CN111048934A - Airflow sensor - Google Patents

Abstract

The invention provides an airflow sensor which comprises a packaging structure formed by a shell with an opening at one end and a PCB (printed Circuit Board), wherein the bottom wall of the shell is provided with an air suction hole communicated with the interior of the packaging structure; a vibrating diaphragm is arranged above the polar plate and is electrically connected with the PCB through an electric connector inside the packaging structure; be provided with the terminal hole on the PCB board be provided with the PCB rivet on the terminal hole to the PCB rivet replaces the contact pin to carry out signal output as airflow sensor's terminal, saves complicated contact pin process, effectively prevents that contact pin and terminal hole cooperation from easily becoming flexible to lead to falling the needle, the crooked bad scheduling problem of needle, makes things convenient for customer PCBA welding simultaneously.

Description

Airflow sensor

Technical Field

The invention relates to the technical field of acoustoelectric technology, in particular to an airflow sensor, and particularly relates to a novel airflow sensor.

Background

Along with the gradual improvement of living standard, the attention degree of people to health is also improved, a large amount of harmful substances are generated in the combustion process of the traditional combustible cigarette, and serious harm is generated to the health of human beings, so related tobacco enterprises expect to seek a substance capable of replacing the traditional tobacco. Electronic cigarettes for replacing combustible cigarettes have appeared, and have been widely used in the market because they have similar appearance and taste to conventional cigarettes, but do not contain harmful components such as tar.

The electron cigarette is provided with the integrated work of a plurality of units, and is required very high to control, and when smoking the electron cigarette, the smoking personage is through breathing in to produce the air current in the electron cigarette, the sensor in the electron cigarette senses the air current and passes through, and give the control unit with signal transmission, the resistance heater heating in the control unit control atomizer atomizes to the tobacco juice. The airflow sensor is widely applied to the electronic cigarette due to the characteristics of small volume, simple structure, good performance and low price, and the airflow sensor is used as an important sensor element in the electronic cigarette, so that the performance stability and reliability are particularly important.

Fig. 1 illustrates a terminal in a conventional airflow sensor structure, in which the terminal is a pin, the pin is used as the terminal, the pin process is complicated, and the pin is easily loosened in cooperation with a terminal hole, thereby causing the problems of pin falling and pin skewing.

In order to solve the above problems, a new airflow sensor design is needed.

Disclosure of Invention

In view of the above problems, an object of the present invention is to provide a new airflow sensor, so as to solve the problems that the conventional airflow sensor structure has complicated pin process because the terminal is a pin and the pin is a terminal, and the pin and the terminal hole are easily loosened to cause pin falling and pin deflection.

The invention provides an airflow sensor, which comprises an encapsulation structure formed by a shell with an opening at one end and a PCB (printed Circuit Board), wherein the bottom wall of the shell is provided with an air suction hole communicated with the interior of the encapsulation structure, the PCB is provided with an air inlet communicated with the interior of the encapsulation structure, and the air inlet is communicated with the interior of the encapsulation structure,

a polar plate is arranged in the packaging structure;

a vibrating diaphragm is arranged above the polar plate and is electrically connected with the PCB through an electric connector inside the packaging structure;

the PCB board is provided with a terminal hole, and the terminal hole is provided with a PCB rivet.

Preferably, the PCB rivet is T-shaped.

Preferably, the PCB rivet penetrates the terminal hole and is in hard contact with the PCB board 2.

Preferably, a through hole is provided on the pole plate.

Preferably, the electrical connection is a vibrating ring.

Preferably, an annular gasket is disposed between the polar plate and the diaphragm.

Preferably, an air gap structure is formed between the polar plate and the diaphragm.

Preferably, the packaging structure further comprises an isolation ring arranged inside the packaging structure; wherein the content of the first and second substances,

the isolation ring is arranged around the diaphragm and the electric connecting piece.

Preferably, the method further comprises the following steps: and the electronic component is fixedly arranged on the PCB.

Preferably, a dust screen covering the air suction hole is disposed on an outer side surface of a bottom wall of the housing.

According to the technical scheme, the PCB rivet is used for replacing the contact pin to serve as the terminal of the airflow sensor to output signals, so that the complex contact pin process is omitted, the problems of pin falling, poor pin deflection and the like caused by the fact that the contact pin is easily loosened in cooperation with the terminal hole are effectively solved, and meanwhile, PCBA welding of customers is facilitated.

Drawings

Other objects and results of the present invention will become more apparent and more readily appreciated as the same becomes better understood by reference to the following specification taken in conjunction with the accompanying drawings. In the drawings:

FIG. 1 is a schematic structural diagram of a contact pin in a conventional airflow sensor;

FIG. 2 is a schematic cross-sectional view of an airflow sensor according to an embodiment of the invention;

FIG. 3A is a top view of an airflow sensor according to an embodiment of the invention;

fig. 3B is a schematic structural diagram of a PCB rivet in an airflow sensor according to an embodiment of the invention.

Wherein the reference numerals include: 1. the PCB comprises a shell, 2, a PCB board, 3, an isolating ring, 4, an air suction hole, 5, a terminal, 6, a polar plate, 7, a vibrating diaphragm, 8, an electric connecting piece, 9, a gasket, 10 and a dust screen.

Detailed Description

Among the current airflow sensor to the contact pin is as the terminal, and the contact pin process is complicated, and the contact pin is not hard up with the terminal hole cooperation on the PCB board easily to lead to falling the needle, the crooked bad problem of needle.

In view of the above problems, the present invention provides an airflow sensor, and the following detailed description will be made of specific embodiments of the present invention with reference to the accompanying drawings.

For the purpose of illustrating the airflow sensor provided by the present invention, fig. 2, 3A and 3B respectively show the structure of the airflow sensor according to the embodiment of the present invention in different views. Specifically, fig. 2 shows a cross-sectional structure of an airflow sensor according to an embodiment of the present invention; FIG. 3A shows a top view of an airflow sensor according to an embodiment of the invention; FIG. 3B shows a PCB rivet schematic in accordance with an embodiment of the present invention.

The following description of the exemplary embodiment(s) is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. Techniques and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail, but are intended to be considered a part of the specification where appropriate.

As shown in fig. 2, the airflow sensor provided by the present invention includes a package structure formed by a housing 1 with an opening at one end and a PCB 2, wherein a suction hole 4 communicated with the interior of the package structure is formed on the bottom wall of the housing 1, and an air inlet hole (not shown) communicated with the interior of the package structure is formed on the PCB 2; the PCB packaging structure comprises a packaging structure and is characterized in that a polar plate 6 is arranged in the packaging structure, a vibrating diaphragm 7 is arranged above the polar plate 6, the vibrating diaphragm 7 is electrically connected with a PCB 2 through an electric connector 8 in the packaging structure, a terminal hole is formed in the PCB 2, a PCB rivet is arranged on the terminal hole, and the PCB rivet is directly riveted on the PCB 2 to replace the traditional pin printing solder paste and over-high temperature reflow soldering for welding; the PCB rivet is T-shaped, and is hammered into hard contact with the PCB 2 after being inserted into a terminal hole in the PCB 2, so that the riveting process is completed; the material of the PCB rivet is not limited herein, and may be plated metal. Replace the contact pin as airflow sensor's terminal 5 with the PCB rivet and carry out signal output, save complicated contact pin process, effectively prevent that the terminal hole cooperation on contact pin and the PCB board 2 is easily not hard up to lead to falling the needle, the crooked bad scheduling problem of needle, make things convenient for customer PCBA welding simultaneously.

In the embodiment shown in fig. 2, a pad 9 is disposed between the pole plate 6 and the diaphragm 7, the pad 9 is in a ring shape, and the electrical connection member 8 is a device for electrically connecting the diaphragm 7 and the PCB board 2, and may be a vibrating ring.

In the embodiment shown in fig. 2, an air gap structure is formed between the polar plate 6 and the diaphragm 7, a through hole 12 is formed in the polar plate 6, a gap 11 exists between the polar plate 2 and the housing, and the through hole in the polar plate 6 and the air inlet hole in the PCB 2 enable air pressures on both sides of the diaphragm 7 to be consistent and the diaphragm 7 to be balanced.

In the embodiment shown in fig. 2, the sensor further comprises an isolation ring 3 arranged inside the encapsulation structure; the isolation ring 3 surrounds the vibrating diaphragm 7 and the electric connecting piece 8, the isolation ring 3 is located between the vibrating diaphragm 7 and the electric connecting piece 8 and the side wall of the shell 1, the isolation ring 3 is not limited in material and can be annular in plastic, the isolation ring 3 enables the position of the vibrating diaphragm to be fixed, and the vibrating diaphragm 7 and the electric connecting piece 8 are prevented from being in contact with the shell to cause short circuit.

In addition, in the embodiment shown in fig. 2, the airflow sensor is further provided with electronic components located inside the package structure and configured on the PCB board 2, and the electronic components 7 may include electronic components such as an ASCI chip, but are not limited to an ASCI chip.

In addition, in the embodiment shown in fig. 2, a dust screen 10 covering the air intake holes 4 is provided on the outer surface of the bottom wall of the housing. The dust screen 10 is located on the surface of the outer side of the bottom wall of the shell 1, and the dust screen 10 can be fixedly bonded with the shell 1 through colloid. The dust-proof net 10 is preferably sized to cover all the air suction holes 4, so as to prevent impurities such as dust from entering the interior of the sensor package structure through the air suction holes and affecting the normal operation of the sensor.

As shown in fig. 2, fig. 3A and fig. 3B, in the airflow sensor provided by the present invention, three PCB rivets are used as terminals 5 instead of conventional pins, the PCB rivets penetrate through the whole PCB 2 from the inner side of the PCB, and are fixed on terminal holes on the PCB 2, and the PCB rivets are used as terminals 5 of the airflow sensor instead of pins for signal output, so that a complicated pin inserting process is omitted, problems of pin dropping, poor pin deflection and the like caused by the fact that the pins are easily loosened when the pins are matched with the terminal holes are effectively prevented, and meanwhile, subsequent PCBA welding is facilitated.

In the embodiment of the invention shown in fig. 2, fig. 3A and fig. 3B, the terminal 5 is used for polarity extraction, so as to be conveniently connected with a motherboard circuit, when air is sucked from the air suction hole 4, the vibration of the vibrating diaphragm 7 causes the air gap distance between the vibrating diaphragm 7 and the polar plate 6 to change by utilizing the matching between the air suction hole 4 and the air inlet hole, so that the capacitance value of the parallel plate capacitor formed by the polar plate 6 and the vibrating diaphragm 7 changes, and when the preset threshold value is reached, the sensor is triggered to start to work, so as to perform a series of actions.

According to the airflow sensor, the PCB rivet is used for replacing the contact pin to serve as the terminal of the airflow sensor to output signals, complex contact pin procedures such as solder paste printing, welding through high-temperature reflow soldering and the like are omitted, the problems of pin falling, poor pin deflection and the like caused by the fact that the contact pin is easily loosened when being matched with the terminal hole are effectively solved, and meanwhile, the PCBA welding of a client is facilitated.

The air flow sensor proposed according to the present invention is described above by way of example with reference to the accompanying drawings. However, it will be appreciated by those skilled in the art that various modifications may be made to the airflow sensor set forth above without departing from the spirit of the invention. Therefore, the scope of the present invention should be determined by the contents of the appended claims.

Claims (10)

1. An airflow sensor comprises a packaging structure formed by a shell with an opening at one end and a PCB, wherein the bottom wall of the shell is provided with an air suction hole communicated with the inside of the packaging structure, the PCB is provided with an air inlet hole communicated with the inside of the packaging structure, and the airflow sensor is characterized in that,

a polar plate is arranged in the packaging structure;

a vibrating diaphragm is arranged above the polar plate and is electrically connected with the PCB through an electric connector inside the packaging structure;

the PCB board is provided with a terminal hole, and the terminal hole is provided with a PCB rivet.

2. The airflow sensor of claim 1,

the PCB rivet is T-shaped.

3. The airflow sensor of claim 1,

the PCB rivet penetrates the terminal hole and is in hard contact with the PCB panel 2.

4. The airflow sensor of claim 1,

and the polar plate is provided with a through hole.

5. The airflow sensor of claim 1,

the electric connecting piece is a vibration ring.

6. The airflow sensor of claim 1,

an annular gasket is arranged between the polar plate and the vibrating diaphragm.

7. The airflow sensor of claim 1,

an air gap structure is formed between the polar plate and the vibrating diaphragm.

8. The airflow sensor of claim 1 further comprising a spacer ring disposed inside the encapsulation structure; wherein the content of the first and second substances,

the isolation ring is arranged around the diaphragm and the electric connecting piece.

9. The airflow sensor of claim 1 further comprising:

and the electronic component is fixedly arranged on the PCB.

10. The airflow sensor of claim 1,

and a dust screen covering the air suction holes is arranged on the outer side surface of the bottom wall of the shell.

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