CN111088517A - Hardware product electroplating processing system - Google Patents
Hardware product electroplating processing system Download PDFInfo
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- CN111088517A CN111088517A CN202010026887.7A CN202010026887A CN111088517A CN 111088517 A CN111088517 A CN 111088517A CN 202010026887 A CN202010026887 A CN 202010026887A CN 111088517 A CN111088517 A CN 111088517A
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- electroplating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
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- Chemical Kinetics & Catalysis (AREA)
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- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a hardware product electroplating processing system which structurally comprises rollers, a placing plate, supporting blocks, a fixing frame, a motor box, supporting legs, a connecting plate, a shifting device and an electroplating box, wherein the rollers are installed on the fixing frame, the fixing frame is mechanically welded with the connecting plate, the connecting plate is positioned at the top of the supporting legs, the supporting legs are fixedly connected with the connecting plate, the electroplating box is arranged on the connecting plate, the shifting device is arranged in the electroplating box, the supporting blocks are connected with the connecting plate, and the placing plate is fixedly arranged on the supporting blocks. Utilize outer mechanical force drive to dial the driving wheel rotatory for dial the five metals work piece in the driving wheel promotes the electroplating chamber, make it be in the state of activity, electroplate the lump layer and contact with the five metals work piece surface, under the common effect of electroplating material, electroplating lump layer and electrolyte, electroplate by the position that the driving wheel promoted on the five metals work piece, be convenient for carry out omnidirectional electroplating to it, solved traditional electroplating scheme and lead to electroplating inhomogeneous problem.
Description
Technical Field
The invention relates to the field of hardware processing, in particular to an electroplating processing system for hardware products.
Background
Along with the development of metal mineral resources, the hardware product replaces the plastic product gradually, but the hardware product need be put into use after painting on its surface, avoids the hardware product to be oxidized, and present hardware product electroplates processing system has following defect:
the existing hardware product electroplating processing equipment directly puts a hardware workpiece to be electroplated into an electroplating cavity for electroplating, the hardware workpiece and the bottom of the electroplating cavity are in a relatively static state, and the connection part of the hardware workpiece and the bottom of the electroplating cavity is not electroplated, so that the electroplating of the hardware workpiece is uneven.
Disclosure of Invention
Aiming at the defects of the prior art, the invention is realized by the following technical scheme: a hardware product electroplating processing system structurally comprises rollers, a placing plate, supporting blocks, a fixing frame, a motor box, supporting legs, a connecting plate, a shifting device and an electroplating box, wherein the rollers are installed on the fixing frame, the fixing frame is mechanically welded with the connecting plate, the connecting plate is located at the top of the supporting legs, the supporting legs are fixedly connected with the connecting plate, the electroplating box is arranged on the connecting plate, the shifting device is arranged in the electroplating box, the supporting blocks are connected with the connecting plate, and the placing plate is fixedly arranged on the supporting blocks;
the stirring device is composed of an electroplating bin, a connecting unit and a stirring unit, wherein the connecting unit is arranged in the electroplating bin, the connecting unit is mechanically matched with the stirring unit, and the stirring unit is connected with the inner wall of the electroplating bin through the connecting unit.
As a further optimization of the invention, the electroplating bin is composed of a positive pole, an electroplating cavity and a negative pole, the positive pole and the negative pole have the same appearance, the positive pole and the negative pole are both arranged at the bottom of the electroplating cavity, the positive pole and the negative pole are arranged in a symmetrical structure, and the positive pole and the negative pole are fixedly connected with a panel at the bottom of the electroplating cavity.
As a further optimization of the invention, the connecting unit is composed of a connecting rod, a main connecting shaft and a connecting shaft, the connecting rod is mechanically connected with the main connecting shaft and the connecting shaft, the main connecting shaft is embedded on the inner wall of the electroplating cavity, the connecting shaft is fixedly connected with the shifting unit, the main connecting shaft and the connecting shaft have the same structure, and the main connecting shaft and the connecting shaft are respectively arranged at two ends of the connecting rod.
As a further optimization of the invention, the poking unit is composed of a solid frame, a hollow frame and a poking wheel, the hollow frame is arranged on the solid frame, the solid frame is connected with the poking wheel, the poking wheel is arranged at the position of the hollow frame on the solid frame, and the poking wheel is matched with the solid frame.
As a further optimization of the invention, the poking wheel is composed of a solid layer, a central shaft, auxiliary electroplating cavities and auxiliary electroplating heads, wherein the solid layer is connected with the central shaft, the central shaft is connected with an external mechanical force and drives the whole poking wheel to roll, the solid layer and the auxiliary electroplating cavities are distributed at intervals, the auxiliary electroplating heads are arranged in the auxiliary electroplating cavities, and the auxiliary electroplating heads are connected with the central shaft.
As a further optimization of the invention, the auxiliary electroplating head is composed of electroplating block layers, a fixed layer, connecting pipes, output holes and electroplating material bins, wherein the electroplating block layers are arranged on the fixed layer, three electroplating block layers are arranged on the fixed layer and are equidistantly arranged, three fixing layers are arranged and are respectively arranged in three auxiliary electroplating cavities, the electroplating block layers are fixedly connected with the fixed layer, the electroplating block layers are provided with the output holes, the output holes penetrate through the centers of the electroplating block layers, the output holes are communicated with the connecting pipes, and the electroplating material bins are communicated with the output holes through the connecting pipes.
As a further optimization of the invention, the electroplating material bin is circularly arranged and is communicated with the connecting pipe, so that metal raw materials required by electroplating are output, and electroplating replacement is facilitated.
As a further optimization of the invention, the number of the auxiliary electroplating cavities is three, and the poking wheels are uniformly distributed, so that three exposed cavities are formed on the side surfaces of the poking wheels, and the auxiliary electroplating heads are convenient to mount.
Advantageous effects
The invention relates to a hardware product electroplating processing system, which is characterized in that a hardware workpiece to be electroplated is placed in an electroplating cavity, electrolyte is poured into the electroplating cavity, metal of the hardware workpiece is replaced and electroplating is realized, in order to avoid local non-electroplating caused by standing of the hardware workpiece and influence on the overall electroplating quality of the hardware workpiece, a central shaft is driven to rotate by means of external mechanical force, so that the whole poking wheel of the central shaft rotates along with the central shaft, the hardware workpiece in the electroplating cavity is pushed to be in a movable state in the rotating process of the poking wheel, the hardware workpiece is convenient to be electroplated in all directions, an electroplating material bin supplies sufficient electroplating material to an output hole through a connecting pipe, an electroplating block layer is in contact with the surface of the hardware workpiece in the process that the poking wheel pushes the hardware workpiece, and the electroplating material, the electroplating block layer and the electrolyte are in a combined action to electroplate the position pushed by the poking wheel on the hardware workpiece, the pushing position is placed with a different plating degree than the other positions.
Compared with the prior art, the invention has the following advantages:
according to the invention, the poking wheel is driven to rotate by using external mechanical force, so that the poking wheel pushes the hardware workpiece in the electroplating cavity to be in a movable state, the electroplating block layer is contacted with the surface of the hardware workpiece, and the position pushed by the poking wheel on the hardware workpiece is electroplated under the combined action of an electroplating material, the electroplating block layer and electrolyte, so that the hardware workpiece is conveniently subjected to omnibearing electroplating, and the problem of uneven electroplating caused by the traditional electroplating scheme is solved.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a schematic structural diagram of an electroplating processing system for hardware products according to the present invention.
FIG. 2 is a top view of a shifting apparatus of the hardware electroplating processing system of the present invention.
FIG. 3 is a drawing showing the structure of a shifting unit of the hardware electroplating processing system according to the present invention.
FIG. 4 is a cross-sectional view of a dial wheel of an electroplating system for hardware products according to the present invention.
FIG. 5 is a perspective view of a toggle unit of the hardware electroplating processing system of the present invention.
FIG. 6 is a cross-sectional view of a shifting apparatus of an electroplating system for hardware products according to the present invention.
In the drawing, a roller-1, a placing plate-2, a supporting block-3, a fixing frame-4, a motor box-5, a supporting leg-6, a connecting plate-7, a shifting device-8, an electroplating box-9, an electroplating bin-81, a connecting unit-82, a shifting unit-83, a positive pole-811, an electroplating cavity-812, a negative pole-813, a connecting rod-821, a main connecting shaft-822, a connecting shaft-823, a solid frame-a, a hollow frame-b, a shifting wheel-c, a solid layer-c 1, a central shaft-c 2, an auxiliary electroplating cavity-c 3, an auxiliary electroplating head-c 4, an electroplating block layer-c 41, a fixing layer-c 42, a connecting pipe-c 43, an output hole-c 44 and an electroplating material bin-c 45.
Detailed Description
In order to make the technical means, the original characteristics, the achieved purposes and the effects of the invention easy to understand, the following description and the accompanying drawings further illustrate the preferred embodiments of the invention.
Example 1
Referring to fig. 1-6, the invention provides an electroplating processing system for hardware products, which structurally comprises a roller 1, a placing plate 2, a supporting block 3, a fixing frame 4, a motor box 5, supporting legs 6, a connecting plate 7, a shifting device 8 and an electroplating box 9, wherein the roller 1 is installed on the fixing frame 4, the fixing frame 4 is mechanically welded with the connecting plate 7, the connecting plate 7 is positioned at the top of the supporting legs 6, the supporting legs 6 are fixedly connected with the connecting plate 7, the electroplating box 9 is arranged on the connecting plate 7, the shifting device 8 is arranged in the electroplating box 9, the supporting block 3 is connected with the connecting plate 7, and the placing plate 2 is fixedly arranged on the supporting block 3;
the poking device 8 is composed of an electroplating bin 81, a connecting unit 82 and a poking unit 83, wherein the connecting unit 82 is arranged in the electroplating bin 81, the connecting unit 82 is mechanically matched with the poking unit 83, and the poking unit 83 is connected with the inner wall of the electroplating bin 81 through the connecting unit 82.
The connecting unit 82 is composed of a connecting rod 821, a main connecting shaft 822 and a connecting shaft 823, the connecting rod 821 is mechanically connected with the main connecting shaft 822 and the connecting shaft 823, the main connecting shaft 822 is embedded in the inner wall of the electroplating cavity 812, the connecting shaft 823 is fixedly connected with the shifting unit 83, the main connecting shaft 822 and the connecting shaft 823 are identical in structure, the main connecting shaft 822 and the connecting shaft 823 are respectively installed at two ends of the connecting rod 821, and the main connecting shaft 822 and the connecting shaft 823 are arranged so that the connecting rod 821 can drive the shifting unit 83 to swing up and down in the electroplating cavity 812.
The poking wheel c is composed of a solid layer c1, a central shaft c2, an auxiliary plating cavity c3 and an auxiliary plating head c4, the solid layer c1 is connected with the central shaft c2, the central shaft c2 is connected with external mechanical force and drives the whole poking wheel c to roll, the solid layer c1 and the auxiliary plating cavity c3 are distributed at intervals, the auxiliary plating head c4 is installed in the auxiliary plating cavity c3, the auxiliary plating head c4 is connected with the central shaft c2, the central shaft c2 is mechanically matched with the solid frame a, and the poking wheel c rolls on the solid frame a.
The auxiliary plating head c4 is composed of a plating block layer c41, a fixing layer c42, a connecting pipe c43, an output hole c44 and a plating material bin c45, the plating block layer c41 is mounted on the fixing layer c42, three plating block layers c41 are arranged on the fixing layer c42, the three plating block layers c41 are mounted at equal intervals, three fixing layers c42 are arranged and mounted in three auxiliary plating cavities c3 respectively, the plating block layer c41 is fixedly connected with the fixing layer c42, an output hole c44 is arranged on the plating block layer c41, the output hole c44 penetrates through the center of the plating block layer c41, the output hole c44 is communicated with the connecting pipe c43, the plating material c45 is communicated with the output hole c44 through the connecting pipe c43, the plating block layer c41 is conical, the side with the larger diameter faces outwards, and the plating block layer c41 is convenient to be in contact with a workpiece bin c 45.
The electroplating material bin c45 is circular, and the electroplating material bin c45 is communicated with the connecting pipe c43 to output metal raw materials required by electroplating, so that electroplating replacement is facilitated.
The auxiliary plating cavity c3 is three, and the poking wheel c is equally distributed, so that three exposed cavities are formed on the side surface of the poking wheel c, the auxiliary plating head c4 is convenient to mount, and the auxiliary plating head c4 is directly contacted with a hardware workpiece and completes plating at a contact position when the hardware workpiece is poked.
The hardware workpiece to be electroplated is placed in the electroplating cavity 812, electrolyte is poured into the electroplating cavity 812, metal of the hardware workpiece is replaced and electroplating is achieved, in order to avoid the situation that the hardware workpiece is not electroplated locally due to standing and influence on the overall electroplating quality of the hardware workpiece, the central shaft c2 is driven to rotate by means of external mechanical force, the whole poking wheel c of the central shaft c2 rotates along with the central shaft c, and in the rotating process, the hardware workpiece in the electroplating cavity 812 is pushed to be in a movable state, so that omnibearing electroplating is conducted on the hardware workpiece.
Example 2
Referring to fig. 1-4, the invention provides an electroplating processing system for hardware products, which structurally comprises a roller 1, a placing plate 2, a supporting block 3, a fixing frame 4, a motor box 5, supporting legs 6, a connecting plate 7, a shifting device 8 and an electroplating box 9, wherein the roller 1 is installed on the fixing frame 4, the fixing frame 4 is mechanically welded with the connecting plate 7, the connecting plate 7 is positioned at the top of the supporting legs 6, the supporting legs 6 are fixedly connected with the connecting plate 7, the electroplating box 9 is arranged on the connecting plate 7, the shifting device 8 is arranged in the electroplating box 9, the supporting block 3 is connected with the connecting plate 7, and the placing plate 2 is fixedly arranged on the supporting block 3; the shifting device 8 comprises an electroplating bin 81, a connecting unit 82 and a shifting unit 83, wherein the electroplating bin 81 is internally provided with the connecting unit 82, the connecting unit 82 is mechanically matched with the shifting unit 83, and the shifting unit 83 is connected with the inner wall of the electroplating bin 81 through the connecting unit 82; the electroplating bin 81 consists of a positive pole 811, an electroplating cavity 812 and a negative pole 813; the poking unit 83 is composed of a solid frame a, a hollow frame b and a poking wheel c; the poking wheel c is composed of a solid layer c1, a central shaft c2, an auxiliary plating cavity c3 and an auxiliary plating head c4, the solid layer c1 is connected with the central shaft c2, the central shaft c2 is connected with external mechanical force and drives the whole poking wheel c to roll, the solid layer c1 and the auxiliary plating cavity c3 are distributed at intervals, the auxiliary plating head c4 is installed in the auxiliary plating cavity c3, the auxiliary plating head c4 is connected with the central shaft c2, the central shaft c2 is mechanically matched with the solid frame a, and the poking wheel c rolls on the solid frame a.
The auxiliary electroplating head c4 is composed of an electroplating block layer c41, a fixed layer c42, a connecting pipe c43, an output hole c44 and an electroplating material bin c45, the electroplating block layer c41 is installed on the fixed layer c42, three electroplating block layers c41 are arranged on the fixed layer c42, the three electroplating block layers c41 are installed at equal intervals, three fixing layers c42 are arranged and are respectively installed in three auxiliary electroplating cavities c3, the electroplating block layer c41 is fixedly connected with the fixed layer c42, an output hole c44 is arranged on the electroplating block layer c41, the output hole c44 penetrates through the center of the electroplating block layer c41, the output hole c44 is communicated with the connecting pipe c43, and the electroplating material bin c45 is communicated with the output hole c44 through the connecting pipe c 43.
In the rotating process of the poking wheel c, because the electroplating material bin c45 provides sufficient electroplating material for the output hole c44 through the connecting pipe c43, and in the process that the poking wheel c pushes the hardware workpiece, the electroplating block layer c41 is in contact with the surface of the hardware workpiece, under the common action of the electroplating material, the electroplating block layer c41 and electrolyte, the position pushed by the poking wheel c on the hardware workpiece is electroplated, and the electroplating degree of the placed pushing position is different from that of other positions.
The invention solves the problem that the existing hardware product electroplating processing equipment directly puts the hardware workpiece to be electroplated into an electroplating cavity for electroplating, the hardware workpiece and the bottom of the electroplating cavity are in a relatively static state, and the connection part of the hardware workpiece and the bottom of the electroplating cavity cannot be electroplated, so that the electroplating of the hardware workpiece is uneven.
While there have been shown and described what are at present considered the fundamental principles of the invention, the essential features and advantages thereof, it will be understood by those skilled in the art that the present invention is not limited by the embodiments described above, which are merely illustrative of the principles of the invention, but rather, is capable of numerous changes and modifications in various forms without departing from the spirit or essential characteristics thereof, and it is intended that the invention be limited not by the foregoing descriptions, but rather by the appended claims and their equivalents.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (8)
1. The utility model provides a hardware products electroplates system of processing, its structure includes gyro wheel (1), places board (2), supporting shoe (3), mount (4), motor case (5), supporting legs (6), linkage plate (7), toggle device (8), electroplating box (9), its characterized in that:
the roller wheels (1) are mounted on a fixing frame (4), the fixing frame (4) is mechanically welded with a connecting plate (7), the connecting plate (7) is located at the top of a supporting foot (6), the supporting foot (6) is fixedly connected with the connecting plate (7), an electroplating box (9) is arranged on the connecting plate (7), a shifting device (8) is arranged in the electroplating box (9), the supporting block (3) is connected with the connecting plate (7), and a placing plate (2) is fixedly arranged on the supporting block (3);
the stirring device (8) is composed of an electroplating bin (81), a connecting unit (82) and a stirring unit (83), wherein the connecting unit (82) is arranged in the electroplating bin (81), the connecting unit (82) is mechanically matched with the stirring unit (83), and the stirring unit (83) is connected with the inner wall of the electroplating bin (81) through the connecting unit (82).
2. The hardware product electroplating processing system according to claim 1, wherein: electroplating storehouse (81) comprises positive post (811), electroplating chamber (812), negative pole post (813), positive post (811) is the same with negative pole post (813) appearance, positive post (811), negative pole post (813) and electroplating chamber (812) bottom panel fixed connection.
3. The hardware product electroplating processing system according to claim 1, wherein: the connecting unit (82) is composed of a connecting rod (821), a main connecting shaft (822) and a connecting shaft (823), the connecting rod (821) is mechanically connected with the main connecting shaft (822) and the connecting shaft (823), the main connecting shaft (822) is embedded in the inner wall of the electroplating cavity (812), and the connecting shaft (823) is fixedly connected with the shifting unit (83).
4. The hardware product electroplating processing system according to claim 1, wherein: stir unit (83) and constitute by solid frame (a), hollow frame (b), thumb wheel (c), solid frame (a) is connected with thumb wheel (c), thumb wheel (c) is installed on solid frame (a) hollow frame (b) place department, thumb wheel (c) cooperatees with solid frame (a).
5. The hardware product electroplating processing system according to claim 4, wherein: the poking wheel (c) is composed of a solid layer (c1), a central shaft (c2), an auxiliary electroplating cavity (c3) and an auxiliary electroplating head (c4), the solid layer (c1) is connected with the central shaft (c2), the solid layer (c1) and the auxiliary electroplating cavity (c3) are distributed at intervals, and the auxiliary electroplating head (c4) is installed in the auxiliary electroplating cavity (c 3).
6. The hardware product electroplating processing system according to claim 5, wherein: the auxiliary electroplating head (c4) is composed of an electroplating block layer (c41), a fixing layer (c42), a connecting pipe (c43), an output hole (c44) and an electroplating material bin (c45), wherein the electroplating block layer (c41) is installed on the fixing layer (c42), the electroplating block layer (c41) is fixedly connected with the fixing layer (c42), the output hole (c44) penetrates through the center of the electroplating block layer (c41), the output hole (c44) is communicated with the connecting pipe (c43), and the electroplating material bin (c45) is communicated with the output hole (c44) through the connecting pipe (c 43).
7. The hardware product electroplating processing system according to claim 6, wherein: the electroplating material bin (c45) is circularly arranged, and the electroplating material bin (c45) is communicated with the connecting pipe (c43) to output metal raw materials required by electroplating so as to facilitate electroplating replacement.
8. The hardware product electroplating processing system according to claim 5, wherein: the number of the auxiliary plating cavities (c3) is three, and the poking wheels (c) are distributed equally, so that three exposed cavities are formed on the side surfaces of the poking wheels (c), and the auxiliary plating heads (c4) are convenient to mount.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010026887.7A CN111088517A (en) | 2020-01-10 | 2020-01-10 | Hardware product electroplating processing system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010026887.7A CN111088517A (en) | 2020-01-10 | 2020-01-10 | Hardware product electroplating processing system |
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| Publication Number | Publication Date |
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| CN111088517A true CN111088517A (en) | 2020-05-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010026887.7A Withdrawn CN111088517A (en) | 2020-01-10 | 2020-01-10 | Hardware product electroplating processing system |
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| CN (1) | CN111088517A (en) |
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| CN1442516A (en) * | 2002-03-01 | 2003-09-17 | 东莞洲亮电镀设备有限公司 | Rolling hanging type electroplating method and its rotating electroplating hanging device |
| CN201545927U (en) * | 2009-06-08 | 2010-08-11 | 深圳市常兴金刚石磨具有限公司 | Electroplating equipment |
| CN102191372A (en) * | 2011-04-11 | 2011-09-21 | 重庆大学 | Combined type stirring impeller for increasing leaching rate of manganese metal electrolyte |
| CN103861354A (en) * | 2014-04-03 | 2014-06-18 | 王赛飞 | Liquid supply device with layered sealing strip and connecting part with radial long and narrow slot |
| CN203855680U (en) * | 2014-04-30 | 2014-10-01 | 曹昌文 | Electroplating device capable of performing continuous rolling electrodeposition on zipper teeth |
| CN204779910U (en) * | 2015-07-06 | 2015-11-18 | 南通瑞泰电子有限公司 | Novel electrolyte stirring mix device |
| CN105755526A (en) * | 2016-04-22 | 2016-07-13 | 河南理工大学 | Electrodeposition device |
| CN105887175A (en) * | 2016-06-27 | 2016-08-24 | 无锡瑾宸表面处理有限公司 | Plating tank with sidewall-fitted stirrer |
| CN205948767U (en) * | 2016-07-20 | 2017-02-15 | 天津西青区瑞博生物科技有限公司 | Rabbling mechanism of high -efficient barrel -plating operation |
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2020
- 2020-01-10 CN CN202010026887.7A patent/CN111088517A/en not_active Withdrawn
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5603815A (en) * | 1994-10-04 | 1997-02-18 | Lashmore; David S. | Electrochemical fluidized bed coating of powders |
| CN1442516A (en) * | 2002-03-01 | 2003-09-17 | 东莞洲亮电镀设备有限公司 | Rolling hanging type electroplating method and its rotating electroplating hanging device |
| CN201545927U (en) * | 2009-06-08 | 2010-08-11 | 深圳市常兴金刚石磨具有限公司 | Electroplating equipment |
| CN102191372A (en) * | 2011-04-11 | 2011-09-21 | 重庆大学 | Combined type stirring impeller for increasing leaching rate of manganese metal electrolyte |
| CN103861354A (en) * | 2014-04-03 | 2014-06-18 | 王赛飞 | Liquid supply device with layered sealing strip and connecting part with radial long and narrow slot |
| CN203855680U (en) * | 2014-04-30 | 2014-10-01 | 曹昌文 | Electroplating device capable of performing continuous rolling electrodeposition on zipper teeth |
| CN204779910U (en) * | 2015-07-06 | 2015-11-18 | 南通瑞泰电子有限公司 | Novel electrolyte stirring mix device |
| CN105755526A (en) * | 2016-04-22 | 2016-07-13 | 河南理工大学 | Electrodeposition device |
| CN105887175A (en) * | 2016-06-27 | 2016-08-24 | 无锡瑾宸表面处理有限公司 | Plating tank with sidewall-fitted stirrer |
| CN205948767U (en) * | 2016-07-20 | 2017-02-15 | 天津西青区瑞博生物科技有限公司 | Rabbling mechanism of high -efficient barrel -plating operation |
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Application publication date: 20200501 |
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