CN111069004A - Bonding sealing process between copper conductive piece and epoxy resin - Google Patents
Bonding sealing process between copper conductive piece and epoxy resin Download PDFInfo
- Publication number
- CN111069004A CN111069004A CN201911425984.7A CN201911425984A CN111069004A CN 111069004 A CN111069004 A CN 111069004A CN 201911425984 A CN201911425984 A CN 201911425984A CN 111069004 A CN111069004 A CN 111069004A
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- Prior art keywords
- copper conductor
- epoxy resin
- red copper
- bonding
- sand blasting
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 121
- 239000010949 copper Substances 0.000 title claims abstract description 119
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 118
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 48
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 48
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000007789 sealing Methods 0.000 title claims abstract description 23
- 230000008569 process Effects 0.000 title claims abstract description 19
- 239000004020 conductor Substances 0.000 claims abstract description 85
- 238000005488 sandblasting Methods 0.000 claims abstract description 26
- 238000002347 injection Methods 0.000 claims abstract description 6
- 239000007924 injection Substances 0.000 claims abstract description 6
- 238000005507 spraying Methods 0.000 claims description 26
- 238000001035 drying Methods 0.000 claims description 22
- 239000007921 spray Substances 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 13
- 239000011230 binding agent Substances 0.000 claims description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 238000004140 cleaning Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 10
- 239000004576 sand Substances 0.000 claims description 9
- 230000009471 action Effects 0.000 claims description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000012535 impurity Substances 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000006004 Quartz sand Substances 0.000 claims description 3
- 239000012752 auxiliary agent Substances 0.000 claims description 3
- 229920005601 base polymer Polymers 0.000 claims description 3
- 239000003054 catalyst Substances 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 239000003431 cross linking reagent Substances 0.000 claims description 3
- 230000002209 hydrophobic effect Effects 0.000 claims description 3
- 239000011256 inorganic filler Substances 0.000 claims description 3
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 abstract description 2
- 238000007254 oxidation reaction Methods 0.000 abstract description 2
- 239000007767 bonding agent Substances 0.000 abstract 4
- 239000007789 gas Substances 0.000 description 9
- 229910018503 SF6 Inorganic materials 0.000 description 7
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 7
- 229960000909 sulfur hexafluoride Drugs 0.000 description 7
- 239000010410 layer Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000005422 blasting Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- LRWZZZWJMFNZIK-UHFFFAOYSA-N 2-chloro-3-methyloxirane Chemical compound CC1OC1Cl LRWZZZWJMFNZIK-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 101001018064 Homo sapiens Lysosomal-trafficking regulator Proteins 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 102100033472 Lysosomal-trafficking regulator Human genes 0.000 description 1
- 235000010703 Modiola caroliniana Nutrition 0.000 description 1
- 244000038561 Modiola caroliniana Species 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 238000003889 chemical engineering Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 230000010358 mechanical oscillation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/002—Pretreatement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
- B05D3/0272—After-treatment with ovens
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2202/00—Metallic substrate
- B05D2202/40—Metallic substrate based on other transition elements
- B05D2202/45—Metallic substrate based on other transition elements based on Cu
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2350/00—Pretreatment of the substrate
- B05D2350/30—Change of the surface
- B05D2350/50—Smoothing
Abstract
The invention discloses a bonding and sealing process between a copper conductive piece and epoxy resin, which specifically comprises the following steps: s1, sand blasting treatment of the surface of the red copper conductor needing to be bonded with the epoxy resin: the invention discloses a red copper conductor which is placed inside sand blasting equipment, and relates to the technical field of bonding and sealing processes. The surface of the copper conductor is difficult to be directly bonded with the epoxy resin, the bonding agent has good affinity with the surface of the processed copper conductor and the epoxy resin, burrs and an oxidation layer on the surface of the copper conductor can be thoroughly removed after the copper conductor is pretreated, the copper conductor after being sprayed with the bonding agent is heated, so that a firm bonding layer is formed between the surface of the copper conductor and the bonding agent, the copper conductor is placed into a die and then is subjected to injection curing of the epoxy resin, and the problem that the copper conductor and the epoxy resin are directly bonded and are not firm is solved because the epoxy resin and the bonding agent are very good.
Description
Technical Field
The invention relates to the technical field of bonding and sealing processes, in particular to a bonding and sealing process between a copper conductive piece and epoxy resin.
Background
Copper is a transition element, chemical symbol Cu, English copper, atomic number 29, pure copper is soft metal, the surface is red orange color band metallic luster when just cutting, simple substance is mauve, ductility is good, thermal conductivity and electrical conductivity are high, therefore it is the most common material in cable and electric, electronic component, also can be used as building material, can make up many kinds of alloys, the copper alloy mechanical property is excellent, the resistivity is very low, the most important number bronze and brass among them, copper is durable metal too in addition, can retrieve many times without damaging its mechanical property.
Epoxy resin is a general name of a polymer containing more than two epoxy groups in a molecule, is a polycondensation product of epoxy chloropropane and bisphenol A or polyhydric alcohol, can be subjected to ring opening by using a plurality of compounds containing active hydrogen due to the chemical activity of the epoxy groups, and is cured and crosslinked to form a network structure, so that the epoxy resin is a thermosetting resin, and the bisphenol A epoxy resin not only has the largest yield and the most complete variety, but also has the continuously increased new modified varieties and the continuously improved quality.
In some high-voltage switches using sulfur hexafluoride gas as an insulating medium, a plurality of insulating parts with excellent sealing performance are needed to be used and are installed on a sulfur hexafluoride gas tank, wherein one end of a copper conductive part is connected with a switch inside the sulfur hexafluoride gas tank, and the other end of the copper conductive part is connected with a cable or other electrical elements outside the gas tank.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a bonding and sealing process between a copper conductive piece and epoxy resin, which solves the problems that the bonding is not firm, the product is scrapped and the product qualification rate is very low due to incomplete sand blasting, incomplete cleaning or incomplete preheating of the surface of a red copper conductor.
(II) technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme: a bonding and sealing process between a copper conductive piece and epoxy resin specifically comprises the following steps:
s1, carrying out sand blasting treatment on the red copper conductor: placing the red copper conductor into sand blasting equipment, wherein the sand blasting equipment adopts compressed air as power, forms a high-speed spray beam inside, sprays spray materials on the surface of the red copper conductor at a high speed, removes a surface oxide layer, impurities and burrs, and observes the roughness of the surface of the red copper conductor after sand blasting is carried out for 5-10 min;
s2, cleaning and drying the red copper conductor: putting the red copper conductor subjected to sand blasting in the step S1 into an ultrasonic cleaning machine, performing ultrasonic cleaning for 40min, taking out, putting into a drying oven, drying, and taking out for later use when the surface of the red copper conductor is free of water stains and is dry and tidy;
s3, spraying the red copper conductor with an adhesive: spraying the binder on the surface of the red copper conductor cleaned and dried in the step S3 by using spraying equipment or a special tool, and taking care of uniform spraying;
s4, bonding the red copper conductor: after being uniformly sprayed, the copper-clad plate is placed in a high-temperature oven, and is heated in the oven at 160 ℃ for 10-20min (the specific time depends on the size of the copper piece), and when the adhesive is tightly adhered to the surface of the copper piece, the red copper conductor can be taken out;
s5, bonding and sealing the epoxy resin and the red copper conductor: and (3) loading the red copper conductor subjected to spraying pretreatment in the step (S3) into a mold with temperature control and capable of heating continuously, pressing epoxy resin in an injection tank into the mold through a pipeline under the action of compressed air, and after the temperature reaches a certain temperature, quickly curing the epoxy resin and well combining with a binder sprayed on the surface of the red copper conductor, so that the red copper conductor and the epoxy resin are well combined.
Preferably, the blasting material in the step S1 is one of copper ore sand, quartz sand, carborundum, iron sand and hainan sand.
Preferably, the sand blasting device in the step S1 adopts a high-pressure sprayer.
Preferably, the inside of the drying oven is sterilized in step S2.
Preferably, the binder in step S3 is prepared by combining a base polymer, an inorganic filler, a cross-linking agent, a catalyst, a hydrophobic agent, and an auxiliary agent.
(III) advantageous effects
The invention provides a bonding and sealing process between a copper conductive piece and epoxy resin. The method has the following beneficial effects: the bonding and sealing process between the copper conductive piece and the epoxy resin comprises the following steps of S1, sand blasting treatment of the red copper conductor: placing the red copper conductor into sand blasting equipment, wherein the sand blasting equipment adopts compressed air as power, forms a high-speed spray beam inside, sprays spray materials on the surface of the red copper conductor at a high speed, removes a surface oxide layer, impurities and burrs, and observes the roughness of the surface of the red copper conductor after sand blasting is carried out for 5-10 min; s2, cleaning and drying the red copper conductor: putting the red copper conductor subjected to sand blasting in the step S1 into an ultrasonic cleaning machine, performing ultrasonic cleaning for 40min, taking out, putting into a drying oven, drying, and taking out for later use when the surface of the red copper conductor is free of water stains and is dry and tidy; s3, spraying the red copper conductor with an adhesive: spraying the binder on the surface of the red copper conductor cleaned and dried in the step S3 by using spraying equipment or a special tool, and taking care of uniform spraying; s4, bonding the red copper conductor: after being uniformly sprayed, the copper-clad plate is placed in a high-temperature oven, and is heated in the oven at 160 ℃ for 10-20min (the specific time depends on the size of the copper piece), and when the adhesive is tightly adhered to the surface of the copper piece, the red copper conductor can be taken out; s5, bonding and sealing the epoxy resin and the red copper conductor: the red copper conductor sprayed and pretreated in the S3 process is arranged in a mould with temperature control and capable of heating continuously, under the action of compressed air, epoxy resin in a material injection tank is pressed into the mould through a pipeline, when the temperature reaches a certain temperature, the epoxy resin is cured rapidly and is well combined with a binder sprayed on the surface of the red copper conductor, so that the red copper conductor and the epoxy resin are well combined, the surface of the copper conductor is difficult to be directly bonded with the epoxy resin, the binder has good affinity with the surface of the treated copper conductor and the epoxy resin, burrs and an oxidation layer on the surface of the copper part can be thoroughly removed after the copper part is pretreated, meanwhile, the copper conductor is cleaned and dried in place, the surface of the copper conductor is heated to form a firm bonding layer with the binder, and the copper part is arranged in the mould and then is subjected to material injection and curing of the epoxy resin, the special adhesive can be widely used for the production of insulating products with high sealing requirements, such as sulfur hexafluoride load switches, the insulating shell of the special adhesive needs to be filled with sulfur hexafluoride gas with certain pressure, the joint surfaces between the copper conductors penetrating through the wall of the insulating shell and the epoxy resin are not leaked, and the same requirements are also provided for inlet and outlet wire sleeves of some gas-filled switch cabinets with metal sealing and sulfur hexafluoride gas insulation.
Drawings
FIG. 1 is a flow chart of the present invention;
FIG. 2 is a schematic view of the installation of the epoxy resin and red copper conductor of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, an embodiment of the present invention provides a technical solution: a process for adhering and sealing the electrically conductive copper piece with epoxy resin features that the surface of copper conductor is difficult to adhere with epoxy resin, the adhesive has very high affinity to the treated surface of copper conductor and epoxy resin, the pre-treated surface of copper piece can remove burr and oxide layer, the copper conductor is heated to form a firm adhesive layer between the surface of copper conductor and adhesive, the epoxy resin is injected and solidified, and the epoxy resin is injected and solidified, the joint surfaces between all copper conductors penetrating through the wall of the insulating shell and epoxy resin are not air-leaked, and the wire inlet and outlet sleeves of some gas-filled switch cabinets which are sealed by metal and insulated by sulfur hexafluoride gas have the same requirements, and the method specifically comprises the following steps:
s1, carrying out sand blasting treatment on the red copper conductor: placing the red copper conductor into sand blasting equipment, wherein the sand blasting equipment adopts compressed air as power, forms a high-speed spray beam inside, sprays spray materials on the surface of the red copper conductor at a high speed, removes a surface oxide layer, impurities and burrs, and observes the roughness of the surface of the red copper conductor after sand blasting is carried out for 5-10 min;
s2, cleaning and drying the red copper conductor: then the red copper conductor after sand blasting in S1 is put into an ultrasonic cleaner, the red copper conductor is taken out after being cleaned for 40min by ultrasonic, the red copper conductor is put into a drying box for drying, when the surface of the red copper conductor has no water stain and is dried and taken out neatly, the red copper conductor is ready for use, the principle of the ultrasonic cleaner is that a high-frequency oscillation signal sent by an ultrasonic generator is converted into high-frequency mechanical oscillation by a transducer and is transmitted into a medium (cleaning solvent), ultrasonic waves are radiated forwards at intervals in cleaning liquid to make the liquid flow to generate tens of thousands of tiny bubbles with the diameter of 50-500 mu m, the tiny bubbles in the liquid vibrate under the action of a sound field, the bubbles form and grow in a negative pressure zone of the longitudinal transmission of the ultrasonic waves, and in a positive pressure zone, when sound pressure reaches a certain value, the bubbles rapidly increase and then are closed suddenly, and shock waves are generated when the bubbles are closed, thousands of atmospheric pressures are generated around the cleaning device, insoluble dirt is damaged to disperse the dirt in the cleaning liquid, and when the group particles are wrapped by oil dirt and adhered to the surface of a cleaning piece, the oil is emulsified, solid particles are separated, so that the aim of cleaning the cleaning piece is fulfilled;
s3, spraying the red copper conductor with an adhesive: spraying the binder on the surface of the red copper conductor cleaned and dried in the step S3 by using spraying equipment or a special tool, and taking care of uniform spraying;
s4, bonding the red copper conductor: after being uniformly sprayed, the copper-clad plate is placed in a high-temperature oven, and is heated in the oven at 160 ℃ for 10-20min (the specific time depends on the size of the copper piece), and when the adhesive is tightly adhered to the surface of the copper piece, the red copper conductor can be taken out;
s5, bonding and sealing the epoxy resin and the red copper conductor: and (3) loading the red copper conductor subjected to spraying pretreatment in the step (S3) into a mold with temperature control and capable of heating continuously, pressing epoxy resin in an injection tank into the mold through a pipeline under the action of compressed air, and after the temperature reaches a certain temperature, quickly curing the epoxy resin and well combining with a binder sprayed on the surface of the red copper conductor, so that the red copper conductor and the epoxy resin are well combined.
In the present invention, the blasting material in step S1 is one of copper ore sand, quartz sand, silicon carbide, iron sand, and Hainan sand.
In the invention, the sand blasting equipment in the step S1 adopts a high-pressure spraying machine, the spraying machine is special coating equipment adopting a spraying technology, the principle is that the air flow is controlled to instantly push the air distribution reversing device to reverse, so that a piston of the pneumatic motor stably and continuously reciprocates to pressurize sucked coating, the coating is conveyed into a spray gun of the spraying machine through a high-pressure hose, the coating is instantly atomized by the spray gun and then is released to the surface of an object to be coated, and the spraying machine mainly comprises a feeding device, the spray gun and an atomization generating source, and is suitable for industries such as leather handbag, gift packaging, furniture, shoe industry, automobile manufacturing and the like.
In the invention, the inside of the drying box is sterilized in step S2, the drying box is classified into two types, namely an electrothermal blowing drying box and a vacuum drying box according to the difference of drying substances, and the drying box is widely applied to industries such as chemical engineering, electronic communication, plastics, cables, electroplating, hardware, automobiles, photoelectricity, rubber products, molds, spraying, printing, medical treatment, aerospace, high institutions and the like, and has huge market demands, so that the variety of the drying box is diversified, the structural quality of products is different, and the quality of the drying box is distinguished by a pair of wisdom eyes for people to know the drying box more clearly.
In the present invention, the binder in step S3 is prepared by combining a base polymer, an inorganic filler, a crosslinking agent, a catalyst, a hydrophobic agent, and an auxiliary agent.
We have developed a special adhesive which is coated on the surface of a copper piece which is sand-blasted and cleaned, and then is heated in an oven at 180 ℃ for 10-20 minutes at 150-.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A bonding and sealing process between a copper conductive piece and epoxy resin is characterized in that: the method specifically comprises the following steps:
s1, carrying out sand blasting treatment on the red copper conductor: placing the red copper conductor into sand blasting equipment, wherein the sand blasting equipment adopts compressed air as power, forms a high-speed spray beam inside, sprays spray materials on the surface of the red copper conductor at a high speed, removes a surface oxide layer, impurities and burrs, and observes the roughness of the surface of the red copper conductor after sand blasting is carried out for 5-10 min;
s2, cleaning and drying the red copper conductor: putting the red copper conductor subjected to sand blasting in the step S1 into an ultrasonic cleaning machine, performing ultrasonic cleaning for 40min, taking out, putting into a drying oven, drying, and taking out for later use when the surface of the red copper conductor is free of water stains and is dry and tidy;
s3, spraying the red copper conductor with an adhesive: spraying the binder on the surface of the red copper conductor cleaned and dried in the step S3 by using spraying equipment or a special tool, and taking care of uniform spraying;
s4, bonding the red copper conductor: after being uniformly sprayed, the copper-clad plate is placed in a high-temperature oven, and is heated in the oven at 160 ℃ for 10-20min (the specific time depends on the size of the copper piece), and when the adhesive is tightly adhered to the surface of the copper piece, the red copper conductor can be taken out;
s5, bonding and sealing the epoxy resin and the red copper conductor: and (3) loading the red copper conductor subjected to spraying pretreatment in the step (S3) into a mold with temperature control and capable of heating continuously, pressing epoxy resin in an injection tank into the mold through a pipeline under the action of compressed air, and after the temperature reaches a certain temperature, quickly curing the epoxy resin and well combining with a binder sprayed on the surface of the red copper conductor, so that the red copper conductor and the epoxy resin are well combined.
2. The process of claim 1, wherein the bonding and sealing between the copper conductive member and the epoxy resin is performed by: the material spraying in the step S1 is one of copper ore sand, quartz sand, carborundum, iron sand and Hainan sand.
3. The process of claim 1, wherein the bonding and sealing between the copper conductive member and the epoxy resin is performed by: the sand blasting device in the step S1 employs a high-pressure sprayer.
4. The process of claim 1, wherein the bonding and sealing between the copper conductive member and the epoxy resin is performed by: in step S2, the inside of the drying oven is sterilized.
5. The process of claim 1, wherein the bonding and sealing between the copper conductive member and the epoxy resin is performed by: the binder in step S3 is prepared from a base polymer, an inorganic filler, a crosslinking agent, a catalyst, a hydrophobic agent, and an auxiliary agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911425984.7A CN111069004A (en) | 2019-12-26 | 2019-12-26 | Bonding sealing process between copper conductive piece and epoxy resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911425984.7A CN111069004A (en) | 2019-12-26 | 2019-12-26 | Bonding sealing process between copper conductive piece and epoxy resin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111069004A true CN111069004A (en) | 2020-04-28 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911425984.7A Pending CN111069004A (en) | 2019-12-26 | 2019-12-26 | Bonding sealing process between copper conductive piece and epoxy resin |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4428987A (en) * | 1982-04-28 | 1984-01-31 | Shell Oil Company | Process for improving copper-epoxy adhesion |
| JP2005097344A (en) * | 2003-09-22 | 2005-04-14 | Nisshinbo Ind Inc | Lamination adhesive composition and adhesive film using the same |
| CN1839219A (en) * | 2003-07-14 | 2006-09-27 | 恩索恩公司 | Adhesion promotion in printed circuit boards |
| CN1865366A (en) * | 2005-05-16 | 2006-11-22 | 3M创新有限公司 | Method and composition for improving adhesion of organic polymer coating to copper surface |
| CN103286052A (en) * | 2013-06-19 | 2013-09-11 | 合肥华信电动科技发展有限公司 | Method of spraying and coating electric automobile coating piece surface and enabling painting surface to have reflective effect at night |
| CN104124005A (en) * | 2014-08-12 | 2014-10-29 | 北海银河开关设备有限公司 | Semi-conductive layer processing technique for solid insulation switches |
-
2019
- 2019-12-26 CN CN201911425984.7A patent/CN111069004A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4428987A (en) * | 1982-04-28 | 1984-01-31 | Shell Oil Company | Process for improving copper-epoxy adhesion |
| CN1839219A (en) * | 2003-07-14 | 2006-09-27 | 恩索恩公司 | Adhesion promotion in printed circuit boards |
| JP2005097344A (en) * | 2003-09-22 | 2005-04-14 | Nisshinbo Ind Inc | Lamination adhesive composition and adhesive film using the same |
| CN1865366A (en) * | 2005-05-16 | 2006-11-22 | 3M创新有限公司 | Method and composition for improving adhesion of organic polymer coating to copper surface |
| CN103286052A (en) * | 2013-06-19 | 2013-09-11 | 合肥华信电动科技发展有限公司 | Method of spraying and coating electric automobile coating piece surface and enabling painting surface to have reflective effect at night |
| CN104124005A (en) * | 2014-08-12 | 2014-10-29 | 北海银河开关设备有限公司 | Semi-conductive layer processing technique for solid insulation switches |
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