CN107389187B - Position-sensitive anode detector and preparation method thereof - Google Patents
Position-sensitive anode detector and preparation method thereof Download PDFInfo
- Publication number
- CN107389187B CN107389187B CN201710438625.XA CN201710438625A CN107389187B CN 107389187 B CN107389187 B CN 107389187B CN 201710438625 A CN201710438625 A CN 201710438625A CN 107389187 B CN107389187 B CN 107389187B
- Authority
- CN
- China
- Prior art keywords
- mcp
- anode
- metal
- ring
- detector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000002360 preparation method Methods 0.000 title abstract description 4
- 229910052751 metal Inorganic materials 0.000 claims abstract description 124
- 239000002184 metal Substances 0.000 claims abstract description 124
- 229910052738 indium Inorganic materials 0.000 claims abstract description 66
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 64
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 238000009413 insulation Methods 0.000 claims abstract description 29
- 239000004020 conductor Substances 0.000 claims abstract description 13
- 238000001514 detection method Methods 0.000 claims abstract description 10
- 239000000919 ceramic Substances 0.000 claims description 46
- 238000007789 sealing Methods 0.000 claims description 39
- 238000000034 method Methods 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 21
- 238000003466 welding Methods 0.000 claims description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 125000004122 cyclic group Chemical group 0.000 claims description 10
- 239000011521 glass Substances 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000012545 processing Methods 0.000 claims description 8
- 239000003513 alkali Substances 0.000 claims description 6
- 238000001704 evaporation Methods 0.000 claims description 6
- 230000008020 evaporation Effects 0.000 claims description 6
- 238000012544 monitoring process Methods 0.000 claims description 6
- 238000012546 transfer Methods 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 5
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 238000001259 photo etching Methods 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 3
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 claims description 3
- 229910001635 magnesium fluoride Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 238000005201 scrubbing Methods 0.000 claims description 3
- 238000001291 vacuum drying Methods 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 2
- 238000005530 etching Methods 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000012943 hotmelt Substances 0.000 claims description 2
- 238000003384 imaging method Methods 0.000 abstract description 6
- 238000005516 engineering process Methods 0.000 abstract description 5
- 238000007740 vapor deposition Methods 0.000 abstract 1
- 239000010453 quartz Substances 0.000 description 6
- 239000011195 cermet Substances 0.000 description 5
- 239000010949 copper Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 229910000639 Spring steel Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 230000002123 temporal effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000006880 cross-coupling reaction Methods 0.000 description 1
- 238000002059 diagnostic imaging Methods 0.000 description 1
- 230000005292 diamagnetic effect Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000002189 fluorescence spectrum Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000009206 nuclear medicine Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
- G01J1/4204—Photometry, e.g. photographic exposure meter using electric radiation detectors with determination of ambient light
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J40/00—Photoelectric discharge tubes not involving the ionisation of a gas
- H01J40/16—Photoelectric discharge tubes not involving the ionisation of a gas having photo- emissive cathode, e.g. alkaline photoelectric cell
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
- Measurement Of Radiation (AREA)
Abstract
The present invention relates to photon counting imaging detection technology fields, more particularly to a kind of position-sensitive anode detector and preparation method thereof, the detector includes cathode window, MCP electron multipliers, position-sensitive anode and tubular shell with photocathode, position-sensitive anode includes anodized insulation substrate and the metal film anode being arranged on anodized insulation substrate, metal film anode lines up anode array side by side in the horizontal direction by n × n assistant anode, each assistant anode is square, and insulated trenches are equipped between adjacent assistant anode；Each assistant anode contact conductor passes perpendicularly through anodized insulation substrate.The making that step completes the detector is sealed by tubular shell sealing-in, tubular shell indium, cathode window metal film vapor deposition, making anodized insulation substrate, making metal film anode, assembly detector assembly, making photocathode, detector indium.The detector dynamic range is big, can not only be operated under the conditions of single-photon incident light, but also can be operated under the conditions of stronger incident light.
Description
Technical field
The present invention relates to photon counting imaging detection technology fields, and in particular to a kind of position-sensitive anode detector and its making
Method.
Background technology
Photon counting imaging Detection Techniques are to utilize atomic low light irradiation to a kind of new technology of atomic dim light target imaging
Under the conditions of, the feature of photoelectric detector output signal nature discretization, using pulse amplitude discriminator or the method for step-by-step counting
Carry out photon counting imaging detection.Position-sensitive anode detector due to being based on microchannel plate (MCP) has high gain, signal-to-noise ratio good
The advantages that, it is more and more widely used in the photon technologies field of detecting such as astronomy, high-energy physics, nuclear medicine.
Position-sensitive anode detector can be divided into impedance type and charge division type by anode decoding mode, and impedance type is according at different location
Electrode impedance it is different and generate different electrode output signals to carry out event decoding, such as Dely-line anodes.Charge division
Type anode is the quantity of electric charge that is received according to Different electrodes to solve the centroid position of charge cloud cluster, such as WSA, Vernier, Cross-
The anodes such as Strip.
Since Delay Line delay line anodes reduce signal pulse using higher dielectric coefficient and snakelike electrode
Transmission speed so that the charge signal of all output electrodes generates delay, and the real-time of signal processing is poor.In addition, due to by
Signal draws the influence of time and electronic response time, can only detect click event, i.e. dynamic range is small.
WSA anode patterns are made of the type electrode of wedge electrode, strip electrode sum, are separated by insulated wire between electrode, the anode
Cross-coupling coefficient is bigger between design feature itself makes tri- electrodes of W, S, Z, and interelectrode capacitance reaches hundreds of pico farads, therefore
The detector temporal resolution is limited.In addition, since it only receives the quantity of electric charge of entire charge cloud cluster with three electrodes, move
State range is small, and it is bigger to deviate the remoter scalloping in center.
In patent CN 101881658A, the electric charge collecting region of Vernier anodes is three kinds of different sinusoidal insulated trenches 19
Rectangular area made of the rectangular electrode unit arrangement of wavelength, shares nine signal output electrodes, although Vernier anodes are in face
It makes moderate progress than WSA anode in terms of product and scalloping distortion, but there is no obviously carry for its dynamic range and time resolution
It rises.
Cross-Strip, which intersects position-sensitive anode, has good time response and dynamic range, but difficulty of processing is big.By
It is divided into upper and lower two layers in the anode, the upper and lower include the identical multiple rectangular conductive items of size, in patent CN
In 103779149A, using the photoetching on 2 pieces of copper clad layers pcb boards, anode then is made in two pieces of pcb board hot pressing.Although solving
Its processing problems, but the anode made of this method cannot bear high-temperature baking, not with vacuum device high-temperature heat treatment process
It is compatible.
Invention content
In order to solve, existing position-sensitive anode detector dynamic range is small, temporal resolution is low, position-sensitive anode difficult processing etc. is asked
Topic, a kind of position-sensitive anode detector of present invention offer and preparation method thereof.There is two-dimensional position to differentiate, is good for detector of the present invention
Time response, high-gain, useful detection area than big, compact-sized, easy splicing the advantages that, can be applied to larger medical imaging
(PET), high energy physical detecting field and time-resolved photon counting device, the mostly light such as small-sized gamma camera, two-dimensional radiation monitoring
Fine scinticounting, fluorescence spectrum, parallel multi-channel read spectroscope etc..
Technical solution of the invention is to provide a kind of position-sensitive anode detector, includes the cathode with photocathode 2
Window 1, MCP electron multipliers 8, position-sensitive anode and tubular shell, above-mentioned position-sensitive anode include anodized insulation substrate 20 and setting
Metal film anode 18 on anodized insulation substrate 20, above-mentioned cathode window 1, tubular shell and anodized insulation substrate 20 constitute vacuum
Seal chamber；Above-mentioned photocathode 2, MCP electron multipliers 8 and metal film anode 18 are located at vacuum sealing intracavitary；
It is characterized in that：
Above-mentioned metal film anode 18 lines up anode array, the numerical value of n side by side in the horizontal direction by n × n assistant anode 24
It requires to determine according to detector spatial resolution, each assistant anode 24 is square, is equipped between adjacent assistant anode 24
Insulated trenches 23；There is each assistant anode 24 contact conductor 21 of equal length, above-mentioned contact conductor 21 to pass through anodized insulation
Substrate 20.
The contact conductor of each assistant anode 24 passes through (preferred vertical passes through) ceramic substrate (or glass plate substrate), each
A assistant anode 24 directly leads out vacuum environment, avoids making signal lead between each assistant anode 24 and increasing signal and do
It disturbs, while the length of lead-out wire of each anode is consistent, the impedance difference of each metal conducting layer anode unit is small, is conducive to detector
Anode impedance matches.Position-sensitive anode one side (leaning on metal conducting layer anode surface) is located in vacuum, and another side is located at outside vacuum, the position
Quick anode avoids multiple anode signal leads and makes the conventional production method for using bonding, and with making, simple, structure is tight
The characteristics of gathering has good compatible in addition, the anode can bear 400 DEG C of high-temperature bakings with vacuum photoelectric device manufacture craft
Property.
Preferably, in order to realize secured and simple fixed MCP electron multipliers 8, detector of the present invention further includes clamp spring
7；
Above described tubular shell includes the indium sealing groove 3 stacked successively, the first ceramic ring 4, the pottery of clamp spring positioning metal ring 5, second
Ceramic ring 9, third ceramic ring 11, ring-type MCP metal trays 12, the 4th ceramic ring 13 and metal lower seal ring 14；
Above-mentioned cathode window 1 is fixed on indium sealing groove 3；
Above-mentioned clamp spring 7 is pressed on 8 input face of MCP electron multipliers, and clamp spring inclined-plane 22 is stuck on clamp spring positioning metal ring 5；
Above-mentioned MCP electron multipliers 8 are placed in cyclic annular MCP metal trays 12；
Anodized insulation substrate 20 further includes the metal sealing ring 19 connected with it；Above-mentioned metal lower seal ring 14 and metal sealing
Ring 19 is connected.
Above-mentioned clip spring structure is that square of the one side with opening is fixed using the preferable spring steel material of elasticity with card
The method that the mode of ring substitutes traditional spot welding metal pressure ring to fix MCP has simple assembly, fixation, high-temperature baking resistant
The advantages that.Clamp spring inclined-plane is stuck on ceramic cartridge clamp spring positioning metal ring, is pressed in below clamp spring on MCP input faces, the water of clamp spring
Square to elastic force be transmitted to vertical direction, be applied on MCP, play the role of fixed MCP.
Preferably, in order to improve the gain of MCP groups, above described tubular shell further includes being located at the second ceramic ring 9 to make pottery with third
Metal electrode ring 10 between MCP between ceramic ring 11；
Above-mentioned MCP electron multipliers 8 are cascaded using 2 MCP, and be in the shape of the letter V arrangement, is placed in cyclic annular MCP metal trays 12
On, metal electrode thin slice ring 15 is placed between 2 MCP；Metal electrode ring 10 connects between above-mentioned metal electrode thin slice ring 15 and MCP
It connects；
Or above-mentioned MCP electron multipliers 8 are cascaded using 3 MCP, are arranged in zigzag, and metal electrode is placed between adjacent MCP
Thin slice ring, lower metal electrode foil ring 15 (count, second metal electrode thin slice ring) the metal electrode ring between MCP from the top down
10 connections.
Above-mentioned 8 one side of MCP electron multipliers can improve the gain of MCP groups, on the other hand can be with every separately adjustable
The operating voltage of MCP makes MCP groups be operated under the conditions of optimum operating voltage.
Preferably, when indium seals cathode window, extra indium stream goes out to cause cathode and MCP conductings or detector portion in order to prevent
Subregion cannot be imaged, and the one side wall that above-mentioned indium sealing groove 3 is located in vacuum-sealed cavity is provided with the indium extended to vacuum-sealed cavity
Slot platform 6, extra indium material are directly left on annular indium slot platform without flowing on MCP.
Preferably, for the ease of the assembly of MCP, cyclic annular MCP metal trays 12 are provided with for fixing MCP electron multipliers
8 MCP positioning convex platforms 16.
Preferably, it is provided with aperture 17 in cyclic annular MCP metal trays 12, is conducive to MCP when detector cathode makes high-temperature baking
The gas discharge in region between anode.
Preferably, for the ease of splicing multiple detectors, the structure of the detector is cube structure and above-mentioned cathode window
1, the vacuum-sealed cavity that tubular shell and anodized insulation substrate 20 are constituted is cube structure.
Preferably, above-mentioned cathode window 1 is Nian Jie with indium sealing groove 3 indium envelope；Each metalwork and ceramic member use pricker in tubular shell
Sealing connects；The thickness of above-mentioned metal electrode thin slice ring 15 is less than 0.1mm.
Preferably, which uses double close-up electron focusing structures, the i.e. cathode plane of photocathode 2 and MCP input faces
Distance is 1~3mm, and MCP output faces are 1~2mm at a distance from metal film anode 18.
Preferably, the thickness of metal film anode 18 is 300nm~1 μm.
Preferably, above-mentioned cathode window 1 is silica glass material, and photocathode 2 is CsK2Sb Bialkali photocathodes；Or cathode window 1
For magnesium fluoride uviol material, photocathode 2 is CsI or Cs2Te multi spaces；
Preferably, above-mentioned anodized insulation substrate 20 is using ceramics or glass material.
The present invention also provides a kind of above-mentioned position-sensitive anode detector production methods, include the following steps：
Tubular shell sealing-in：Sealing-in mould is processed, each metalwork of detector tubular shell, ceramic member are sealed successively
It connects, takes out leak detection；
Tubular shell indium：The tubular shell for completing sealing-in is placed in vacuum drying oven, it is pre- in the indium sealing groove 3 of tubular shell
Appropriate indium material is melted, it is for use to wipe a part of surface indium after taking-up off；
1 metal film of cathode window is deposited：Metal multilayer film is deposited on contact surface in 1 indium cover of cathode window i.e. with indium sealing groove 3；
Make anodized insulation substrate 20：Process sealing-in mould, by more contact conductors 21, metal sealing ring 19 respectively with pottery
Porcelain plate or glass plate sealing-in；
Make metal film anode 18：In 20 surface evaporation metal conductive film of anodized insulation substrate, material Au, Cr, Cu,
Ni or Al obtains multiple assistant anodes 24 by etching；
Assemble detector assembly：Assemble lower layer MCP, metal electrode thin slice successively in metal detector ceramic tubular shell
Ring 15, upper layer MCP, clamp spring 7 and position-sensitive anode；By metal electrode ring between the MCP in metal electrode thin slice ring 15 and tubular shell
Connection makes on the clamp spring positioning metal ring 5 that clamp spring inclined-plane 22 is stuck in tubular shell, and clamp spring 7 is pressed on MCP input faces, will be positive
The metal sealing ring 19 of pole dielectric substrate 20 is connect with the metal lower seal ring 14 in tubular shell, is then hunted leak；
Make photocathode 2：Cathode window 1, cathode making alkali source are fitted into the moon in ultrahigh vacuum transfer system first
Pole prepares chamber, and detector assembly is packed into indium and seals chamber, then carries out vacuum high-temperature baking exhaust, baking to each component of detector
Electronic Scrubbing is carried out to MCP after the completion, excludes its internal residual gas；Finally monitor the photocurrent variations feelings of photocathode 2
Condition adjusts the evaporation capacity of alkali source according to situation of change, the sensitivity of photocathode 2 is made to reach optimum value；
Detector indium seals：After photocathode 2 completes, the cathode window 1 with cathode from vacuum transfer system
Cathode prepare chamber be transferred to indium envelope chamber 3 sealing-in of indium sealing groove of cathode window 1 and detector assembly is made using hot indium encapsulation method
On.
Preferably, each metalwork of tubular shell and ceramic member are using soldering sealing-in；Using method for welding by more electricity
Pole lead 21 and ceramic wafer sealing-in, using the method for high temperature hot melt by more contact conductors 21 and glass plate sealing-in；Using photoetching
Method or Laser focus method obtain multiple assistant anodes 24；It is golden between MCP in metal electrode thin slice ring 15 and tubular shell
Belong to electrode retaining collar and passes through spot-welded；It will be in the metal sealing ring 19 of anodized insulation substrate and tubular shell using method of laser welding
Metal lower seal ring 14 welds；Utilize the photocurrent variations situation of photocurrent monitor monitoring of tools photocathode 2；Cathode window 1 and spy
It is 120 DEG C -160 DEG C to survey device assembly sealing temperature.
The beneficial effects of the invention are as follows：
1, detector anode of the present invention is made of multiple independent anode array, and each anode has independent signal to draw
Line, detector dynamic range is big, can not only be operated under the conditions of single-photon incident light, but also can be operated in stronger incident striation
Under part；
2, detector anode signal of the present invention is directly drawn below anodized insulation substrate, and processing is simple, compact-sized；
3, detector of the present invention uses double close-up structure and the cascade electron multiplier of polylith microchannel plate, has the time special
The good, high gain of property, diamagnetic interference, low noise advantages, meet the application demand in photon counting imaging field；
4, the present invention fixes the method that the mode of MCP substitutes traditional spot welding metal pressure ring to fix MCP, assembly letter with clamp spring
List, fixation, high-temperature baking resistant；
5, it is located at vacuum-sealed cavity side in indium sealing groove and devises one small indium slot platform, can receives when being sealed because of detector indium
The extra indium material squeezed out in indium sealing groove, prevents in indium stream to MCP, leads to cathode and MCP is connected or detector portion
Subregion cannot be imaged；
6, MCP positioning steps are devised in detector ring-type MCP metal trays of the invention, is assembled convenient for MCP；In ring-type
Machining small is designed in MCP metal trays, is conducive to the gas in region between MCP and anode when detector cathode makes high-temperature baking
Discharge；
7, detector of the invention uses square structure, effective area rate to splice side by side conducive to multiple detectors up to 90%
It uses, and detection blind area is small when multiple detectors splice and use.
Description of the drawings
Fig. 1 is the position-sensitive anode detector structural schematic diagram of the present invention；
Fig. 2 a are MCP fixed rings positive view of the present invention；
Fig. 2 b are MCP fixed rings sectional view of the present invention；
Fig. 3 a are position-sensitive anode positive view of the present invention；
Fig. 3 b are position-sensitive anode sectional view of the present invention；
Fig. 4 is position-sensitive anode detector production method block diagram of the present invention.
Reference numeral：1- cathode windows, 2- photocathodes, 3- indium sealing grooves, the first ceramic rings of 4-, 5- clamp spring positioning metal rings,
6- indium slot platforms, 7- clamp springs, 8-MCP electron multipliers, the second ceramic rings of 9-, metal electrode ring between 10-MCP, 11- third ceramics
Ring, 12- ring-type MCP metal trays, the 4th ceramic rings of 13-, 14- metal lower seal rings, 15- metal electrode thin slice rings, 16-MCP are fixed
Position boss, 17- apertures, 18- metal film anodes, 19- metal sealing rings, 20- anodized insulation substrates, 21- contact conductors, 22- cards
Spring inclined-plane, 23- insulated trenches, 24- assistant anodes.
Specific implementation mode
The present invention will be further described with reference to the accompanying drawings and embodiments.
The effective working size of position-sensitive anode detector of the present invention is 20x20mm~100x100mm, including cathode window 1, light
Electric cathode 2, MCP electron multipliers 8, clamp spring 7 (MCP fixed rings), position-sensitive anode and cermet tubulose shell, detector use
It is 1~3mm, MCP output faces and electronic receipt sun that double close-up electron focusing structures, i.e. cathode plane closely paste distance with MCP input faces
It is 1~2mm that pole-face, which closely pastes distance, sees Fig. 1.
It (is not limited to rectangular, or circle knot it will be seen from figure 1 that cermet tubulose shell is square structure
Structure), including the indium metal sealing groove 3, the first ceramic ring 4, clamp spring positioning metal ring 5, the second ceramic ring 9, the gold between MCP that stack successively
Belong to electrode retaining collar 10, third ceramic ring 11, ring-type MCP metal trays 12, the 4th ceramic ring 13, metal lower seal ring 14, each metalwork
With ceramic member using soldering sealing-in, there is good vacuum-tightness.In indium sealing groove 3 one small indium slot is devised close to inlet side
Platform 6 can absorb the extra indium material because being squeezed out in detector indium Feng Shicong indiums sealing groove 3, prevent in indium stream to MCP,
Cause cathode and MCP conductings or explorer portion region that cannot be imaged；In addition, being devised in cyclic annular MCP metal trays 12
MCP positioning convex platforms 16 assemble convenient for MCP；Machining small 17 is designed in cyclic annular MCP metal trays 12, is conducive to detector cathode
The gas in region is discharged between MCP and anode when making high-temperature baking.
Detector cathode window 1 is silica glass material (unlimited quartz glass and CsK2Sb Bialkali photocathodes), photocathode 2 is
CsK2Sb Bialkali photocathodes (can also be magnesium fluoride, uviol window material and CsI, Cs2Te, multi space), the sound of detector
It is 160~650nm to answer wave band.Quartz cathode window 1 is placed on indium sealing groove 3, is bonded together between the two with the mode that indium seals, stone
1 one side of English cathode window is located at outside vacuum environment, and another side is located in vacuum environment.Quartz cathode window 1 is served as a contrast as photocathode 2
Bottom, photocathode 2 are located at the suction surface of quartz cathode window 1.
MCP electron multipliers 8 are cascaded using 2 MCP, and the arrangement that is in the shape of the letter V is placed in the ring-type of cermet tubulose shell
It is the metal electrode thin slice ring 15 less than 0.1mm, metal electrode thin slice that thickness is placed in MCP metal trays 12, between 2 MCP
Metal electrode ring spot-welded between ring 15 and the MCP of ceramet tubular shell can also use 3 according to the requirement of detector gain
Piece MCP cascades, zigzag arrange, and metal electrode thin slice ring 15 is placed between adjacent MCP, golden between lower metal electrode foil ring and MCP
Belong to 10 spot-welded of electrode retaining collar.On the one hand the gain that MCP groups can be improved, on the other hand can be with the work of separately adjustable every MCP
Make voltage, MCP groups is made to be operated under the conditions of optimum operating voltage.
MCP electron multipliers 8 are fixed by clamp spring 7, such as Fig. 2 a and Fig. 2 b, clamp spring 7 (MCP fixed rings) structure is a sideband
The square for having opening substitutes traditional spot welding metal pressure ring using the preferable spring steel material of elasticity with the mode of card fixed ring
Method to fix MCP has many advantages, such as simple assembly, fixation, high-temperature baking resistant.MCP fixed rings inclined-plane is stuck in ceramics
It on the clamp spring positioning metal ring 5 of tubular shell, is pressed in below fixed ring on MCP input faces, the elastic force of the horizontal direction of clamp spring 7 passes
It is delivered to vertical direction, is applied on MCP, fixed MCP is played the role of.
From Fig. 3 a and Fig. 3 b can be seen that position-sensitive anode include anodized insulation substrate 20 and make on substrate it is multiple solely
24 array of vertical anode, multiple assistant anodes 24 are lined up side by side in the horizontal direction, and quantity is n × n, and the numerical value of n is according to detector
Spatial resolution requirements determine.Each assistant anode 24 is square, and the thickness of assistant anode 24 is 300nm~1 μm, and length is
A, 23 width of insulated trenches between each assistant anode 24 are b.The present embodiment is effectively to detect size as 60x60mm, anode
Number is for 8 × 8 (anode dimension and number numerical value without being limited thereto), then a is 7.3mm, b 0.2mm.Each assistant anode
24 contact conductor 21 passes perpendicularly through ceramic substrate (or glass plate substrate), metal film anode 18 directly lead out by cathode window 1,
The vacuum environment that cermet tubulose shell and ceramic substrate or glass plate substrate are constituted, avoids making between each assistant anode 24
Make signal lead and increase signal interference, while the length of lead-out wire of each anode is consistent, the resistance of each assistant anode Unit 24
Robust is not small, is conducive to detector anode impedance and matches.Position-sensitive anode one side (i.e. assistant anode face) is located in vacuum, another side position
In outside vacuum, which avoids multiple anode signal leads and makes the conventional production method for using bonding, has system
Make simple, compact-sized feature, in addition, the anode can bear 400 DEG C of high-temperature bakings, has with vacuum photoelectric device manufacture craft
There is good compatibility.
Position-sensitive anode detector of the present invention completes (as shown in Figure 4) by the following method：
Cermet tubulose shell sealing-in：Design processing sealing-in mould, assembles each of metal detector ceramic tubular shell
A metalwork, ceramic member, silver-copper brazing alloy are fitted into soldering oven the sealing-in that heats up after assembling, take out leak detection, it is desirable that leak rate≤10- 13Pa·l/s。
Tubular shell indium：The good tubular shell of sealing-in is placed in vacuum drying oven, is allowed pre- in ceramic tubular shell indium sealing groove 3
Appropriate indium material is melted, it is for use to wipe a part of surface indium after taking-up off.
1 metal film of cathode window is deposited：Metal multilayer film is deposited on 1 indium cover of quartz cathode window, enhancing indium material is on window
Wellability, improve vacuum seal air-tightness.
Position-sensitive anode dielectric substrate 20 makes：Design processing sealing-in mould, using method for welding more metal lead wires with
Ceramic wafer sealing-in is completed position-sensitive anode dielectric substrate 20 and is made, and more metal lead wires and glass plate high temperature can also be used to heat
Method make position-sensitive anode dielectric substrate 20.
Assistant anode array makes：In 20 surface evaporation metal conductive film of anodized insulation substrate, material Au, Cr, Cu,
Ni, Al obtain multiple assistant anodes 24 using photoetching process or Laser focus method.
Detector assembly erection welding：Lower layer MCP, metal electrode are assembled successively in metal detector ceramic tubular shell
Thin slice ring 15, upper layer MCP, MCP fixed ring, position-sensitive anode, with mash welder metal electrode thin slice ring 15 and ceramet tubulose
Between the MCP of shell in metal electrode ring spot-welded, MCP fixed rings inclined-plane is allowed to be stuck in ceramic tubular shell snap ring positioning metal ring
It is pressed on 5, below fixed ring on MCP input faces, with method of laser welding the metal sealing ring 19 and ceramic tubular of anode substrate
In the welding of shell lower seal ring 14, then hunt leak, it is desirable that leak rate≤10-13Pa.l/s。
Photocathode 2 makes：Quartz cathode window 1, cathode making alkali source are fitted into the moon in ultrahigh vacuum transfer system
Pole prepares chamber, and detector assembly is packed into indium and seals chamber, then carries out vacuum high-temperature baking exhaust, baking to each component of detector
Electronic Scrubbing is carried out to microchannel plate after the completion, excludes its internal residual gas.Finally carry out the making of photocathode 2, system
With the photocurrent variations situation of light current monitoring equipment monitoring photocathode 2 during making, alkali source is adjusted according to situation of change
Evaporation capacity makes the sensitivity of photocathode 2 reach optimum value.
Detector indium seals：After photocathode 2 completes, the quartz window with cathode from the moon of vacuum transfer system
Pole chamber is transferred to indium envelope chamber to be made in cathode window 1 and detector assembly sealing-in, sealing temperature 120 using hot indium encapsulation method
℃-160℃。
Claims (10)
1. a kind of position-sensitive anode detector, including carry photocathode (2) cathode window (1), MCP electron multipliers (8), position it is quick
Anode and tubular shell, the position-sensitive anode include anodized insulation substrate (20) and are arranged on anodized insulation substrate (20)
Metal film anode (18), the cathode window (1), tubular shell and anodized insulation substrate (20) constitute vacuum-sealed cavity；The light
Electric cathode (2), MCP electron multipliers (8) and metal film anode (18) are located at vacuum sealing intracavitary；
It is characterized in that：
The metal film anode (18) lines up anode array, the numerical value of n side by side in the horizontal direction by n × n assistant anode (24)
It requires to determine according to detector spatial resolution, each assistant anode (24) is square, between adjacent assistant anode (24)
Equipped with insulated trenches (23)；Each assistant anode (24) has the contact conductor (21) of equal length, the contact conductor (21)
Across anodized insulation substrate (20).
2. position-sensitive anode detector according to claim 1, it is characterised in that：Further include clamp spring (7), the clamp spring (7)
For fixing MCP electron multipliers (8)；
The tubular shell includes the indium sealing groove (3) stacked successively, the first ceramic ring (4), clamp spring positioning metal ring (5), second
Ceramic ring (9), third ceramic ring (11), ring-type MCP metal trays (12), the 4th ceramic ring (13) and metal lower seal ring (14)；
The cathode window (1) is fixed on indium sealing groove (3)；
The clamp spring (7) is pressed on MCP electron multipliers (8) input face, and clamp spring inclined-plane (22) are stuck in clamp spring positioning metal ring (5)
On；The MCP electron multipliers (8) are placed on cyclic annular MCP metal trays (12)；
Anodized insulation substrate (20) further includes the metal sealing ring (19) connected with it；The metal lower seal ring (14) is sealed with metal
Ring (19) is connect to be connected.
3. position-sensitive anode detector according to claim 2, it is characterised in that：The tubular shell further includes being located at second
Metal electrode ring (10) between MCP between ceramic ring (9) and third ceramic ring (11)；
The MCP electron multipliers (8) are cascaded using 2 MCP, and be in the shape of the letter V arrangement, is placed in cyclic annular MCP metal trays (12)
On, metal electrode thin slice ring (15) is placed between 2 MCP；Metal electrode thin slice ring (15) metal electrode ring between MCP
(10) it connects；
Or the MCP electron multipliers (8) are cascaded using 3 MCP, are arranged in zigzag, and it is thin that metal electrode is placed between adjacent MCP
Loop (15), lower metal electrode foil ring (15) metal electrode ring (10) between MCP are connect.
4. according to any position-sensitive anode detector of claim 2 to 3, it is characterised in that：The indium sealing groove (3) is located at true
One side wall in empty seal chamber is provided with the indium slot platform (6) extended to vacuum-sealed cavity.
5. position-sensitive anode detector according to claim 4, it is characterised in that：Cyclic annular MCP metal trays (12) are provided with
MCP positioning convex platforms (16) for fixing MCP electron multipliers (8).
6. position-sensitive anode detector according to claim 5, it is characterised in that：It is provided on cyclic annular MCP metal trays (12)
Aperture (17)；The vacuum-sealed cavity that the cathode window (1), tubular shell and anodized insulation substrate (20) are constituted is cube knot
Structure.
7. position-sensitive anode detector according to claim 3, it is characterised in that：The cathode window (1) and indium sealing groove (3) indium
Envelope bonding；Each metalwork and ceramic member are using soldering sealing-in in tubular shell；The thickness of the metal electrode thin slice ring (15) is small
In 0.1mm；The cathode plane of photocathode (2) is 1~3mm, MCP output faces and metal film anode (18) with MCP input face distances
Distance be 1~2mm；The thickness of metal film anode (18) is 300nm~1 μm.
8. position-sensitive anode detector according to claim 7, it is characterised in that：The cathode window (1) is quartz glass material
Material, photocathode (2) are CsK2Sb Bialkali photocathodes；Or cathode window (1) is magnesium fluoride uviol material, photocathode (2) is
CsI or Cs2Te multi spaces；
The anodized insulation substrate (20) is using ceramics or glass material.
9. a kind of any position-sensitive anode detector production method of claim 1 to 8, which is characterized in that including following step
Suddenly：
Tubular shell sealing-in：Processing sealing-in mould takes each metalwork of detector tubular shell, ceramic member sealing-in successively
Go out leak detection；
Tubular shell indium：The tubular shell for completing sealing-in is placed in vacuum drying oven, in indium sealing groove (3) interior fritting of tubular shell
Appropriate indium material, it is for use to wipe a part of surface indium off after taking-up；
Cathode window (1) metal film is deposited：Multiple layer metal is deposited on contact surface in cathode window (1) indium cover i.e. with indium sealing groove (3)
Film；
Make anodized insulation substrate (20)：Process sealing-in mould, by more contact conductors (21), metal sealing ring (19) respectively with
Ceramic wafer or glass plate sealing-in；
Make metal film anode (18)：In anodized insulation substrate (20) surface evaporation metal conductive film, material Au, Cr, Cu,
Ni or Al obtains multiple assistant anodes (24) by etching；
Assemble detector assembly：Assemble lower layer MCP, metal electrode thin slice ring successively in metal detector ceramic tubular shell
(15), upper layer MCP, clamp spring (7) and position-sensitive anode；By metal electricity between the MCP in metal electrode thin slice ring (15) and tubular shell
Polar ring connects, and makes on the clamp spring positioning metal ring (5) that clamp spring inclined-plane (22) is stuck in tubular shell, and clamp spring (7) is pressed in MCP inputs
On face, the metal sealing ring (19) of anodized insulation substrate (20) is connect with the metal lower seal ring (14) in tubular shell, then
Leak detection；
Make photocathode (2)：Cathode window (1), cathode making alkali source are fitted into the moon in ultrahigh vacuum transfer system first
Pole prepares chamber, and detector assembly is packed into indium and seals chamber, then carries out vacuum high-temperature baking exhaust, baking to each component of detector
Electronic Scrubbing is carried out to MCP after the completion, excludes its internal residual gas；The finally photocurrent variations of monitoring photocathode (2)
Situation adjusts the evaporation capacity of alkali source according to situation of change；
Detector indium seals：After photocathode (2) completes, the cathode window (1) with cathode from vacuum transfer system
Cathode prepare chamber be transferred to indium envelope chamber the indium sealing groove (3) of cathode window (1) and detector assembly is made using hot indium encapsulation method
In sealing-in.
10. position-sensitive anode detector production method according to claim 9, it is characterised in that：Each gold of tubular shell
Belong to part and ceramic member using soldering sealing-in；Using method for welding by more contact conductors (21) and ceramic wafer sealing-in, using high temperature
The method of hot melt is by more contact conductors (21) and glass plate sealing-in；It is obtained using photoetching process or Laser focus method multiple
Assistant anode (24)；Metal electrode ring passes through spot-welded between MCP in metal electrode thin slice ring (15) and tubular shell；Using
Method of laser welding welds the metal lower seal ring (14) in the metal sealing ring (19) of anodized insulation substrate and tubular shell；It utilizes
The photocurrent variations situation of photocurrent monitor monitoring of tools photocathode (2)；Cathode window (1) is with detector assembly sealing temperature
120℃-160℃。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710438625.XA CN107389187B (en) | 2017-06-12 | 2017-06-12 | Position-sensitive anode detector and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710438625.XA CN107389187B (en) | 2017-06-12 | 2017-06-12 | Position-sensitive anode detector and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107389187A CN107389187A (en) | 2017-11-24 |
| CN107389187B true CN107389187B (en) | 2018-08-03 |
Family
ID=60331771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710438625.XA Active CN107389187B (en) | 2017-06-12 | 2017-06-12 | Position-sensitive anode detector and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107389187B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113299537A (en) * | 2021-04-27 | 2021-08-24 | 中国科学院西安光学精密机械研究所 | Integrated narrow-frame photoelectric detector and manufacturing method thereof |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110068393A (en) * | 2019-04-03 | 2019-07-30 | 中国科学院西安光学精密机械研究所 | A kind of position-sensitive anode and position-sensitive anode detector for photodetection imaging |
| CN111024226B (en) * | 2019-12-17 | 2023-08-18 | 中国科学院西安光学精密机械研究所 | Position sensitive anode detector and manufacturing method thereof |
| CN111463100B (en) * | 2020-05-09 | 2022-08-16 | 北方夜视技术股份有限公司 | Photomultiplier special-shaped anode with rapid rise time characteristic and photomultiplier |
| CN111463099B (en) * | 2020-05-09 | 2022-07-08 | 北方夜视技术股份有限公司 | Near-contact focusing type photomultiplier |
| CN111883413B (en) * | 2020-07-23 | 2022-07-08 | 北方夜视技术股份有限公司 | Close-contact type micro-channel plate type photomultiplier with large opening area ratio |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102368584A (en) * | 2011-09-16 | 2012-03-07 | 北京工业大学 | Passive mode-locking ultrashort pulse all-fiber laser with waveband of 2.0 microns |
| CN206905898U (en) * | 2017-06-12 | 2018-01-19 | 中国科学院西安光学精密机械研究所 | A kind of position-sensitive anode detector |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08213689A (en) * | 1995-02-03 | 1996-08-20 | Seitai Hikari Joho Kenkyusho:Kk | Solid-state laser medium and solid-state laser device |
| JP2004177147A (en) * | 2002-11-25 | 2004-06-24 | Shimadzu Corp | Light emission measuring apparatus |
-
2017
- 2017-06-12 CN CN201710438625.XA patent/CN107389187B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102368584A (en) * | 2011-09-16 | 2012-03-07 | 北京工业大学 | Passive mode-locking ultrashort pulse all-fiber laser with waveband of 2.0 microns |
| CN206905898U (en) * | 2017-06-12 | 2018-01-19 | 中国科学院西安光学精密机械研究所 | A kind of position-sensitive anode detector |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113299537A (en) * | 2021-04-27 | 2021-08-24 | 中国科学院西安光学精密机械研究所 | Integrated narrow-frame photoelectric detector and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107389187A (en) | 2017-11-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107389187B (en) | Position-sensitive anode detector and preparation method thereof | |
| EP2442350B1 (en) | Photomultiplier tube | |
| CN103915311B (en) | Photomultiplier of electrostatic focusing micro-channel plates | |
| US8507838B2 (en) | Microstructure photomultiplier assembly | |
| JP3401044B2 (en) | Photomultiplier tube | |
| CN111024226B (en) | Position sensitive anode detector and manufacturing method thereof | |
| CN206905898U (en) | A kind of position-sensitive anode detector | |
| CN111883413B (en) | Close-contact type micro-channel plate type photomultiplier with large opening area ratio | |
| GB846911A (en) | Improvements in or relating to photo-multipliers | |
| CN209878135U (en) | Potential-sensitive anode for photoelectric detection imaging and potential-sensitive anode detector | |
| CN211401438U (en) | Induction readout potential sensitive anode with different layer structure | |
| US20200326433A1 (en) | Methods of fabricating vacuum housings with hermetic solder seals using capillary solder wicks | |
| CN206516606U (en) | A kind of contact conductor unit and vacuum photoelectric device | |
| JP3312771B2 (en) | Electron multiplier | |
| CN113299537B (en) | Integrated narrow-frame photoelectric detector and manufacturing method thereof | |
| KR101610158B1 (en) | X-ray detector with metal substrates | |
| CN110068393A (en) | A kind of position-sensitive anode and position-sensitive anode detector for photodetection imaging | |
| CN101478645B (en) | Electric charge induction image forming method based on semiconductor layer | |
| CN106876229B (en) | A kind of contact conductor unit, vacuum photoelectric device and preparation method thereof | |
| CN116972967A (en) | Multilayer structure capacitor anode, preparation method thereof and position sensitive anode detector | |
| CN116705586A (en) | Large-opening area ratio near-attached microchannel plate type photomultiplier | |
| JP3312772B2 (en) | Photomultiplier tube | |
| CN114551210A (en) | Photoelectric detection array anode and multi-anode photomultiplier tube | |
| CN117059467A (en) | Large-area electrostatic focusing position-sensitive microchannel plate type photomultiplier | |
| JPS612001A (en) | Incident position detector |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |