CN111050481A - PCB (printed circuit board) tombstone effect printing method - Google Patents

PCB (printed circuit board) tombstone effect printing method Download PDF

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Publication number
CN111050481A
CN111050481A CN201911415813.6A CN201911415813A CN111050481A CN 111050481 A CN111050481 A CN 111050481A CN 201911415813 A CN201911415813 A CN 201911415813A CN 111050481 A CN111050481 A CN 111050481A
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size
pcb
information
correcting
printing method
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CN201911415813.6A
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CN111050481B (en
Inventor
阳洋
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Chongqing Jinyu Electronics Co ltd
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Chongqing Kaige Electronics Co ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0008Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007Surface contacts, e.g. bumps

Abstract

The invention relates to the technical field of PCB production processes, and provides a PCB tombstone effect printing method for solving the problem of time consumption caused by manually adjusting the size of a window in a design layout in the existing PCB manufacturing process, which comprises the following steps: an obtaining step, obtaining a PCB design layout; identifying, namely identifying the position and the design size of a window in a design layout; the obtaining step is also used for obtaining the set size of the windowing; correcting, namely correcting the design size according to the acquired set size; and printing, namely printing the copper-clad plate according to the corrected design layout. The invention ensures that the printed PCB finished product has higher quality and higher qualification rate.

Description

PCB (printed circuit board) tombstone effect printing method
Technical Field
The invention relates to the technical field of PCB (printed circuit board) production processes, in particular to a PCB tombstone effect printing method.
Background
A PCB refers to a printed circuit board, and a conductive pattern formed by making a printed circuit, a printed component, or a combination of both on an insulating material according to a predetermined design is generally called a printed circuit. And a conductive pattern on the insulating substrate that provides electrical connection between the components is called a printed wiring. The finished board of the printed circuit or printed circuit is also referred to as a printed circuit board, also known as a printed circuit board or printed circuit board. The design of the device is mainly a layout design and needs various factors such as internal electronic elements, metal connecting lines, the layout of through holes and external connection, electromagnetic protection, heat dissipation, crosstalk and the like. With the development of electronic technology, electronic products require components with smaller size, faster speed and stronger functions, which makes the existing PCB board have a plurality of positions for soldering components, i.e. pads.
At present, for the pad design of a PCB, the traditional manufacturing mode is to directly adopt a resistance welding windowing design on the pad of a circuit board to expose the pad. In a conventional design, a solder mask window is designed in the same size, so that copper leaks at a connecting part of a pad and a connection, meanwhile, the welding area of the pad on a copper sheet after the solder mask window is welded is enlarged, and the manufactured pad has a certain trailing phenomenon, namely a tombstone effect, so that when an element is welded on a PCB (printed circuit board), the displacement of solder paste causes the offset of the element, and meanwhile, a false solder is easily formed, so that a short circuit is easily caused; the problems that welding contact surfaces are uneven in the mounting process of a multi-pin device, poor welding is caused, a plate cannot be used, the defective product rate is increased and the like are solved. Therefore, in order to improve the quality of the manufactured PCB, it is necessary to manually reduce and optimize the solder pads when designing the solder pads. However, because the number of the pads on the PCB is large and the shape and size of the pads used for soldering different components are different, the manual optimization in the pad design process is heavy, takes a long time, and even missing pads may occur. Therefore, in order to improve the quality of the finished PCB, the existing PCB production process needs to be optimized.
Disclosure of Invention
The invention aims to provide a printing method for the tombstone effect of a PCB (printed circuit board), which aims to solve the problem of long time consumption caused by manually adjusting the size of a window in a design layout in the existing PCB manufacturing process.
The basic scheme provided by the invention is as follows: the PCB tombstone effect printing method comprises the following steps:
an obtaining step, obtaining a PCB design layout;
identifying, namely identifying the position and the design size of a window in a design layout;
the obtaining step is also used for obtaining the set size of the windowing;
correcting, namely correcting the design size according to the acquired set size;
and printing, namely printing the copper-clad plate according to the corrected design layout.
The basic scheme has the working principle and the beneficial effects that: compared with the existing PCB printing mode, in the scheme, before printing, through the matching of the recognition step and the correction step, the automatic adjustment of the size of the window in the design layout is realized, the current manual adjustment mode is replaced, the working efficiency is improved, and the precision of the mode adjustment adopting the automatic correction is more accurate, so that the quality of the printed PCB finished product is higher, and the qualification rate is higher.
The first preferred scheme is as follows: preferably, the method further comprises a storage step of storing the acquired windowing set size as a windowing preset size; the acquiring step is also used for acquiring selection information, and the correcting step is used for selecting a corresponding windowing preset size according to the selection information to correct the windowing design size. Has the advantages that: in view of the fact that the corresponding windowing sizes of the same elements are the same, in the scheme, after the windowing preset size is stored, when the windowing with the same size needs to be corrected next time, the stored windowing preset size can be selected through the selection information without resetting the windowing size.
The preferred scheme II is as follows: preferably, the obtaining step is further configured to obtain a package type, and the correcting step corrects the windowing design size according to the windowing preset size and the package type. Has the advantages that: considering that the packaging modes are different, the sizes of the required welding discs are different, therefore, the packaging type is obtained in the scheme, the windowing size is adjusted according to the packaging type during correction, and the accuracy of the size of the manufactured PCB welding disc is improved.
The preferable scheme is three: preferably, the acquiring step is further configured to acquire a correction range, and the correcting step corrects the windowing within the correction range. Has the advantages that: in this scheme, through setting up the correction scope, when correcting, correct all windowing in the correction scope of selecting, need not the corresponding windowing of one-by-one selection and correct convenient operation.
The preferable scheme is four: preferably, as a first preferred embodiment, the method further comprises a comparison step, after the set size is obtained, the identification step is further used for comparing the obtained set size with a preset size;
a warning step, if the set size is not consistent with the preset size, sending a warning prompt; the acquiring step is also used for acquiring feedback information, the identifying step identifies the feedback information, and if the feedback information is identified as positive information, the correcting step is used for correcting according to the acquired set size; and if the information is identified as negative information, the correction step is used for correcting according to the compared preset size. Has the advantages that: considering that the set size may be wrong, in this scheme, the set size is compared with the preset size already stored by using the comparison step, if the set storage is different from the preset size, there are two situations, one is that an error occurs when an operator inputs the set size, and the other is that the set size input this time is a new size, at this time, a warning message is sent to remind the operator to recheck the set size, after the rechecking is completed, the operator sends feedback information, if the feedback information is identified as positive information, the set size is correct, the correction step is used for correcting according to the set size, if the feedback information is identified as negative information, the set size is wrong, at this time, the correction step is used for correcting according to the preset size compared, thereby ensuring the accuracy of the window size after correction.
The preferable scheme is five: preferably, in the fourth aspect, after recognizing that the feedback information is positive information, the storing step further stores the acquired set size of the current time as a new preset size. Has the advantages that: if the feedback information is identified as positive information, the set size of the time is correct, so that the set size of the time is stored as a new preset size in the scheme, and the next selection is facilitated.
The preferable scheme is six: preferably, in the storing step, the corrected design layout is stored. Has the advantages that: considering that the same PCB is sometimes required to be produced at intervals, the storage step is also used for storing the corrected design layout, so that the call is convenient to be carried out when the same PCB is produced later.
The preferable scheme is seven: preferably, in the storing step, custom information is generated for the stored preset size, and the custom information and the preset size are stored in association when the custom information is stored. Has the advantages that: in the scheme, the self-defined information of production and the preset size are stored in a correlated mode when the preset size is stored, and the selection of the preset storage is facilitated.
The preferable scheme is eight: preferably, the basic scheme further comprises a modification step, the acquisition step further acquires modification information, and the modification step is used for modifying the design layout according to the modification information. Has the advantages that: according to the scheme, the design layout is modified by utilizing the modification information, and the design layout is convenient to finely adjust.
The preferable scheme is nine: preferably, in the step of storing, the original design layout and the corrected design layout are stored in a correlated manner. Has the advantages that: in the scheme, the original design layout and the corrected design layout are also stored in an associated mode, and the original design layout is convenient to query.
Drawings
FIG. 1 is a block diagram of a process of a first embodiment of a PCB tombstone effect printing method according to the present invention;
fig. 2 is a schematic view of a window interface for setting a size according to an embodiment.
Detailed Description
The following is further detailed by way of specific embodiments:
example one
Substantially as shown in figure 1: the PCB tombstone effect printing method comprises the following steps:
an obtaining step, obtaining a PCB design layout;
identifying, namely identifying the position and the design size of a window in a design layout;
the obtaining step is also used for obtaining the set size, the packaging type and the correction range of the windowing; modification information is also acquired;
correcting, namely correcting the design size of the window in the correction range according to the acquired set size and the packaging type;
printing, namely printing the copper-clad plate according to the corrected design layout;
a storage step, wherein the acquired windowing set size is stored as a windowing preset size, and the corrected design layout and the original design layout are stored in an associated manner; self-defining information is generated for the stored preset size, and the self-defining information and the preset size are stored in a correlated mode during storage;
the acquiring step is also used for acquiring selection information, and the correcting step is used for selecting a corresponding windowing preset size according to the selection information to correct the windowing design size;
and modifying, namely modifying the design layout according to the modification information.
Based on the printing method, the embodiment also discloses a printing system. The method comprises the following steps:
the acquisition module is used for acquiring a PCB design layout;
the identification module is used for identifying the position and the design size of the opening window in the acquired design layout;
the acquisition module is also used for acquiring the set size, the packaging type and the correction range of the windowing; modification information is also acquired;
the correcting module is used for correcting the windowing design size in the correcting range according to the acquired set size and the packaging type;
the printing module is used for printing the copper-clad plate according to the corrected design layout;
the storage module is used for storing the acquired windowing set size as a windowing preset size and also storing the corrected design layout and the original design layout in an associated manner; self-defining information is generated for the stored preset size, and the self-defining information and the preset size are stored in a correlated mode during storage;
the acquisition module is also used for acquiring selection information, and the correction module is used for selecting a corresponding windowing preset size according to the selection information to correct the windowing design size;
and the modification module modifies the design layout according to the modification information.
The specific implementation process is as follows: the printing method in the embodiment is used in the production process of the PCB. Before the film step, typesetting is required, and the method is applied to the typesetting process.
After receiving a design layout of the PCB, the identification module identifies the position and the design size of a window in the equipment layout; the obtaining module obtains the set size, the packaging type and the correction range of the window, as shown in fig. 2.
Then correcting the windowing design size in the correction range according to the acquired set size and the packaging type; and after the correction is finished, the printing module prints the copper-clad plate according to the corrected design layout to finish the printing process.
Example two
The difference from the first embodiment is that the method further includes a comparison step, and after the set size is obtained, the identification step is further used for comparing the obtained set size with a preset size;
a warning step, if the set size is not consistent with the preset size, sending a warning prompt; the acquiring step is also used for acquiring feedback information, the identifying step identifies the feedback information, and if the feedback information is identified as positive information, the correcting step is used for correcting according to the acquired set size; if the information is identified as negative information, the correction step is used for correcting according to the compared preset size;
the storing step further stores the acquired set size of the time as a new preset size after recognizing that the feedback information is positive information.
Considering that the set size may be wrong, in this scheme, the set size is compared with the preset size already stored by using the comparison step, if the set storage is different from the preset size, there are two situations, one is that an error occurs when an operator inputs the set size, and the other is that the set size input this time is a new size, at this time, a warning message is sent to remind the operator to recheck the set size, after the rechecking is completed, the operator sends feedback information, if the feedback information is identified as positive information, the set size is correct, the correction step is used for correcting according to the set size, if the feedback information is identified as negative information, the set size is wrong, at this time, the correction step is used for correcting according to the preset size compared, thereby ensuring the accuracy of the window size after correction.
The foregoing is merely an example of the present invention, and common general knowledge in the field of known specific structures and characteristics is not described herein in any greater extent than that known in the art at the filing date or prior to the priority date of the application, so that those skilled in the art can now appreciate that all of the above-described techniques in this field and have the ability to apply routine experimentation before this date can be combined with one or more of the present teachings to complete and implement the present invention, and that certain typical known structures or known methods do not pose any impediments to the implementation of the present invention by those skilled in the art. It should be noted that, for those skilled in the art, without departing from the structure of the present invention, several changes and modifications can be made, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation of the present invention and the practicability of the patent. The scope of the claims of the present application shall be determined by the contents of the claims, and the description of the embodiments and the like in the specification shall be used to explain the contents of the claims.

Claims (10)

  1. The printing method of the tombstone effect of the PCB is characterized by comprising the following steps: the method comprises the following steps:
    an obtaining step, obtaining a PCB design layout;
    identifying, namely identifying the position and the design size of a window in the design layout;
    the obtaining step is also used for obtaining the set size of the windowing;
    correcting, namely correcting the design size according to the acquired set size;
    and printing, namely printing the copper-clad plate according to the corrected design layout.
  2. 2. The PCB gravestone effect printing method of claim 1, wherein: the method also comprises a storage step, wherein the acquired set size is stored as a preset size;
    the obtaining step is also used for obtaining the selection information, and the correcting step is used for selecting the corresponding preset size according to the selection information to correct the design size.
  3. 3. The PCB gravestone effect printing method of claim 1, wherein: the obtaining step is also used for obtaining the packaging type, and the correcting step corrects the design size according to the preset size and the packaging type.
  4. 4. The PCB gravestone effect printing method of claim 1, wherein: in the acquiring step, the window opening correction method is further used for acquiring a correction range, and in the correcting step, the window opening in the correction range is corrected.
  5. 5. The PCB gravestone effect printing method of claim 2, wherein: the method further comprises a comparison step, wherein after the set size is obtained, the identification is also used for comparing the obtained set size with the preset size;
    a warning step, wherein if the set size is not consistent with the preset size, the warning step sends a warning prompt; the acquiring step is also used for acquiring feedback information, the identifying step identifies the feedback information, and if the feedback information is identified as positive information, the correcting step is used for correcting according to the acquired set size; and if the information is identified as negative information, the correction step is used for correcting according to the compared preset size.
  6. 6. The PCB plate tombstone effect printing method of claim 5, wherein: after the feedback information is identified as positive information, the storing step further stores the acquired set size of the time as a new preset size.
  7. 7. The PCB gravestone effect printing method of claim 1, wherein: and in the storage step, the corrected design layout is stored.
  8. 8. The PCB gravestone effect printing method of claim 2, wherein: in the storage step, custom information is generated for the stored preset size, and the custom information and the preset size are stored in a correlation mode during storage.
  9. 9. The PCB gravestone effect printing method of claim 1, wherein: the method also comprises a modification step, wherein the acquisition step also acquires modification information, and the modification step is used for modifying the design layout according to the modification information.
  10. 10. The PCB gravestone effect printing method of claim 1, wherein: in the storage step, the original design layout and the corrected design layout are stored in an associated mode.
CN201911415813.6A 2019-12-31 2019-12-31 PCB (printed circuit board) tombstone effect printing method Active CN111050481B (en)

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CN111050481B CN111050481B (en) 2021-05-28

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1487472A (en) * 2002-08-06 2004-04-07 欧姆龙株式会社 Method for checking data production and substrate checking apparatus by the same method
CN101318399A (en) * 2005-09-30 2008-12-10 株式会社日立工业设备技术 Screen printing equipment and printing system having the same
JP2012112779A (en) * 2010-11-24 2012-06-14 Yamaha Motor Co Ltd Measurement device of screen mask and printing device
CN104904332A (en) * 2012-12-25 2015-09-09 松下知识产权经营株式会社 Electronic component mounting system and electronic component mounting method
CN109451663A (en) * 2018-10-16 2019-03-08 上海望友信息科技有限公司 The parameters analysis method and analysis system connect applied to Through-hole reflow

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1487472A (en) * 2002-08-06 2004-04-07 欧姆龙株式会社 Method for checking data production and substrate checking apparatus by the same method
CN101318399A (en) * 2005-09-30 2008-12-10 株式会社日立工业设备技术 Screen printing equipment and printing system having the same
JP2012112779A (en) * 2010-11-24 2012-06-14 Yamaha Motor Co Ltd Measurement device of screen mask and printing device
CN104904332A (en) * 2012-12-25 2015-09-09 松下知识产权经营株式会社 Electronic component mounting system and electronic component mounting method
CN109451663A (en) * 2018-10-16 2019-03-08 上海望友信息科技有限公司 The parameters analysis method and analysis system connect applied to Through-hole reflow

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Address after: 402460 no.11-18, east section of Changzhou Avenue, Rongchang District, Chongqing

Patentee after: Chongqing Jinyu Electronics Co.,Ltd.

Address before: 402460 no.11-18, east section of Changzhou Avenue, Rongchang District, Chongqing

Patentee before: CHONGQING KAIGE ELECTRONICS Co.,Ltd.

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