CN111090295A - Control method and control system for environmental parameters in EFEM (electronic flash memory) - Google Patents
Control method and control system for environmental parameters in EFEM (electronic flash memory) Download PDFInfo
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Abstract
The application provides a control method and a control system for environmental parameters in EFEM. The control method comprises the following steps: providing a clean space having a set volume outside the EFEM; removing predetermined impurities in the clean space; heating the temperature in the clean space to a preset temperature and then blowing air into the EFEM; and dynamically adjusting the heating temperature in the clean space according to the temperature and the humidity inside the EFEM so as to keep the temperature and the humidity inside the EFEM constant. This application sets up clean space in EFEM's outside, through carrying out the filtration of impurity such as acid, alkali, volatile organic compound, particulate matter to clean space and getting rid of the inside dustless high temperature gas of back conveying of EFEM to temperature through in the dynamic adjustment clean space makes EFEM be in the constant temperature and humidity environment, guarantees that the wafer can not appear gaseous condition at the wafer surface dewfall in EFEM data send process, effectively improves the yield of wafer, and then satisfies higher semiconductor technology demand.
Description
Technical Field
The application relates to the technical field of semiconductor preparation, in particular to a control method and a control system for environmental parameters in an equipment front-end module EFEM.
Background
In a semiconductor manufacturing process, wafers are transferred between processing apparatuses using a container called a Front Opening Unified Pod (FOUP) or the like. When the wafers are processed, the wafers in the container are transferred from the front-end-opening cassette to the processing chamber via an EFEM (Equipment front-end module) provided in each processing apparatus. The EFEM typically includes a robot that transports the wafer from the FOUP, through the EFEM, to other components of the semiconductor processing tool, and back to the FOUP.
In order to protect the surface of the wafer being carried by the wafer carrier from oxidation or contamination, it is necessary to maintain the environment of the wafer carrying chamber in an inert state and a clean state exceeding a predetermined state. As a method for improving the inert state or cleanliness of the gas in the wafer transfer chamber, it is known that a fan filter unit in which a fan for blowing air, a particle removal filter such as ULPA (ultra high performance air filter) and HEPA (high efficiency air filter), and a chemical filter for removing harmful gas components are combined is provided in the ceiling portion of the wafer transfer chamber, and clean air filtered by the filter is uniformly fed to the EFEM at a set air speed.
As semiconductor processing requirements become higher, higher requirements are placed on the environment inside the EFEM, and besides controlling the particle content in the EFEM, it is also necessary to control the acid-base organic matter and RH (relative humidity) in the EFEM. Because the filter in the prior EFEM can only filter particles which are more than or equal to 0.3 mu m in the air, the prior semiconductor process requirements can not be met.
Disclosure of Invention
An object of the embodiments of the present invention is to provide a method and a system for controlling environmental parameters in EFEM, so as to meet higher semiconductor process requirements.
The embodiment of the application provides a method for controlling environmental parameters in EFEM, which comprises the following steps:
providing a clean space having a set volume outside of the EFEM;
removing predetermined impurities in the clean space;
heating the temperature in the clean space to a preset temperature and then blowing air into the EFEM;
and dynamically adjusting the heating temperature in the clean space according to the temperature and the humidity inside the EFEM so as to keep the temperature and the humidity inside the EFEM constant.
In the realization process, this application sets up the clean space in EFEM's outside, gets rid of through carrying out the filtration of impurity such as acid, alkali, volatile organic compound, particulate matter to the clean space, heats the temperature of clean space to the inside air supply of EFEM behind 30 ℃ -50 ℃ high temperature state again, through the heating temperature in the dynamic adjustment clean space, makes the inside constant temperature and humidity of EFEM. The EFEM is in the constant temperature and humidity environment, so that the wafer can be prevented from dewing on the surface of the wafer in the EFEM transmission process, the yield of the wafer is effectively improved, and the corrosion of EFEM structural components is effectively reduced. Because the EFEM in this application is in the clean environment of impurity such as no acid, alkali, volatile organic compound, particulate matter all the time, therefore can satisfy higher semiconductor technology demand.
In one possible implementation, the EFEM internal constant temperature and humidity satisfies the following conditions:
no condensation of moisture on the wafer surface occurs during the EFEM transfer process.
In one possible implementation, the predetermined impurity is at least one of a particulate matter, a predetermined acidic substance, a predetermined basic substance, and a volatile organic compound.
In one possible implementation, the temperature within the clean space is in the range of 30 ℃ to 50 ℃.
In one possible implementation, the dynamically adjusting the heating temperature within the clean space based on the temperature inside the EFEM to thermostatize the EFEM interior comprises:
arranging an air inlet cover at an outlet of the clean space, wherein an air outlet of the air inlet cover is in butt joint with an air inlet of the EFEM, and setting a temperature value of the air outlet;
collecting corresponding temperature values inside the EFEM when the temperature values at the air outlet are different, and manufacturing a temperature control table;
determining a preset relation according to the data in the temperature control table, and obtaining a first double-PID series control algorithm through a temperature setting program;
executing automatic control according to the first double-PID series control algorithm, and starting a first setting timer;
after the first setting timer finishes timing, judging the deviation between the actual temperature and the set temperature of the air outlet;
if the deviation is within the preset range, the temperature is automatically controlled;
if the deviation exceeds the preset range, starting a PID self-tuning mode in the temperature control table, recalculating a PID parameter in the first double-PID series control algorithm, writing the recalculated PID parameter into the temperature control table again, restarting a first tuning timer, and judging the deviation between the actual temperature and the set temperature of the air outlet again after the first tuning timer finishes timing;
and after the PID self-tuning mode is started for 3 times, sending alarm information if the deviation between the actual temperature and the set temperature of the air outlet is still not within the preset range.
In one possible implementation, the dynamically adjusting the heating temperature within the clean space according to the humidity inside the EFEM such that the EFEM internal constant humidity includes:
acquiring corresponding humidity values inside the EFEM when the temperature values at the air outlet are different, and manufacturing a temperature and humidity matching table;
determining a preset relation according to the data in the temperature and humidity matching table, and obtaining a second double-PID series control algorithm through a temperature and humidity matching setting program;
setting a humidity value of the air outlet; setting a corresponding temperature value according to the temperature and humidity matching table;
executing automatic control according to the second double-PID series control algorithm, and starting a second setting timer;
after the second setting timer finishes timing, judging the deviation between the actual temperature and the set temperature of the air outlet;
if the deviation is within the preset range, the humidity is automatically controlled;
if the deviation exceeds the preset range, starting a self-tuning mode of the second double-PID series control algorithm, recalculating the PID parameters, writing the recalculated PID parameters into the second double-PID series control algorithm again, and setting the latest air outlet temperature value; restarting a second setting timer, and judging the deviation between the actual temperature and the set temperature of the air outlet again after the second setting timer finishes timing;
and after the PID self-tuning mode is started for 3 times, sending alarm information if the deviation between the actual humidity and the set temperature of the air outlet is still not within the preset range.
In a second aspect, an embodiment of the present application further provides a system for controlling environmental parameters in an EFEM, including:
an outlet of the clean space is provided with an air inlet cover, and an air outlet of the air inlet cover is in butt joint with an air inlet of the EFEM;
a filter assembly disposed inside the clean space for removing predetermined impurities inside the clean space;
a heating assembly disposed in the clean space for heating a temperature in the clean space to a predetermined temperature;
the air outlet of the air inlet cover is in butt joint with the air inlet of the EFEM;
a temperature sensor and a humidity sensor disposed inside the EFEM;
the control box sets up clean space's outside, with heating element, temperature sensor and humidity transducer connect, are used for right heating element in the clean space carries out dynamic adjustment, so that the inside constant temperature and humidity of EFEM.
In one possible implementation, the filter assembly includes a particulate filter element, a predetermined acid filter element, a predetermined base filter element, and a voc filter element.
In one possible implementation, the control box is provided with:
the heating PLC is electrically connected with the heating assembly;
and the temperature control unit is electrically connected with the temperature sensor, the humidity sensor and the heating PLC.
In a possible implementation manner, the surface of the box body of the control box is further provided with at least one structure of an alarm indicator lamp, a buzzer, a control button, a display screen, an EMO (emergency stop) button and the like.
According to the technical scheme, this application sets up the clean space in EFEM's outside, through carrying out the filtration of impurity such as acid, alkali, volatile organic compound, particulate matter to the clean space and getting rid of to make the clean space reach the invariable humidity state of EFEM demand, thereby effectively improved the yield of wafer, because EFEM in this application is in the clean environment of impurity such as no acid, alkali, volatile organic compound, particulate matter all the time, therefore can satisfy higher semiconductor technology demand.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.
FIG. 1 is a flow chart illustrating a method for controlling environmental parameters in an EFEM according to an embodiment of the present application;
FIG. 2 is a flow chart illustrating temperature control according to an embodiment of the present application;
FIG. 3 is a flow chart illustrating humidity control according to an embodiment of the present application;
FIG. 4 is a schematic diagram of a second dual PID series control algorithm according to an embodiment of the present application;
FIG. 5 is a schematic view illustrating a structure of a part of an assembly disposed in a clean space according to an embodiment of the present application;
FIG. 6 is a flow chart illustrating the control of the system for controlling environmental parameters in an EFEM according to an embodiment of the present application.
Icon: 100-a filter assembly; 200-a heating assembly; 300-an air inlet cover.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
FIG. 1 is a flow chart illustrating a method for controlling environmental parameters in an EFEM according to an embodiment of the present application. Referring to fig. 1, the method for controlling environmental parameters in EFEM includes the steps of:
s101: a clean space having a set volume is provided outside the EFEM.
The internal environment of the EFEM needs to be guaranteed to be a positive pressure environment, namely, air of the external environment is continuously sent to the EFEM, and in the prior art, the external air enters the EFEM to filter particles, chemical substances and the like in the EFEM. Because the air needs to be sent into the EFEM in advance, the filter components and the like in the EFEM have relative delay on the change of environmental parameters, and the filtering effect has certain influence.
In an embodiment of the present application, a clean space is provided outside the EFEM, and contaminant-free air is provided in the clean space, i.e., the environmental parameters are directly purified at the air inlet end of the EFEM. Meanwhile, the heating temperature in the clean space is dynamically adjusted by measuring the temperature and the humidity inside the EFEM, so that the temperature and the humidity inside the EFEM are constant. The EFEM is in a constant temperature and humidity environment, so that the yield of the wafer can be effectively improved. The scheme in this application embodiment can make EFEM's inside be in the environment of semiconductor technology demand all the time, compares in the inside structural feature who sets up filter core space of current EFEM, and this application embodiment can make EFEM save filter core space, prolongs EFEM's life.
S102: and removing the predetermined impurities in the clean space.
In an embodiment of the present application, the predetermined impurity is at least one of a particulate matter, a predetermined acidic substance, a predetermined basic substance, and a volatile organic compound.
In the implementation process, at least one of a particulate filter element, a filter element for preset acidic substances, a filter element for preset alkaline substances and a filter element for volatile organic compounds is arranged in the clean space. The clean space in this application can select corresponding filter core according to the production demand selectivity, in the higher use scene to the semiconductor technology requirement, can set up the filter core that corresponds above-mentioned four debris in the clean space in this application.
It should be noted that, the types of the predetermined acid substance, the predetermined alkali substance and the corresponding filter element are not specifically limited in this application, and the types and the number of the filter elements in the clean space in the embodiment of this application can be customized according to the needs of the user.
S103: the temperature in the clean space is heated to a predetermined temperature and then air is supplied to the inside of the EFEM.
In one possible implementation, the temperature in the clean space in the embodiments of the present application ranges from 30 ℃ to 50 ℃.
S104: and dynamically adjusting the heating temperature in the clean space according to the temperature and the humidity inside the EFEM so as to keep the temperature and the humidity inside the EFEM constant.
In this application, the constant temperature and the constant humidity in the clean space need to satisfy the following conditions: no condensation of moisture on the wafer surface occurs during EFEM transfer.
In the realization process, this application sets up the clean space in EFEM's outside, through carrying out the filtration of impurity such as acid, alkali, volatile organic compound, particulate matter to the clean space and getting rid of, heat the temperature of clean space to a certain predetermined temperature value in 30 ~ 50 ℃ and then supply air to the inside of EFEM, set up temperature sensor and humidity transducer inside the EFEM, through the temperature of dynamic adjustment heating clean space, make EFEM reach the constant temperature and humidity state of demand. The EFEM is in the constant temperature and humidity environment, so that the wafer can be prevented from dewing on the surface of the wafer in the EFEM transmission process, the yield of the wafer is effectively improved, and the corrosion of EFEM structural components is effectively reduced. Because the technical scheme of this application can be in the clean environment of constant temperature and humidity, no impurity such as acid, alkali, volatile organic compound, particulate matter in making EFEM all the time, therefore can satisfy higher semiconductor technology demand.
In one possible implementation mode, an air inlet cover is arranged in the clean space, and an air outlet of the air inlet cover is in butt joint with an air inlet of the EFEM. Fig. 2 is a flowchart illustrating temperature control according to an embodiment of the present disclosure. Referring to fig. 2, the dynamic adjustment of the heating temperature within the clean space based on the temperature inside the EFEM to thermostatize the inside of the EFEM includes the steps of:
collecting corresponding EFEM internal temperature values at different temperature values at the air outlet of the air inlet cover, and manufacturing into a temperature control meter;
determining a preset relation according to data in the temperature control table, and obtaining a first double-PID (proportional, integral and differential control) series control algorithm through a temperature setting program;
setting a temperature value of the air outlet;
executing automatic control according to a first double-PID series control algorithm, and starting a first setting timer;
after the first setting timer finishes timing, judging the deviation between the actual temperature of the air outlet and the set temperature;
if the deviation is within the preset range, the temperature is automatically controlled;
if the deviation exceeds the preset range, starting a PID self-tuning mode in the temperature control table, recalculating the PID parameters in the first double-PID series control algorithm, writing the recalculated PID parameters into the temperature control table again, restarting the first tuning timer, and judging the deviation between the actual temperature and the set temperature of the air outlet again after the first tuning timer finishes timing;
after the PID self-tuning mode is started for 3 times, the deviation between the actual temperature and the set temperature of the air outlet is still not within the preset range, and alarm information is sent.
Fig. 3 is a flow chart illustrating humidity control according to an embodiment of the present disclosure. Referring to fig. 3, the dynamic adjustment of the heating temperature in the clean space according to the humidity inside the EFEM so that the EFEM interior humidity is constant includes the steps of:
acquiring corresponding humidity values inside the EFEM when different temperature values are obtained at the air outlet, and manufacturing a temperature and humidity matching table;
and determining a preset relation according to data in the temperature and humidity matching table, and obtaining a second double-PID series control algorithm through a temperature and humidity matching setting program, referring to FIG. 4.
Matching a temperature set value of the air outlet according to a humidity set value in the EFEM and a temperature and humidity matching table;
executing automatic control according to a second double-PID series control algorithm, and starting a second setting timer;
after the second setting timer finishes timing, judging the deviation between the actual temperature of the air outlet and the set temperature;
if the deviation is within the preset range, the temperature is automatically controlled;
if the deviation exceeds the preset range, starting a self-tuning mode of a second double-PID series control algorithm, recalculating the PID parameters, writing the recalculated PID parameters into the second double-PID series control algorithm again, and setting the latest air outlet temperature value; restarting the second setting timer, and judging the deviation between the actual temperature of the air outlet and the set temperature again after the second setting timer finishes timing;
after the PID self-tuning mode is started for 3 times, the deviation between the actual temperature and the set temperature of the air outlet is still not within the preset range, and alarm information is sent.
In a second aspect, an embodiment of the present application further provides a system for controlling environmental parameters in an EFEM, where the system for controlling environmental parameters in an EFEM includes:
a clean space disposed outside the EFEM and having a set volume;
a filter assembly disposed inside the clean space for removing predetermined impurities inside the clean space;
a heating assembly for heating a temperature in the clean space to a predetermined temperature;
the air inlet cover is connected with the air inlet of the EFEM in a butt joint mode;
a temperature sensor and a humidity sensor disposed inside the EFEM;
the control box is arranged outside the clean space, is connected with the heating component, the temperature sensor and the humidity sensor, and is used for dynamically adjusting the heating component in the clean space so as to ensure constant temperature and humidity inside the EFEM.
Fig. 5 is a schematic structural view illustrating a part of components of an environmental parameter control system in an EFEM according to an embodiment of the present invention, and referring to fig. 5, the environmental parameter control system in the EFEM includes a filter assembly 100, a heating assembly 200, and a wind inlet cover 300, and the filter assembly 100, the heating assembly 200, and the wind inlet cover 300 together configure a clean space having a set volume, wherein a wind outlet of the wind inlet cover 300 is configured to interface with a wind inlet of the EFEM.
In one possible embodiment, the filter assembly includes a particulate filter element, a predetermined acid filter element, a predetermined base filter element, and a voc filter element. In the implementation process, the filter element corresponding to the four impurities is arranged in the clean space, so that at least one of particulate matters, preset acidic matters, preset alkaline matters and volatile organic compounds can be filtered, and the filter element can be adapted to a use scene with high requirements on a semiconductor process.
It should be noted that, the types of the predetermined acid substance, the predetermined alkali substance and the corresponding filter element are not specifically limited in this application, and the types and the number of the filter elements in the clean space in the embodiment of this application can be customized according to the needs of the user.
In one possible implementation, the control box is provided with:
the heating PLC is electrically connected with the heating assembly;
and the temperature control unit is electrically connected with the temperature sensor, the humidity sensor and the heating PLC.
In a possible implementation manner, the surface of the box body of the control box is further provided with at least one structure of an alarm indicator lamp, a buzzer, a control button, a display screen, an EMO (emergency stop) button and the like.
The size of the clean space of the control system of the environmental parameters in the EFEM can be adjusted along with the volume of the EFEM, and the control system can also be expanded to the whole environment of a semiconductor factory. The control system of environmental parameters in EFEM in this application can adopt the modularized design, can customize the upgrading according to customer's demand.
FIG. 6 is a flow chart illustrating the control of the system for controlling environmental parameters in an EFEM according to an embodiment of the present application. Referring to fig. 6, after the system starts to operate, a self-test of the device is performed first, where the self-test items include whether the Filter assembly 100 is operating normally, whether the heater is powered on, whether the sensors (temperature sensor and humidity sensor) are normal, whether the heating PLC (programmable logic controller) is operating normally, and whether the EMO button is normal. In the event that any of the above tests are not normal, the system will not operate. And only after all the detection items pass, the temperature and the humidity are automatically controlled and operated.
In the process of automatically controlling the temperature and humidity, temperature setting and humidity setting are firstly performed, and after the temperature and humidity setting is completed, the equipment dynamically adjusts the temperature and humidity according to the flow shown in fig. 2 and 3. In the dynamic temperature and humidity adjusting process, four items, namely whether an EMO button, a temperature sensor and a humidity sensor are normal, whether an FFU operates normally and whether a temperature switch is normal, need to be inspected, and after any inspection item is abnormal, an alarm system is triggered to give an alarm through an audible and visual alarm system. And simultaneously resetting the system, starting the system after the alarm of the system is relieved, and carrying out equipment self-checking and subsequent operation steps again. In one possible implementation, the alarm information may optionally be recorded and uploaded to an MES (manufacturing execution management) system.
If no alarm is given during the dynamic temperature and humidity adjustment process, temperature and humidity data are collected and recorded, and the control system is closed after the preset time is reached.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (10)
1. A method for controlling environmental parameters in an equipment front-end module EFEM is characterized by comprising the following steps:
providing a clean space having a set volume outside of the EFEM;
removing predetermined impurities in the clean space;
heating the temperature in the clean space to a preset temperature and then blowing air into the EFEM;
and dynamically adjusting the heating temperature in the clean space according to the temperature and the humidity inside the EFEM so as to keep the temperature and the humidity inside the EFEM constant.
2. The method for controlling environmental parameters in EFEM of claim 1,
the internal constant temperature and humidity of the EFEM meets the following conditions:
no condensation of moisture on the wafer surface occurs during the EFEM transfer process.
3. The method for controlling environmental parameters in EFEM of claim 1,
the predetermined impurities are at least one of particulate matters, predetermined acidic matters, predetermined basic matters and volatile organic compounds.
4. The method of controlling environmental parameters in an EFEM of claim 2, wherein the temperature in the clean space is in a range of 30-50 ℃.
5. The method of controlling environmental parameters in an EFEM of any one of claims 1 to 4, wherein the dynamically adjusting the heating temperature in the clean space based on the temperature and humidity inside the EFEM to thermostatt he EFEM inside comprises:
arranging an air inlet cover at an outlet of the clean space, wherein an air outlet of the air inlet cover is in butt joint with an air inlet of the EFEM, and setting a temperature value of the air outlet;
collecting corresponding temperature values inside the EFEM when the temperature values at the air outlet are different, and manufacturing a temperature control table;
determining a preset relation according to the data in the temperature control table, and obtaining a first double-PID series control algorithm through a temperature setting program;
executing automatic control according to the first double-PID series control algorithm, and starting a first setting timer;
after the first setting timer finishes timing, judging the deviation between the actual temperature and the set temperature of the air outlet;
if the deviation is within the preset range, the temperature is automatically controlled;
if the deviation exceeds the preset range, starting a PID self-tuning mode in the temperature control table, recalculating a PID parameter in the first double-PID series control algorithm, writing the recalculated PID parameter into the temperature control table again, restarting a first tuning timer, and judging the deviation between the actual temperature and the set temperature of the air outlet again after the first tuning timer finishes timing;
and after the PID self-tuning mode is started for 3 times, sending alarm information if the deviation between the actual temperature and the set temperature of the air outlet is still not within the preset range.
6. The method of controlling environmental parameters in an EFEM of claim 5, wherein the dynamically adjusting the heating temperature in the clean space based on the temperature and humidity inside the EFEM to make the EFEM inside constant humidity comprises:
acquiring corresponding humidity values inside the EFEM when the temperature values at the air outlet are different, and manufacturing a temperature and humidity matching table;
determining a preset relation according to the data in the temperature and humidity matching table, and obtaining a second double-PID series control algorithm through a temperature and humidity matching setting program;
setting a humidity value of the air outlet; setting a corresponding temperature value according to the temperature and humidity matching table;
executing automatic control according to the second double-PID series control algorithm, and starting a second setting timer;
after the second setting timer finishes timing, judging the deviation between the actual temperature and the set temperature of the air outlet;
if the deviation is within the preset range, the humidity is automatically controlled;
if the deviation exceeds the preset range, starting a self-tuning mode of the second double-PID series control algorithm, recalculating the PID parameters, writing the recalculated PID parameters into the second double-PID series control algorithm again, and setting the latest air outlet temperature value; restarting a second setting timer, and judging the deviation between the actual humidity and the set temperature of the air outlet again after the second setting timer finishes timing;
and after the PID self-tuning mode is started for 3 times, sending alarm information if the deviation between the actual temperature and the set temperature of the air outlet is still not within the preset range.
7. A system for controlling environmental parameters in an EFEM, comprising:
an outlet of the clean space is provided with an air inlet cover, and an air outlet of the air inlet cover is in butt joint with an air inlet of the EFEM;
a filter assembly disposed inside the clean space for removing predetermined impurities inside the clean space;
a heating assembly disposed in the clean space for heating a temperature in the clean space to a predetermined temperature;
a temperature sensor and a humidity sensor disposed inside the EFEM;
the control box sets up clean space's outside, with heating element, temperature sensor and humidity transducer connect, are used for right heating element in the clean space carries out dynamic adjustment, so that the inside constant temperature and humidity of EFEM.
8. The system for controlling environmental parameters in an EFEM of claim 7, wherein the filter assembly comprises a particulate filter element, a predetermined acid filter element, a predetermined base filter element and a VOC filter element.
9. The system for controlling environmental parameters in an EFEM of claim 7, wherein said control box is provided with:
the heating programmable logic controller PLC is electrically connected with the heating assembly;
and the temperature control unit is electrically connected with the temperature sensor, the humidity sensor and the heating PLC.
10. The system of claim 9, wherein the control box further comprises at least one of an alarm indicator, a buzzer, a control button, a display screen, an emergency EMO button, and the like mounted on the surface of the control box.
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| CN117672928A (en) * | 2023-10-19 | 2024-03-08 | 重庆鹰谷光电股份有限公司 | Box opening method |
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| CN110277331A (en) * | 2018-03-15 | 2019-09-24 | 昕芙旎雅有限公司 | Method for supplying gas in EFEM system and EFEM system |
| CN209183508U (en) * | 2018-11-02 | 2019-07-30 | 睿励科学仪器（上海）有限公司 | Equipment for measuring chip |
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