CN111081844A - Linear curved surface light source production robot production line - Google Patents
Linear curved surface light source production robot production line Download PDFInfo
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- CN111081844A CN111081844A CN201911275185.6A CN201911275185A CN111081844A CN 111081844 A CN111081844 A CN 111081844A CN 201911275185 A CN201911275185 A CN 201911275185A CN 111081844 A CN111081844 A CN 111081844A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
Abstract
The invention relates to the technical field of automation, in particular to a linear curved surface light source production robot production line which comprises a transmission belt, wherein two sides of the transmission belt are respectively provided with a curved surface light source production device; the size precision is ensured by leveling the base plate twice before and after blanking; the reflow soldering and the adhesive tape drying process are adjacent, so that low heat loss can be ensured, and the energy utilization rate is improved.
Description
Background
The invention patent No. 201811522973.6 proposes a curved LED light source and a manufacturing method thereof, in order to solve the problem that the curved LED light source has poor continuity of light emission and needs a light-emitting cover to atomize the light source. Because the curved surface light source does not need to be assembled, the procedures of the pasting and welding process are more, equipment specially used for producing the product is not available at present, the production can only be carried out on the existing equipment in steps, the efficiency is low, and the product yield cannot be guaranteed.
Disclosure of Invention
The invention aims to provide a linear curved surface light source production robot production line aiming at the defects in the prior art, the production efficiency is greatly improved and the yield and the consistency of products are also greatly improved by placing belt type continuous production.
The purpose of the invention is realized by the following technical scheme: the utility model provides a linear curved surface light source production robot production line, includes a transmission band, the transmission band both sides all are equipped with a curved surface light source production facility, and the discharge end of two curved surface light source production facilities all is located transmission band one side.
The curved surface light source production equipment comprises a bottom plate; the bottom plate is sequentially provided with a material coil, a material pulling mechanism, a substrate leveling mechanism, a substrate blanking mechanism, a post-punching leveling mechanism, a welded plate placing mechanism, a solder paste dispensing mechanism, a light-emitting wafer placing mechanism, a reflow soldering mechanism, an adhesive tape dispensing mechanism, an adhesive tape drying mechanism, a laser cutting mechanism and a bending mechanism;
the material pulling mechanism is used for driving a material roll to sequentially pass through the substrate leveling mechanism, the substrate blanking mechanism, the post-punching leveling mechanism, the welded plate placing mechanism, the solder paste dispensing mechanism, the light-emitting wafer placing mechanism, the reflow soldering mechanism, the adhesive tape dispensing mechanism, the adhesive tape drying mechanism, the laser cutting mechanism and the bending mechanism;
the bottom plate is provided with a supporting seat and a top plate connected with the supporting seat; the welding plate placing mechanism, the solder paste dispensing mechanism, the light-emitting wafer placing mechanism, the reflow soldering mechanism, the adhesive tape dispensing mechanism, the adhesive tape drying mechanism, the laser cutting mechanism and the bending mechanism are all arranged on the supporting seat and between the top plates.
The invention is further provided that the material pulling mechanism comprises a material pulling seat arranged on the bottom plate, a power roller rotationally connected with the material pulling seat, a material pressing frame slidably connected with the material pulling seat, a pressing roller rotationally connected with the material pressing frame, a material pulling motor used for driving the power roller to rotate and a lifting piece used for driving the material pressing frame to lift; the power roller and the pressing roller are oppositely arranged;
the lifting piece comprises an electromagnet arranged at the top of the material pulling seat and a material pulling spring arranged between the top of the material pulling seat and the material pressing frame; the material pulling seat is a magnetizer.
The invention is further provided that the base plate leveling mechanism and the post-punching leveling mechanism respectively comprise a leveling seat arranged on the base plate, a supporting roller rotationally connected with the leveling seat, a leveling frame slidably connected with the leveling seat, a leveling roller rotationally connected with the leveling frame, a leveling cylinder used for driving the leveling frame to lift and a leveling spring arranged between the leveling seat and the leveling frame; the supporting roller and the leveling roller are arranged oppositely; the leveling cylinder is arranged at the top of the leveling seat.
The blanking mechanism comprises a blanking seat, a lower die plate arranged at the bottom of the blanking seat, a blanking cylinder arranged at the top of the blanking seat, an upper die plate connected with the output end of the blanking cylinder, a blanking male die arranged at the bottom of the upper die plate and a blanking cutting edge arranged on the lower die plate; the blanking male die is opposite to the blanking cutting edge;
a guide frame is arranged between the upper template and the lower template;
the blanking seat is provided with a discharge chute at the bottom of the lower template;
the bottom of the upper template is provided with a material pressing head; and a material pressing spring is arranged between the material pressing head and the upper template.
The invention is further arranged that the welding plate placing mechanism and the luminous wafer placing mechanism respectively comprise a feeding groove arranged on the supporting seat, a feeding cylinder arranged on the top plate, a feeding frame connected with the output end of the feeding cylinder, a feeding electromagnetic push rod arranged on the feeding frame, a connecting plate connected with the output end of the feeding electromagnetic push rod and an adsorption head arranged on the connecting plate; the adsorption head is used for conveying the materials in the feeding groove to the material roll.
The invention is further set that the solder paste dispensing mechanism comprises a solder paste dispensing frame arranged on the top plate, a solder paste dispensing electromagnetic push rod arranged on the solder paste dispensing frame, a solder paste dispensing plate connected with the output end of the solder paste dispensing electromagnetic push rod, and a solder paste dispensing head arranged on the solder paste dispensing plate.
The invention is further arranged that the reflow soldering mechanism and the adhesive tape drying mechanism both comprise a heating chamber arranged on the supporting seat and a heating plate arranged in the heating chamber.
The invention is further arranged in that the adhesive tape dispensing mechanism comprises an adhesive tape dispensing frame arranged on the top plate, an adhesive tape dispensing cylinder arranged on the adhesive tape dispensing frame and an adhesive tape dispensing head connected with the output end of the adhesive tape dispensing cylinder.
The invention is further provided that the laser cutting mechanism comprises a cutting frame arranged on the top plate, a cutting cylinder arranged on the cutting frame and a laser cutting head connected with the output end of the cutting cylinder.
The bending mechanism comprises a bending male die arranged at the end part of the supporting seat, a bending air cylinder arranged on the top plate, a bending frame connected with the output end of the bending air cylinder, a bending electromagnetic push rod arranged on the bending frame, a bending plate connected with the output end of the bending electromagnetic push rod and a material pressing strip arranged on the bending plate; a bending spring is arranged between the bending plate and the pressing strip; and a blanking groove is formed at the bottom of the bending male die.
The invention has the beneficial effects that: 1. the base plate adopts belt type continuous production, the station transfer is realized by carrying materials by the base plate, the efficiency is high, and the structure is compact; 2. the size precision is ensured by leveling the base plate twice before and after blanking; 3. the reflow soldering and the adhesive tape drying process are adjacent, so that low heat loss can be ensured, and the energy utilization rate is improved.
Description of the drawings
The invention is further illustrated by means of the attached drawings, but the embodiments in the drawings do not constitute any limitation to the invention, and for a person skilled in the art, other drawings can be derived on the basis of the following drawings without inventive effort.
FIG. 1 is a top view of the present invention;
FIG. 2 is a schematic structural view of the present invention;
FIG. 3 is a schematic structural view of the pulling mechanism of the present invention;
FIG. 4 is a schematic view of a substrate leveling mechanism of the present invention;
FIG. 5 is an exploded view of the base plate blanking mechanism of the present invention;
FIG. 6 is an exploded view of the alternative view of the substrate blanking mechanism of the present invention;
FIG. 7 is a schematic structural view of a weld plate placement mechanism of the present invention;
FIG. 8 is a schematic view of the laser cutting mechanism and bending mechanism of the present invention;
FIG. 9 is a partial enlarged view of portion A of FIG. 2;
FIG. 10 is a partial enlarged view of portion B of FIG. 2;
wherein: 11. a base plate; 12. a supporting seat; 13. a top plate; 14. material rolls; 2. a material pulling mechanism; 21. a material pulling seat; 22. a power roller; 23. a material pressing frame; 24. a pressure roller; 25. an electromagnet; 26. a material pulling spring; 31. a substrate leveling mechanism; 32. a post-impact leveling mechanism; 33. a leveling seat; 34. a support roller; 35. leveling frames; 36. leveling rollers; 37. leveling a cylinder; 4. a substrate blanking mechanism; 41. blanking the base; 42. a lower template; 43. blanking the air cylinder; 44. mounting a template; 45. blanking a male die; 46. cutting edges; 47. a guide frame; 48. a discharge chute; 49. pressing the material head; 51. a weld plate placement mechanism; 52. a light emitting chip placing mechanism; 53. a feed chute; 54. a feeding cylinder; 55. a feeding frame; 56. feeding an electromagnetic push rod; 57. a connecting plate; 58. an adsorption head; 6. a solder paste dispensing mechanism; 61. a solder paste dispensing frame; 62. the electromagnetic push rod is dispensed with the solder paste; 63. solder paste dispensing plate; 64. a solder paste dispensing head; 71. a reflow soldering mechanism; 72. an adhesive tape drying mechanism; 8. a glue dispensing mechanism of the glue strip; 81. a glue dispensing frame of the glue strip; 82. an adhesive tape dispensing cylinder; 83. a glue dispensing head of the glue strip; 84. a laser cutting mechanism; 85. a cutting frame; 86. cutting off the air cylinder; 87. laser cutting head; 9. a bending mechanism; 91. bending the male die; 92. bending the air cylinder; 93. a bending frame; 94. bending the electromagnetic push rod; 95. bending the plate; 96. pressing the material strips; 97. and (4) discharging the trough.
Detailed Description
The invention is further described with reference to the following examples.
As can be known from fig. 1 to 10, the linear curved-surface light source production robot production line of the present embodiment includes a transmission belt a1, two curved-surface light source production devices are disposed on two sides of the transmission belt, and the discharge ends of the two curved-surface light source production devices are disposed on one side of the transmission belt.
The curved surface light source production equipment comprises a bottom plate 11; the bottom plate 11 is sequentially provided with a material coil 14, a material pulling mechanism 2, a substrate leveling mechanism 31, a substrate blanking mechanism 4, a post-punching leveling mechanism 32, a welded plate placing mechanism 51, a solder paste dispensing mechanism 6, a light-emitting wafer placing mechanism 52, a reflow soldering mechanism 71, a rubber strip dispensing mechanism 8, a rubber strip drying mechanism 72, a laser cutting mechanism 84 and a bending mechanism 9;
the material pulling mechanism 2 is used for driving a material roll 14 to sequentially pass through a substrate leveling mechanism 31, a substrate blanking mechanism 4, a post-punching leveling mechanism 32, a welded plate placing mechanism 51, a solder paste dispensing mechanism 6, a light-emitting wafer placing mechanism 52, a reflow soldering mechanism 71, a rubber strip dispensing mechanism 8, a rubber strip drying mechanism 72, a laser cutting mechanism 84 and a bending mechanism 9;
the bottom plate 11 is provided with a supporting seat 12 and a top plate 13 connected with the supporting seat 12; the welding plate placing mechanism 51, the solder paste dispensing mechanism 6, the light-emitting wafer placing mechanism 52, the reflow soldering mechanism 71, the adhesive tape dispensing mechanism 8, the adhesive tape drying mechanism 72, the laser cutting mechanism 84 and the bending mechanism 9 are all arranged between the supporting seat 12 and the top plate 13.
Specifically, in the linear curved light source production apparatus of the present embodiment, the substrate is fixed to the rightmost side of the production apparatus in the form of the material roll 14, the material roll 14 is unwound by the material pulling mechanism 2, the material roll 14 is fed into the substrate leveling mechanism 31 to be leveled for the first time, the substrate is leveled by the substrate leveling mechanism 31, the substrate blanking mechanism 4 blanks the end pin part and the bending stress relief slit between the lamp strips, and after blanking, the substrate is leveled for the second time by the post-punching leveling mechanism 32 to remove the defects such as the flash and the burr of the blanking opening part; after leveling is finished, the molded substrate enters an element assembly area, the soldering plates are grabbed and placed on the substrate through a soldering plate placing mechanism 51 in a linear arrangement mode, after the leveling is finished, the solder paste is coated on the soldering plates and the substrate through a solder paste dispensing mechanism 6, and after the leveling is finished, the light-emitting wafer placing mechanism 52 grabs and places the light-emitting wafer at the appointed position of the soldering plate and enables the light-emitting wafer to be in uniform contact with the solder paste; after the placement of the component is completed, the component and the substrate are put into the reflow soldering mechanism 71, and the light emitting chip, the solder plate, and the substrate are soldered together by heating. After reflow soldering, the adhesive tape dispensing mechanism 8 coats sealing adhesive on the top of the light-emitting chip in a linear strip shape to seal the light-emitting chip; after coating, the substrate carrying elements enter the adhesive tape drying mechanism 72 for drying and curing, and after passing through the adhesive tape drying mechanism 72, the substrate in a planar state is deformed along the edge of the bending male die 91 under the extrusion of the bending mechanism 9, so that a light source is installed in a curved surface; after the bending is completed, the laser cutting mechanism 84 is operated to cut the substrate and the finished light source is transferred out of the work area from the discharge chute 48.
In the linear curved-surface light source production robot production line of this embodiment, the pulling mechanism 2 includes a pulling seat 21 disposed on the bottom plate 11, a power roller 22 rotatably connected to the pulling seat 21, a material pressing frame 23 slidably connected to the pulling seat 21, a pressing roller 24 rotatably connected to the material pressing frame 23, a pulling motor for driving the power roller 22 to rotate, and a lifting member for driving the material pressing frame 23 to lift; the power roller 22 and the pressure roller 24 are oppositely arranged;
the lifting piece comprises an electromagnet 25 arranged at the top of the material pulling seat 21 and a material pulling spring 26 arranged between the top of the material pulling seat 21 and the material pressing frame 23; the material pulling seat 21 is a magnetizer.
Specifically, the material pulling motor is arranged in the power roller 22 in a built-in mode, the material pulling part is composed of the power roller 22 and a pressing roller 24 which provide power, the pressing roller 24 is installed on the floating material pressing frame 23 and can slide in a track of the material pulling seat 21, the top end of the material pressing frame 23 enables the material pressing frame 23 to keep pressing force on the material belt through a material pulling spring, and the material pressing frame 23 is adsorbed through the electromagnet 25 so as to penetrate through the material belt when the material roll 14 is replaced.
In the production line of the linear curved-surface light source production robot of the present embodiment, each of the substrate leveling mechanism 31 and the post-punching leveling mechanism 32 includes a leveling seat 33 disposed on the bottom plate 11, a supporting roller 34 rotatably connected to the leveling seat 33, a leveling frame 35 slidably connected to the leveling seat 33, a leveling roller 36 rotatably connected to the leveling frame 35, a leveling cylinder 37 for driving the leveling frame 35 to move up and down, and a leveling spring disposed between the leveling seat 33 and the leveling frame 35; the supporting roller 34 is arranged opposite to the leveling roller 36; the leveling cylinder 37 is provided at the top of the leveling seat 33.
Specifically, the leveling cylinder 37 of the present embodiment controls the leveling frame 35 to move up and down, so as to control the distance between the supporting roller 34 and the leveling roller 36, and thus level the material roll 14 between the supporting roller 34 and the leveling roller 36.
In the production line of the linear curved-surface light source production robot of this embodiment, the substrate blanking mechanism 4 includes a blanking base 41, a lower template 42 disposed at the bottom of the blanking base 41, a blanking cylinder 43 disposed at the top of the blanking base 41, an upper template 44 connected to an output end of the blanking cylinder 43, a blanking punch 45 disposed at the bottom of the upper template 44, and a blanking edge 46 disposed on the lower template 42; the blanking male die 45 is arranged opposite to the blanking cutting edge 46;
a guide frame 47 is arranged between the upper template 44 and the lower template 42;
the blanking seat 41 is provided with a discharge chute 48 at the bottom of the lower template 42;
the bottom of the upper template 44 is provided with a material pressing head 49; a material pressing spring is arranged between the material pressing head 49 and the upper template 44.
Specifically, in the substrate blanking mechanism 4 according to the embodiment, when the material tape reaches between the lower die plate 42 and the upper die plate 44, the blanking cylinder 43 controls the upper die plate 44 to descend, so that the blanking punch 45 is pressed downwards, and the blanking punch 45 cooperates with the blanking edge 46 to blank the bending stress relief slit between the end pin portion of the substrate and the lamp tape; in addition, the material pressing spring is arranged, so that the size deviation caused by the displacement of the substrate in the cutting process and the excessive burr generated in the cutting process can be prevented, and after cutting, waste materials are discharged and recycled from the discharge groove 48 at the bottom, wherein the material pressing spring is not drawn in the drawing.
In the production line of the linear curved-surface light source production robot according to this embodiment, each of the welding plate placement mechanism 51 and the luminescent wafer placement mechanism 52 includes a feeding chute 53 disposed on the support base 12, a feeding cylinder 54 disposed on the top plate 13, a feeding frame 55 connected to an output end of the feeding cylinder 54, a feeding electromagnetic push rod 56 disposed on the feeding frame 55, a connecting plate 57 connected to an output end of the feeding electromagnetic push rod 56, and an adsorption head 58 disposed on the connecting plate 57; the suction head 58 is used for transferring the material from the feed chute 53 to the material roll 14.
Specifically, the welding plate and the light emitting chip are placed in an external vibration tray, and after the vibration tray transmits the welding plate and the light emitting chip to the feeding groove 53, the feeding cylinder 54 and the feeding electromagnetic push rod 56 work in a matching manner so as to respectively feed the welding plate and the light emitting chip to the substrate material belt.
The linear curved-surface light source production robot production line described in this embodiment, the solder paste dispensing mechanism 6 includes a solder paste dispensing frame 61 arranged on the top plate 13, a solder paste dispensing electromagnetic push rod 62 arranged on the solder paste dispensing frame 61, a solder paste dispensing plate 63 connected to the output end of the solder paste dispensing electromagnetic push rod 62, and a solder paste dispensing head 64 arranged on the solder paste dispensing plate 63.
The solder paste dispensing electromagnetic push rod 62 pushes the solder paste dispensing plate 63 to work, so that solder paste can be coated on the soldering plate and the substrate.
This embodiment a linear curved surface light source production robot production line, reflow soldering mechanism 71 and adhesive tape stoving mechanism 72 all include the heating chamber of locating supporting seat 12 and locate the hot plate in the heating chamber.
This embodiment a linear curved surface light source production robot production line, adhesive tape dispensing mechanism 8 is including the adhesive tape dispensing frame 81 of locating roof 13, locate adhesive tape dispensing frame 81's adhesive tape dispensing cylinder 82 and the adhesive tape dispensing head 83 of being connected with adhesive tape dispensing cylinder 82 output. The sealing glue can be coated on the top of the light-emitting wafer in a linear strip shape to seal the light-emitting wafer.
In the linear curved light source production robot production line of this embodiment, the laser cutting mechanism 84 includes a cutting frame 85 disposed on the top plate 13, a cutting cylinder 86 disposed on the cutting frame 85, and a laser cutting head 87 connected to an output end of the cutting cylinder 86. In the production line of the linear curved light source production robot described in this embodiment, the bending mechanism 9 includes a bending male die 91 disposed at an end of the support base 12, a bending cylinder 92 disposed on the top plate 13, a bending frame 93 connected to an output end of the bending cylinder 92, a bending electromagnetic push rod 94 disposed on the bending frame 93, a bending plate 95 connected to an output end of the bending electromagnetic push rod 94, and a pressing strip 96 disposed on the bending plate 95; a bending spring is arranged between the bending plate 95 and the pressing strip 96; the bottom of the bending male die 91 is provided with a blanking groove 97, wherein the bending spring is not shown in the figure.
After the light source in a plane state after the adhesive tape is baked and cured reaches the edge of the bending male die 91, the bending electromagnetic push rod 94 is pushed out, the bending plate 95 downwards probes, the elastic pressing strip 96 presses the substrate between the next light source strips, the bending protruding portion continuously downwards probes to bend the substrate between the previous light source strips along the stress release seam, and the substrate between each light source strip is bent to form a curved-surface light source. After the bending is finished, the bending plate 95 retracts, the laser cutting head 87 is pushed out by the driving of the bending electromagnetic push rod 94 to cut off the substrate, and the bent light source is separated from the plane light band and transferred out of the working area through the discharge chute 48.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the protection scope of the present invention, although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Claims (10)
1. The utility model provides a linear curved surface light source production robot production line which characterized in that:
including a transmission band (a 1), the transmission band both sides all are equipped with a curved surface light source production facility, and the discharge end of two curved surface light source production facilities all is located transmission band one side.
2. The linear curved light source production robot production line of claim, wherein:
the curved-surface light source production equipment ((11) (11) (11) comprises a bottom plate (11), wherein a material coil (14), a material pulling mechanism (2), a substrate leveling mechanism (31), a substrate blanking mechanism (4), a post-punching leveling mechanism (32), a welding plate placing mechanism (51), a solder paste dispensing mechanism (6), a light-emitting wafer placing mechanism (52), a reflow soldering mechanism (71), a rubber strip dispensing mechanism (8), a rubber strip drying mechanism (72), a laser cutting mechanism (84) and a bending mechanism (9) are sequentially arranged on the bottom plate (11);
the material pulling mechanism (2) is used for driving a material coil (14) to sequentially pass through a substrate leveling mechanism (31), a substrate blanking mechanism (4), a post-blanking leveling mechanism (32), a welding plate placing mechanism (51), a solder paste dispensing mechanism (6), a light-emitting wafer placing mechanism (52), a reflow soldering mechanism (71), a rubber strip dispensing mechanism (8), a rubber strip drying mechanism (72), a laser cutting mechanism (84) and a bending mechanism (9);
the bottom plate (11) is provided with a supporting seat (12) and a top plate (13) connected with the supporting seat (12); the welding plate placing mechanism (51), the solder paste dispensing mechanism (6), the light-emitting wafer placing mechanism (52), the reflow soldering mechanism (71), the adhesive tape dispensing mechanism (8), the adhesive tape drying mechanism (72), the laser cutting mechanism (84) and the bending mechanism (9) are all arranged between the support base (12) and the top plate (13),
the material pulling mechanism (2) comprises a material pulling seat (21) arranged on the bottom plate (11), a power roller (22) rotatably connected with the material pulling seat (21), a material pressing frame (23) slidably connected with the material pulling seat (21), a pressing roller (24) rotatably connected with the material pressing frame (23), a material pulling motor used for driving the power roller (22) to rotate and a lifting piece used for driving the material pressing frame (23) to lift; the power roller (22) and the pressing roller (24) are oppositely arranged;
the lifting piece comprises an electromagnet (25) arranged at the top of the material pulling seat (21) and a material pulling spring (26) arranged between the top of the material pulling seat (21) and the material pressing frame (23); the material pulling seat (21) is a magnetizer.
3. The linear curved light source production robot production line according to claim 1, wherein: the base plate leveling mechanism (31) and the post-punching leveling mechanism (32) respectively comprise a leveling seat (33) arranged on the base plate (11), a supporting roller (34) rotatably connected with the leveling seat (33), a leveling frame (35) slidably connected with the leveling seat (33), a leveling roller (36) rotatably connected with the leveling frame (35), a leveling cylinder (37) used for driving the leveling frame (35) to lift, and a leveling spring arranged between the leveling seat (33) and the leveling frame (35); the supporting rollers (34) are arranged opposite to the leveling rollers (36); the leveling cylinder (37) is arranged at the top of the leveling seat (33).
4. The linear curved light source production robot production line according to claim 1, wherein: the substrate blanking mechanism (4) comprises a blanking seat (41), a lower template (42) arranged at the bottom of the blanking seat (41), a blanking cylinder (43) arranged at the top of the blanking seat (41), an upper template (44) connected with the output end of the blanking cylinder (43), a blanking male die (45) arranged at the bottom of the upper template (44) and a blanking cutting edge (46) arranged on the lower template (42); the blanking male die (45) is opposite to the blanking cutting edge (46);
a guide frame (47) is arranged between the upper template (44) and the lower template (42);
the blanking seat (41) is provided with a discharge chute (48) at the bottom of the lower template (42);
the bottom of the upper template (44) is provided with a material pressing head (49); a material pressing spring is arranged between the material pressing head (49) and the upper template (44).
5. The linear curved light source production robot production line according to claim 1, wherein: the welding plate placing mechanism (51) and the luminous wafer placing mechanism (52) respectively comprise a feeding groove (53) arranged on the supporting seat (12), a feeding cylinder (54) arranged on the top plate (13), a feeding frame (55) connected with the output end of the feeding cylinder (54), a feeding electromagnetic push rod (56) arranged on the feeding frame (55), a connecting plate (57) connected with the output end of the feeding electromagnetic push rod (56) and an adsorption head (58) arranged on the connecting plate (57); the adsorption head (58) is used for conveying the materials in the feeding groove (53) to the material roll (14).
6. The linear curved light source production robot production line according to claim 1, wherein: the solder paste dispensing mechanism (6) comprises a solder paste dispensing frame (61) arranged on the top plate (13), a solder paste dispensing electromagnetic push rod (62) arranged on the solder paste dispensing frame (61), a solder paste dispensing plate (63) connected with the output end of the solder paste dispensing electromagnetic push rod (62), and a solder paste dispensing head (64) arranged on the solder paste dispensing plate (63).
7. The linear curved light source production robot production line according to claim 1, wherein: the reflow soldering mechanism (71) and the adhesive tape drying mechanism (72) comprise heating chambers arranged on the supporting base (12) and heating plates arranged in the heating chambers.
8. The linear curved light source production robot production line according to claim 1, wherein: the adhesive tape dispensing mechanism (8) comprises an adhesive tape dispensing frame (81) arranged on the top plate (13), an adhesive tape dispensing cylinder (82) arranged on the adhesive tape dispensing frame (81), and an adhesive tape dispensing head (83) connected with the output end of the adhesive tape dispensing cylinder (82).
9. The linear curved light source production robot production line according to claim 1, wherein: the laser cutting mechanism (84) comprises a cutting frame (85) arranged on the top plate (13), a cutting cylinder (86) arranged on the cutting frame (85) and a laser cutting head (87) connected with the output end of the cutting cylinder (86).
10. The linear curved light source production robot production line according to claim 1, wherein: the bending mechanism (9) comprises a bending male die (91) arranged at the end part of the supporting seat (12), a bending air cylinder (92) arranged on the top plate (13), a bending frame (93) connected with the output end of the bending air cylinder (92), a bending electromagnetic push rod (94) arranged on the bending frame (93), a bending plate (95) connected with the output end of the bending electromagnetic push rod (94) and a material pressing strip (96) arranged on the bending plate (95); a bending spring is arranged between the bending plate (95) and the pressing strip (96); and a blanking groove (97) is arranged at the bottom of the bending male die (91).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911275185.6A CN111081844B (en) | 2019-12-12 | 2019-12-12 | Linear curved surface light source production robot production line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911275185.6A CN111081844B (en) | 2019-12-12 | 2019-12-12 | Linear curved surface light source production robot production line |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111081844A true CN111081844A (en) | 2020-04-28 |
| CN111081844B CN111081844B (en) | 2021-04-09 |
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| CN111081844B (en) | 2021-04-09 |
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Effective date of registration: 20211028 Address after: 150028 room 730-28, building 9, No. 1616, Chuangxin Road, Songbei District, Harbin City, Heilongjiang Province Patentee after: Harbin haitejunxuan Technology Co.,Ltd. Address before: No. 114-024, Yueyue Hubei Road, Dongbao District, Jingmen City, Hubei Province Patentee before: Jingmen omankai mechanical and Electrical Equipment Co.,Ltd. |