CN209214685U - A kind of gas flow transducer - Google Patents
A kind of gas flow transducer Download PDFInfo
- Publication number
- CN209214685U CN209214685U CN201822121392.3U CN201822121392U CN209214685U CN 209214685 U CN209214685 U CN 209214685U CN 201822121392 U CN201822121392 U CN 201822121392U CN 209214685 U CN209214685 U CN 209214685U
- Authority
- CN
- China
- Prior art keywords
- gas flow
- wafer body
- flow transducer
- wiring board
- asic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000000034 method Methods 0.000 claims abstract description 10
- 239000010410 layer Substances 0.000 claims description 13
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 10
- 150000001875 compounds Chemical class 0.000 claims description 9
- 239000011241 protective layer Substances 0.000 claims description 9
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 241000218202 Coptis Species 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 244000247747 Coptis groenlandica Species 0.000 description 8
- 239000003571 electronic cigarette Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 238000005493 welding type Methods 0.000 description 4
- 241000208125 Nicotiana Species 0.000 description 3
- 235000002637 Nicotiana tabacum Nutrition 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 235000019504 cigarettes Nutrition 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 239000000779 smoke Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 235000011389 fruit/vegetable juice Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Measuring Volume Flow (AREA)
Abstract
The utility model discloses a kind of gas flow transducer, is related to sensor technical field, and the gas flow transducer includes wiring board and in conjunction with the wafer body being fixed on the wiring board；The surface of the wafer body includes ASIC line layer, and the ASIC line layer is to process to be formed directly on the wafer body；The wafer body is formed between the wiring board by way of wire bonding to be electrically connected.This has new structural gas flow transducer, and overall dimensions are small, and manufacture craft is simple, and processing cost is low.
Description
Technical field
The utility model relates to sensor technical fields.More particularly, to a kind of gas flow transducer.
Background technique
With being gradually increased for living standard, people also increase accordingly the attention degree of health, it is traditional can burning smoke exist
A large amount of harmful substance is generated in combustion process, serious harm is generated to the health of the mankind, therefore related tobacco enterprise expectation is sought
Seek a kind of substance that can substitute traditional tobacco.Then there is the electronic cigarette for substituting combustible cigarette, since it has and biography
Appearance and mouthfeel similar in system cigarette, but do not include the harmful components such as tar, therefore extensive use has been commercially available.
Electronic cigarette includes that multiple units integrate work, very high to control requirement, and when sucking electronic cigarette, smoke personage
By air-breathing, and air-flow is generated in electronic cigarette, the sensor sensing in electronic cigarette passes through to air-flow, and transmits a signal to control
Unit processed, control unit control the resistance heated filament heating in atomizer and are atomized to tobacco juice.
Gas flow transducer, also referred to as microphone are mainly used in examining air-flow in the device of the air-flows such as electronic cigarette variation
It surveys.The working principle of gas flow transducer: forming plane-parallel capacitor by pole plate, gasket and vibrating diaphragm, from from acoustic aperture when air-breathing, puts down
The capacitance of parallel plate capacitor becomes larger, and when capacitance reaches given threshold, can trigger ASIC and close the switch, and ASIC starts to work,
Carry out a series of actions.
Existing gas flow transducer causes since its dedicated ASIC uses the packing forms of SOT23-5 or SOT23-6
The size of ASIC is very big, and the size of the overall package structure of such gas flow transducer is just very big, generallys use φ 6.0*
The form of 2.5mm is not able to satisfy electronic product micromation, lightening design requirement.In addition, the output of existing gas flow transducer
Connection type generallys use wire welding type or contact pin type, production or using when require to occupy a large amount of manpower.
Accordingly, it is desirable to provide a kind of have new structural gas flow transducer.
Utility model content
The purpose of this utility model is that being to provide one kind has new structural gas flow transducer, the gas flow transducer
Overall dimensions are small, and manufacture craft is simple.
In order to achieve the above objectives, the utility model adopts the following technical solutions:
A kind of gas flow transducer, including wiring board and in conjunction with the wafer body being fixed on the wiring board；
The surface of the wafer body includes ASIC line layer, and the ASIC line layer is directly to process on the wafer body
It is formed；The wafer body is formed between the wiring board by way of wire bonding to be electrically connected.
Further, it is preferable to which scheme is, it is adhesively fixed between the wafer body and the wiring board by epoxide-resin glue.
Further, it is preferable to which scheme is, it is electrically connected between the wafer body and the wiring board by gold thread.
Further, it is preferable to which scheme is, the gas flow transducer further includes having sealing compound protective layer, and the sealing compound protective layer is at least
Coat the wafer body and gold thread.
Further, it is preferable to which scheme is, the sealing compound protective layer is formed and is wrapped up by way of chip on board packaging technology
The wafer body and gold thread.
Further, it is preferable to scheme is, the side surface away from the wafer body of the wiring board includes and external electrical
The pad of electrical connection is formed between sub- equipment by surface-pasted mode.
Further, it is preferable to scheme is, the attachment face of the pad protrude from the wiring board away from the wafer body
One side surface.
Further, it is preferable to scheme is, the ASIC line layer be formed in the wafer body away from the one of the wiring board
Side surface.
The beneficial effects of the utility model are as follows:
Wafer body including ASIC line layer is directly installed to wiring board by gas flow transducer provided by the utility model
On, it eliminates ASIC encapsulation and the step of SMT (surface mounting technology) and cost, simplifies the manufacturing procedure of gas flow transducer；
Meanwhile the gas flow transducer of the structure reduces the occupied space of ASIC, effectively reduces the overall volume of sensor, Ke Yiman
Sufficient electronic product micromation, lightening design requirement.
On the other hand, the connection type of the gas flow transducer that the preferred embodiments of the present invention provide, output uses
SMD (Surface Mount Device, surface mount device) mode is attached with pad and external electronic device, compared to
Wire welding type or contact pin type in the prior art can save a large amount of people in the production and use process of gas flow transducer
Power simplifies the manufacture craft of sensor.
Detailed description of the invention
It, below will be to required in embodiment description in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
Attached drawing to be used is simply introduced.It is understood that the accompanying drawings in the following description is only the one of the utility model
A little embodiments for those of ordinary skill in the art without creative efforts, can also be according to these
Attached drawing obtains other attached drawings.
Fig. 1 shows the overlooking structure diagram of gas flow transducer in the utility model.
Fig. 2 shows the present invention looks up structural representation of gas flow transducer in the utility model.
Description of symbols: 1, wiring board；2, wafer body；3, gold thread；4, sealing compound protective layer；5, pad.
Specific embodiment
The various exemplary embodiments of the utility model are described in detail now with reference to attached drawing.It should also be noted that unless another
It illustrates outside, the component and the positioned opposite of step, numerical expression and numerical value otherwise illustrated in these embodiments is unlimited
The scope of the utility model processed.
Be to the description only actually of at least one exemplary embodiment below it is illustrative, never as to this is practical
Novel and its application or any restrictions used.
Technology and equipment known to person of ordinary skill in the relevant may be not discussed in detail, but in appropriate situation
Under, the technology and equipment should be considered as part of specification.
It is shown here and discuss all examples in, any occurrence should be construed as merely illustratively, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, then in subsequent attached drawing does not need that it is further discussed.
Gas flow transducer in the prior art, dedicated ASIC use the packing forms of SOT23-5 or SOT23-6, cause
The size of ASIC is very big, and the size of the overall package structure of such gas flow transducer is just very big, is not able to satisfy electronic product
Micromation, lightening design requirement.Based in the prior art, the utility model provides a kind of tool
There is new structural gas flow transducer, the overall dimensions of the gas flow transducer are small, and manufacture craft is simple.
Specifically, it is described in detail with reference to the accompanying drawing, Fig. 1 shows the vertical view knot of gas flow transducer in the utility model
Structure schematic diagram.Fig. 2 shows the present invention looks up structural representation of gas flow transducer in the utility model.
As described in Fig. 1, the utility model provides a kind of gas flow transducer, the gas flow transducer include wiring board 1 with
And in conjunction with the wafer body 2 being fixed on the wiring board 1；The surface of the wafer body 2 includes ASIC line layer, the ASIC line
Road floor is to process to be formed directly on the wafer body 2, the function of conventional asic chip may be implemented, it is preferable that the ASIC
Line layer is formed in the side surface away from the wiring board 1 of the wafer body 2；The wafer body 2 passes through wire bonding
It is formed and is electrically connected between the mode of (Wire Bonding) and the wiring board 1.
In the utility model, the wiring board 1 can be common pcb board (printed circuit board), also can choose ability
Common 1 type of other wiring boards in domain, the utility model do not do further limitation to this.
The full name of ASIC is Application Specific Integrated Circuit, in integrated circuit circle ASIC
It is considered as a kind of integrated circuit designed for special purpose, refers to the needs for answering specific user to require with particular electronic system
And the integrated circuit for designing, manufacturing.The characteristics of ASIC is the demand towards specific user, and ASIC is in batch production and generic set
At circuit compare have volume is smaller, power consumption is lower, reliability improve, performance improve, confidentiality enhancing, cost reduce etc. it is excellent
Point, existing ASIC generally use the packing forms of SOT23-5 or SOT23-6.Gas flow transducer provided by the utility model, directly
It connects and the wafer body 2 including ASIC line layer is installed on wiring board 1, the function of conventional asic chip may be implemented in ASIC line layer
Can, it eliminates ASIC encapsulation and the step of SMT (surface mounting technology) and cost, simplifies the manufacturing procedure of gas flow transducer；
Meanwhile the gas flow transducer of the structure reduces the occupied space of ASIC, effectively reduces the overall volume of sensor, Ke Yiman
Sufficient electronic product micromation, lightening design requirement.
It is solid by epoxy resin glue sticking between the wafer body 2 and the wiring board 1 in this preferred embodiment
Fixed, the technique taken can be common patch (Die Bonding) mode, and wafer body 2 is bonded assist side 1 using colloid
Plate face on.
It is further preferred that being electrically connected between the wafer body 2 and the wiring board 1 by gold thread 3, the effect of gold thread 3
It is to connect the ASIC route on 2 surface of wafer body with wiring board 1, plays conducting electric current.In its of the utility model
In its embodiment, it can also be electrically connected by other conductor wires between the wafer body 2 and the wiring board 1, example
Such as, the conductor wire can also be selected as aluminum steel.
In order to protect the ASIC line layer on 2 surface of wafer body and the gold for being electrically connected the wafer body 2 and wiring board 1
Line 3, the gas flow transducer further include having sealing compound protective layer 4, and the sealing compound protective layer 4 at least coats the wafer body 2 and gold
Line 3 prevents from destroying the wafer body 2 and gold thread 3 in the process of processing and using, extends the service life of gas flow transducer.Into
One step, the sealing compound protective layer 4 is formed by way of chip on board packaging technology and wraps up the wafer body 2 and gold thread 3.
The output connection type of existing gas flow transducer generallys use wire welding type or contact pin type, production or when using all
Need to occupy a large amount of manpowers；In this preferred embodiment, the side surface away from the wafer body 2 of the wiring board 1 is wrapped
Include the pad 5 for being formed and being electrically connected by surface-pasted mode between external electronic device.The output of the gas flow transducer
Connection type, compared with the prior art in wire welding type or contact pin type, can be in the production and use process of gas flow transducer
In can save a large amount of manpowers, simplify the manufacture craft of sensor.
It is further preferred that the attachment face of the pad 5 protrude from the wiring board 1 away from the one of the wafer body 2
Side surface facilitates and carries out positioning and being connected and fixed between external electronic device.
Obviously, the above embodiments of the present invention is merely examples for clearly illustrating the present invention, and
It is not limitations of the embodiments of the present invention, for those of ordinary skill in the art, in above description
On the basis of can also make other variations or changes in different ways, all embodiments can not be exhaustive here,
It is all to belong to obvious changes or variations that the technical solution of the utility model is extended out still in the utility model
The column of protection scope.
Claims (8)
1. a kind of gas flow transducer, which is characterized in that including wiring board and in conjunction with the wafer body being fixed on the wiring board；
The surface of the wafer body includes ASIC line layer, and the ASIC line layer is directly to process shape on the wafer body
At；
The wafer body is formed between the wiring board by way of wire bonding to be electrically connected.
2. gas flow transducer according to claim 1, which is characterized in that pass through between the wafer body and the wiring board
Epoxide-resin glue is adhesively fixed.
3. gas flow transducer according to claim 1, which is characterized in that pass through between the wafer body and the wiring board
Gold thread electrical connection.
4. gas flow transducer according to claim 3, which is characterized in that the gas flow transducer further includes having sealing protection
Layer, the sealing compound protective layer at least coat the wafer body and gold thread.
5. gas flow transducer according to claim 4, which is characterized in that the sealing compound protective layer is encapsulated by chip on board
The mode of technique forms and wraps up the wafer body and gold thread.
6. gas flow transducer according to claim 1, which is characterized in that the wiring board away from the one of the wafer body
Side surface includes to form the pad being electrically connected by surface-pasted mode between external electronic device.
7. gas flow transducer according to claim 6, which is characterized in that the attachment face of the pad protrudes from the route
The side surface away from the wafer body of plate.
8. gas flow transducer according to claim 1, which is characterized in that the ASIC line layer is formed in the wafer body
The side surface away from the wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822121392.3U CN209214685U (en) | 2018-12-18 | 2018-12-18 | A kind of gas flow transducer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822121392.3U CN209214685U (en) | 2018-12-18 | 2018-12-18 | A kind of gas flow transducer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209214685U true CN209214685U (en) | 2019-08-06 |
Family
ID=67464969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822121392.3U Active CN209214685U (en) | 2018-12-18 | 2018-12-18 | A kind of gas flow transducer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209214685U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021179194A1 (en) * | 2020-03-11 | 2021-09-16 | 深圳市驰泰电子科技有限公司 | New chip variable capacitor |
-
2018
- 2018-12-18 CN CN201822121392.3U patent/CN209214685U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021179194A1 (en) * | 2020-03-11 | 2021-09-16 | 深圳市驰泰电子科技有限公司 | New chip variable capacitor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200612 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 266100 Qingdao, Laoshan District, North House Street investment service center room, Room 308, Shandong Patentee before: GOERTEK TECHNOLOGY Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: F / F, phase II, Qingdao International Innovation Park, 1 Keyuan Weiyi Road, Laoshan District, Qingdao City, Shandong Province, 266104 Patentee after: Geer Microelectronics Co.,Ltd. Address before: Room 103, 396 Songling Road, Laoshan District, Qingdao City, Shandong Province 266104 Patentee before: Goer Microelectronics Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231114 Address after: 261206 No.2 Zhengtai Road, Fangzi District, Weifang City, Shandong Province Patentee after: WEIFANG ZHENGDA INDUSTRY CO.,LTD. Address before: F / F, phase II, Qingdao International Innovation Park, 1 Keyuan Weiyi Road, Laoshan District, Qingdao City, Shandong Province, 266104 Patentee before: Geer Microelectronics Co.,Ltd. |