A CN111103958B (en) | 2020-02-26 | 2020-02-26 | Circulation cooling device for improving heat dissipation efficiency of computer |
Publications (2)
| Publication Number | Publication Date |
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| CN111103958A true CN111103958A (en) | 2020-05-05 |
| CN111103958B CN111103958B (en) | 2021-06-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010118870.4A Active CN111103958B (en) | 2020-02-26 | 2020-02-26 | Circulation cooling device for improving heat dissipation efficiency of computer |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101056522A (en) * | 2006-04-14 | 2007-10-17 | 鸿富锦精密工业（深圳）有限公司 | Radiator and liquid-cooled heat radiator applying the same |
| US20080049422A1 (en) * | 2006-08-22 | 2008-02-28 | Automatic Power, Inc. | LED lantern assembly |
| CN101193527A (en) * | 2006-11-17 | 2008-06-04 | 富准精密工业(深圳)有限公司 | Liquid-cooling heat radiator |
| JP3195692U (en) * | 2014-11-14 | 2015-01-29 | 奇▲こう▼科技股▲ふん▼有限公司 | Mobile device carrier with heat dissipation structure |
| CN105549704A (en) * | 2016-01-28 | 2016-05-04 | 武汉攀升兄弟科技有限公司 | Liquid-cooled case structure |
| CN105700652A (en) * | 2016-03-16 | 2016-06-22 | 深圳市超频三科技股份有限公司 | Cooler |
| CN208888752U (en) * | 2018-11-16 | 2019-05-21 | 王帆 | A kind of computer cooling device |
| CN110764595A (en) * | 2019-10-17 | 2020-02-07 | 江苏吉祥星智能科技有限公司 | Heat radiator for notebook computer |
-
2020
- 2020-02-26 CN CN202010118870.4A patent/CN111103958B/en active Active
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|---|---|---|---|---|
| CN101056522A (en) * | 2006-04-14 | 2007-10-17 | 鸿富锦精密工业（深圳）有限公司 | Radiator and liquid-cooled heat radiator applying the same |
| US20080049422A1 (en) * | 2006-08-22 | 2008-02-28 | Automatic Power, Inc. | LED lantern assembly |
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| JP3195692U (en) * | 2014-11-14 | 2015-01-29 | 奇▲こう▼科技股▲ふん▼有限公司 | Mobile device carrier with heat dissipation structure |
| CN105549704A (en) * | 2016-01-28 | 2016-05-04 | 武汉攀升兄弟科技有限公司 | Liquid-cooled case structure |
| CN105700652A (en) * | 2016-03-16 | 2016-06-22 | 深圳市超频三科技股份有限公司 | Cooler |
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| 郭磊: "《电子器件散热及冷却的发展现状研究》", 《制冷技术》 * |
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| CN111103958B (en) | 2021-06-01 |
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