CN111089655A - Induction readout potential-sensitive anode with different-layer structure and manufacturing method thereof - Google Patents
Induction readout potential-sensitive anode with different-layer structure and manufacturing method thereof Download PDFInfo
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Abstract
The invention provides an induction-read out different-layer structure position-sensitive anode and a manufacturing method thereof, and solves the problems that the existing position-sensitive anode processing needs to adopt a high-precision microelectronic process or laser etching equipment, and the processing period and the processing cost are high. The potential sensitive anode comprises an anode substrate, a W electrode, an S electrode and a Z electrode, wherein the W electrode and the S electrode are positioned on the same plane layer and positioned on the top layer of the anode substrate; the Z electrode is positioned on the other plane layer and positioned on the bottom layer of the anode substrate. The three electrodes are respectively positioned on two different plane layers, so that the requirements on manufacturing equipment and manufacturing process are reduced, the manufacturing difficulty of the position-sensitive anode is greatly simplified, and the manufacturing period of the position-sensitive anode is shortened; the width of the insulating channel between the electrodes is increased, the phenomenon that the insulating channel between the two electrodes is too narrow is avoided, the risk of conduction between the two electrodes is reduced, and the reliability of the detector is improved.
Description
Technical Field
The invention belongs to the weak and extremely weak light detection technology, and particularly relates to an induction-read potential sensitive anode with a different layer structure and a manufacturing method thereof.
Background
The photon counting method is characterized in that the characteristic that electrical signals output by a photon detector are naturally scattered under the irradiation of weak light is utilized, and extremely weak signals are identified and extracted by adopting a pulse discrimination technology and a digital counting technology. The photon counting imaging detector based on the reading of the microchannel plate and the position sensitive anode has the advantages of high signal-to-noise ratio, good drift resistance, good time stability and the like, and is widely applied to the fields of astronomy, high-energy physics, biomedicine and the like.
The position-sensitive anode detector collects electron clouds output by the microchannel plate by adopting a position-sensitive anode, and decodes the position of an incident event according to electron signals collected by different electrodes of the anode. There are two ways of reading out the imaging charge of the potential-sensitive anode detector: the charge sensing readout (mirror charge method) is characterized in that imaging charges output by a micro-channel plate (MCP) are collected by a semiconductor germanium layer with high impedance characteristic, and then the charges collected on the germanium layer are coupled to a position-sensitive anode through charge sensing; and the charge direct collection method is to directly collect imaging charges output by a microchannel plate (MCP) by a potential sensitive anode. Compared with a direct reading mode of a direct charge collection method, the sensing reading mode of charge sensing reading has many obvious advantages, such as effectively reducing the distribution noise generated by the charge division type position-sensitive anode and greatly simplifying the vacuum packaging process of the anode detector, and the like, and particularly see the Chinese patent with the application number of 200810184963.6.
The bit-sensitive Anode for collecting the output electrons of the Microchannel plate mainly comprises a resistance Anode (Resistive Anode), a Multi-Anode Microchannel Array (MAMA/Multi-Anode Microchannel Array), a Wedge-shaped Anode (WSA/Wedge and Anode), a Vernier Anode (Vernier), a Cross stripe (Cross-Strip) and the like. Among them, the WSA potential sensitive anode is most widely used.
As shown in fig. 1, which shows a schematic geometric diagram of a 3-electrode WSA anode, a wedge-shaped potential sensitive anode is a charge-divided anode comprising three electrodes, a wedge-shaped electrode (W electrode 01), a striped electrode (S electrode 02) and a zigzag electrode (Z electrode 04) between W and S, the W electrode 01, the S electrode 02, the Z electrode 04 being metal electrodes divided by insulated channels, the S electrode being a strip whose width increases in the X direction. W is a wedge shape, the width of the wedge shape increases along the Y direction, Z is an electrode between W and S, the WSA anode has periodicity, and the decoding formula of the induction read heterolamellar structure position-sensitive anode is as follows:
X＝2*Qs/(Qw+Qs+Qz)，Y＝2*Qw/(Qw+Qs+Qz)；
in the formula: qw, Qs, and Qz are the electrical quantities collected by the W, S, Z electrodes for 3 electrical pulses.
At present, there are two main methods for manufacturing WSA position-sensitive anodes, in which an anode pattern is etched on a metal film attached to an insulating material, three electrodes of the position-sensitive anode are distributed on the same plane, an anode substrate 03 generally adopts quartz glass or ceramic, and the processing mode mainly adopts a microelectronic lithography process and a laser processing process. The literature (reports on photonics, 2008, 37 (1): 11-16) describes in detail the methods of microelectronic lithography, which are divided into "lithography etching first followed by electroplating thickening" and "lithography etching first followed by electroplating thickening". The laser processing method is to directly etch the metal film layer attached to the substrate to obtain the required pattern.
The conventional potential-sensitive anode structure is formed by evaporating a metal film layer on an insulating substrate and then photoetching or laser etching a required anode pattern on the metal film layer. Because the insulation channel between each electrode of the anode is narrow (generally tens of microns to tens of microns), the anode processing needs to adopt a high-precision microelectronic process or laser etching equipment, and the processing period and the processing cost are both high. In addition, conductive particles are easily attached to an excessively narrow insulating channel to cause electrode conduction, and reliability of the detector is affected.
Disclosure of Invention
The invention provides an induction-read out different-layer structure position-sensitive anode and a manufacturing method thereof, which can improve the reliability of a detector, and aims to solve the technical problems that the existing position-sensitive anode needs to adopt a high-precision microelectronic process or laser etching equipment, and the processing period and the processing cost are high.
In order to achieve the purpose, the technical scheme provided by the invention is as follows:
an induction-read potential sensitive anode with a different-layer structure is characterized in that: the device comprises an anode substrate, a W electrode, an S electrode and a Z electrode, wherein the W electrode and the S electrode are positioned on the same plane layer and positioned on the top layer of the anode substrate; the Z electrode is positioned on the other plane layer and positioned on the bottom layer of the anode substrate.
Furthermore, extraction electrodes are arranged on the two plane layers;
the anode substrate is provided with an electrode leading-out hole matched with the leading-out electrode;
the anode substrate is also provided with a first marking hole for positioning the two plane layers so as to ensure the accuracy of the positions of the patterns on the two plane layers.
Further, the device also comprises a support ring connected with the top layer or the bottom layer of the anode substrate;
the outer contour size of the support ring is matched with the outer contour size of the anode substrate, and the inner diameter of the support ring is larger than the outer diameter of the collecting area of the electrode; the material of the support ring is the same as that of the anode substrate.
Further, the anode substrate is a double-sided copper-clad plate; the base material of the double-sided copper-clad plate is FR4 or PTFE sheet material, the thickness of the base material is 0.1-0.3 mm, and the thickness of copper is 2-17 μm.
Furthermore, adhesive glue is arranged between the anode substrate and the support ring;
and a second marking hole matched with the first marking hole is arranged on the support ring.
Meanwhile, the invention provides a method for manufacturing a sensing-read different-layer structure potential-sensitive anode, which is characterized by comprising the following steps of:
1) determining electrode distribution locations
Determining electrodes distributed on the top layer and the bottom layer of the position-sensitive anode according to the graph of the position-sensitive anode and a decoding formula of the position-sensitive anode;
the electrodes comprise a W electrode, an S electrode and a Z electrode;
the decoding formula of the position-sensitive anode is as follows:
X＝2*Qs/(Qw+Qs+k*Qz)，Y＝2*Qw/(Qw+Qs+k*Qz)；
wherein Q isw、Qs、QzCollecting the electric quantity of 3 electric pulses by the W electrode, the S electrode and the Z electrode respectively;
x, Y respectively refer to the coordinates of the mass center of the electron cloud received by the anode;
k is a correction factor;
2) making a mask
Respectively manufacturing a top layer electrode pattern mask and a bottom layer electrode pattern mask according to the required overall dimension of the potential sensitive anode;
the top layer electrode pattern mask comprises a W electrode and an S electrode, and the bottom layer electrode pattern mask is a Z electrode;
3) processing anode substrates
3.1) processing an anode substrate according to the size of the position-sensitive anode, wherein the size of the processed anode substrate is matched with the outline size of the position-sensitive anode;
3.2) photoetching the patterns of the W electrode and the S electrode on the top layer of the anode substrate by utilizing a top layer electrode pattern mask; and photoetching the Z electrode pattern on the bottom layer of the anode substrate by using a bottom electrode pattern mask.
Further, still include:
step 4) installing a support ring
4.1) processing a corresponding support ring according to the size of the anode substrate, wherein the outer contour size of the support ring is matched with that of the anode substrate, and the inner diameter of the support ring is larger than the outer diameter of a collecting area of an electrode;
the material of the support ring is the same as that of the anode substrate;
4.2) fixing the anode substrate processed in the step 3.2) with the support ring processed in the step 4.2).
Further, in the step 2), processing marks on the top layer electrode pattern mask and the bottom layer electrode pattern mask;
in the step 3.2), a first marking hole matched with the mark is processed on the anode substrate;
a second marking hole matched with the first marking hole is machined in the support ring;
in the step 4.1), the method further comprises the step 4.2) specifically: adding adhesive between the anode substrate and the support ring, and pressing the anode substrate and the support ring under certain pressure and temperature; and in the bonding and pressing process, the first marking hole on the anode substrate is ensured to be aligned with the second marking hole on the support ring.
Further, in step 4.1), electrode pinholes are formed on the anode substrate provided with the support ring, and the pinholes are metallized to form conductive through holes.
Further, in the step 3.1), the anode substrate is a double-sided copper-clad plate;
the base material of the double-sided copper-clad plate is FR4 or PTFE sheet material, the thickness of the base material is 0.1-0.3 mm, and the thickness of copper is 2-17 μm.
Compared with the prior art, the invention has the advantages that:
1. the three electrodes of the position-sensitive anode are respectively positioned on two different plane layers, so that the requirements on manufacturing equipment and manufacturing process are reduced, the manufacturing difficulty of the position-sensitive anode is greatly simplified, and the manufacturing period of the position-sensitive anode is shortened;
the different layer distribution structure of several electrodes of the potential sensitive anode greatly increases the width of the insulating channel between the electrodes, avoids the narrow insulating channel between the two electrodes, reduces the risk of conduction between the two electrodes and improves the reliability of the detector.
2. The anode substrate of the invention is provided with a marking hole for aligning the electrode patterns on the two plane layers.
3. The anode substrate in the position-sensitive anode can adopt a double-sided copper-clad plate, and the electrode is processed on the copper surface of the double-sided copper-clad plate, so that the manufacturing process of the position-sensitive anode is greatly simplified, the manufacturing cost is reduced, and the mass production is possible.
Drawings
FIG. 1 is a view showing a structure of a conventional wedge-bar type anode;
in fig. 1, the reference numerals are as follows:
01-W electrode, 02-S electrode, 03-anode substrate, 04-Z electrode.
FIG. 2 is an exploded view of a hetero-layered structure potential sensitive anode for sensing readout according to the present invention (without a support plate);
FIG. 3 is a cross-sectional view of FIG. 2;
FIG. 4 is a schematic view of a position sensitive anode with a support ring according to the present invention;
FIG. 5 is an exploded view of FIG. 4;
FIG. 6 is a sectional view taken along line A-A of FIG. 4;
FIG. 7 is a schematic diagram of an application of a metamorphic potential sensitive anode for sensing readout according to the present invention;
in fig. 2 to 7, the reference numerals are as follows:
the method comprises the following steps of 1-W electrode, 2-S electrode, 3-anode substrate, 4-Z electrode, 5-first marking hole, 6-support ring, 7-electrode leading-out hole, 8-leading-out electrode, 9-second marking hole, 11-input window, 12-photocathode, 13-microchannel plate, 14-high resistance film, 15-ceramic substrate, 16-position sensitive anode and 17-bonding pad.
Detailed Description
The invention is described in further detail below with reference to the figures and specific embodiments.
The wedge-shaped potential sensitive anode comprises three electrodes, a wedge-shaped (W) electrode, a stripe (S) electrode and a zigzag (Z) electrode between the wedge-shaped (W) electrode and the stripe (S) electrode, wherein the electrodes are positioned on the same plane, and the decoding formula is that X is 2Qs/(Qw+Qs+Qz)，Y＝2*Qw/(Qw+Qs+Qz) (ii) a The conventional design and manufacturing method comprises the following steps: an anode pattern is etched on a metal film attached to an insulating material, three electrodes of a potential sensitive anode are distributed on the same plane, a substrate generally adopts quartz glass or ceramic, and a processing mode mainly adopts a microelectronic process or a laser processing process.
The imaging charge of the potential-sensitive anode detector is read out by charge induction method by using mirror charge technology and vapor depositionA high resistance film 14 on the ceramic substrate 15 collects the electron cloud output by the MCP, while a potential sensitive anode on the back of the ceramic substrate 15 induces a corresponding charge cloud. According to the principle of induced charge, the potential-sensitive anode can be innovatively designed and processed so as to optimize the processing technology of the potential-sensitive anode and improve the reliability of the detector. And determining the electrodes distributed on the top layer and the bottom layer according to the graph of the position-sensitive anode and the decoding formula of the position-sensitive anode. The amount of charge collected by the W electrode 1 and the S electrode 2 determines the centroid position of the electron cloud. The Z-electrode 4 can be placed in other planes by the principle of induced charge. After the induction reading, the induction signal of the Z electrode 4 is slightly weaker than that of the coplanar structure, and can be corrected by a correction factor when the electronic cloud center of mass is decoded, namely the decoding formula is changed into X2Qs/(Qw+Qs+k*Qz)，Y＝2*Qw/(Qw+Qs+k*Qz) Where k is a calibration factor related to the thickness, material, and relative dielectric constant of the anode substrate 3, and the specific value can be determined experimentally.
As shown in fig. 2 to 6, an induction readout potential sensitive anode with a different layer structure comprises an anode substrate 3 and a metal electrode; the electrode pattern and the number of the metal electrodes are different according to different decoding principles of each anode, wherein the specific decoding principle refers to decoding based on a charge division type, the anode is a charge division type potential sensitive anode, specifically a wedge-shaped anode, and is deformed according to the related design of specific application, for example, the anode can be round, square, rectangular, fan-shaped and other structures; the number of electrodes includes a three-electrode structure and a four-electrode structure.
The individual electrodes of the anode are distributed in different planes, in particular in two different planar layers, and the two individual electrode layers share the anode substrate 3 (insulating medium). For the wedge-bar type anode, an insulating medium layer is arranged between two electrode layer plane layers, the metal electrodes comprise a W electrode 1, an S electrode 2 and a Z electrode 4, the W electrode 1 and the S electrode 2 used for determining the two-dimensional position of photons are positioned on the same plane layer and positioned on the top layer of the anode substrate 3, and the rest Z electrodes 4 are positioned on the other plane layer and positioned on the bottom layer of the anode substrate 3; the three electrode patterns can still form the potential sensitive anode with a conventional structure when being positioned on the same plane.
The metal electrode material can be copper, gold, aluminum and other metal materials with good electrical conductivity, the thickness of the electrode is 1-17 μm, and if copper and other metal materials which are easy to oxidize are adopted, gold is plated on the surface of the electrode pattern to prevent the anode panel from being oxidized.
The anode substrate 3 is made of FR4, PTFE or other insulating materials, and has a relative dielectric constant of 2-5 and a thickness of 0.1-0.3 mm. In addition, the anode substrate 3 is also a double-sided copper-clad plate; the base material of the double-sided copper-clad plate is FR4 or PTFE sheet material, the thickness of the base material is 0.1-0.3 mm, the thickness of copper is 2-17 μm, and the W electrode 1, the S electrode 2 and the Z electrode 4 are processed by photoetching on the copper foil of the double-sided copper-clad plate, so that the manufacturing process of the position-sensitive anode is greatly simplified, the manufacturing difficulty is reduced, and the reliability of the position-sensitive anode is improved.
The two plane layers are both provided with marks; the anode substrate 3 is provided with a plurality of first mark holes 5 matched with the marks for aligning the electrode patterns on the two plane layers.
The position-sensitive anode of the embodiment also comprises a support ring 6, the size of the outer contour of the support ring 6 is matched with (slightly larger than) that of the outer contour of the anode substrate 3, and the inner diameter of the support ring 6 is larger than the outer diameter of the collecting area of the electrode; the material of the support ring 6 is the same as that of the anode substrate 3, and the thickness of the support ring is 1-3 mm. The bonding glue is arranged between the anode substrate 3 and the support ring 6, the anode substrate 3 and the support ring 6 are pressed under certain pressure and temperature, the second mark hole 9 is formed in the support ring 6, the alignment mark needs to be noticed in the bonding and pressing process, and the copper electrode of the press ring and the position-sensitive anode lead electrode are ensured to be corresponding in position.
The embodiment also provides a method for manufacturing the induction readout metamorphic structure potential sensitive anode, which comprises the following steps:
1) determining electrode distribution locations
Determining electrodes distributed on the top layer and the bottom layer of the position-sensitive anode according to the graph of the position-sensitive anode and a decoding formula of the position-sensitive anode;
the electrodes comprise a W electrode 1, an S electrode 2 and a Z electrode 4;
the decoding formula of the position-sensitive anode is as follows:
X＝2*Qs/(Qw+Qs+k*Qz)，Y＝2*Qw/(Qw+Qs+k*Qz)；
wherein Q isw、Qs、QzW, S, Z electrodes 4 respectively collect the electric quantity of 3 electric pulses;
x, Y respectively refer to the coordinates of the mass center of the electron cloud received by the position-sensitive anode;
k is a calibration factor, which is related to the thickness, material, and relative dielectric constant of the anode substrate 3, and the specific value can be determined by experiment.
2) Making a mask
Respectively manufacturing a top layer electrode pattern mask and a bottom layer electrode pattern mask according to the required overall dimension of the potential-sensitive anode, and processing marks on the top layer electrode pattern mask and the bottom layer electrode pattern mask;
the top layer electrode pattern mask comprises a W electrode 1 and an S electrode 2, and the bottom layer electrode pattern mask comprises a Z electrode 4;
3) machining of the Anode substrate 3
3.1) taking out the double-sided copper-clad plate, wherein the basic parameters of the double-sided copper-clad plate meet the following requirements: the base material is FR4 or PTFE sheet material, the thickness of the base material is 0.1 mm-0.3 mm, the thickness of the copper foil is 2 μm-17 μm, and the cutting is carried out according to the size of the position sensitive anode. The size of the cut plate is slightly larger than the outline size of the needed position-sensitive anode, and a first marking hole 5 is made in the plate to be matched with the marks on the top layer electrode pattern mask and the bottom layer electrode pattern mask so as to ensure the positioning accuracy and the pattern accuracy of the top layer electrode pattern and the bottom layer electrode pattern;
3.2) photoetching the patterns of the W electrode 1 and the S electrode 2 on the top layer of the anode substrate 3 by utilizing a top layer electrode pattern mask; the pattern of the Z electrode 4 is photoetched on the bottom layer of the anode substrate 3 by utilizing a bottom layer electrode pattern mask, and during photoetching, alignment is needed according to the mask pattern mark and the first mark hole 5 of the copper-clad plate substrate so as to ensure the accurate positions of the patterns on two layers.
4) Processing the support ring 6:
and processing a corresponding support ring 6 according to the size of the position-sensitive anode, wherein the support ring 6 has a certain width and can cover the extraction electrode hole of the position-sensitive anode. The inner diameter of the support ring 6 needs to be larger than the outer diameter of the collecting area of the position-sensitive anode, so as to avoid the influence on the anode sensing signal. A second marking hole 9 corresponding to the first marking hole 5 of the copper-clad plate base material is arranged on the support ring 6, and a circular copper electrode is photoetched at the position of the support ring corresponding to the anode electrode lead-out hole 7 so as to be convenient for subsequent metal via hole and lead welding;
the material of the support ring 6 is the same as that of the anode base 3, and the thickness of the base material is 1 mm-3 mm.
5) Fixing the support ring 6 with the anode base 3
Adding adhesive between the anode substrate 3 and the support ring 6, and pressing the position-sensitive anode and the support ring 6 under certain pressure and temperature; in the bonding and pressing process, the first marking hole 5 on the anode substrate 3 is aligned with the second marking hole 9 on the support ring 6, so that the pressing ring copper electrode corresponds to the position of the position-sensitive anode lead electrode.
6) Making conductive vias
And (3) carrying out electrode pinhole forming on the anode substrate 3 with the support ring 6, wherein the aperture of the pinhole is phi 0.5 mm-phi 1mm, and metalizing the pinhole to prepare a conductive through hole.
7) Gold plating treatment
The formed position-sensitive anode is plated with gold, and the specific method can adopt electroplating or chemical plating to avoid the oxidation of the copper electrode, and the manufactured position-sensitive anode for induction reading is shown in fig. 4 to 6.
The manufacturing method shortens the manufacturing period of the position-sensitive anode, reduces the manufacturing cost and makes the mass manufacturing of the anode possible. Meanwhile, the width of an insulation channel between anode electrodes is increased, and the reliability is improved.
As shown in fig. 7, the fabricated position-sensitive anode 16 is assembled into a photon counting imaging detector, anode signals are led out from each pad 17 in the position-sensitive anode support ring 6 and enter the readout electronics, light reaches the photocathode 12 through the input window 11 and generates a photoelectric effect, electrons emitted by the photoelectric effect enter the microchannel 13 and multiply to output an electron cloud, the high-resistance film 14(Ge) evaporated on the ceramic substrate 15 collects the electron cloud output by the MCP, the position-sensitive anode 16 positioned on the back of the ceramic substrate 15 simultaneously senses corresponding electron cloud signals, the electrode on the top layer of the anode (near the Ge layer substrate) senses signals through the ceramic substrate medium, and the electrode on the bottom layer of the anode senses signals through the ceramic substrate and the anode substrate medium. Therefore, the electrode sensing signal at the bottom layer of the anode is slightly weaker than that at the top layer, when the photon event position is calculated, the attenuation of the electrode signal at the bottom layer needs to be taken into consideration, the attenuation of the bottom layer sensing signal of the position-sensitive anode 16 is corrected through the k value, and the imaging result of the detector is obtained after reading electronics and relevant data processing software. The photon counting imaging detector belongs to weak signal detection, the distance between front-end electronics and a potential-sensitive anode 16 needs to be as short as possible so as to reduce electronics noise, and the potential-sensitive anode 16 and the front-end electronics can be integrally designed and manufactured on the same pcb so as to further reduce the front-end electronics noise and improve the imaging performance of the detector.
The above description is only for the purpose of describing the preferred embodiments of the present invention and does not limit the technical solutions of the present invention, and any known modifications made by those skilled in the art based on the main technical concepts of the present invention fall within the technical scope of the present invention.
Claims (10)
1. An inductively read out heterolamellar structure potential-sensitive anode, characterized in that: comprises an anode substrate (3), a W electrode (1), an S electrode (2) and a Z electrode (4),
the W electrode (1) and the S electrode (2) are positioned on the same plane layer and positioned on the top layer of the anode substrate (3);
the Z electrode (4) is positioned on the other plane layer and is positioned on the bottom layer of the anode substrate (3).
2. An inductively read out heterostructured, potential-sensitive anode of claim 1, wherein: the two plane layers are both provided with an extraction electrode (8);
an electrode leading-out hole (7) matched with the leading-out electrode (8) is formed in the anode substrate (3);
the anode substrate (3) is also provided with a first marking hole (5) for positioning the two plane layers.
3. An inductively read out heterostructured, potential-sensitive anode of claim 2, wherein: the anode comprises a support ring (6) connected with the top layer or the bottom layer of the anode substrate (3);
the outer contour dimension of the support ring (6) is matched with the outer contour dimension of the anode substrate (3), and the inner diameter of the support ring (6) is larger than the outer diameter of the collecting area of the electrode;
the material of the support ring (6) is the same as that of the anode substrate (3).
4. A metamorphic potential sensitive anode for inductive readout as claimed in any of claims 1 to 3 wherein: the anode substrate (3) is a double-sided copper-clad plate;
the base material of the double-sided copper-clad plate is FR4 or PTFE sheet material, the thickness of the base material is 0.1-0.3 mm, and the thickness of copper is 2-17 μm.
5. An inductively read out heterostructured, potential-sensitive anode of claim 3, wherein: adhesive glue is arranged between the anode substrate (3) and the support ring (6);
and a second marking hole (9) matched with the first marking hole (5) is arranged on the support ring (6).
6. A method for manufacturing a sensing readout metamorphic structure potential sensitive anode is characterized by comprising the following steps:
1) determining electrode distribution locations
Determining electrodes distributed on the top layer and the bottom layer of the position-sensitive anode according to the graph of the position-sensitive anode and a decoding formula of the position-sensitive anode;
the electrodes comprise a W electrode (1), an S electrode (2) and a Z electrode (4);
the decoding formula of the position-sensitive anode is as follows:
X＝2*Qs/(Qw+Qs+k*Qz)，Y＝2*Qw/(Qw+Qs+k*Qz)；
wherein Q iswQs and Qz are electric quantities of 3 electric pulses collected by the W electrode (1), the S electrode (2) and the Z electrode (4) respectively;
x, Y respectively refer to the coordinates of the mass center of the electron cloud collected by the anode;
k is a correction factor;
2) making a mask
Respectively manufacturing a top layer electrode pattern mask and a bottom layer electrode pattern mask according to the required overall dimension of the potential sensitive anode;
the top layer electrode pattern mask comprises a W electrode (1) and an S electrode (2), and the bottom layer electrode pattern mask comprises a Z electrode (4);
3) processing anode substrate (3)
3.1) processing an anode substrate (3) according to the size of the position-sensitive anode, wherein the size of the processed anode substrate (3) is matched with the outline size of the position-sensitive anode;
3.2) photoetching the patterns of the W electrode (1) and the S electrode (2) on the top layer of the anode substrate (3) by utilizing a top layer electrode pattern mask; and photoetching the bottom layer of the anode substrate (3) to form the pattern of the Z electrode (4) by using a bottom layer electrode pattern mask.
7. The method for fabricating a metamorphic potential sensitive anode for sensing according to claim 6, further comprising:
step 4) installing a support ring (6)
4.1) processing a corresponding support ring (6) according to the size of the anode substrate (3), wherein the external contour size of the support ring (6) is matched with the external contour size of the anode substrate (3), and the internal diameter of the support ring (6) is larger than the collecting area of the electrode;
the material of the support ring (6) is the same as that of the anode substrate (3);
4.2) fixing the anode substrate (3) processed in the step 3.2) with the support ring (6) processed in the step 4.2).
8. The method for fabricating a metamorphic structure potential sensitive anode for sensing readout according to claim 7, wherein: in the step 2), processing marks on the top layer electrode pattern mask and the bottom layer electrode pattern mask;
step 3.2), a first marking hole (5) matched with the mark is machined in the anode substrate (3);
in the step 4.1), a second marking hole (9) matched with the first marking hole (5) is machined in the support ring (6);
step 4.2), specifically, adding adhesive between the anode substrate (3) and the support ring (6), and pressing the anode substrate (3) and the support ring (6) under certain pressure and temperature; and in the bonding and pressing process, the first mark hole (5) on the anode substrate (3) is ensured to be aligned with the second mark hole (9) on the support ring (6).
9. The method for manufacturing a metamorphic structure potential sensitive anode for sensing readout according to claim 8 is characterized in that in step 4.1), the method further comprises the steps of forming electrode holes on the support ring (6) and metalizing the holes to form conductive through holes.
10. The method for fabricating a metamorphic structure potential sensitive anode for sensing according to any of claims 6 to 9, wherein: in the step 3.1), the anode substrate (3) is a double-sided copper-clad plate;
the base material of the double-sided copper-clad plate is FR4 or PTFE sheet material, the thickness of the base material is 0.1-0.3 mm, and the thickness of copper is 2-17 μm.
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