CN112512275A - Radiator for electronic product - Google Patents
Radiator for electronic product Download PDFInfo
- Publication number
- CN112512275A CN112512275A CN202011422137.8A CN202011422137A CN112512275A CN 112512275 A CN112512275 A CN 112512275A CN 202011422137 A CN202011422137 A CN 202011422137A CN 112512275 A CN112512275 A CN 112512275A
- Authority
- CN
- China
- Prior art keywords
- heat
- sleeve
- finned tubes
- electronic product
- annular sleeve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Abstract
The invention provides a radiator for electronic products, comprising: the heat absorption sleeve, the cooling device and the heat dissipation device; a suction fan is arranged inside the heat absorption sleeve; the heat sink includes: the annular sleeve is communicated with the heat absorption sleeve, finned tubes are arranged on the periphery of the annular sleeve, and the finned tubes are connected with a circulating water device; the heat dissipating double-fuselage includes: the heat conducting block is arranged at one end, far away from the heat absorption sleeve, of the annular sleeve, the heat conducting block is connected with a laval nozzle, and a heat dissipation ring is arranged at one end, far away from the heat conducting block, of the laval nozzle. According to the invention, the heat in the electronic product is absorbed into the heat absorption sleeve, the annular sleeve is cooled, and then the heat conduction block conducts the heat energy into the Laval nozzle for high-speed discharge, so that the high-efficiency heat dissipation of the electronic product is realized.
Description
Technical Field
The invention relates to the technical field of heat dissipation of electronic products, in particular to a heat radiator for an electronic product.
Background
Electronic products refer to electronic products for daily consumer life, the first generation of electronic products uses electronic tubes as a core, belongs to specific household appliances, has electronic components therein, and can be generally applied to entertainment, communication and document purposes, such as telephones, audio equipment, televisions, even electronic clocks, and the like.
Current heat dissipation equipment mostly adopts modes such as circulating water cooling treatment, blows low-temperature gas to the inside steam discharge with electronic product, and this kind of mode electronic product is inside very easily to wet, causes electronic product's damage.
Disclosure of Invention
In view of this, the present invention provides a heat sink for electronic products, which sucks out hot gas inside an electronic product, and then cools and discharges the hot gas, so as to effectively perform heat dissipation.
The invention provides a radiator for electronic products, which comprises: the heat absorption sleeve, the cooling device and the heat dissipation device; wherein the content of the first and second substances,
a suction fan is arranged inside the heat absorption sleeve;
the heat sink includes: the annular sleeve is communicated with the heat absorption sleeve, finned tubes are arranged on the periphery of the annular sleeve, and the finned tubes are connected with a circulating water device;
the heat dissipating device includes: the heat-conducting block is arranged at one end, far away from the heat-absorbing sleeve, of the annular sleeve and is connected with a laval nozzle pipe, and a heat-radiating ring is arranged at one end, far away from the heat-conducting block, of the laval nozzle pipe.
Preferably, a plurality of mounting rings are circumferentially arranged on the heat absorbing sleeve.
Preferably, the heat absorption sleeve is a conical sleeve body.
Preferably, the water circulating apparatus includes: the cooling water tank and the circulating pump are arranged in the cooling water tank; wherein the content of the first and second substances,
the pump water end of the circulating pump is connected with the finned tubes, and the finned tubes are connected with the cooling water tank through water return pipes.
Preferably, the heat dissipation ring is rotatably connected with a heat dissipation fan.
According to the invention, the heat in the electronic product is absorbed into the heat absorption sleeve, the annular sleeve is cooled, and then the heat conduction block conducts the heat energy into the Laval nozzle for high-speed discharge, so that the high-efficiency heat dissipation of the electronic product is realized.
Drawings
Fig. 1 is a schematic structural diagram of a heat sink for an electronic product according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of the heat-absorbing jacket provided by the embodiment of the invention.
Reference numerals:
the heat-absorbing device comprises a heat-absorbing sleeve-1, a mounting ring-2, an annular sleeve-3, a cooling water tank-4, a water return pipe-5, a heat-conducting block-6, a Laval nozzle-7, a heat-dissipating ring-8, a heat-dissipating fan-9 and a suction fan-10.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The following describes a heat sink for an electronic product according to an embodiment of the present application with reference to the drawings.
Referring to fig. 1-2 together, fig. 1 is a schematic structural diagram of a heat sink for an electronic product according to an embodiment of the present invention; the radiator for the electronic product in the embodiment of the application comprises: a heat-absorbing jacket 1; the heat absorption sleeve 1 is a conical sleeve body; and a plurality of mounting rings 2 are circumferentially arranged on the heat absorption sleeve 1. The plurality of mounting rings 2 are provided to facilitate the assembly of the heat absorbing jacket 1 at the heat dissipation outlet of the electronic device.
In addition, a suction fan 10 is provided inside the heat absorbing jacket 1.
In addition, in the embodiment of the pump application, the hot gas pumped by the suction fan 10 is subjected to primary heat dissipation through the annular sleeve 3 which is cooled circularly. Specifically, the heat sink includes: the annular sleeve 3 is communicated with the heat absorption sleeve 1, finned tubes are arranged on the circumferential direction of the annular sleeve 3, and the finned tubes are connected with a circulating water device; the water circulating device comprises: a cooling water tank 4 and a circulation pump disposed inside the cooling water tank 4; wherein the content of the first and second substances,
the pump water end of the circulating pump is connected with a plurality of finned tubes, and the finned tubes are connected with a cooling water tank 4 through a water return pipe 5.
When the hot gas after preliminary heat dissipation is radiated and discharged, heat conduction is adopted and high-flow-rate discharge is carried out, so that the heat dissipation effect is ensured. Specifically, the heat dissipation device includes: the heat conducting block 6 is arranged at one end of the annular sleeve 3, which is far away from the heat absorption sleeve 1, the heat conducting block 6 is connected with a Laval nozzle 7, and a heat dissipation ring 8 is arranged at one end of the Laval nozzle 7, which is far away from the heat conducting block 6; the heat dissipation ring 8 is rotatably connected with a heat dissipation fan 9.
In the structure, heat generated by the electronic product is absorbed into the heat absorption sleeve 1 by the suction fan 10 and then is primarily cooled by the annular sleeve 3; the heat conducting block 6 absorbs and conducts the heat energy into the Laval nozzle 7, and the heat radiation fan 9 discharges the residual heat at high speed, thereby ensuring the best heat conducting performance of the heat conducting block 6.
According to the invention, the heat in the electronic product is absorbed into the heat absorption sleeve 1, the annular sleeve 3 is cooled, and then the heat conduction block 6 conducts the heat energy into the Laval nozzle 7 to be discharged at a high speed, so that the high-efficiency heat dissipation of the electronic product is realized.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. A heat sink for an electronic product, comprising: the heat absorption sleeve, the cooling device and the heat dissipation device; wherein the content of the first and second substances,
a suction fan is arranged inside the heat absorption sleeve;
the heat sink includes: the annular sleeve is communicated with the heat absorption sleeve, finned tubes are arranged on the periphery of the annular sleeve, and the finned tubes are connected with a circulating water device;
the heat dissipating device includes: the heat-conducting block is arranged at one end, far away from the heat-absorbing sleeve, of the annular sleeve and is connected with a laval nozzle pipe, and a heat-radiating ring is arranged at one end, far away from the heat-conducting block, of the laval nozzle pipe.
2. The heat sink as claimed in claim 1, wherein the heat absorbing cover has a plurality of mounting rings disposed circumferentially thereon.
3. The heat sink as claimed in claim 2, wherein the heat absorbing jacket is a conical jacket.
4. The heat sink for electronic products as claimed in claim 2, wherein said water circulating means comprises: the cooling water tank and the circulating pump are arranged in the cooling water tank; wherein the content of the first and second substances,
the pump water end of the circulating pump is connected with the finned tubes, and the finned tubes are connected with the cooling water tank through water return pipes.
5. The heat sink as claimed in claim 1, wherein the heat dissipating ring is rotatably connected to a heat dissipating fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011422137.8A CN112512275A (en) | 2020-12-08 | 2020-12-08 | Radiator for electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011422137.8A CN112512275A (en) | 2020-12-08 | 2020-12-08 | Radiator for electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112512275A true CN112512275A (en) | 2021-03-16 |
Family
ID=74971240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011422137.8A Withdrawn CN112512275A (en) | 2020-12-08 | 2020-12-08 | Radiator for electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112512275A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114114878A (en) * | 2021-12-13 | 2022-03-01 | 维沃移动通信有限公司 | Dial structure and wearable equipment |
-
2020
- 2020-12-08 CN CN202011422137.8A patent/CN112512275A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114114878A (en) * | 2021-12-13 | 2022-03-01 | 维沃移动通信有限公司 | Dial structure and wearable equipment |
| CN114114878B (en) * | 2021-12-13 | 2023-06-09 | 维沃移动通信有限公司 | Dial structure and wearable equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20210316 |