CN111055390A - Cooling and lubricating structure for cutting silicon wafer for solar cell slicing machine - Google Patents
Cooling and lubricating structure for cutting silicon wafer for solar cell slicing machine Download PDFInfo
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- CN111055390A CN111055390A CN201811209204.0A CN201811209204A CN111055390A CN 111055390 A CN111055390 A CN 111055390A CN 201811209204 A CN201811209204 A CN 201811209204A CN 111055390 A CN111055390 A CN 111055390A
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- 238000005520 cutting process Methods 0.000 title claims abstract description 82
- 238000001816 cooling Methods 0.000 title claims abstract description 77
- 230000001050 lubricating effect Effects 0.000 title claims abstract description 32
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 30
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 30
- 239000010703 silicon Substances 0.000 title claims abstract description 30
- 238000001802 infusion Methods 0.000 claims abstract description 46
- 239000013078 crystal Substances 0.000 claims abstract description 39
- 239000000110 cooling liquid Substances 0.000 claims abstract description 25
- 235000012431 wafers Nutrition 0.000 claims abstract description 18
- 230000007246 mechanism Effects 0.000 claims abstract description 9
- 239000007788 liquid Substances 0.000 claims description 9
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 2
- 210000004027 cell Anatomy 0.000 description 8
- 210000005056 cell body Anatomy 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000005461 lubrication Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002826 coolant Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 210000002421 cell wall Anatomy 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention discloses a cooling and lubricating structure for cutting silicon wafers for a solar cell slicer, which comprises a pair of main rollers and a plurality of cutting lines wound on the two main rollers and used for cutting the silicon wafers; a cooling and lubricating part is arranged above each main roller, and a crystal bar in contact with the cutting line is arranged between the two main rollers; a first groove body used for containing and collecting cooling liquid is arranged below the two main rollers, a second groove body used for placing crystal bars is arranged between the two main rollers, and the second groove body is positioned in an area surrounded by the cutting line; and an infusion mechanism is arranged between the first tank body and the second tank body and is used for conveying the cooling liquid in the first tank body into the second tank body. And a certain power is adopted, so that the cooling liquid is circulated all the time, the crystal bar is cooled from the front cutting surface and the side surface of the crystal bar, and the crystal bar descends along with the cutting process of the crystal bar to soak and arrange the crystal bar for cooling and arranging the crystal bar, and the cutting line is rapidly cooled and arranged in a large area.
Description
Technical Field
The invention relates to the field of solar cell slicers, in particular to a cooling and lubricating structure for a cut silicon wafer of a solar cell slicer.
Background
With the enlargement and rapid development of the photovoltaic industry, the yield of the cell in the photovoltaic industry in 2017 in China has reached 68 GW. The whole photovoltaic industry has higher and higher requirements on upgrading of equipment capacity. The multi-line cutting process is a commonly used slicing process in the industry, and the linear speed of the slicing equipment at the present stage is generally about 20 m/s. As the pressure of the cell slice ring section on improving the productivity is increased, the jet system is used as a cooling and lubricating part on the slicing equipment to determine the quality of the slice, the running speed of the cutting line and the cooling and lubricating of the cutting line, plays a key role and directly determines the quality of the slice.
Fig. 1 and 2 show a conventional jet cooling structure in which a ingot (3 ') made of silicon ingot is mounted on a susceptor (2') and is integrally placed in a pair of main rolls (1 '), a plurality of cutting lines (5') are wound around the pair of main rolls (1 '), a cooling and lubricating portion (4') is provided above each main roll (1 '), each cutting line (5') is lubricated, and a collecting tank (6 ') is provided below the ingot (3') to recover cooling liquid. Because the cooling liquid can only cool and lubricate the outlet and the inlet of the cutting line (5 ') in the cutting process, the cooling liquid cannot be brought into the crystal bar (3') in a large amount, the inside of the cutting line (5 ') or the crystal bar (3') cannot be lubricated and cooled, when the cutting resistance of the cutting line (5 ') is large, the requirement on the tension of the cutting line (5') is high, the requirement on the diameter of the cutting line (5 ') is high, the diameter of the cutting line (5') is large, the sheet yield of the same length is low (each line diameter is reduced by 10 mu m, each sheet can be saved by 0.5-0.6g), and the cost is increased. And the resistance is large in cutting, so that the wire breakage is easily caused, and the loss can be caused by the wire breakage.
With the continuous improvement of the sheet yield of the cutting, the thinning trend is shown (the current 60um line, the later 50um line and even the future 40um line). It is desirable that the resistance of the silicon ingot to the cutting line is as low as possible during the cutting process, so that the original cooling method cannot meet the requirements.
Disclosure of Invention
In order to overcome the defects, the invention aims to provide a cooling and lubricating structure for a cut silicon wafer for a solar cell slicer, which reduces the resistance of a silicon ingot to a cutting line in the cutting process.
In order to achieve the above purposes, the invention adopts the technical scheme that: a cooling and lubricating structure for cutting silicon wafers for a solar cell slicing machine comprises a pair of main rollers and a plurality of cutting lines which are wound on the two main rollers and used for cutting the silicon wafers; a cooling and lubricating part is arranged above each main roller, and a crystal bar in contact with the cutting line is arranged between the two main rollers; a first groove body used for containing and collecting cooling liquid is arranged below the two main rollers, a second groove body used for placing crystal bars is arranged between the two main rollers, and the second groove body is positioned in an area surrounded by the cutting line; and an infusion mechanism is arranged between the first tank body and the second tank body and is used for conveying the cooling liquid in the first tank body into the second tank body.
Can carry out cooling and lubrication to the crystal bar through the application of second cell body on the one hand, reduce the resistance of crystal bar to the cutting line, on the other hand collects the sweeps that the crystal bar cutting produced.
In order to prevent the cutting line from being damaged due to the contact with the cooling tank when the cutting line is cut, a buffer plate is arranged at the notch of the first tank body, is made of resin materials, is fixed on the cooling tank 6 through bolts, and is subjected to water leakage prevention treatment at the joint. The cutting line just can contact with the cooling bath after contacting with the buffer board earlier like this to effectively avoid the cutting line direct with the cooling bath contact, make it be difficult for the broken string and protect the cooling bath.
The second groove body comprises a bearing plate, the bearing plate and the main roller are in the same direction, two ends of the bearing plate extend outwards to the outside of the cutting line, two ends of the bearing plate are fixed on the first groove body through vertical plates, side plates are arranged on two sides of the bearing plate, and the side plates, the bearing plate and the vertical plates are encircled to form the second groove body. Above-mentioned riser and the cell wall integrated into one piece of first cell body improve holistic fastness.
Further, the infusion mechanism comprises a branch infusion tube arranged in the second groove body, one end of the branch infusion tube is communicated with one end of a main infusion tube outside the vertical plate, the other end of the main infusion tube is communicated with the second groove body, and a pump is arranged on the main infusion tube. And the cooling liquid in the first tank body is injected into the second tank body by a pump, so that the cooling and lubrication of the crystal bar are realized.
Furthermore, a main infusion tube is arranged on the outer side of each vertical plate, and corresponding branch infusion tubes are arranged on the bearing plate and are symmetrically distributed along the central line of the bearing plate. Two groups of infusion mechanisms are adopted, and the second tank body can be injected with liquid independently or simultaneously.
Furthermore, the number of the branch infusion tubes connected with the main infusion tube is three, and the branch infusion tubes are distributed on the left, the middle and the right of the bearing plate. The branch transfusion tubes distributed in the above way can be more uniform during the transfusion.
Furthermore, a cavity for placing the main infusion tube is arranged on the outer side surface of the vertical plate. The main infusion tube is placed in the cavity through the design, so that the main infusion tube is prevented from being exposed outside the vertical plate, and the overall attractiveness is improved.
Further, the cooling and lubricating portion comprises a cooling container, a liquid injection port is formed in the cooling container, a guide plate for guiding cooling liquid to the cutting line is arranged on the outer side of the cooling container, and the cooling liquid guided by the guide plate drops into the first groove body from the outer side of the second groove body. The cooling and lubricating part is separated from the second groove body, so that the position of cooling is enlarged, and the best cooling effect is obtained.
Compared with the prior art, the invention has the following advantages: and a certain power is adopted, so that the cooling liquid is circulated all the time, the crystal bar is cooled from the front cutting surface and the side surface of the crystal bar, and the crystal bar descends along with the cutting process of the crystal bar to soak and arrange the crystal bar for cooling and arranging the crystal bar, and the cutting line is rapidly cooled and arranged in a large area.
Drawings
FIG. 1 is a perspective view of a prior art jet cooling configuration;
FIG. 2 is a schematic liquid flow diagram of a prior art jet cooling configuration;
FIG. 3 is a perspective view of an embodiment of the present invention;
FIG. 4 is a side view of FIG. 3;
FIG. 5 is a schematic flow diagram of a liquid in accordance with an embodiment of the present invention;
fig. 6 is a perspective view of the cooling bath of fig. 3.
In the figure:
1-a main roll; 2-crystal support; 3-crystal bar; 4-cooling and lubricating part; 41-cooling the container; 42-liquid injection port; 43-a guide plate; 5-cutting line; 6-cooling the tank; 61-main infusion tube; 62-a first trough body; 63-vertical plate; 64-a carrier plate; 65-side plate; 66-branch transfusion tubes; 7-buffer plate.
Detailed Description
The following detailed description of the preferred embodiments of the present invention, taken in conjunction with the accompanying drawings, will make the advantages and features of the invention easier to understand by those skilled in the art, and thus will clearly and clearly define the scope of the invention.
Examples
Referring to fig. 3 to 6, the cooling and lubricating structure for cutting silicon wafers for a solar cell slicer in the embodiment includes a pair of main rollers 1, and a plurality of cutting lines 5 wound on the two main rollers 1 for cutting silicon wafers; a cooling and lubricating part 4 is arranged above each main roller 1, a crystal bar 3 in contact with a cutting line 5 is arranged between the two main rollers 1, and the crystal bar 3 is arranged on a crystal support 2. The above structure is the same as the prior art. The difference in this embodiment is:
two 1 below in the home roll is provided with the cooling tank 6 that is used for holding and collecting the coolant liquid, cooling tank 6 includes the first cell body 62 of below, the second cell body of top, and the second cell body is located two between the home roll, be used for supplying crystal bar 3 to place. As can be seen in fig. 4, the second groove is located in the area surrounded by the cutting line 5. An infusion mechanism is arranged between the first tank body 62 and the second tank body and is used for conveying the cooling liquid in the first tank body 62 into the second tank body.
In order to prevent the damage of the cutting line 5 caused by the contact of the cutting line 5 with the cooling tank 6 during cutting, a buffer plate 7 is disposed at the notch of the first tank body 62, the buffer plate 7 is made of resin material and fixed on the cooling tank 6 by bolts, and the joint is processed for preventing water leakage. Therefore, the cutting line 5 is firstly contacted with the buffer plate 7 and then contacted with the cooling groove 6, so that the direct contact of the cutting line 5 and the cooling groove 6 is effectively avoided, and the cutting line is not easy to break and protects the cooling groove. In order to cool the cutting wire over a larger area and to more effectively remove the scrap on the cutting wire, the inside of the buffer plate 7 is provided with a slope.
As can be seen from fig. 6, the second trough body includes a bearing plate 64, the bearing plate 64 is in the same direction as the main roller 1, and two ends of the bearing plate 64 extend outward to the outside of the cutting line 5, two ends of the bearing plate 64 are fixed on the first trough body 62 through a vertical plate 63, two sides of the bearing plate 64 are provided with side plates 65, and the side plates 65, the bearing plate 64, and the vertical plate 63 surround to form the second trough body. In this embodiment, the vertical plate 63 and the groove wall of the first groove 62 are integrally formed, so as to improve the overall firmness.
The infusion mechanism comprises a branch infusion tube 66 arranged in the second groove body, one end of the branch infusion tube 66 is communicated with one end of a main infusion tube 61 outside the vertical plate 63, the other end of the main infusion tube 61 is communicated with the second groove body, and a pump is arranged on the main infusion tube 61. And the cooling liquid in the first tank body 62 is injected into the second tank body by a pump to realize cooling and lubrication of the crystal bar.
As can be seen from fig. 6, a main infusion tube 61 is disposed outside each vertical plate 63, and corresponding branch infusion tubes 66 are disposed on the carrier plate 64 and symmetrically distributed about the center line of the carrier plate 64. The two groups of transfusion mechanisms can independently or simultaneously inject liquid into the second tank body. In the present embodiment, the number of the branch infusion tubes 66 connected to the main infusion tube 61 is three (66a, 66b, 66c), and the branch infusion tubes are distributed in three directions, i.e., left, middle, and right, of the carrier plate. The branch transfusion tubes distributed in the above way can be more uniform during the transfusion. A cavity for placing a main infusion tube is arranged on the outer side surface of the vertical plate 63. The main infusion tube 61 is placed in the cavity, so that the main infusion tube is prevented from being exposed outside the vertical plate, and the overall attractiveness is improved.
As can be seen from fig. 5, the cooling and lubricating portion 4 includes a cooling container 41, a liquid injection port 42 is provided on the cooling container 41, a guide plate 43 for guiding the cooling liquid to the cutting line is provided on the outer side of the cooling container 41, and the cooling liquid guided by the guide plate 43 drops into the first groove 62 from the outer side of the second groove. The cooling and lubricating part is separated from the second groove body, so that the position of cooling is enlarged, and the best cooling effect is obtained.
The cooling and lubricating structure provided in the embodiment keeps the original cooling, and meanwhile, the upper part of the cooling and lubricating structure adopts a cooling container, and the lower part of the cooling and lubricating structure adopts a cooling groove which is made of metal or nonmetal materials and used for storing cooling liquid. The coolant in the cooling container can perform cooling and lubricating treatment on the main roller and the cutting line adjacent to the main roller. The cooling liquid in the first groove body is injected into the second groove body through a pump in the cooling groove, the cutting ingot and the wire are cooled and lubricated, and meanwhile, the silicon ingot (crystal bar) outside the feed is cooled and lubricated by the lower part of the cooling groove, so that the best cooling effect is obtained. And (3) controlling the pump to automatically adjust the flow of the cooling liquid along with the descending of the silicon ingot (crystal bar) until the silicon ingot (crystal bar) is soaked in the cooling liquid and then the cutting is finished, thereby realizing perfect cutting.
According to the technical scheme, certain power is adopted, the cooling liquid is circulated all the time, the front side and the side surface of the silicon ingot (crystal bar) are cooled together, the silicon ingot (crystal bar) descends along with the cutting process, the silicon ingot (crystal bar) is immersed for cooling and cutting, and the cutting line is rapidly cooled and cut in a large area. The invention aims to reduce the resistance of a silicon ingot (crystal bar) to a cutting line in a cutting process, prepare for thinning and improve the number of slices output with the same length. The problem of difficult row of cutting in the conventional cutting, the cutting line is high with silicon ingot (crystal bar) temperature, is favorable to promoting the linear velocity (when the temperature is low, speed can promote relatively). The equipment has better cutting performance and higher cutting efficiency, and the cost is reduced.
The above embodiments are merely illustrative of the technical concept and features of the present invention, and the present invention is not limited thereto, and any equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of the present invention.
Claims (8)
1. A cooling and lubricating structure for cutting silicon wafers for a solar cell slicing machine comprises a pair of main rollers and a plurality of cutting lines which are wound on the two main rollers and used for cutting the silicon wafers; a cooling and lubricating part is arranged above each main roller, and a crystal bar in contact with the cutting line is arranged between the two main rollers; the method is characterized in that: a first groove body used for containing and collecting cooling liquid is arranged below the two main rollers, a second groove body used for placing crystal bars is arranged between the two main rollers, and the second groove body is positioned in an area surrounded by the cutting line; and an infusion mechanism is arranged between the first tank body and the second tank body and is used for conveying the cooling liquid in the first tank body into the second tank body.
2. The cooling and lubricating structure for the cut silicon wafer for the solar cell slicer according to claim 1, characterized in that: the second groove body comprises a bearing plate, the bearing plate and the main roller are in the same direction, and the two ends of the bearing plate extend outwards to the outside of the cutting line, the two ends of the bearing plate are fixed on the first groove body through vertical plates, side plates are arranged on the two sides of the bearing plate, and the side plates, the bearing plate and the vertical plates are surrounded to form the second groove body.
3. The cooling and lubricating structure for the cut silicon wafer for the solar cell slicer according to claim 2, characterized in that: the infusion mechanism comprises a branch infusion tube arranged in the second groove body, one end of the branch infusion tube is communicated with one end of a main infusion tube outside the vertical plate, the other end of the main infusion tube is communicated with the second groove body, and a pump is arranged on the main infusion tube.
4. The cooling and lubricating structure for the cut silicon wafer for the solar cell slicer according to claim 3, characterized in that: the outer side of each vertical plate is provided with a main infusion tube, and the bearing plate is provided with corresponding branch infusion tubes which are symmetrically distributed along the central line of the bearing plate.
5. The cooling and lubricating structure for the cut silicon wafer for the solar cell slicer according to claim 3 or 4, characterized in that: the number of the branch infusion tubes connected with the main infusion tube is three, and the branch infusion tubes are distributed on the left, the middle and the right of the bearing plate.
6. The cooling and lubricating structure for the cut silicon wafer for the solar cell slicer according to claim 5, characterized in that: and a cavity for placing a main infusion tube is arranged on the outer side surface of the vertical plate.
7. The cooling and lubricating structure for the cut silicon wafer for the solar cell slicer according to claim 5, characterized in that: the cooling and lubricating part comprises a cooling container, a liquid injection port is formed in the cooling container, a guide plate for guiding cooling liquid to the cutting line is arranged on the outer side of the cooling container, and the cooling liquid guided by the guide plate drips into the first groove body from the outer side of the second groove body.
8. The cooling and lubricating structure for the cut silicon wafer for the solar cell slicer according to claim 5, characterized in that: and a buffer plate is arranged at the notch of the first groove body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811209204.0A CN111055390A (en) | 2018-10-17 | 2018-10-17 | Cooling and lubricating structure for cutting silicon wafer for solar cell slicing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811209204.0A CN111055390A (en) | 2018-10-17 | 2018-10-17 | Cooling and lubricating structure for cutting silicon wafer for solar cell slicing machine |
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| CN111055390A true CN111055390A (en) | 2020-04-24 |
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| CN201811209204.0A Pending CN111055390A (en) | 2018-10-17 | 2018-10-17 | Cooling and lubricating structure for cutting silicon wafer for solar cell slicing machine |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111844488A (en) * | 2020-08-10 | 2020-10-30 | 无锡中环应用材料有限公司 | Cooling device and hollow bonding plate comprising same |
| CN116277560A (en) * | 2023-05-17 | 2023-06-23 | 浙江求是半导体设备有限公司 | Crystal bar cutting system and diamond wire service life detection method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102528955A (en) * | 2010-12-31 | 2012-07-04 | 微钻石线材设备有限公司 | Cutting cooling device of diamond wire |
| CN104552638A (en) * | 2015-01-15 | 2015-04-29 | 无锡隆基硅材料有限公司 | Automatic starting/stopping mechanism for cooling spray |
| US20160016243A1 (en) * | 2014-07-16 | 2016-01-21 | Korea Institute Of Energy Research | Silicon wafer slicing device using wire discharge machining |
| CN205167279U (en) * | 2015-12-02 | 2016-04-20 | 英利能源（中国）有限公司 | Silicon wafer cutting device |
| CN209649212U (en) * | 2018-10-17 | 2019-11-19 | 苏州捷得宝机电设备有限公司 | A kind of solar battery slicer cutting silicon wafer cooling and lubricating structure |
-
2018
- 2018-10-17 CN CN201811209204.0A patent/CN111055390A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102528955A (en) * | 2010-12-31 | 2012-07-04 | 微钻石线材设备有限公司 | Cutting cooling device of diamond wire |
| US20160016243A1 (en) * | 2014-07-16 | 2016-01-21 | Korea Institute Of Energy Research | Silicon wafer slicing device using wire discharge machining |
| CN104552638A (en) * | 2015-01-15 | 2015-04-29 | 无锡隆基硅材料有限公司 | Automatic starting/stopping mechanism for cooling spray |
| CN205167279U (en) * | 2015-12-02 | 2016-04-20 | 英利能源（中国）有限公司 | Silicon wafer cutting device |
| CN209649212U (en) * | 2018-10-17 | 2019-11-19 | 苏州捷得宝机电设备有限公司 | A kind of solar battery slicer cutting silicon wafer cooling and lubricating structure |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111844488A (en) * | 2020-08-10 | 2020-10-30 | 无锡中环应用材料有限公司 | Cooling device and hollow bonding plate comprising same |
| CN116277560A (en) * | 2023-05-17 | 2023-06-23 | 浙江求是半导体设备有限公司 | Crystal bar cutting system and diamond wire service life detection method |
| CN116277560B (en) * | 2023-05-17 | 2023-08-11 | 浙江求是半导体设备有限公司 | Crystal bar cutting system and diamond wire service life detection method |
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