CN111068183A

CN111068183A - Manufacturing method of welding type heating device

Info

Publication number: CN111068183A
Application number: CN201911403672.6A
Authority: CN
Inventors: 李震玟
Original assignee: Qingdao Wenke Microelectronics Technology Co Ltd
Current assignee: Qingdao Wenke Microelectronics Technology Co Ltd
Priority date: 2019-12-31
Filing date: 2019-12-31
Publication date: 2020-04-28
Anticipated expiration: 2039-12-31
Also published as: CN111068183B

Abstract

The invention provides a manufacturing method of a welding type heating device, which comprises the following steps: preparing a power terminal mold on one side of a first substrate mold; after the power terminal die is prepared, placing a flexible material in the first substrate die; a second substrate is bonded on the molded first substrate; a bonded body formed by bonding the first substrate and the second substrate together; and the third substrate die presses a flexible material for forming a third substrate, the third substrate is welded on the combined body, the flexible material formed by the third substrate is smeared on the combined body, and the smearing of the flexible material formed by the third substrate corresponds to the appearance shape of the combined body. In the prior art, the welding type heating device prepared by the manufacturing method of the invention is made of flexible materials, can be comfortably worn on each body part including the abdomen of a female, and can normally carry out daily life in a wearing state.

Description

Manufacturing method of welding type heating device

Technical Field

The invention relates to the technical field of female supplies, in particular to a manufacturing method of a welding type heating device.

Background

The number of women who experience physiological pain each month increases year by year. According to the data of health insurance examination and evaluation hospitals, 160835 patients with physiological pain go to hospitals in 2013, compared with 179786 patients with physiological pain in 2016, the number of the patients is increased sharply. Under the unprecedented severe employment situation, recently, a social atmosphere that women want to develop a strong competition from the standpoint equal to men is formed. Therefore, it is not only young women who are not concerned about uterine diseases, but also mothers of pregnant women and parturients, and the like, that need to perfectly participate in competition. The great pressure they have to withstand is the main cause of hindering the intrauterine circulation, thus exacerbating the physiological pain.

With the increasing demand for women to enter society and realize themselves, there is a strong need to solve this problem, and a device and a method for manufacturing the device for relieving various pains including physiological pains will be described below.

The physiological pain relief device utilizing visible light is used for women with irregular menstrual cycles for 30 minutes every day and more than 3 months continuously before the physiological pain for one week, so that the physiological pain can be effectively relieved. But women feel psychological burden due to the problem of long use and during sensitive periods. The intense light of 600 nm in the visible light near the body is actually a limiting factor in outdoor activity when wearing the product.

Physiological pain relief techniques have also been proposed in which a function of nerve transmission is blocked by an electronic signal, but physiological pain is caused by excessive contraction of muscles, and blocks only a residual wave of uterine myalgia caused after a pain nerve.

Disclosure of Invention

The invention aims to provide a manufacturing method of a welding type heating device.

The invention solves the following technical problems: designing shrinkage rate of shrinkage material generated by soft substance plastic material; the soft coping structure problem generated in the manufacturing process between the soft shrinkage material and the hard material; this results in a delay in production time; welding the two materials while maintaining their electrical characteristics and controlling the increase in the defective fraction; the problems of deformation and the like after welding of products need to be solved.

In order to solve the above problems, the present invention provides a method for manufacturing a welding type heating device, comprising: preparing a power terminal mold on one side of a first substrate mold; after the power terminal die is prepared, placing a flexible material in the first substrate die; a second substrate is bonded on the molded first substrate; a bonded body formed by bonding the first substrate and the second substrate together; and the third substrate die presses a flexible material for forming a third substrate, the third substrate is welded on the combined body, the flexible material formed by the third substrate is smeared on the combined body, and the smearing of the flexible material formed by the third substrate corresponds to the appearance shape of the combined body.

Compared with the prior art, the manufacturing method of the welding type heating device has the advantages that according to the embodiment of the invention, the welding type heating device manufactured by the manufacturing method is made of flexible materials, can be comfortably worn on each body part including the abdomen of a female, and can normally carry out daily life in a wearing state; the production time possibly required in the production of the manufacturing method can be minimized; the manufacturing method of the invention can reduce the fraction defective during manufacturing; the manufacturing method of the invention can reduce the faults caused by the heating device in the using process to the maximum extent; the welding type heating device prepared by the manufacturing method is not visible light and cannot be identified by naked eyes, but the near infrared rays can penetrate through the flexible material and be absorbed by a human body, so that the welding type heating device has an effect on the human body.

Drawings

FIG. 1 is a heat-generating device according to an embodiment of the present invention;

FIG. 2 is an exploded view of a heat generating device in an embodiment of the present invention;

FIG. 3 is a first substrate of a heat generating device according to an embodiment of the present invention;

fig. 4(a) is a mold of a first substrate of a heat generating device according to an embodiment of the present invention, and fig. 4(B) is a fixed mold of the first substrate used for bonding the first substrate according to an embodiment of the present invention;

fig. 5 is a schematic diagram of placing a power terminal mold on a mold of a first substrate according to an embodiment of the invention:

FIG. 6 is a top view of a first substrate being molded on a mold for the first substrate according to an embodiment of the present invention;

FIG. 7 is a top view of the first substrate positioned on the first substrate mold after the first substrate has been retracted in accordance with an embodiment of the present invention:

FIG. 8 is a cross-sectional view of FIG. 7I-I';

FIG. 9 is a diagram illustrating a second substrate mounted on a first substrate according to an embodiment of the present invention;

FIG. 10 is a cross-sectional view of the heat-generating device of FIGS. 9 II-II';

FIG. 11 is a cross-sectional view of a third substrate formed on the first and second substrates according to an embodiment of the present invention;

fig. 12 is a schematic view of a completed heat-generating device according to an embodiment of the present invention.

Detailed Description

Hereinafter, specific embodiments of the present invention will be described in detail with reference to the drawings. However, the inventive concept is not limited to the following implementation examples, and a practitioner who understands the inventive concept can easily propose addition, modification, deletion, addition, etc. of constituent elements including other examples within the scope of the same concept. This is also included within the scope of the inventive concept.

In order to facilitate understanding of the concept of the present invention, the drawings are illustrated in the overall structure, and the specific parts such as the installation positions are different, and the same names are used for the same functions, so that the understanding is easy. When there are a plurality of the same structures, only one structure will be described, and the same description will be given to the other structures, and the description will be omitted.

In addition, the upper, lower, left, and right sides of the drawings described below are provided to facilitate understanding of the drawings, and the structures shown in the drawings can be converted into views of one side.

Fig. 1 is a heat generating device of the present invention. As shown in fig. 1, the heat generating device 1 according to the working example of the present invention has a curved or oval shape and is shaped to closely fit the abdomen or other parts of the body of a female.

As shown in fig. 1, the heat generating device 1 of the present invention includes a first substrate 10, a third substrate 20, and at least one heat source part 30 on the third substrate 20. The surface of the third substrate 20 provided with the heat source part 30 is a skin-contacting surface.

The first substrate 10 and the third substrate 20 are soft materials, preferably made of flexible materials having a hardness of 60 or less. The flexible material is flexible. The flexible material constituting the first substrate 10 and the third substrate 20 is a polymer such as rubber, silicone, plastic, or a combination thereof. The material used here is a material that adheres well to the skin.

A hole, i.e., a hole 40, into which a power supply line can be inserted is formed on the side surface of the first substrate 10.

The third substrate 20 has a heat source part 30 thereon. The heat source member 30 is composed of a heat transfer material that can efficiently transfer heat emitted from a heat source inside the heat generating device 1. In addition, near infrared rays generated inside the heat generating device 1 may be transmitted through one of the first substrate 10 or the third substrate 20.

Fig. 2 is an exploded view of the heat generating device of the present invention. As shown in fig. 2, the first substrate 10, the second substrate 50 formed on the first substrate 10, the power supply terminal 60 at one end of the second substrate 50, and the third substrate 20 formed by fusion bonding on the first substrate 10 and the second substrate 50 are provided from the bottom.

A hole-insertion hole 40 into which a power supply line is inserted may be formed at a portion of the first substrate 10 where the power supply terminal 60 is put. It is noted that the receptacle 40 may form a closed structure. The insertion hole 40 of the closed type structure can be opened by cutting a portion on one side of the first substrate, and can also be opened by using a mold of a thin plate.

A structure into which the power terminals 60 can be inserted may be formed on one side of the first substrate 10. The structure of the pluggable power terminal 60 can be a male or female slot.

The third substrate 20 is connected to one side of the first and

second substrates

10 and 50 to form a stack with the first and

second substrates

10 and 50. One side of the third substrate 20 directly contacts the skin. There is at least one heat generating source part 30 on the side of the third substrate 20 contacting the skin.

In a specific example, the third substrate 20 has a skin-contacting surface on which a first heat source part 31, a second heat source part 32, and a third heat source part 33 are provided. Here, the heat source part 30 and the skin contact surface of the third substrate 20 form an integral body.

The other side of the third substrate 20 is in contact with a second substrate 50 containing at least one or more heat sources, a temperature sensor, a circuit for adjusting temperature, and a communication circuit.

In addition, the material of the third substrate 20 may be a transparent or opaque material. The material of the third substrate 20 is a flexible material suitable for heat transfer.

More than 1 heating source 51 is distributed on the second substrate 50. The heat generation source 51 may convert the electric energy transferred through the power terminal 60 into thermal energy, thereby generating heat.

The second substrate 50 is a flexible circuit board. For example, the second substrate 50 is a circuit board having a conductive material such as metallic copper, aluminum, and a conductive polymer and an insulator for preventing conduction on an insulating substrate having a thickness of 10 μm.

More heating devices are formed on the second substrate 50. The heating device is bendable together with the second substrate 50, so that it is on the second substrate 50 with a very thin thickness. The thickness of the heating device is preferably less than 2 mm here. On the other hand, if there is no separate heating device, the second substrate 50 itself may also function as a heat generating device.

The heating equipment is distributed with a heating source, a temperature sensor capable of sensing temperature, a terminal for transmitting power, a component for controlling power and a wireless communication module for controlling power, and the heating equipment is composed of a circuit board for supplying power to the heating source.

The heat source may be a component that converts electrical energy to thermal energy. As an example, the heat generating source 51 may be a near infrared ray light emitting diode and a resistor. Here, the heat generated by the near infrared ray light emitting diode and the resistor used as the heat source may be designed as a heat source whose heat quantity is close. Therefore, only power limited to within 25% of the rated maximum power of the near infrared light emitting diode can be recognized as the near infrared light emitting diode.

The heating device is provided with at least one near infrared light emitting diode, and preferably 3. In a possible working example, the near infrared light emitting diode is a near infrared light emitting diode having a wavelength of 700 nm or more.

In this manner, the third substrate 20 is not a suspended structure or a transparent material but an opaque material and a transmissive material in a specific wavelength range by using the near infrared ray.

If one infrared light emitting diode is located at the center of the heat generating device, the remaining infrared light emitting diodes are symmetrically distributed at both sides with the near infrared light emitting diode located at the center. All the heat sources 51 are distributed within 10cm from which the human body can feel the same feeling.

After the power supply terminal 60 formed at one end of the second substrate 50 is connected to the power supply line, the power transmitted from the power supply line is transmitted to the second substrate 50. One end of the power terminal 60 is shaped to allow the power line to be inserted therein, and the other end is connected to the second substrate 50 by soldering.

Fig. 3 is a first substrate of the heat generating device according to the embodiment of the present invention. Fig. 3 shows a surface of the first substrate 10 which is in contact with the third substrate 20 after the second substrate 50 shown in fig. 2 is stably fixed. As shown in fig. 3, the first substrate 10 may include an appearance adhesive part 11, a first substrate chassis 12, a substrate fixing structure 13, a power terminal fixing structure 14, and a substrate fixing post 15.

The first substrate tray 12 is an integral part of the first substrate 10. The appearance contour bonding portion 11 forms a contact surface with the third substrate 20 shown in fig. 2 according to a side surface of the outer contour of the first substrate chassis 12, and the appearance contour bonding portion 11 and the first substrate chassis 12 are integrated.

The substrate fixing structure 13 is formed on one side surface of the first substrate 10. In addition, the substrate fixing structures 13 internally protrude at regular intervals on one side surface of the first substrate 10, forming a rugged state. The substrate fixing structures 13 protrude inside at regular intervals along the shape of the appearance contour bonding part 11, and may be formed in an uneven shape. The power terminal fixing structure 14 is formed by bonding the part 11 along the outer contour and protruding inside, and is larger than the power terminal.

As shown in fig. 3, the outline adhesive portion 11, the substrate fixing structure 13, and the power terminal fixing structure 14 are arranged in a step shape on one side surface of the first substrate chassis 12. In the specific embodiment, the step heights of the appearance contour bonding portion 11, the substrate fixing structure 13 and the power terminal fixing structure 14 are uniform. In other embodiments, the substrate fixing structure 13 and the power terminal fixing structure 14 form a first step at a uniform height, and the contour bonding portion 11 is higher or lower than the first step to form a second step. In another embodiment, the heights of the outline adhesion portion 11, the substrate fixing structure 13, and the power terminal fixing structure 14 are different from each other, and a stepped structure is formed.

The substrate fixing structure 13 is a function of a fixing auxiliary material for fixing the second substrate 50 shown in fig. 2 to the first substrate 10. In the embodiment, the substrate fixing structure 13 forms a fixing structure of the second substrate 50 according to a mold structure. In other embodiments, the substrate securing structure 13 and the first substrate tray 12 are integral and require subsequent cutting operations after manufacture.

The power terminal fixing structure 14 is a function of a fixing auxiliary material for fixing the power terminal 60 and the second substrate 50 shown in fig. 2 on the first substrate 10. As described above, the power terminal fixing structure is a stepped structure added to the appearance contour bonding portion 11 and the substrate fixing structure 13. This added stepped structure can be used as a cutting reference of the closed type insertion hole of the first substrate 10, thereby forming an open shape.

The substrate fixing posts 15 function as fixing auxiliary materials for fixing the second substrate 50 shown in fig. 2 to the first substrate 10. In the embodiment, the substrate fixing posts 15 are formed protruding on the first substrate base 12.

In addition, one side surface of the appearance contour bonding portion 11 is a contact surface with the third substrate 20. The other side of the bonding surface is preferably horizontal to the second substrate 50 fixed to the first substrate 10.

The following is a description of a process of forming the heat generating device by welding according to an embodiment of the present invention, beginning with the forming of the first substrate 10 described in fig. 3.

Fig. 4(a) shows a mold for molding the first substrate. As shown in fig. 4(a), according to the working example of the present invention, a first substrate of a heat generating device is manufactured by a first substrate mold 100. After the female mold/lower mold 101(femaledie) of the first substrate molded at the center of the mold 100 of the first substrate is formed, one end of the female mold/lower mold 101 of the first substrate is extended to form a power terminal female mold/lower mold 102.

The lower mold half 101 of the first substrate is a lower substrate of the molding object, i.e., the heat generating device, and has a shape corresponding to the shape of the first substrate. The lower mold half 101 of the first substrate has a concave shape with the same height as the first substrate.

Fig. 4(B) shows a fixing mold for the first substrate used for performing the fusing operation on the first substrate. The first substrate fixing mold 200 shown in fig. 4(B) includes a lower mold half 201 of the first substrate fixing mold that fixes the first substrate. The lower mold half 201 of the first substrate fixing mold mentioned here and the first substrate lower mold half 101 are similar in shape. The lower mold half 201 of the first substrate fixing mold has a smaller inner space than the inner space of the first substrate lower mold half 101.

Specifically, the first substrate lower mold half 101 is the space where the first substrate was first formed. While the first substrate molded on the first substrate lower mold half 101 is cooled, the flexible material shrinks according to the shrinkage rate, and the place where the first substrate is fixed after the shrinkage is finished is the first substrate fixed mold lower mold half 201.

Therefore, the size of the inner space of the first substrate stationary mold half 201 is smaller than the inner space of the first substrate lower mold half 101 by the amount of contraction of the flexible material. Shrinkage here may be within 10%, in practical cases of feasibility 2% to 3%.

Also, the first substrate fixing mold 200 is different from the first substrate mold 100 in that the power source side lower mold half 102 is not provided. After the first substrate is molded, the power terminal mold is removed from the molded first substrate, so that the fixing mold 200 of the first substrate does not include the power terminal lower mold.

Fig. 5 is a schematic view of the power terminal mold placed on the first substrate mold. As shown in fig. 5, the power terminal mold 300 is on the first substrate mold 100. The power terminal mold 300 is a mold for making a void inside the first substrate. The space mentioned here is a mounting position portion of the power terminal to be described later. The power terminal mold 300 is a portion inserted into the lower half 101 of the first substrate in order to form a space capable of receiving the power terminal inside the first substrate.

In addition, the power terminal mold 300 has a shape with a space into which the power terminal can be inserted on the first substrate 10 on one side. In addition, the power terminal mold 300 has a structure on one side thereof for preventing the power terminal from falling off the first substrate.

Fig. 6 is a top view of a first substrate molded according to a mold for the first substrate. As shown in fig. 6, the first substrate 10 is molded by the first substrate lower mold half 101. Specifically, the first substrate mold 100 is heated to place the flexible material into the first substrate lower mold half of the first substrate mold. Then, after the putting, the soft material is punched with a punching device, and then the first substrate 10 is molded. At this time, the punching surface of the punching device corresponds to the shape of one surface of the first substrate 10 shown in fig. 6.

As shown in fig. 6, the first substrate 10 has an outline-adhering portion 11, a first substrate base 12, a substrate-fixing structure 13, a power-terminal-fixing structure 14, and a substrate-fixing post 15 on one surface thereof.

Here, the outline edges of the areas of the left and right first substrate chassis 12 are shaped in accordance with the positive tolerance of the second substrate to be described below. Then, the peripheral edge of the first substrate tray 12 is shrunk according to the shrinkage rate of the flexible material. In the embodiment, the peripheral edge of the first substrate tray 12 is determined by the appearance contour bonding part 11.

Fig. 7 is a plan view of the first substrate molded by the first substrate mold after being contracted and then placed in the first substrate fixing mold. As shown in fig. 7, the first substrate 10 is placed and fixed on the first substrate fixing mold 200. The first substrate 10 fixed to the first substrate fixing mold 200 is in a state where the power terminal mold shown in fig. 6 is not placed. In this state, the power supply terminals 60 disposed on one sides of the second and

third substrates

50 and 20 shown in fig. 2 are combined with the first substrate 10. To explain this, please refer to the structure of the first substrate 10 shown in fig. 8 below.

Fig. 8 is a cross-sectional view of fig. 7I-I'. As shown in fig. 8, the first substrate 10 is mounted and fixed on the first substrate fixing mold 200. As described above, the first substrate 10 includes the outline adhesion portion 11, the first substrate chassis 12, the substrate fixing structure 13, the power terminal fixing structure 14, and the substrate fixing post 15. Since the outline bonding portion 11, the first substrate chassis 12, the substrate fixing structure 13, and the power terminal fixing structure 14 have been described in detail above, the description thereof is omitted and will not be repeated.

The protrusions of the substrate fixing posts 15 are formed in a protruding shape on the first substrate chassis 12 shown in fig. 8. The height of the substrate fixing post 15 protrusion is higher than the thickness of a second substrate to be described below.

The first substrate 10 includes a power supply terminal provision portion 17. Specifically, the power supply terminal provision portion 17 is formed on one side surface inside the first substrate 10.

In addition, the power terminal providing part 17 may have a first separation preventing connection part 16a and a second separation preventing connection part 16b formed on the upper and lower outer sides thereof, respectively. The first and second separation preventing

coupling portions

16a and 16b correspond to the shape of a separation preventing portion to be described below.

The first and second separation preventing

coupling parts

16a and 16b may have first and second

handle coupling parts

18a and 18b formed at upper and lower sides thereof, respectively. And the first and second power cord

handle hooking parts

18a and 18b may have a power cord handle part 19 formed on one side surface thereof. The first detachment prevention coupling part 16a, the second detachment prevention coupling part 16b, the power supply terminal provision part 17, the first power supply cord handle hanging part 18a, the second power supply cord handle hanging part 18b, and the power supply cord handle part 19 described herein are voids produced according to the power supply terminal mold 300 described in fig. 6.

On the other hand, the substrate fixing structure 13 and the first substrate chassis 12 are integrated and molded together. And all or a portion of a on one side a of the substrate-fixing structure 13 needs to be cut after the molding step of the first substrate 10. In the exemplary embodiment, a boundary surface is formed between one side A of the substrate holding structure 13 and the first substrate tray 12.

Also, the power terminal fixing structure 14 and the first substrate chassis 12 are integrally formed. And all or a part of one side B of the power terminal fixing structure 14 needs to be cut after the molding step of the first substrate 10. In the exemplary embodiment, a boundary surface is formed between one side B of the power terminal holding structure 14 and the first substrate chassis 12.

In one aspect, the first substrate fixing mold 200 further includes a mold for filling the inner space of the power cord handle part 19. Here, the mold for filling the internal space of the power cord handle portion 19 may be formed integrally with the first substrate fixing mold 200, or may be formed separately. The mold filling the inner space of the power supply terminal handle part 19 can prevent the power supply terminal 60 inside the power supply terminal accommodating part 17 from being damaged when the third substrate 20 is subsequently welded to the combined body of the first substrate 10 and the second substrate 50.

Fig. 9 shows a state where the second substrate is mounted on the first substrate. As shown in fig. 9, the first substrate 10 has a second substrate 50 on one side thereof. The second substrate 50 is fixed by the first substrate chassis 12 of the first substrate, the substrate fixing structure 13, the power terminal fixing structure 14, and the substrate fixing post 15. The joined state of the second substrate 50 and the first substrate is described in detail with reference to fig. 10 described below.

Fig. 10 is a cross-sectional view of the heat generating device of fig. 9 ii-ii'. As shown in fig. 10, one end of the second substrate 50 is fixed to a first gap a' formed between a on one side surface of the substrate fixing structure 13 and the first substrate chassis 12. Here, the first slit a' is formed by cutting all or part of one surface a of the substrate fixing structure 13.

In addition, the other end of the second substrate 50 is fixed to a second gap B' formed between the one side surface B of the power terminal fixing structure 14 and the first substrate chassis 12. Here, the second slit B' is formed by cutting all or a part of one side B of the power terminal fixing structure 14.

Here, the first gap a 'and the second gap B' are designed to have a tolerance of 0 or minus (-) with respect to the second substrate 50. Specifically, the first substrate 10 is composed of a flexible material that can be contracted. In addition, since the first substrate 10 is a flexible material that can be shrunk, the first substrate 10 is designed with the tolerance as described above. Between the substrate fixing structure 13 and the first substrate chassis 12 and between the power terminal fixing structure 14 and the first substrate chassis 12, complete sealing is possible even in the case where the second substrate 50 is not mounted. However, the first substrate 10 is a flexible material that can be shrunk, and thus the second substrate 50 can be inserted even in the case of the above-described sealing. In addition, if the second substrate 50 is inserted, there is an effect that the second substrate 50 can be completely fixed on the first substrate 10 due to the above tolerance value.

In addition, the second substrate 50 is fixed by the substrate fixing posts 15. At least more than one holes penetrating the second substrate are formed on the second substrate 50, and the substrate fixing posts 15 are engaged in the holes penetrating the second substrate 50, thereby fixing the second substrate 50.

The power supply terminal 60 is fixed in the power supply terminal housing 17. The power supply terminal provision portion 17 is formed by a separate mold as described above. The power supply terminal providing part 17 may be formed in a shape corresponding to the shape of the power supply terminal 60. Specifically, the power supply terminal provision unit 17 is formed in a shape corresponding to the shape and tolerance of the power supply terminal 60.

Specifically, the power supply terminal device 17 is designed such that a tolerance of 0 or minus (-) is set in addition to the power supply terminal 60. The power supply terminal 60 is designed to have a positive (+) tolerance on the basis of the power supply terminal providing unit 17. Similarly, the first substrate (10 is a flexible material which can be contracted, so that the power terminal 60 can be inserted into the power terminal providing unit 17. since the power terminal providing unit 17 has a tolerance of 0 or negative with respect to the power terminal 60 and the power terminal 60 has a tolerance of positive (+) with respect to the power terminal providing unit 17, the power terminal 60 is in a close contact state in the power terminal providing unit 10, and a reliable fixing effect can be achieved.

On the other hand, as shown in fig. 10, the second substrate 50 needs to have a certain empty space between the first substrate chassis 12 and the substrate fixing structure 13 and between the power terminal fixing structure 14 and the second gap B' of the first substrate chassis 12, and can be fixed. Fig. 10 is a view for clearly explaining the position of the second substrate 50 between the respective slits. In fact, since the first substrate chassis 12, the substrate fixing structure 13, and the power terminal fixing structure 14 are completely attached to the second substrate 50, the first gap a 'and the second gap B' may not be formed, or may be very small even if formed.

In addition, the tip of the power terminal 60 may be formed with a detachment prevention part 61. The detachment prevention portion 61 is located at an edge of each surface of the power terminal 60, and has a shape of an inclined surface rising from a distal end of one surface of the power terminal 60 in a direction in which an external force is supplied. The detachment prevention section 61 prevents the power supply terminal 60 from being detached from the device by an external force when the inserted power supply terminal is pulled out from the heat generating device. Specifically, the detachment prevention portion 61 prevents the power supply terminals 60 from being detached from the first substrate 20 by physical external force.

In addition, the first substrate 10 further includes a first separation preventing coupling portion 16a and a second separation preventing coupling portion 16b that can catch the respective separation preventing portions 61. The first separation preventing portion 16a and the second separation preventing portion 16b correspond to the separation preventing portion 61, and are distributed not only in the vertical direction but also in the front, rear, left, and right directions as shown in fig. 7.

The first power cord handle hanging part 18a, the second power cord handle hanging part 18b and the power cord handle part 19 are spaces for fixing the power cord inserted into the power supply terminal 60. The first power cord grip hanging part 18a and the second power cord grip hanging part 18b are parts that are caught at one side in the insertion direction of the power cord grip. The power cord is inserted into the power supply terminal 60 by passing through the space between the first power cord handle hooking part 18a and the second power cord handle hooking part 18 b.

Here, the power cord handle portion 19 is designed to have a tolerance of 0 or minus (-) with respect to the power cord. In a particular embodiment, the difference between the handle portion 19 of the power cord and the power cord is within 3mm of one side. In one aspect, the power cord handle is designed to a 0 tolerance or positive (+) tolerance relative to the power cord handle portion 19.

Due to the characteristics of the flexible material having flexibility, the insertion of the power cord is not problematic even if the space within the handle portion 19 of the power cord is smaller than the size of the power cord. Instead, the snug structure formed by this negative tolerance and each side after insertion can serve to secure the power cord.

In this feasible example, when the power cord handle part 19 of the power cord is inserted, the internal space becomes large due to the characteristics of the soft material of the power cord handle part 19, but the first and second detachment

prevention coupling parts

16a and 16b, and the first and second power cord

handle hooking parts

18a and 18b do not become large.

In addition, between the power terminal 60 and the second substrate 50, some more flexible material 62 may be added. The flexible material 62 is disposed between the power terminal 60 and the second substrate 50, and also functions to absorb an external force when the power terminal is inserted. The flexible material 62 can be bent in any direction by an external force transmitted when the power cord is connected, and thus absorbs the external force. Flexible material the flexible material 62 may be designed to 0 or negative tolerances.

Fig. 11 is a sectional view of the third substrate molded on the first substrate and the second substrate by the third substrate mold after the second substrate and the power supply terminals are fixed to the first substrate. As shown in fig. 11, the third substrate 20 is molded thereon in a state where the second substrate 50 is fixed on the first substrate 10. In order to mold the third substrate 20, a flexible material is applied to one surface of a combined body (hereinafter, referred to as a "combined body") of the first substrate 10 and the second substrate 50. And for the molding of the third substrate, after the flexible material is coated, the flexible material forms the third substrate 20 on one side of the combined body after the pressing of the third substrate mold 400.

In this case, when the flexible material is applied to one surface of the joined body for molding the third substrate, it is preferable to uniformly apply the flexible material to the pressing surface to the maximum extent. The pressing surface here means a surface for fusing the flexible material of the third substrate and the bonded body.

Generally, when the flexible material is formed by a mold, the flexible material is intensively placed at a central point in order to simplify the process. In contrast, in the embodiment of the present invention, in the method of performing the mold welding process, the flexible material for forming the third substrate 20 is applied in a shape corresponding to the pressing surface of the coupled body, and then the third substrate 20 is formed by pressing the third substrate mold 400. Here, when the flexible material is applied, all electronic components included in the second substrate fixed to the first substrate are covered.

For example, the soft material formed on the third substrate may be coated in an elliptical shape corresponding to the shape of the pressing surface of the combined body. Furthermore, the soft material of the third substrate is initially applied to a surface smaller than the pressing surface.

By such a manufacturing method, the possibility of distortion occurring in the welding process between the third substrate 20 and the joined body is minimized, and the possibility of breakage of the second substrate included in the joined body is minimized. Fig. 12 shows the completed heat-generating device after the third substrate mold is removed.

As shown in fig. 12, the heat generating device 1 is manufactured by the first substrate setting mold 200. The heat generating device 1 forms a third substrate 20 on the first substrate 10.

In fig. 12, one surface of the third substrate 20 is a surface that contacts the skin. As shown in fig. 12, the heat source member 30 is disposed on one surface of the third substrate 20. The shape of the third substrate 20 including the heat source member 30 is determined according to the shape of a third substrate mold for molding the third substrate 20.

The detailed description is not to be construed in a limiting sense in all respects, and should be regarded as examples. The scope of the invention should be determined by reasonable interpretation of the appended claims, and all changes and modifications within the equivalent scope of the invention are included in the scope of the invention.

Claims

1. A manufacturing method of a welding type heating device is characterized by comprising the following steps:

preparing a power terminal mold on one side of a first substrate mold;

after the power terminal die is prepared, placing a flexible material in the first substrate die;

a second substrate is bonded on the molded first substrate;

a bonded body formed by bonding the first substrate and the second substrate together;

and the third substrate die presses a flexible material for forming a third substrate, the third substrate is welded on the combined body, the flexible material formed by the third substrate is smeared on the combined body, and the smearing of the flexible material formed by the third substrate corresponds to the appearance shape of the combined body.

2. A method of manufacturing a fusion-bonded heat-generating device as claimed in claim 1, wherein bonding a second substrate to the molded first substrate further comprises:

the power supply terminal die is taken off from the first substrate formed by the first substrate die, and a jack for inserting a power supply line can be inserted into one side surface of the first substrate;

forming a power supply terminal provision portion inside the first substrate;

the first substrate after the power terminal die is taken off is placed in a first substrate preparation die; the proportion of the substrate lower half mold of the first substrate preparation mold is smaller than that of the first substrate mold.

3. A method of manufacturing a heat generating device of a fusion type according to claim 2, wherein a ratio of the substrate lower mold half of the first substrate preparation mold is determined based on a shrinkage ratio of a flexible material constituting the first substrate.

4. A method of manufacturing a fusion-type heat-generating device according to claim 2, wherein the first substrate includes a first substrate base plate having an outer edge bonding portion formed along an outer periphery of the first substrate base plate; the outer edge bonding part protrudes from the inside of the substrate fixing structure at a certain interval, and the power terminal fixing structure covering the power terminal and the substrate fixing column protruding from the first substrate chassis by a certain height are formed along the inner protrusion of the outer edge bonding part.

5. A method of manufacturing a heat generating device of a fusion-type according to claim 4, wherein said molded first substrate is bonded with a second substrate, further comprising

Cutting the lower end face of the substrate fixing structure;

the lower end face of the power terminal fixing structure is cut;

a first cutting seam formed by fixing one side of the second substrate on the lower end face of the substrate fixing structure for cutting, and a second cutting seam formed by fixing the second substrate on the lower end face of the power supply terminal fixing structure for cutting;

and clamping the fixing hole of the second substrate on the substrate fixing column of the first substrate for fixing, and fixing the power supply terminal in the power supply terminal preparation part.

6. A method of manufacturing a heat generating device of a fusion type according to claim 5, wherein the first cut line and the second cut line have a zero tolerance or a negative tolerance with respect to the second base plate;

the power terminal spare part has zero tolerance or negative tolerance corresponding to the power terminal;

the outer edge of the first substrate chassis has a positive tolerance with respect to the third substrate.

7. A method of manufacturing a heat generating device of a fusion type according to claim 5, wherein the first substrate further includes a detachment prevention portion hooking portion, a power cord handle hooking portion, and a power cord handle portion on the side of the power supply terminal accommodating portion; the handle part of the power cord is provided with zero or positive tolerance corresponding to the power cord inserted into the power supply terminal.

8. A method of manufacturing a heat generating device of a fusion type according to claim 7, wherein when the power cord is inserted into the handle portion, a space inside the handle portion becomes large, and the detachment prevention portion engaging portion and the handle portion engaging portion are kept unchanged.

9. A method of manufacturing a heat generating device of a fusion type according to claim 5, wherein said third base plate mold further comprises a mold for filling a space inside the handle portion of the power cord.

10. A method for manufacturing a heat generating device of a fusion-bonding type according to claim 1, wherein the flexible material formed by the third substrate is applied to the bonded body, and the flexible material formed by the third substrate is applied so that one side of all electronic components included in the second substrate is covered with the flexible material.