CN111059644A - Air condensing units and have its air conditioning system - Google Patents
Air condensing units and have its air conditioning system Download PDFInfo
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- CN111059644A CN111059644A CN201911295527.0A CN201911295527A CN111059644A CN 111059644 A CN111059644 A CN 111059644A CN 201911295527 A CN201911295527 A CN 201911295527A CN 111059644 A CN111059644 A CN 111059644A
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- heat
- outdoor unit
- semiconductor
- air conditioner
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F1/00—Room units for air-conditioning, e.g. separate or self-contained units or units receiving primary air from a central station
- F24F1/06—Separate outdoor units, e.g. outdoor unit to be linked to a separate room comprising a compressor and a heat exchanger
- F24F1/42—Separate outdoor units, e.g. outdoor unit to be linked to a separate room comprising a compressor and a heat exchanger characterised by the use of the condensate, e.g. for enhanced cooling
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/22—Means for preventing condensation or evacuating condensate
- F24F13/222—Means for preventing condensation or evacuating condensate for evacuating condensate
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Air Humidification (AREA)
- Other Air-Conditioning Systems (AREA)
Abstract
The invention provides an air conditioner outdoor unit and an air conditioning system with the same, wherein the air conditioner outdoor unit comprises a shell, a condenser and a fan, wherein the fan and the condenser are arranged in the shell; the outdoor unit of an air conditioner further includes: the semiconductor refrigeration structure comprises a semiconductor refrigerator, wherein the semiconductor refrigerator is provided with a heat absorption end and a heat release end; the semiconductor refrigeration structure is arranged in the shell and located between the condenser and the fan, and air passing through the condenser passes through the semiconductor refrigeration structure under the driving of the fan, so that heat exchange is carried out between the air passing through the semiconductor refrigeration structure and the heat absorption end, condensed water is formed on the heat absorption end, and the condensed water is transferred into the air conditioner indoor unit. The air conditioner outdoor unit solves the problem that an external water source is inconvenient to provide for an air conditioner indoor unit in the prior art.
Description
Technical Field
The invention relates to the field of air conditioning equipment, in particular to an air conditioning outdoor unit and an air conditioning system with the same.
Background
With the gradual improvement of the living standard of people and the increasingly development of the manufacturing level of household appliance industries such as air conditioners and the like, the competitiveness of air conditioner products is not limited to a single function, the use comfort gradually becomes an important evaluation standard, and the influence of indoor humidity on the human body comfort is very important in the actual use experience.
However, in the process of adjusting the indoor temperature of the current air conditioner, the humidity may be too high or too low, and if the humidity is too low, the air conditioner cannot increase the humidity level by heating or cooling. The water source for humidification can not be or is difficult to be supplied externally, and the water source for automatic cleaning of the air conditioner can not be or is difficult to be supplied externally.
Disclosure of Invention
The invention mainly aims to provide an air conditioner outdoor unit and an air conditioner system with the same, and aims to solve the problem that an external water source is inconvenient to provide for an air conditioner indoor unit in the prior art.
In order to achieve the above object, according to one aspect of the present invention, there is provided an outdoor unit of an air conditioner including a casing, a condenser, and a blower fan, both of which are disposed in the casing, the outdoor unit further including: the semiconductor refrigeration structure comprises a semiconductor refrigerator, wherein the semiconductor refrigerator is provided with a heat absorption end and a heat release end; the semiconductor refrigeration structure is arranged in the shell and located between the condenser and the fan, and air passing through the condenser passes through the semiconductor refrigeration structure under the driving of the fan, so that heat exchange is carried out between the air passing through the semiconductor refrigeration structure and the heat absorption end, condensed water is formed on the heat absorption end, and the condensed water is transferred into the air conditioner indoor unit.
Further, the semiconductor refrigeration structure also comprises a heat absorption component, and the heat absorption component is arranged on the heat absorption end, so that the air passing through the semiconductor refrigeration structure is subjected to heat exchange with the heat absorption component, and condensed water is formed on the heat absorption component.
Further, the heat absorbing component comprises a plurality of first fins, and the plurality of first fins are arranged on the heat absorbing end at intervals.
Furthermore, each first fin comprises a first connecting end and a second connecting end which are oppositely arranged, the first connecting end is connected with one end of the heat absorbing end far away from the heat releasing end, and the second connecting end extends towards one end far away from the heat releasing end; wherein, a plurality of first fins set up parallelly.
Further, a hydrophilic film is provided on a surface of each of the first fins.
Further, the semiconductor refrigeration structure further comprises a heat dissipation assembly, and the heat dissipation assembly is arranged on the heat release end, so that air passing through the semiconductor refrigeration structure is in contact with the heat dissipation assembly.
Further, the heat dissipation assembly comprises a plurality of second fins which are arranged on the heat release end at intervals; the second fins are arranged in parallel, each second fin comprises a third connecting end and a fourth connecting end which are arranged oppositely, the third connecting ends and the heat release ends are connected with one ends, far away from the heat absorption ends, of the heat release ends, and the fourth connecting ends extend towards one ends, far away from the heat absorption ends.
Further, the outdoor unit of an air conditioner further includes: the water receiving tank is arranged in the shell and communicated with the semiconductor refrigerating structure so as to receive condensed water generated by the semiconductor refrigerating structure; and one end of the liquid supply pipeline is used for being connected with the water receiving tank, and the other end of the liquid supply pipeline is used for being connected with a water supply tank of an indoor unit of the air conditioner.
Further, the outdoor unit of an air conditioner further includes: the water pump is arranged in the shell, is arranged on the liquid supply pipeline and is positioned between the water receiving tank and the water supply tank.
According to another aspect of the present invention, an air conditioning system is provided, which includes an air conditioning indoor unit and an air conditioning outdoor unit, and condensed water generated by a semiconductor refrigeration structure of the air conditioning outdoor unit is used for conveying to the air conditioning indoor unit, wherein the air conditioning outdoor unit is the above-mentioned air conditioning outdoor unit.
The air conditioner outdoor unit comprises a semiconductor refrigeration structure, wherein the semiconductor refrigeration structure is arranged in a shell and is positioned between a condenser and a fan, and air passing through the condenser passes through the semiconductor refrigeration structure under the driving of the fan, so that heat exchange is generated between the air passing through the semiconductor refrigeration structure and a heat absorption end, condensed water is formed on the heat absorption end, and the condensed water is transferred into the air conditioner indoor unit. The condensed water produced by the air conditioner outdoor unit is used for providing a water source for the humidifier and the cleaning device of the air conditioner indoor unit, the purpose of no manual water supply and humidification can be achieved, meanwhile, a water source required by automatic cleaning of an air conditioner can be provided, the problem that an external water source is not convenient to provide for the air conditioner indoor unit is solved, and the water supply mode of the air conditioner outdoor unit is simple and reliable.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic structural view illustrating an embodiment of an outdoor unit of an air conditioner according to the present invention;
fig. 2 is a plan view illustrating an embodiment of an outdoor unit of an air conditioner according to the present invention;
fig. 3 is a schematic view illustrating a structure of a semiconductor cooling structure of an outdoor unit of an air conditioner according to the present invention;
fig. 4 is a partial schematic view illustrating a semiconductor cooling structure of an outdoor unit of an air conditioner according to the present invention;
fig. 5 is a schematic view illustrating a semiconductor cooling structure of an outdoor unit of an air conditioner according to the present invention;
fig. 6 shows a schematic structural diagram of an embodiment of an air conditioning system according to the present invention.
Wherein the figures include the following reference numerals:
10. a condenser; 20. a fan; 3. a semiconductor refrigeration structure; 30. a semiconductor refrigerator; 31. a heat absorption end; 32. a heat releasing end; 40. a heat sink assembly; 41. a first fin; 50. a heat dissipating component; 51. a second fin; 60. a water receiving tank; 70. a liquid supply conduit; 80. a water supply tank; 90. a water pump; 1. an air-conditioning indoor unit; 2. an outdoor unit of an air conditioner.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the disclosure. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
The present invention provides an outdoor unit of an air conditioner, referring to fig. 1 to 5, including a casing, a condenser 10 and a fan 20, wherein the fan 20 and the condenser 10 are both disposed in the casing, the outdoor unit of the air conditioner includes: the semiconductor refrigeration structure 3, the semiconductor refrigeration structure 3 comprises a semiconductor refrigerator 30, the semiconductor refrigerator 30 is provided with a heat absorption end 31 and a heat release end 32; the semiconductor refrigeration structure 3 is arranged in the shell, the semiconductor refrigeration structure 3 is located between the condenser 10 and the fan 20, air passing through the condenser 10 passes through the semiconductor refrigeration structure 3 under the driving of the fan 20, so that heat exchange occurs between the air passing through the semiconductor refrigeration structure 3 and the heat absorption end 31, condensed water is formed on the heat absorption end 31, and the condensed water is transferred into the indoor air conditioner 1.
The air conditioner outdoor unit comprises a semiconductor refrigeration structure 3, wherein the semiconductor refrigeration structure 3 is arranged in a shell, the semiconductor refrigeration structure 3 is positioned between a condenser 10 and a fan 20, air passing through the condenser 10 passes through the semiconductor refrigeration structure 3 under the driving of the fan 20, so that the air passing through the semiconductor refrigeration structure 3 is subjected to heat exchange with a heat absorption end 31, condensed water is formed on the heat absorption end 31, and the condensed water is transferred into the air conditioner indoor unit 1. The condensed water produced by the air conditioner outdoor unit is used for providing a water source for the humidifier and the cleaning device of the air conditioner indoor unit, the purpose of no manual water supply and humidification can be achieved, meanwhile, a water source required by automatic cleaning of an air conditioner can be provided, the problem that an external water source is not convenient to provide for the air conditioner indoor unit is solved, and the water supply mode of the air conditioner outdoor unit is simple and reliable.
During specific implementation, the semiconductor refrigeration structure 3 of the air conditioner outdoor unit is used for supplying water to a wall-mounted air conditioner, so that the problem that an external water source cannot be provided by the mounting position of the wall-mounted air conditioner to meet the humidifying function is solved, and the problem that the external water source cannot be provided by the mounting position of the wall-mounted air conditioner to meet the automatic water cleaning function is also solved.
Preferably, the fan 20 is an axial fan.
In the present embodiment, the semiconductor cooling structure 3 further includes a heat absorbing assembly 40, and the heat absorbing assembly 40 is disposed on the heat absorbing end 31, so that air passing through the semiconductor cooling structure 3 exchanges heat with the heat absorbing assembly 40 to form condensed water on the heat absorbing assembly 40. Such an arrangement increases the contact area of the air with the heat absorbing end to increase the condensate yield.
Preferably, the heat sink assembly 40 includes a plurality of first fins 41, the plurality of first fins 41 being spaced apart on the heat sink end 31. The arrangement further increases the contact area of the air and the heat absorption assembly, and increases the yield of condensed water.
Preferably, each of the first fins 41 includes a first connection end and a second connection end which are oppositely arranged, the first connection end is connected with one end of the heat absorption end 31 far away from the heat release end 32, and the second connection end extends towards one end far away from the heat release end 32; wherein the plurality of first fins 41 are arranged in parallel.
Specifically, each of the first fins 41 extends in the vertical direction.
Preferably, each first fin 41 is provided on a surface thereof with a hydrophilic film (or hydrophilic coating); the hydrophilic film (or hydrophilic coating) has good hydrophilic characteristic and can quickly dredge condensed water formed on the surface of the fin. Such setting up guarantees that the water droplet on first fin 41 surface can in time fall and collect in the water receiving tank, can not form water film or water bridge influence heat transfer effect on its surface. The hydrophilic film (or hydrophilic coating) is a material which is commonly used on the fin tube type heat exchanger and covers the surface of the fin, and the hydrophilic film is used for leading the surface moisture to be condensed into water drops (the diameter is more than 2mm) as soon as possible and dropping into the water receiving tank by utilizing the hydrophilic property of the hydrophilic film. If the hydrophilic film is not arranged, the mist-shaped small water drops (the diameter is less than 2mm) are distributed on the surface of the fin of the radiator, so that the heat exchange effect is greatly reduced.
In the present embodiment, the semiconductor cooling structure 3 further includes a heat dissipation assembly 50, and the heat dissipation assembly 50 is disposed on the heat dissipation end 32, so that the air passing through the semiconductor cooling structure 3 contacts the heat dissipation assembly 50. This arrangement accelerates heat dissipation from the heat radiating end so as not to affect the cooling efficiency due to reverse heat transfer.
Preferably, the heat dissipation assembly 50 includes a plurality of second fins 51, the plurality of second fins 51 being disposed on the heat releasing end 32 at intervals; the plurality of second fins 51 are arranged in parallel, each second fin 51 comprises a third connecting end and a fourth connecting end which are arranged oppositely, the third connecting end is connected with one end, far away from the heat absorption end 31, of the heat release end 32, and the fourth connecting end extends towards one end, far away from the heat absorption end 31. Such an arrangement further accelerates heat dissipation from the heat radiating end.
Specifically, each of the second fins 51 extends in the vertical direction.
In the implementation, the heat absorbing end 31 is located below the heat releasing end 32 along the vertical direction.
In this embodiment, the outdoor unit of an air conditioner further includes: the water receiving tank 60 is arranged in the shell, and the water receiving tank 60 is communicated with the semiconductor refrigerating structure 3 so as to receive condensed water generated by the semiconductor refrigerating structure 3; and one end of the liquid supply pipeline 70 is used for being connected with the water receiving tank 60, and the other end of the liquid supply pipeline 70 is used for being connected with a water supply tank 80 of the indoor unit 1 of the air conditioner. Such an arrangement enables the condensate water produced by the semiconductor refrigeration structure 3 to be delivered to the indoor unit of the air conditioner.
In specific implementation, the water receiving tank 60 is disposed below the semiconductor refrigeration structure 3, and a water receiving port of the water receiving tank 60 is disposed opposite to the heat absorbing assembly 40.
Specifically, the humidifier and the cleaning device of the indoor unit 1 of the air conditioner are both communicated with the water supply tank 80.
In one embodiment, the outdoor unit of an air conditioner further includes a water pump 90 disposed in the casing, and the water pump 90 is disposed on the liquid supply pipe 70 and between the water receiving tank 60 and the water supply tank 80.
In another embodiment, the liquid supply conduit 70 is a siphon.
In this embodiment, the outdoor unit of the air conditioner further includes a temperature sensing device disposed on a side of the semiconductor cooling structure 3 away from the fan 20, the temperature sensing device is configured to detect an actual temperature of air that has not passed through the semiconductor cooling structure 3 and send the actual temperature to the control system, and the control system compares the actual temperature with a predetermined temperature to adjust an input current of the semiconductor cooler so that a temperature of the heat absorbing end is lower than a dew point temperature of the air. Preferably, the temperature sensing device is a temperature sensor.
In specific implementation, the electrical box of the air conditioner outdoor unit is used for supplying power to the semiconductor refrigerator.
Specifically, the refrigeration principle of the semiconductor refrigerator is shown in fig. 5, the circuit in fig. 5 can generate heat transfer after being connected with direct current, and the current flows from the N-type element to the joint of the P-type element to absorb heat to form a heat absorption end; the heat is released from the P-type element to the N-type element, and becomes a heat releasing end.
During the operation of the outdoor unit of the air conditioner, the operation of the fan 20 brings a large amount of flowing gas, the contact area and the air volume are important factors for forming the amount of condensed water, and when the semiconductor refrigerator 30 is powered on with direct current, when the current flows from the N pole to the P pole, a heat absorption phenomenon is generated on the heat absorption end 31; the current flows from the P pole to the N pole, and the heat release end 32 generates a heat release phenomenon; if the direction of the current is reversed, the heat absorption and heat release ends are switched with each other.
In specific implementation, the heat absorbing end and the heat releasing end are both provided with fins, and the fins are parallel to the gas flowing direction (as shown in fig. 3 and 4), so that on one hand, the yield of condensed water is increased in order to increase the contact area between the gas flow and the heat absorbing end, and on the other hand, the heat dissipation of the heat releasing end is accelerated so as to avoid the influence of reverse heat transfer on the refrigeration efficiency. Because the air after heat exchange of the condenser in the air-conditioning outdoor unit respectively flows through the fins at the heat absorption end and the heat release end, the utilization of air heat does not influence the energy efficiency of the air-conditioning capacity, and the heat exchange at the cold and hot ends of the semiconductor refrigerator does not influence each other (the air does not successively pass through the cold and hot ends, and the phenomenon of heat channeling does not occur.
Under the premise that the number of pairs of N-type elements and P-type elements of semiconductor materials is fixed, the current input into a semiconductor refrigerator determines the temperature difference between the cold end and the hot end, namely the heat absorption capacity and the heat release capacity, the current temperature is obtained through conventional temperature detection means such as a temperature sensor, automatic control systems such as remote control, program control and computer control can be easily realized, the input current is accurately controlled, so that the temperature of the heat absorption end is controlled to be lower than the dew point temperature under the current air pressure and temperature, and the surface of the heat absorption end and the surface of the first fin can continuously form condensed water.
Through test verification and estimation, the air quantity of an external machine is 600m at the dry bulb temperature of 27 ℃, the relative humidity of 60 percent and under the standard atmospheric pressure3The total surface area of the heat absorbing end and the first fin is 6000mm under the condition of/h2Can generate 100-120ml/h condensed water, and can meet the general humidification requirement.
In addition, when humidification is not needed, liquid water collected by the water receiving tank can be used for a filter screen or an evaporator automatic cleaning device in an air-conditioning indoor unit, and the cleaned sewage is discharged through a common drain pipe.
A humidifier in the air-conditioning indoor unit supplies the atomized water vapor to humidify indoor air along with the air supplied by the indoor unit through an ultrasonic atomization technology.
With the above apparatus, a water pump may be used to transfer the condensed water generated by the semiconductor cooler into the room instead of the siphon tube.
The humidification air conditioner has wide market prospect at home and abroad, but no mature product is released in the market at present because the problem that the humidification function needs a water supply source cannot be solved. The existing air conditioning system which solves the problem that the humidifying function needs a water supply source has a very complicated internal structure, needs to extract water by utilizing electric heating and a fan, is low in efficiency and high in cost, and is made of a water absorption disc material which is fragile and short in service life.
The air conditioner outdoor unit of the invention collects the moisture in the outdoor air by using the semiconductor material, and the moisture is sucked by the siphon pipe or the water pump and collected indoors.
The invention adopts the semiconductor refrigeration piece to collect the moisture in the outdoor air, and the moisture is led into the room through a special device to humidify and clean the inside of the air conditioning system. The invention has the following advantages: condensed water can be generated as long as the temperature is lower than the corresponding dew point temperature under the current atmospheric pressure and the dry bulb temperature, the influence of humidity is basically avoided, and moisture can be still provided even under the dry condition; the structure is simple, and the cost is controllable; the efficiency is higher, and the structure is reliable, and supplies water steadily constantly.
The invention also provides an air conditioning system, as shown in fig. 6, comprising an indoor air conditioning unit 1 and an outdoor air conditioning unit 2, wherein condensed water generated by the semiconductor refrigeration structure 3 of the outdoor air conditioning unit 2 is used for conveying to the indoor air conditioning unit 1, wherein the outdoor air conditioning unit is the outdoor air conditioning unit in the above embodiment.
From the above description, it can be seen that the above-described embodiments of the present invention achieve the following technical effects:
the air conditioner outdoor unit comprises a semiconductor refrigeration structure 3, wherein the semiconductor refrigeration structure 3 is arranged in a shell, the semiconductor refrigeration structure 3 is positioned between a condenser 10 and a fan 20, air passing through the condenser 10 passes through the semiconductor refrigeration structure 3 under the driving of the fan 20, so that the air passing through the semiconductor refrigeration structure 3 is subjected to heat exchange with a heat absorption end 31, condensed water is formed on the heat absorption end 31, and the condensed water is transferred into the air conditioner indoor unit. The condensed water produced by the air conditioner outdoor unit is used for providing a water source for the humidifier and the cleaning device of the air conditioner indoor unit, the purpose of no manual water supply and humidification can be achieved, meanwhile, a water source required by automatic cleaning of an air conditioner can be provided, the problem that an external water source is not convenient to provide for the air conditioner indoor unit is solved, and the water supply mode of the air conditioner outdoor unit is simple and reliable.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. An outdoor unit of an air conditioner, comprising a casing, a condenser (10), and a fan (20), wherein the fan (20) and the condenser (10) are both disposed in the casing, the outdoor unit of an air conditioner further comprising:
the semiconductor refrigeration structure (3), the semiconductor refrigeration structure (3) comprises a semiconductor refrigerator (30), and the semiconductor refrigerator (30) is provided with a heat absorption end (31) and a heat release end (32);
the semiconductor refrigeration structure (3) is arranged in the shell, the semiconductor refrigeration structure (3) is located between the condenser (10) and the fan (20), air passing through the condenser (10) passes through the semiconductor refrigeration structure (3) under the driving of the fan (20), so that the air passing through the semiconductor refrigeration structure (3) and the heat absorption end (31) are subjected to heat exchange, condensed water is formed on the heat absorption end (31), and the condensed water is transferred into the indoor air conditioner (1).
2. The outdoor unit of claim 1, wherein the semiconductor cooling structure (3) further comprises a heat absorbing member (40), and the heat absorbing member (40) is disposed on the heat absorbing end (31) such that air passing through the semiconductor cooling structure (3) exchanges heat with the heat absorbing member (40) to form condensed water on the heat absorbing member (40).
3. The outdoor unit of claim 2, wherein the heat absorbing member (40) comprises a plurality of first fins (41), and the plurality of first fins (41) are spaced apart from each other at the heat absorbing end (31).
4. The outdoor unit of claim 3, wherein each of the first fins (41) includes a first connection end and a second connection end which are oppositely disposed, the first connection end being connected to an end of the heat absorbing end (31) remote from the heat radiating end (32), and the second connection end extending toward an end remote from the heat radiating end (32); wherein a plurality of the first fins (41) are arranged in parallel.
5. The outdoor unit of claim 3, wherein a hydrophilic film is provided on a surface of each of the first fins (41).
6. The outdoor unit of claim 1, wherein the semiconductor cooling structure (3) further comprises a heat radiating member (50), and the heat radiating member (50) is disposed on the heat radiating end (32) so that air passing through the semiconductor cooling structure (3) is in contact with the heat radiating member (50).
7. The outdoor unit of claim 6, wherein the heat discharging unit (50) comprises a plurality of second fins (51), the plurality of second fins (51) being provided at the heat discharging end (32) to be spaced apart from each other; the plurality of second fins (51) are arranged in parallel, each second fin (51) comprises a third connecting end and a fourth connecting end which are arranged oppositely, the third connecting end is connected with one end, away from the heat absorption end (31), of the heat release end (32), and the fourth connecting end extends towards one end, away from the heat absorption end (31).
8. The outdoor unit of any one of claims 1 to 7, further comprising:
the water receiving tank (60) is arranged in the shell, and the water receiving tank (60) is communicated with the semiconductor refrigerating structure (3) so as to receive condensed water generated by the semiconductor refrigerating structure (3);
and one end of the liquid supply pipeline (70) is used for being connected with the water receiving tank (60), and the other end of the liquid supply pipeline (70) is used for being connected with a water supply tank (80) of the indoor air conditioner unit (1).
9. The outdoor unit of claim 8, further comprising:
and the water pump (90) is arranged in the shell, and the water pump (90) is arranged on the liquid supply pipeline (70) and is positioned between the water receiving tank (60) and the water supply tank (80).
10. Air conditioning system comprising an indoor air conditioning unit (1) and an outdoor air conditioning unit (2), the semiconductor refrigeration structure (3) of the outdoor air conditioning unit (2) producing condensed water for delivery to the indoor air conditioning unit (1), characterized in that it is an outdoor air conditioning unit according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911295527.0A CN111059644A (en) | 2019-12-16 | 2019-12-16 | Air condensing units and have its air conditioning system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911295527.0A CN111059644A (en) | 2019-12-16 | 2019-12-16 | Air condensing units and have its air conditioning system |
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| Publication Number | Publication Date |
|---|---|
| CN111059644A true CN111059644A (en) | 2020-04-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911295527.0A Pending CN111059644A (en) | 2019-12-16 | 2019-12-16 | Air condensing units and have its air conditioning system |
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| CN (1) | CN111059644A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113251848A (en) * | 2021-06-28 | 2021-08-13 | 王才兴 | Water-free cooling fin for indoor unit of air conditioner |
-
2019
- 2019-12-16 CN CN201911295527.0A patent/CN111059644A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113251848A (en) * | 2021-06-28 | 2021-08-13 | 王才兴 | Water-free cooling fin for indoor unit of air conditioner |
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