CN111048648B - Display panel, manufacturing method and electronic equipment - Google Patents

Display panel, manufacturing method and electronic equipment Download PDF

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Publication number
CN111048648B
CN111048648B CN201911356167.0A CN201911356167A CN111048648B CN 111048648 B CN111048648 B CN 111048648B CN 201911356167 A CN201911356167 A CN 201911356167A CN 111048648 B CN111048648 B CN 111048648B
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Prior art keywords
retaining wall
wall structure
substrate
bearing substrate
carrier substrate
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CN111048648A (en
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何睦
杨铭
安平
霍思涛
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Wuhan Tianma Microelectronics Co Ltd
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Wuhan Tianma Microelectronics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
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Abstract

The invention discloses a display panel, a manufacturing method and electronic equipment, wherein the manufacturing method of the display panel provides a bearing substrate and an array substrate which are mutually independent, a retaining wall structure is fixed on the array substrate by aligning and attaching the bearing substrate and the array substrate, each LED unit is correspondingly placed in one groove, and then the bearing substrate and the retaining wall structure are separated to remove the bearing substrate, so that the integral transfer of the retaining wall structure is realized, and the manufacturing process of a Micro-LED display panel is simplified to a great extent.

Description

Display panel, manufacturing method and electronic equipment
Technical Field
The invention relates to the technical field of display, in particular to a display panel, a manufacturing method and electronic equipment.
Background
Micro-LEDs (Micro-LEDs) are a new generation of Display technology, and compared with the existing OLED (Organic Light-Emitting Diode) or LCD (Liquid Crystal Display) technology, the Micro-LEDs have the advantages of high resolution, high brightness, super power saving, fast response speed, high Light-Emitting efficiency, long service life, and the like, and are widely applied to the Display fields of mobile phones, notebook computers, televisions, and the like.
However, the current Micro-LED display panel has a complicated process and a low production yield.
Disclosure of Invention
In view of the above, to solve the above problems, the present invention provides a display panel, a manufacturing method thereof, and an electronic device, and the technical solution is as follows:
a method of fabricating a display panel, the method comprising:
providing a bearing substrate and an array substrate, wherein a plurality of LED units arranged in an array are arranged on the array substrate;
forming a retaining wall structure on the bearing substrate, wherein the retaining wall structure is provided with a plurality of grooves arranged in an array manner;
aligning and attaching the bearing substrate and the array substrate, fixing the retaining wall structure on the array substrate, and correspondingly placing each LED unit in one groove;
and separating the bearing substrate from the retaining wall structure, and removing the bearing substrate.
A display panel, the display panel comprising:
the LED array comprises an array substrate, wherein a plurality of LED units arranged in an array are arranged on the array substrate;
fix retaining wall structure on the array substrate, retaining wall structure has the recess that a plurality of arrays were arranged, wherein, each LED unit is placed in one correspondingly in the recess.
An electronic device is characterized by comprising the display panel.
Compared with the prior art, the invention has the following beneficial effects:
the manufacturing method of the display panel provides the bearing substrate and the array substrate which are mutually independent, the retaining wall structures are fixed on the array substrate by aligning and laminating the bearing substrate and the array substrate, each LED unit is correspondingly placed in one groove, and then the bearing substrate and the retaining wall structures are separated to remove the bearing substrate, so that the integral transfer of the retaining wall structures is realized, and the manufacturing process of the Micro-LED display panel is simplified to a great extent.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a manufacturing method of a display panel according to an embodiment of the present invention;
FIGS. 2-8 are schematic structural diagrams corresponding to the manufacturing method shown in FIG. 1 according to an embodiment of the present invention;
fig. 9 is a schematic structural view of a retaining wall structure according to an embodiment of the present invention;
fig. 10 is a schematic flowchart of another method for manufacturing a display panel according to an embodiment of the invention;
FIGS. 11-12 are schematic structural diagrams corresponding to the method of FIG. 10 according to an embodiment of the present invention;
fig. 13 is a schematic flowchart illustrating a method for manufacturing a display panel according to another embodiment of the present invention;
FIGS. 14-15 are schematic structural diagrams corresponding to the method of FIG. 12 according to an embodiment of the present invention;
fig. 16 is a schematic structural view of another retaining wall structure according to an embodiment of the present invention;
fig. 17 is a schematic structural view of another retaining wall structure according to an embodiment of the present invention;
fig. 18 is a schematic flowchart illustrating a method for manufacturing a display panel according to another embodiment of the present invention;
FIG. 19 is a schematic structural diagram corresponding to the method of FIG. 18 according to an embodiment of the present invention;
FIG. 20 is a flowchart illustrating a method for fabricating a display panel according to yet another embodiment of the present invention;
FIGS. 21-22 are schematic structural diagrams corresponding to the method of FIG. 20 according to an embodiment of the present invention;
fig. 23 is a schematic structural view of another retaining wall structure according to an embodiment of the present invention;
fig. 24 is a schematic flowchart illustrating a method for manufacturing a display panel according to another embodiment of the present invention;
FIGS. 25-27 are schematic structural diagrams corresponding to the method of FIG. 24 according to an embodiment of the present invention;
fig. 28 is a schematic structural diagram of a display panel according to an embodiment of the disclosure;
fig. 29 is a schematic structural diagram of another display panel according to an embodiment of the present invention;
fig. 30 is a schematic structural diagram of another display panel according to an embodiment of the invention;
fig. 31 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
After research, the inventor finds that the current manufacturing methods of the full-color Micro-LED display panel mainly comprise two types, wherein one type relates to three Micro-LED chips of red, green and blue which are respectively transferred in a large amount on an active matrix substrate; another type is to provide a single color (typically blue or ultraviolet) Micro-LED active matrix substrate, converting part of the blue (or ultraviolet) light into red and green light by means of a color converting material.
In addition, in order to prevent the optical crosstalk between the adjacent Micro-LEDs, an opaque organic film layer should be arranged on the surface of the active matrix substrate and between the Micro-LED chips.
However, after the research, the inventors found that the process difficulty of directly preparing the opaque organic layer on the Micro-LED active matrix substrate is high, and the wet etching process may damage the existing substrate.
Therefore, the following embodiments of the present application provide a method for manufacturing a display panel to solve the problems in the prior art.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
Referring to fig. 1, fig. 1 is a manufacturing method of a display panel according to an embodiment of the present invention.
The manufacturing method comprises the following steps:
s101: as shown in fig. 2, a carrier substrate 11 and an array substrate 12 are provided, and as shown in fig. 3, a plurality of LED units 13 arranged in an array are disposed on the array substrate 12.
In this step, the carrier substrate 11 and the array substrate 12 are two independent substrate structures, and the Micro-LEDs are massively transferred on the array substrate 12 by means of a massive transfer, so as to form the array substrate 12 having a plurality of LED units 13 arranged in an array.
Alternatively, as shown in fig. 4, the height L1 of the LED unit 13 is 5 μm to 15 μm, for example, the height L1 of the LED unit 13 is 6 μm or 10 μm or 13 μm, and the height of the LED unit 13 may be determined according to the actual use requirement, which is not limited in the embodiment of the present invention.
S102: as shown in fig. 5, a retaining wall structure 14 is formed on the carrier substrate 11, and the retaining wall structure 14 has a plurality of grooves 15 arranged in an array.
In this step, the carrier substrate 11 includes, but is not limited to, a glass substrate, and includes, but is not limited to, a patterned light-tight retaining wall structure 14 fabricated by a wet etching process, where the retaining wall structure 14 has a plurality of grooves 15 arranged in an array, and the positions of the grooves 15 correspond to the positions of the LED units 13 one to one.
Specifically, as shown in fig. 6, the depth L2 of the groove 15 is at least greater than the height L1 of the LED unit 13, so as to avoid the problem of color mixing of the display panel on the initial surface of light emission.
The groove 15 penetrates through the retaining wall structure 14 until the surface of the carrier substrate 11 is exposed. In other words, the recess 15 is a hollow structure penetrating through the film layer where the retaining wall structure 14 is located.
Moreover, due to inevitable process error factors, as shown in fig. 6, the width L3 of the retaining wall structure 14 is at least smaller than the distance between two adjacent LED units 13, so as to ensure that the retaining wall structure 14 can completely surround each LED unit 13.
Further, the width L3 of the retaining wall structure 14 can be properly reduced again within the allowable range to increase the distance between the retaining wall structure and the LED unit 13, so as to avoid extruding the LED unit 13, reduce the risk of dropping the LED unit 13, and further enhance the structural stability of the display panel.
S103: as shown in fig. 7, the carrier substrate 11 and the array substrate 12 are aligned and bonded, the retaining wall structure 14 is fixed on the array substrate 12, and each LED unit 13 is correspondingly placed in one of the grooves 15.
In this step, the carrier substrate 11 is inverted, and the retaining wall structure 14 is opposite to the array substrate 12, including but not limited to aligning the carrier substrate 11 and the array substrate 12 by using a high-precision bonding machine, and bonding is performed after the gap between the retaining wall structure 14 and the LED unit 13 is reasonably adjusted.
S104: as shown in fig. 8, the carrier substrate 11 and the retaining wall structures 14 are separated, and the carrier substrate 11 is removed.
In this step, it is necessary to ensure that the retaining wall structures are not damaged during the process of separating the carrier substrate 11 from the retaining wall structures 14.
As can be seen from the above description, the manufacturing method of forming the retaining wall structure 14 on the carrier substrate 11, forming the LED units 13 arranged in an array on the array substrate 12, then performing alignment and attachment, and separating and removing the carrier substrate 11 is compared with the manufacturing method of forming the retaining wall structure 14 on the array substrate 12, and then forming the LED units 13 in the grooves 15 of the retaining wall structure 14, or forming the LED units 13 and then arranging the retaining wall structure 14.
In addition, in the prior art, since the density of the transfer head is not as high as the patterning density of the retaining wall structure, the retaining wall structure needs to be grabbed and transferred in batches, and the process is complex. And, since the gripping force of the transfer head is limited, the thickness and weight of the retaining wall structure are limited within a certain range, and in the subsequent processing, the retaining wall structure is more easily damaged, which is not favorable for the structural stability of the display panel.
However, the manufacturing method provided by the embodiment of the application realizes the integral transfer of the retaining wall structure, can manufacture the retaining wall structure with larger thickness, greatly simplifies the manufacturing process of the Micro-LED display panel, and has strong structural stability of the display panel.
Further, referring to fig. 9, fig. 9 is a schematic structural diagram of a retaining wall structure according to an embodiment of the present invention.
The recess 15 in the retaining wall structure 14 does not extend through the retaining wall structure 14.
After the retaining wall structure 14 is fixed to the array substrate 11, the retaining wall structure 14 can further protect the LED units under the supporting effect.
In this embodiment, the material of the retaining wall structure 14 is not limited in the embodiment of the present invention, and can be determined according to the actual process requirements.
Further, based on the above embodiments of the present invention, referring to fig. 10, fig. 10 is a schematic flow chart of another method for manufacturing a display panel according to an embodiment of the present invention.
Before the carrying substrate and the array substrate are aligned and fixed, the manufacturing method further includes:
s105: as shown in fig. 11 and 12, a first adhesive layer 16 is formed on a surface of the retaining wall structure 14 facing away from the side of the carrier substrate 11, and after the carrier substrate 11 and the array substrate 12 are aligned and attached, the retaining wall structure 14 and the array substrate 12 are fixed by the first adhesive layer 16.
In this embodiment, the first adhesive layer 16 completely covers the surface of the retaining wall structure 14 on the side away from the carrier substrate 11, and after the carrier substrate 11 and the array substrate 12 are aligned and attached, the retaining wall structure 14 and the array substrate 12 are completely fixed by the first adhesive layer 16, so as to improve the bonding stability of the retaining wall structure 14 and the carrier substrate 12.
Specifically, the method for forming the first adhesive layer 16 on the surface of the retaining wall structure 14 facing away from the carrier substrate 11 includes, but is not limited to, wet or patterned mold transfer printing, and the like.
Optionally, the material of the first adhesive layer 16 includes, but is not limited to, a pressure-sensitive adhesive, and the components of the pressure-sensitive adhesive include a main resin and an auxiliary agent, and the auxiliary agent is mainly one or more of a plasticizer, a viscosity regulator, an antifoaming agent, a leveling agent, a wetting agent, and a solvent.
Further, according to the above embodiment of the present invention, the first adhesive layer 16 is a negative pressure-sensitive adhesive layer or a positive pressure-sensitive adhesive layer;
in the alignment and bonding process of the bearing substrate 11 and the array substrate 12, the viscosity of the positive pressure-sensitive adhesive is gradually increased along with the increase of pressure;
the negative pressure-sensitive adhesive gradually increases in viscosity to a maximum value with increasing pressure, and then gradually decreases in viscosity with continued increase in pressure.
In this embodiment, the main resin of the negative pressure-sensitive adhesive layer or the positive pressure-sensitive adhesive layer is a pseudoplastic fluid having shear thinning properties.
Optionally, the thickness of the first adhesive layer 16 is not greater than 10 μm, so that the problem of adhesive overflow is avoided on the premise that stable adhesion between the retaining wall structure 14 and the array substrate 12 is achieved, and the light emitting effect of the LED unit 13 is not affected.
When the thickness of the first adhesive layer 16 exceeds a certain range, based on the fluid property of the pressure sensitive adhesive, the wall structure 14 and the array substrate 12 may have a risk of dislocation, and further may cause extrusion to the LED unit 13, thereby reducing the display effect of the display panel, and therefore, in the embodiment of the invention, the thickness of the first adhesive layer 16 is set to be not greater than 10 μm.
Further, according to the above embodiment of the present invention, a negative pressure sensitive adhesive layer is used as the first adhesive layer 16.
Specifically, in the alignment and bonding process of the carrier substrate 11 and the array substrate 12, if the pressure is too high, the retaining wall structure 14 may be extruded and deformed, and then the viscosity of the negative pressure-sensitive adhesive layer is reduced by continuously applying the pressure, so that the retaining wall structure 14 may be better separated from the array substrate 12, and the negative pressure-sensitive adhesive layer may not be left on the array substrate 12.
Therefore, in order to ensure that the negative pressure-sensitive adhesive layer has better adhesive force and that the retaining wall structure 14 is not deformed by extrusion, in the embodiment of the present invention, the bonding pressure of the carrier substrate 11 and the array substrate 12 is set to be 0.01bar-2 bar.
Further, based on the above embodiment of the present invention, the separating the carrier substrate 11 and the retaining wall structure 14 to remove the carrier substrate 11 includes:
and separating the bearing substrate 11 from the retaining wall structure 14 by adopting a laser lift-off method to remove the bearing substrate 11.
In this embodiment, since the retaining wall structures 14 are directly formed on the carrier substrate, in order to ensure that the retaining wall structures 14 are not damaged, the carrier substrate 11 and the retaining wall structures 14 are separated by, but not limited to, laser lift-off to remove the carrier substrate 11.
In the laser lift-off, the laser with short wavelength can penetrate through the carrier substrate 11 made of glass material and is absorbed by the retaining wall structure 14 at the interface with the retaining wall structure 14, and the high-energy laser degrades the interface, so that the carrier substrate 11 and the retaining wall structure 14 are separated.
Further, based on the above embodiments of the present invention, referring to fig. 13, fig. 13 is a schematic flowchart of a manufacturing method of another display panel according to an embodiment of the present invention.
Before forming the retaining wall structure 14 on the carrier substrate 11, the manufacturing method further includes:
s106: as shown in fig. 14, a second adhesive layer 17 is coated on the surface of the carrier substrate 11, and the retaining wall structure 14 is formed on the second adhesive layer 17.
In this embodiment, by disposing the second adhesive layer 17 between the retaining wall structures 14 and the carrier substrate 11, the carrier substrate 11 and the retaining wall structures 14 can be separated by mechanical peeling to remove the carrier substrate 11.
Compared with a laser stripping mode, the second glue layer 17 is arranged under the condition that a complex process is not added, and the separation process of the bearing substrate 11 and the retaining wall structure 14 is further simplified to a great extent by combining a simple mechanical stripping mode.
In addition, the mechanical stripping mode can avoid the influence of the laser irradiation with over high energy on the display panel, so as to improve the production yield.
As shown in fig. 15, another embodiment is provided for the embodiment of the present invention, wherein the second adhesive layer 17 is a negative pressure-sensitive adhesive layer; the first adhesive layer 16 is a positive pressure sensitive adhesive layer.
In this embodiment, since the positive pressure-sensitive adhesive has a property of gradually increasing in viscosity with an increase in pressure; the viscosity of the negative pressure-sensitive adhesive gradually increases to a maximum value with the increase of the pressure, and then the viscosity gradually decreases with the continuous increase of the pressure, so as shown in fig. 15, the second adhesive layer 17 is set as a negative pressure-sensitive adhesive layer, the first adhesive layer 16 is set as a positive pressure-sensitive adhesive layer, during the alignment and bonding of the carrier substrate 11 and the array substrate 12, the viscosity between the retaining wall structure 14 and the array substrate 12 will continuously increase with the continuous increase of the bonding pressure, the viscosity between the carrier substrate 11 and the retaining wall structure 14 will also increase to a maximum value, and then the bonding pressure will continuously increase, and under the condition that the retaining wall structure 14 is not damaged, the viscosity between the carrier substrate 11 and the retaining wall structure 14 will decrease, and finally the viscosity of the second adhesive layer 17 will be smaller than the viscosity of the first adhesive layer 16. Furthermore, the carrier substrate 11 and the retaining wall structures 14 can be separated more easily by mechanical peeling.
It should be noted that, in other alternative embodiments of the present application, a first adhesive layer 16 is formed on a surface of the retaining wall structure 14 facing away from the side of the carrier substrate 11, and a second adhesive layer 17 is formed on a surface of the retaining wall structure facing towards the side of the carrier substrate, where the viscosity of the second adhesive layer 17 is smaller than that of the first adhesive layer 16, that is, the viscosity of the second adhesive layer 17 and the viscosity of the first adhesive layer 16 are: the viscosity of the second glue layer 17 is less than the viscosity of the first glue layer 16. That is, the first adhesive layer 16 and the second adhesive layer 17 are adhesive layers that are adhesively (or adhesively) fixed, and the adhesiveness of the second adhesive layer 17 is less than that of the first adhesive layer 16.
Further, referring to fig. 16, fig. 16 is a schematic structural diagram of another retaining wall structure according to an embodiment of the present invention.
The retaining wall structure 14 has a first end face and a second end face which are oppositely arranged, wherein the area of the first end face is smaller than that of the second end face;
the first end face faces the carrier substrate 11, and the second end face faces away from the carrier substrate 11.
In this embodiment, in the process of manufacturing the retaining wall structure 14, the retaining wall structure 14 is directly manufactured into a retaining wall structure with an inverted trapezoidal cross section, that is, the retaining wall structure 14 has a first end surface and a second end surface which are oppositely arranged, wherein the area of the first end surface is smaller than that of the second end surface; the first end face faces the carrier substrate 11.
That is, by reducing the contact area between the retaining wall structures 14 and the carrier substrate 11, the separation between the retaining wall structures 14 and the carrier substrate 11 is facilitated.
Further, referring to fig. 17, fig. 17 is a schematic structural diagram of another retaining wall structure according to an embodiment of the present invention.
One end of the retaining wall structure 14 adjacent to the carrier substrate 11 is formed with a notch structure.
In this embodiment, on the premise of reducing the contact area between the retaining wall structure 14 and the carrier substrate 11, a notch structure is further formed at one end of the carrier substrate 11 adjacent to the retaining wall structure 14, so as to provide a separation path between the carrier substrate 11 and the retaining wall structure 14, and further facilitate the separation between the retaining wall structure 14 and the carrier substrate 11.
Further, based on the above embodiments of the present invention, referring to fig. 18, fig. 18 is a schematic flowchart of a manufacturing method of another display panel according to an embodiment of the present invention.
After forming the retaining wall structure 14 on the carrier substrate 11, the manufacturing method further includes:
s107: as shown in fig. 19, the sidewall of the retaining wall structure 14 adjacent to one end of the carrier substrate 11 is etched to reduce the contact area between the retaining wall structure 14 and the carrier substrate 11.
It should be noted that, in this embodiment, the reduction of the contact area between the retaining wall structure 14 and the carrier substrate 11 is compared with the contact area between the retaining wall structure 14 and the carrier substrate 11 when the retaining wall structure 14 is not etched.
In this embodiment, the contact area between the retaining wall structures 14 and the carrier substrate 11 is reduced, so that the retaining wall structures 14 and the array substrate 12 are easily peeled off after the retaining wall structures 14 are fixed to the carrier substrate 11.
However, for etching the retaining wall structures 14, the etching height of the retaining wall structures 14 and the contact area between the retaining wall structures 14 and the carrier substrate 11 after etching need to be reasonably controlled to prevent damage, such as deformation, to the etched region during the attaching process.
Moreover, by etching the side wall of the retaining wall structure 14 adjacent to one end of the carrier substrate 11, after the retaining wall structure 14 and the array substrate 12 are fixed, each light emitting area is correspondingly increased, so that the light emitting quality of the display panel can be improved, and the notch formed by etching can also provide a separation path for separation between the retaining wall structure and the array substrate, thereby being more beneficial to separation of the retaining wall structure and the array substrate.
Further, based on the above embodiments of the present invention, referring to fig. 20, fig. 20 is a schematic flowchart of a manufacturing method of another display panel according to an embodiment of the present invention.
After forming the retaining wall structure 14 on the carrier substrate 11, the manufacturing method further includes:
s108: as shown in fig. 21, among the plurality of grooves 15 arranged in an array, a part of the grooves 15 is selected as the grooves 18 to be processed;
and etching the inner side wall of the opening at one end of the groove 18 to be processed, which is adjacent to the bearing substrate 11, so as to reduce the contact area between the groove 18 to be processed and the bearing substrate 11.
It should be noted that, in this embodiment, the reduction of the contact area between the groove to be processed 18 and the carrier substrate 11 is compared with the contact area between the groove to be processed 18 and the carrier substrate 11 when the etching process is not performed on the groove to be processed 18.
In this embodiment, since there is a difference in luminance between the light emitted by the three primary colors, red light, green light, and blue light, if the size of each light emitting region is set to be uniform, a difference in luminance between the light and dark display inevitably occurs.
Therefore, in the embodiment of the present invention, a part of the grooves 15 is selected as the grooves 18 to be processed, and etching is performed on the inner sidewall of the opening at one end of the carrying substrate 11 adjacent to the grooves 18 to be processed, so as to reduce the contact area between the grooves 18 to be processed and the carrying substrate 11, as shown in fig. 22, after the retaining wall structure 14 is fixed to the array substrate 12, the light emitting area L4 of the light emitting units disposed in the grooves 18 to be processed is larger than the light emitting areas L5 of the light emitting units disposed in other grooves 15, thereby solving the display difference of different light emitting units.
Moreover, the etching process is performed on part of the groove 18 to be processed, and after the retaining wall structure 14 and the array substrate 12 are fixed, the notch formed by the etching process can also improve the separation path for the retaining wall structure and the carrier substrate, and is still beneficial to the peeling between the retaining wall structure 14 and the carrier substrate 11.
Further, based on the above embodiments of the present invention, referring to fig. 23, fig. 23 is a schematic structural diagram of a retaining wall structure according to an embodiment of the present invention.
The retaining wall structure 14 includes a first retaining wall structure 141 and a second retaining wall structure 142 in a first direction, the first direction is perpendicular to the carrier substrate 11, and the carrier substrate 11 points to the retaining wall structure 14;
the contact area between the first retaining wall structure 141 and the second retaining wall structure 142 is smaller than the surface area of the first retaining wall structure 141 adjacent to the second retaining wall structure 142.
In this embodiment, compared with the processing method of etching the sidewall of the retaining wall structure 14 adjacent to the end of the carrier substrate 11, in order to optimize the control method, a double-layer retaining wall structure is fabricated on the carrier substrate 11, that is, in the first direction, the retaining wall structure 14 includes a first layer of retaining wall structure 141 and a second layer of retaining wall structure 142, and in the fabrication process, the contact area of the first layer of retaining wall structure 141 and the second layer of retaining wall structure 142 is smaller than the surface area of the second layer of retaining wall structure 142 adjacent to the first layer of retaining wall structure 141, that is, the projection area of the first layer of retaining wall structure 141 on the carrier substrate 11 is smaller than the projection area of the second layer of retaining wall structure 142 on the carrier substrate 11.
Therefore, the size of the double-layer retaining wall structure manufactured by layering is easier to control than the etching processing method.
In addition, the heights of the first-layer retaining wall structure 141 and the second-layer retaining wall structure 142 in the first direction may be different, so as to change the size of the light emitting region, and weaken the display difference of different light emitting units.
Further, based on the above-mentioned embodiment of the present invention, referring to fig. 24, fig. 24 is a schematic flow chart of a manufacturing method of another display panel according to an embodiment of the present invention.
Separating the carrier substrate 11 from the retaining wall structure 14, and after removing the carrier substrate 11, the manufacturing method further includes:
s109: as shown in fig. 25, a color conversion layer 20 is provided on the LED unit 13 through the groove 15.
The color conversion layer 20 includes, but is not limited to, a quantum dot layer and/or an organic phosphor layer, and a partially transparent light scattering material layer.
In this embodiment, since the Micro-LEDs in the current Micro-LED display panel are arranged in an LED array emitting RGB tricolor light, that is, LED chips of three colors of RGB are required, which increases the difficulty in the process and technology, reduces the yield, and increases the production cost.
However, in this embodiment, the LED units 13 arrayed on the array substrate 12 are all blue LEDs, and red light and green light are emitted by disposing quantum dot layers or organic fluorescent powder on the surface thereof, and blue light is emitted by disposing transparent light scattering material layers on some of the blue LEDs, that is, the Micro-LED display panel realizes wide color gamut full color display by the same LED chip.
S110: as shown in fig. 26, a color resist layer 21 is provided on a side of the color conversion layer 20 facing away from the LED unit 13.
In this embodiment, in order to suppress the leakage of blue light of the backlight and the reflection of the external ambient light, the color resist layer 21 is disposed to solve the problem of light mixing on the initial light emitting surface, thereby improving the display effect.
The light emitting regions of different colors are provided with corresponding color resist layers.
S111: as shown in fig. 27, a protective layer 22 is provided on the side of the color resist layer 21 away from the color conversion layer 20.
In this embodiment, the structure inside the recess 15 is protected by providing a protective layer 22 of transparent material to improve its lifetime.
Based on all the above embodiments of the present invention, in another embodiment of the present invention, a display panel is further provided, referring to fig. 28, and fig. 28 is a schematic structural diagram of a display panel provided in an embodiment of the present invention.
The display panel includes:
the LED array comprises an array substrate 12, wherein a plurality of LED units 13 arranged in an array are arranged on the array substrate 12;
and the retaining wall structure 14 is fixed on the array substrate 12, the retaining wall structure 14 is provided with a plurality of grooves 15 arranged in an array manner, wherein each of the LED units 13 is correspondingly placed in one of the grooves 15.
In this embodiment, the display panel is manufactured by the manufacturing method provided by the above embodiment of the present invention, the retaining wall structure is fixed on the array substrate by aligning and attaching the mutually independent carrier substrate and the array substrate, each of the LED units is correspondingly placed in one of the grooves, and then the carrier substrate and the retaining wall structure are separated to remove the carrier substrate, thereby realizing the integral transfer of the retaining wall structure and greatly simplifying the manufacturing process of the Micro-LED display panel.
Further, based on the above embodiments of the present invention, referring to fig. 29, fig. 29 is a schematic structural diagram of another display panel provided in the embodiments of the present invention.
The retaining wall structure 14 is divided into a first area a and a second area B in a direction perpendicular to the array substrate 12;
wherein the second region B is adjacent to the array substrate 12;
the contact area of the first region A and the second region B is smaller than the surface area of the second region B adjacent to the first region A.
In this embodiment, the contact area between the first region a and the second region B is smaller than the surface area of the second region B adjacent to the first region a, so that each light emitting region is correspondingly increased, and the light emitting quality of the display panel can be improved.
Further, based on the above-mentioned embodiment of the present invention, referring to fig. 30, fig. 30 is a schematic structural diagram of another display panel provided in the embodiment of the present invention.
The retaining wall structure 14 includes a first retaining wall structure 141 and a second retaining wall structure 142 in a direction perpendicular to the array substrate 12;
the second-layer retaining wall structure 142 is adjacent to the array substrate 12;
the contact area between the first retaining wall structure 141 and the second retaining wall structure 142 is smaller than the surface area of the first retaining wall structure 141 adjacent to the second retaining wall structure 142.
In this embodiment, by providing the double-layer retaining wall structure, the heights of the first-layer retaining wall structure 141 and the second-layer retaining wall structure 142 in the first direction are different, so as to change the size of the light emitting region, and weaken the display difference of different light emitting units.
Furthermore, because the human eyes have different recognition degrees for different colors and the service life of the pixel units is short, in order to further weaken the display difference of the display panel, the height of the second-layer retaining wall structure adjacent to the pixel unit with weak human eye recognition sensitivity or short service life is less than the height of the second-layer retaining wall structure adjacent to the pixel unit with strong human eye recognition sensitivity or long service life. Optionally, the total height of each retaining wall structure in the embodiment is the same.
The pixel unit with low light conversion efficiency may be understood as a pixel unit with low light conversion efficiency of a light emitting layer, and the light emitting layer may be, for example, a Quantum Dot (QD) layer, and the pixel unit with low light conversion efficiency may be a pixel unit with low light conversion efficiency of a quantum dot, or the light emitting layer may be an organic light emitting layer in an LED or OLED light emitting element.
Similarly, a long pixel cell life indicates a long life of a quantum dot, a long life of a light emitting element such as an LED or an OLED, or a high light conversion efficiency of a quantum dot.
For example, the degree of recognition of red by human eyes is low, and then the height of the second-layer retaining wall structure adjacent to the pixel unit emitting red light is reduced to increase the area of the light emitting area, so that the display brightness of red light can be improved, and the phenomenon of red light color weakness cannot occur when the human eyes observe the display panel.
Further, according to the above embodiment of the present invention, as shown in fig. 22, a gap structure is formed on an inner side wall of the opening of a portion of the groove facing away from the array substrate 12.
In this embodiment, the light-emitting area of the light-emitting unit disposed in the groove is larger than the light-emitting areas of the light-emitting units disposed in other grooves, so as to solve the display difference of different light-emitting units and improve the display effect of the display panel.
Based on all the above embodiments of the present invention, in another embodiment of the present invention, an electronic device is further provided, referring to fig. 31, and fig. 31 is a schematic structural diagram of an electronic device provided in an embodiment of the present invention.
The electronic device 19 includes the display panel.
Specifically, the electronic device 19 includes, but is not limited to, a mobile phone, a tablet, and other electronic devices.
The display panel, the manufacturing method and the electronic device provided by the invention are described in detail, and the principle and the implementation mode of the invention are explained by applying specific examples, and the description of the examples is only used for helping to understand the method and the core idea of the invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
It should be noted that, in the present specification, the embodiments are all described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other. The device disclosed in the embodiment corresponds to the method disclosed in the embodiment, so that the description is simple, and the relevant points can be referred to the description of the method part.
It is further noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include or include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (7)

1. A manufacturing method of a display panel is characterized by comprising the following steps:
providing a bearing substrate and an array substrate, wherein a plurality of LED units arranged in an array are arranged on the array substrate;
forming a retaining wall structure on the bearing substrate, wherein the retaining wall structure is provided with a plurality of grooves which are arranged in an array manner;
aligning and attaching the bearing substrate and the array substrate, fixing the retaining wall structure on the array substrate, and correspondingly placing each LED unit in one groove;
separating the bearing substrate from the retaining wall structure, and removing the bearing substrate;
a notch structure is formed at one end of the retaining wall structure adjacent to the bearing substrate;
before the carrying substrate and the array substrate are aligned and fixed, the manufacturing method further includes:
forming a first adhesive layer on the surface of the retaining wall structure on the side away from the bearing substrate, wherein the retaining wall structure and the array substrate are fixed through the first adhesive layer after the bearing substrate and the array substrate are aligned and attached;
before forming the retaining wall structure on the carrier substrate, the manufacturing method further includes:
coating a second adhesive layer on the surface of the bearing substrate;
forming the retaining wall structure on the second adhesive layer;
the second adhesive layer is a negative pressure-sensitive adhesive layer; the first adhesive layer is a positive pressure-sensitive adhesive layer;
during the alignment and bonding process of the bearing substrate and the array substrate, the viscosity of the positive pressure-sensitive adhesive is gradually increased along with the increase of pressure;
the negative pressure-sensitive adhesive gradually increases in viscosity to a maximum value with increasing pressure, and then gradually decreases in viscosity with continued increase in pressure.
2. The method of claim 1, wherein the separating the carrier substrate from the retaining wall structure to remove the carrier substrate comprises:
and separating the bearing substrate from the retaining wall structure by adopting a mechanical stripping method so as to remove the bearing substrate.
3. The method as claimed in claim 1, wherein the step of separating the carrier substrate from the retaining wall structure to remove the carrier substrate comprises:
and separating the bearing substrate from the retaining wall structure by adopting a laser stripping method so as to remove the bearing substrate.
4. The method of claim 1, wherein after forming the retaining wall structure on the carrier substrate, the method further comprises:
and etching the side wall at one end of the bearing substrate adjacent to the retaining wall structure to reduce the contact area between the retaining wall structure and the bearing substrate.
5. The method according to claim 1, wherein the retaining wall structure has a first end surface and a second end surface which are oppositely arranged, wherein the area of the first end surface is smaller than that of the second end surface;
the first end face faces the bearing substrate, and the second end face faces away from the bearing substrate.
6. The method of claim 1, wherein after forming the retaining wall structure on the carrier substrate, the method further comprises:
selecting partial grooves as grooves to be processed from a plurality of grooves arranged in an array;
and etching the inner side wall of the opening at one end of the bearing substrate adjacent to the groove to be processed.
7. The method according to claim 1, wherein the retaining wall structure comprises a first retaining wall structure layer and a second retaining wall structure layer in a first direction, the first direction is perpendicular to the carrier substrate and is directed to the retaining wall structure by the carrier substrate;
the contact area of the first layer retaining wall structure and the second layer retaining wall structure is smaller than that of the second layer retaining wall structure adjacent to the surface area of the first layer retaining wall structure.
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