CN111043215A - Piezoelectric type intelligent dynamic vibration absorber - Google Patents
Piezoelectric type intelligent dynamic vibration absorber Download PDFInfo
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F7/00—Vibration-dampers; Shock-absorbers
- F16F7/10—Vibration-dampers; Shock-absorbers using inertia effect
- F16F7/104—Vibration-dampers; Shock-absorbers using inertia effect the inertia member being resiliently mounted
- F16F7/116—Vibration-dampers; Shock-absorbers using inertia effect the inertia member being resiliently mounted on metal springs
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
- H02N2/18—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing electrical output from mechanical input, e.g. generators
- H02N2/186—Vibration harvesters
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F2228/00—Functional characteristics, e.g. variability, frequency-dependence
- F16F2228/06—Stiffness
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F2230/00—Purpose; Design features
- F16F2230/0005—Attachment, e.g. to facilitate mounting onto confer adjustability
Abstract
The embodiment of the invention discloses a piezoelectric type intelligent dynamic vibration absorber, relates to the field of low-frequency vibration noise control and utilization, and can carry out multi-directional vibration reduction and adjust characteristic parameters of the piezoelectric type intelligent dynamic vibration absorber. The invention comprises the following steps: the piezoelectric spring (3) and the mass block (4) form a piezoelectric type dynamic vibration absorber structure, and the control system (5) is connected with a piezoelectric element in the piezoelectric type dynamic vibration absorber structure; the coupler (2) is used for connecting the foundation structure (1) and the piezoelectric type dynamic vibration absorber structure, and the coupler (2) and the foundation structure (1) are fastened and fixed through bolts; the piezoelectric spring (3) is composed of a spring structure and the piezoelectric element; the piezoelectric element is used for changing the equivalent stiffness of the spring structure and the equivalent damping in the telescopic oscillation process; the control system (5) has a self-powered function, and changes the equivalent stiffness and damping of the piezoelectric spring by controlling the voltage at two ends of the piezoelectric element. The invention is suitable for the field of low-frequency vibration noise control and utilization.
Description
Technical Field
The invention relates to the field of low-frequency vibration noise control and utilization, in particular to a piezoelectric type intelligent dynamic vibration absorber.
Background
Mechanical vibrations tend to degrade the performance and reliability of the machine or the main structure itself or affect the performance and reliability of the equipment on which the main structure is placed, and most of the above mechanical vibrations need to be eliminated or suppressed. Among many vibration reduction methods, the dynamic vibration absorber has the characteristics of low cost, good effect and the like, and is widely researched and applied. The basic working principle of the dynamic vibration absorber is that a sub-oscillation system with mass, damping and rigidity, namely the vibration absorber, is added at a specific part of a controlled main vibration system, the vibration condition of the main system is changed by reasonably selecting relevant parameters of the vibration absorber, and the vibration energy is transferred to the vibration absorber, so that the vibration of the main system is reduced.
However, in the practical engineering application process, once the structure of the dynamic vibration absorber is designed and processed, the characteristic parameters of the dynamic vibration absorber are difficult to adjust in real time, and if the vibration frequency of the main system changes due to the change of the environment or the structure of the dynamic vibration absorber, the dynamic vibration absorber cannot obtain an ideal vibration reduction effect in time.
Disclosure of Invention
The embodiment of the invention provides a piezoelectric type intelligent dynamic vibration absorber which has the functions of multi-directional vibration reduction and adjustable characteristic parameters.
In order to achieve the above purpose, the embodiment of the invention adopts the following technical scheme:
the device comprises a base structure (1), a coupler (2), a piezoelectric spring (3), a mass block (4) and a control system (5) connected with a piezoelectric element in the piezoelectric spring (3); the piezoelectric spring (3) and the mass block (4) form a piezoelectric type dynamic vibration absorber structure, and the control system (5) is connected with a piezoelectric element in the piezoelectric spring (3) in the piezoelectric type dynamic vibration absorber structure; the coupler (2) is used for connecting the foundation structure (1) and the piezoelectric type dynamic vibration absorber structure, and the coupler (2) and the foundation structure (1) are fastened and fixed through bolts; the piezoelectric spring (3) consists of a spring structure and a piezoelectric element integrated on the spring structure, and the piezoelectric element is used for changing the equivalent stiffness of the spring structure and the equivalent damping in the telescopic oscillation process; the control system (5) changes the equivalent stiffness and damping of the spring structure by controlling the voltage across the piezoelectric element.
Specifically, the control system (5) forms an equivalent LC oscillating circuit through an inductor and a piezoelectric element, and adjusts the voltage at two ends of the piezoelectric element through the on-off of an electronic switch in the equivalent LC oscillating circuit; the electronic switch is a field effect transistor switch or a triode switch.
And the microprocessor in the control system (5) is used for monitoring the vibration state of the piezoelectric intelligent dynamic vibration absorber, and outputting a driving level or a driving current to trigger the electronic switch to be switched on or switched off after logical judgment is carried out by a preset control algorithm.
Specifically, the piezoelectric type dynamic vibration absorber structure is suspended on a base structure (1) through a coupler (2). In a preferred scheme, the mechanical vibration generated by the base structure (1) is low-frequency vibration in a horizontal plane, and the vibration frequency is not more than 5 Hz; and/or the mechanical vibration generated by the base structure (1) is low-frequency vibration in a vertical plane, and the vibration frequency is not more than 10 Hz; wherein, the spring pendulum structure includes 2 degrees of freedom: the degree of freedom of oscillation and the degree of freedom of spring expansion and contraction oscillation.
Specifically, the head end and the tail end of the piezoelectric spring (3) are respectively connected with the base structure (1) and the mass block (4) through T-shaped pins, the piezoelectric spring (3) is composed of metal clamping pieces and U-shaped metal pins, piezoelectric elements are attached to the inner surface and the outer surface of each metal clamping piece, and the number of the metal clamping pieces forming the piezoelectric spring (3) is larger than or equal to 1.
The metal clamping piece is formed by bending or punching a metal sheet, the cross section of the metal clamping piece forms an unsealed triangle and comprises at least n bent planes, each plane comprises an inner surface and an outer surface, the total number of the planes is 2n, and n is a positive integer; each surface is pasted with a piezoelectric element, the equivalent rigidity of the piezoelectric spring (3) is lower than that of the piezoelectric element, and the piezoelectric element is a piezoelectric ceramic piece.
Specifically, the piezoelectric element is a piezoelectric stack element; the piezoelectric spring (3) is composed of a piezoelectric stack element with a displacement amplification mechanism, the displacement amplification mechanism is respectively connected with the coupler (2) and the mass block (4) through a pair of flexible hinges, the expansion direction of the displacement amplification mechanism is the expansion oscillation direction of the spring, and the flexible hinges of the displacement amplification mechanism, the coupler (2) and the mass block (4) are fixed through threaded holes and bolts.
The flexible hinge is used for counteracting bending moment applied to the displacement amplification mechanism in the swinging process of the structure; in the installation process of the displacement amplification mechanism, pre-pressure is firstly applied to the piezoelectric stack element, so that the piezoelectric stack element is always in a pressed state when the free end of the displacement amplification mechanism is in telescopic change.
Further, the self vibration mechanical energy is converted into electric energy through the piezoelectric element, and the electric energy is supplied to a control system (5).
The invention provides a piezoelectric intelligent dynamic vibration absorber which has two functions of multi-directional vibration attenuation and adjustable resonant frequency, and can fully utilize the positive and negative piezoelectric effect of a piezoelectric element to realize the self-powered control system and the efficient vibration attenuation of a main vibration system. The control system matched with the piezoelectric element is used for adjusting characteristic parameters of the control system, achieving the purpose of the intelligent self-adaptive main system vibration reduction effect of the dynamic vibration absorber structure, and mainly used for adjusting voltage between electrode surfaces of the piezoelectric element and achieving the purpose of changing equivalent rigidity and damping of the piezoelectric spring pendulum structure in a specific state.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic diagram of a piezoelectric dynamic vibration absorber structure and a control system thereof according to an embodiment of the present invention;
fig. 2 is a specific piezoelectric intelligent dynamic vibration absorber structure provided in an embodiment of the present invention, which includes an assembly connection manner between the dynamic vibration absorber structure and a base structure, i.e., a main vibration structure;
FIG. 3 is a schematic structural diagram of an exemplary universal joint cross coupling according to an embodiment of the present invention;
fig. 4 is a schematic diagram of vibration reduction of another piezoelectric intelligent dynamic vibration absorber structure according to an embodiment of the present invention, which can effectively suppress the vibration amplitude of the basic structure, i.e., the main vibration structure, in the horizontal direction;
fig. 5 is a schematic structural diagram of a piezoelectric spring according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of another piezoelectric spring structure provided in an embodiment of the present invention;
fig. 7 is a block diagram of a control system according to an embodiment of the present invention.
Detailed Description
In order to make the technical solutions of the present invention better understood, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention. As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may also be present. Further, "connected" or "coupled" as used herein may include wirelessly connected or coupled. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. It will be understood by those skilled in the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
The invention provides a dynamic vibration absorber structure with a piezoelectric intelligent element and a control system thereof, and particularly relates to a vibration absorber structure based on the spring pendulum and mass spring oscillation system principle, wherein the piezoelectric element is integrated in the spring structure, the voltage at two ends of the piezoelectric element is changed in real time by using a control circuit, and the equivalent stiffness and the damping of the dynamic vibration absorber system are further changed, so that the dynamic vibration absorber structure is self-adaptive, intelligent and efficient in vibration attenuation. Namely, the dynamic vibration absorber meets the vibration reduction requirement of more complicated main system vibration working conditions. The basic principle is as follows: the vibration of the base structure, i.e. the main vibration system, is transferred to the dynamic vibration absorber structure, which is subjected to severe oscillations. The piezoelectric element on the vibration absorber converts mechanical vibration energy into electric energy, so that vibration control of a main system and electric energy collection after electromechanical energy conversion are realized, the electric energy is used for power supply of a control system and is used for adjusting voltage at two ends of the piezoelectric element in turn, and vibration of a main structure is further effectively inhibited.
The spring-pendulum-piezoelectric-like dynamic vibration absorber has the advantages that the defects of narrow available frequency band, single control direction and the like of the traditional dynamic vibration absorber are overcome, and the vibration is absorbed through the spring-pendulum-like piezoelectric type dynamic vibration absorber with multi-direction and adjustable resonant frequency. The design can be applied to a mechanical vibration structure with low frequency and properly variable main vibration frequency, and theoretically has no limit to the vibration direction. Therefore, the technical problem to be solved by the present invention is to require the dynamic vibration absorber structure to have multi-directional freedom and to have a proper variation of the self-resonant frequency. In addition, a corresponding control system is required to be added, and the vibration suppression efficiency is maximized while the functions are obtained. And finally, the control system has a self-powered function. In the prior art, the dynamic vibration absorber for suppressing the multi-directional vibration has less structural research, and the embodiment of the invention creatively realizes the vibration in multiple directions by using the traditional spring pendulum and/or mass spring structure, and the spring in the structure can expand and contract to oscillate, so that the characteristic parameters of the dynamic vibration absorber are changed by using the piezoelectric element, and the vibration is effectively suppressed finally. Under nonlinear conditions (two degrees of freedom are coupled with each other), an internal resonance phenomenon occurs in a practical structure, vibration energy can be converted between different vibration modes, even the vibration energy is excited on one mode, and the energy is completely transferred to other modes. It is worth mentioning that, at this time, the amplitude-frequency characteristic curve of the swing freedom degree respectively has peaks at two sides of the linear frequency ω 1, that is, a double jump phenomenon occurs. The phenomenon theoretically widens the inherent working frequency band of the dynamic vibration absorber structure, and shows that the structure has a wider vibration absorbing frequency band even if a control system is not adopted, thereby further widening the application range and conditions of the vibration absorber structure.
In this embodiment, as shown in fig. 1, the piezoelectric intelligent dynamic vibration absorber includes:
the device comprises a base structure (1), a coupler (2), a piezoelectric spring (3), a mass block (4) and a control system (5) connected with a piezoelectric element in the piezoelectric spring (3).
The base structure (1) is an application structure specifically aimed at by the dynamic vibration absorber, namely a main vibration structure or a main vibration system, and the vibration energy of the structure is collected and suppressed by the dynamic vibration absorber.
The piezoelectric spring (3) and the mass block (4) form a piezoelectric type dynamic vibration absorber structure, and the control system (5) is connected with a piezoelectric element in the piezoelectric spring (3). The piezoelectric spring (3) has various structural forms and can effectively integrate a piezoelectric element, so that the embodiment is suitable for inhibiting low-frequency multidirectional vibration or efficiently damping a main body structure.
The coupler (2) is used for connecting the base structure (1) and the piezoelectric type dynamic vibration absorber structure, and the coupler (2) and the base structure (1) are fastened and fixed through bolts. In this embodiment, the dynamic vibration absorber can also expand and contract along the gravity direction to oscillate, and has a multi-directional vibration absorbing function. The coupler (2) has multi-directional freedom, and ensures that the dynamic vibration absorber can swing in any plumb plane.
The piezoelectric spring (3) is composed of a designed spring structure and the piezoelectric element, wherein the form of the spring structure and the form of the piezoelectric element are not unique.
The piezoelectric element is used for changing the equivalent stiffness of the spring structure and the equivalent damping in the telescopic oscillation process. The control system (5) changes the equivalent stiffness and damping of the piezoelectric spring by controlling the voltage at the two ends of the piezoelectric element, and finally realizes the efficient conversion of electromechanical energy and the matching adjustment of characteristic parameters (structural resonance frequency).
The "intellectualization" described in this embodiment is mainly embodied in that the resonance frequency of the vibration absorber structure is adjustable, and the energy conversion efficiency of the system is adaptively optimized, and is specifically realized by the combined action of the piezoelectric element and the control system thereof. The dynamic vibration absorber is applied to low-frequency vibration suppression of the base structure (1), can convert vibration energy into electric energy to supply power for the control system (5), and can greatly increase vibration suppression efficiency through the control system (5).
The key parts of the dynamic vibration absorber structure provided by the embodiment are composed of a piezoelectric element, a spring structure and a mass block, and the design of relevant parameters of the piezoelectric element, the spring structure and the mass block is specially designed according to specific application scenes. However, the final parameters of the vibration absorber are mainly 3, namely equivalent mass, equivalent stiffness and the variation range thereof, equivalent damping and the variation range thereof, the overall structural design is simpler, and the structure runs stably and reliably. In the control system provided by the embodiment of the invention, a key control circuit consists of an inductor, an electronic switch and a diode which are matched with the equivalent capacitance of the piezoelectric element; the matching mainly means that the equivalent output impedance of the piezoelectric element is approximate to or equal to the equivalent input impedance of a subsequent loop mainly built by an inductor; the electronic switch driving control is composed of a microprocessor and a peripheral circuit thereof in a control system.
Most of the conventional dynamic vibration absorbers only have one degree of freedom, so that vibration can be reduced only in one direction, and the vibration absorbers are almost stranded in the face of vibration sources with multi-directional vibration or vibration direction change. The embodiment provides a structural scheme of a dynamic vibration absorber based on a piezoelectric spring pendulum, vibration suppression in any direction in a horizontal plane is achieved through a coupler, matching adjustment of resonant frequency of the vibration absorber is achieved through a piezoelectric intelligent element, and vibration suppression in a wide frequency band range is achieved. The invention effectively solves the problems of single vibration suppression direction and narrow frequency band range of the traditional dynamic vibration absorber structure.
For example: as shown in fig. 4, the control system (5) is used to adjust the equivalent stiffness and damping of the piezoelectric spring (3). In the structural schematic diagram, if the base structure (1) is regarded as an actual structure, the mechanical vibration of the structure is mainly in the horizontal direction, and the dynamic vibration absorber structure can be simply regarded as a spring pendulum vibration system. The pendulum length of the dynamic vibration absorber with the spring pendulum structure can be in telescopic oscillation, so that the related parameters of the spring can be adjusted through the control system according to the real-time oscillation condition of the structure, and the dynamic vibration absorber can absorb and dissipate the vibration energy of the main structure to the maximum extent.
The piezoelectric spring pendulum dynamic vibration absorber structure can be equivalent to a two-degree-of-freedom square nonlinear spring pendulum system, namely a pendulum degree of freedom and a spring expansion degree of freedom. According to the nonlinear vibration theory, when the natural frequency of the spring expansion and contraction oscillation is equal to or close to twice of the swing natural frequency, the structure generates an internal resonance phenomenon. Under the internal resonance phenomenon, vibration energy can be converted between different vibration modes, even excited in one mode, and the energy is completely transferred to other modes. Therefore, the dynamic vibration absorber structure can match the vibration of any direction in the horizontal plane of the main system by using the swing freedom degree, and further utilizes the piezoelectric element to adjust the vibration on the telescopic freedom degree of the spring, thereby achieving the purposes of vibration energy collection and main system vibration suppression.
Furthermore, if the primary system vibrates only in the vertical direction, the piezoelectric spring pendulum dynamic vibration absorber is simplified and equivalent to a mass spring oscillation system, and only the spring expands and contracts for one degree of freedom, so that the piezoelectric spring pendulum dynamic vibration absorber is similar to the conventional dynamic vibration absorber in structure. However, as the piezoelectric intelligent element is integrated in the spring pendulum structure, the resonance frequency and equivalent damping of the mass spring oscillation system can be adjusted, and the complex and variable main system vibration is suppressed to the maximum extent.
In the embodiment, an equivalent LC oscillating circuit is formed by an inductor and a piezoelectric element in the control system (5), and the voltage at two ends of the piezoelectric element is adjusted by the on-off of an electronic switch in the equivalent LC oscillating circuit. The equivalent LC tank is a common electrical concept, and various circuit design forms of the equivalent LC tank exist in various textbooks and documents at present, and are not described in detail in this embodiment. The electronic switch is a field effect transistor switch or a triode switch. The control energy required for the electronic switch is small. The control system integrated circuit is mainly supplied with power by the electric energy collected and converted by the dynamic vibration absorber without providing an additional power supply from the outside, thereby saving structural components for power input. The switch control algorithm is mainly based on a synchronous switch damping technology and a derivative technology thereof, and is simple to control and high in reliability; the algorithm is mainly realized by a low-power consumption microprocessor in the control system.
Specifically, a microprocessor in the control system (5) is used for controlling the on-off of the electronic switch. The power supply of an integrated chip such as a microprocessor and an AD conversion chip in the control system (5), the driving energy of an electronic switch and the like are all provided by the dynamic vibration absorber, a piezoelectric element in the vibration absorber firstly converts the mechanical energy of the spring stretching oscillation into electric energy, after the initial electric energy is stored to a certain degree, the control system is electrified and reset to start working, and the mechanical vibration of a main structure is suppressed to the maximum extent according to a control algorithm.
The microprocessor is used for monitoring the vibration state of the piezoelectric type intelligent dynamic vibration absorber, and outputting a driving level or current to trigger the electronic switch to be switched on or switched off after logical judgment is carried out through a preset control algorithm.
In this embodiment, the piezoelectric dynamic vibration absorber structure is suspended on the base structure (1) by the coupling (2), and the piezoelectric dynamic vibration absorber structure is influenced by gravity. For example: the assembly connection of the main vibrating structure shown in fig. 2. Wherein the base structure (1) can still be regarded as a schematic structure, which shows that the piezoelectric dynamic vibration absorber structure is suspended on the base structure (1) by the coupling (2), and the piezoelectric dynamic vibration absorber structure is influenced by gravity. In this case, the vibration absorber structure has two degrees of freedom, namely, oscillation and spring expansion oscillation, and can suppress vibration in any direction. If the base structure (1) is regarded as an actual structure, the mechanical vibration of the structure is mainly vertical, and the dynamic vibration absorber structure can be simplified and regarded as a mass spring oscillation system.
In a preferred scheme, the mechanical vibration generated by the base structure (1) is low-frequency vibration in a horizontal plane, and the vibration frequency is generally not more than 5 Hz; and/or the mechanical vibrations generated by the base structure (1) are low frequency vibrations in the vertical plane, and the vibration frequency is generally not more than 10 Hz. Wherein the dynamic vibration absorber structure comprises 2 degrees of freedom: the degree of freedom of oscillation and the degree of freedom of spring expansion and contraction oscillation. For example: the basic structure (1) is a main vibration structure, is a specific application structure of the dynamic vibration absorber, and the mechanical vibration generated by the structure is generally low-frequency vibration in a horizontal plane, and the main vibration frequency is generally not more than 5 Hz; or low frequency vibrations in the vertical plane, the dominant vibration frequency typically not exceeding 10 Hz. Through the additional dynamic vibration absorber, the vibration amplitude of the main structure can be greatly restrained, so that the equipment on the platform of the main structure can be ensured to run more stably, and the fatigue life of the structure can be greatly prolonged. The dynamic vibration absorber structure has 2 degrees of freedom: the degree of freedom of oscillation and the degree of freedom of spring expansion and contraction oscillation. It is assumed here that the resonant frequencies are ω respectively for the two degrees of freedom1And ω2Omega in linear conditions (two degrees of freedom not coupled to each other)1Theoretically only with the gravitational acceleration g and the initial spring pendulum length l0Related, ω2Only with respect to the spring equivalent stiffness K and the mass equivalent mass M. Thus, the resonant frequency ω of the degree of freedom of oscillation1Generally, the frequency does not exceed 5Hz, and the ultra-low frequency vibration suppression device can be matched with ultra-low frequency structure mechanical vibration, thereby skillfully solving the problem of ultra-low frequency vibration suppression of the structure. The actual piezoelectric element and the spring structure are integrated, and the spring telescopic oscillation resonant frequency omega is required for obtaining higher electromechanical conversion efficiency and effectively inhibiting the vibration of a main system2For the oscillating resonant frequency omega1Twice as much as the amount of the first,i.e. requires ω2Not exceeding 10 Hz. For this purpose, it is necessary to keep the spring equivalent stiffness K as low as possible and the equivalent mass M as large as possible.
Specifically, the coupling (2) can adopt a cross shaft type universal coupling. As shown in fig. 3, a typical universal joint pin type universal coupling is schematically shown in the drawing, the driven part of the coupling and the cross pin jointly form the universal coupling, and the coupling and the base structure (1) can be fastened and fixed through bolts. The cross-axle type coupling is simple in structure, only two orthogonal swinging directions of the spring pendulum in the horizontal plane are limited theoretically, but according to the theoretical mechanics theory, the cross-axle type coupling can respond to vibration excitation in any direction in the horizontal plane and only responds to a certain influence relation between the amplitude and the vibration direction. If the influence relation is to be eliminated, the excitation response in any vibration direction is the largest, and a Rzeppa universal coupling with a more complex design structure can be selected. The rzeppa universal coupling can realize complete constant-speed transmission, and structurally, the vibration suppression efficiency of the dynamic vibration absorber in any direction in a horizontal plane is fully improved. Optionally, the coupling (2) may also be a rzeppa universal coupling.
In the embodiment, the piezoelectric spring (3) consists of two metal clamping pieces, a piezoelectric element integrated with the metal clamping pieces and a U-shaped metal pin, and the piezoelectric element can be pasted and adhered on the inner surface and the outer surface of each metal clamping piece. As shown in fig. 2, the piezoelectric spring (3) is assembled by two metal clamping pieces and a U-shaped pin, the piezoelectric element is designed and integrated on the inner and outer planes at the bottom of the metal clamping pieces, the structural form is not unique, but the structural design scheme is more favorable for inhibiting low-frequency mechanical vibration, the processing cost is low, the assembly is simple, and the operation is reliable; the mass (4) is made of a material with high density and low cost as much as possible, for example, the mass (4) is made of lead.
Specifically, the metal clamping piece is formed by bending or punching a metal sheet, the cross section of the metal clamping piece forms an unsealed triangle and comprises at least n bent planes, each plane comprises an inner surface and an outer surface, and the total number of the planes is 2 n. And a piezoelectric element is pasted on each surface, the piezoelectric element is a piezoelectric ceramic piece, and the equivalent stiffness of the piezoelectric spring (3) is lower than that of the piezoelectric element. For example: fig. 5 shows a schematic diagram of a possible piezoelectric spring structure, which is assembled by using metal clamping pieces (3.1), piezoelectric elements (3.2) integrated with the metal clamping pieces and U-shaped metal pins (3.3), wherein the number of the metal clamping pieces (3.1) is selected according to design requirements. Wherein the spring structure is formed by at least one triangular (or delta-shaped) metal clip, also called a clip spring, and the structure form is similar to a common metal ticket holder. The clamping piece spring pendulum structure is provided with at least six planes which can be pasted with the piezoelectric ceramic elements, the equivalent stiffness of the integrated piezoelectric spring is far lower than the stiffness of the piezoelectric ceramic elements, and the parameter design of the dynamic vibration absorber is facilitated. The two free ends of the clamping piece are provided with round holes, so that the spring pendulum structure can be conveniently expanded or restrained, the metal clamping piece is generally bent or punched and formed, and then the residual stress is removed through heat treatment for preparation. In consideration of pendulum length, equivalent stiffness and the like, the piezoelectric spring structure in the embodiment can connect a plurality of delta-shaped metal clamping pieces (3.1) in series through U-shaped metal pins (3.3).
Furthermore, through the piezoelectric spring structure assembled by the U-shaped metal pin (3.3), the metal pin and the metal clamping piece hole are required to be in interference fit, and a binder is added into the assembly hole, so that the metal pin is ensured not to slip in the hole. It should be noted that the assembly process is not exclusive and that welding processes or boss pin designs may be used to ensure reliable attachment of the pin within the bore. Furthermore, if the structural parameters of the dynamic vibration absorber are determined according to the actual application scene, the structure of the clip type piezoelectric spring can be integrally designed, and the assembly process of the U-shaped metal pin is cancelled. The integrated structure is still prepared by bending or punching and removing residual stress through heat treatment. At least six planes of the delta-shaped metal clamping piece can be pasted with piezoelectric ceramic elements, and the actual design needs to be chosen according to parameter design requirements. The piezoelectric ceramic elements can be connected in parallel or in series, and even can be selected to be connected in series or in parallel. Before the electrical connection mode is selected, the polarity of the electrode surface of the element should be artificially determined according to the stress form of the piezoelectric ceramic element and the polarization direction of the element.
The piezoelectric spring structure in this embodiment further includes: piezoelectric stack element and corresponding displacement amplification mechanism. The telescopic direction of the displacement amplification mechanism is consistent with the telescopic oscillation direction of the spring structure. The displacement amplification mechanism is respectively connected with the coupler (2) and the mass block (4) through a pair of flexible hinges by means of threaded holes and bolts, and the flexible hinge structure can effectively counteract bending moment generated to the displacement amplification mechanism in the swinging process of the vibration absorber.
During the installation process of the displacement amplifying mechanism, pre-pressure should be applied to the piezoelectric stack element first, so that the piezoelectric stack element is always in a pressed state when the free end of the displacement amplifying mechanism is in telescopic change.
For example: fig. 6 shows a piezoelectric spring structure based on a displacement amplification mechanism (3.1), a piezoelectric stack (3.2) and a flexible hinge (3.3), wherein the piezoelectric element is the piezoelectric stack, the displacement amplification mechanism (3.1) is used for reducing the equivalent stiffness of the structure, and the structure is diversified. The displacement amplification direction of the displacement amplification mechanism is consistent with the telescopic oscillation direction of the spring structure, and the flexible hinge structure (3.3) can counteract the bending moment generated to the displacement amplification mechanism in the swinging process of the vibration absorber, so that the structure is prevented from bending deformation during telescopic motion of the displacement amplification mechanism, energy loss is generated, and the transmission efficiency is reduced. In the actual assembly process, pre-pressure is applied to the piezoelectric stack element firstly, so that the piezoelectric stack is always in a pressed state when the free end of the displacement amplifying mechanism is stretched and changed, the piezoelectric stack is further always involved in the electromechanical conversion of the structure, and the control system (5) is always ensured to work stably and effectively. Furthermore, similar to a metal clip type spring structure, in the embodiment, at least 2 displacement amplification mechanisms (3.1) and corresponding piezoelectric stack elements (3.2) can be selected to be connected in series to form the piezoelectric spring, and each displacement amplification mechanism is still connected in series through a flexible hinge (3.3) through a bolt fastener.
The embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the apparatus embodiment, since it is substantially similar to the method embodiment, it is relatively simple to describe, and reference may be made to some descriptions of the method embodiment for relevant points. If the structural parameters of the dynamic vibration absorber are determined according to the actual application scene, the piezoelectric spring pendulum structure with a plurality of displacement amplification mechanisms, and the assembly process of welding and bolt fastening can be integrally designed. The integrated spring pendulum structure is formed by linear cutting or a numerical control milling machine.
Fig. 7 is a block diagram of the control system of this embodiment, and the power of the control system is generated by the dynamic vibration absorber through the piezoelectric effect of the piezoelectric element, and is provided by the power management unit. The control loop composed of the piezoelectric spring structure, the diode, the inductor and the electronic switch is the core of the control system. The control loop can realize synchronous switch damping and derivative technology thereof, ensure that the voltage at two ends of the electrode surface of the piezoelectric element can be greatly changed by adopting a small amount of control energy, and increase the control efficiency. According to the basic principle of synchronous switch damping, the equivalent damping of the piezoelectric spring structure can be effectively changed, the equivalent stiffness of the structure is instantly changed, the resonant frequency of the dynamic vibration absorber structure is finally changed, and the suppression efficiency of the mechanical vibration of the main structure is improved.
As an implementation mode, the control system mainly directly controls the voltage value of the electrode surface of the piezoelectric element through the electronic switch, the on-off control of the electronic switch is realized by the switch driving circuit, and the control algorithm is realized by the microprocessor according to the vibration monitoring signal and the designed logic control algorithm. The control system firstly obtains an actual vibration signal through a piezoelectric sensing element integrated in a piezoelectric spring or a main vibration structure, judges the vibration frequency and amplitude and transmits the vibration frequency and amplitude to a microprocessor; the microprocessor outputs a switch driving signal according to a control algorithm, and controls the electronic switch in real time after the driving voltage is amplified by the switch driving circuit; the electronic switch changes the voltage values at two ends of the electrode surface of the piezoelectric element in real time by controlling the on-off state of the loop, influences the electromechanical coupling efficiency of the piezoelectric spring structure, and finally changes the equivalent stiffness and damping of the structure.
As an implementation mode, the control system is powered by standard direct current voltage output by the power management unit, the input of the power management unit is provided by electric energy converted by the piezoelectric element, the vibration mechanical energy of the dynamic vibration absorber is firstly converted into alternating current electric energy, then the alternating current electric energy is converted into direct current electric energy through a rectifier bridge inside the power management unit, and finally the standard direct current supply voltage is output through a high-efficiency DC/DC voltage stabilizer. Because the vibration mechanical energy is unstable, a high-capacity super capacitor is also arranged in the power management unit and used for storing part of electric energy, and the time required by the control system to work stably is ensured.
Furthermore, if the rechargeable battery is selected to store electric energy, the power management unit should optimize the design of the high-efficiency charging circuit, and the design of the voltage stabilizing circuit is relatively simple and is a common design, which is not described herein again.
The embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the apparatus embodiment, since it is substantially similar to the method embodiment, it is relatively simple to describe, and reference may be made to some descriptions of the method embodiment for relevant points. The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. The utility model provides a piezoelectric type intelligence dynamic vibration absorber which characterized in that includes:
the device comprises a base structure (1), a coupler (2), a piezoelectric spring (3), a mass block (4) and a control system (5) connected with a piezoelectric element in the piezoelectric spring (3);
the piezoelectric spring (3) and the mass block (4) form a piezoelectric type dynamic vibration absorber structure, and the control system (5) is connected with a piezoelectric element in the piezoelectric spring (3) in the piezoelectric type dynamic vibration absorber structure;
the coupler (2) is used for connecting the foundation structure (1) and the piezoelectric type dynamic vibration absorber structure, and the coupler (2) and the foundation structure (1) are fastened and fixed through bolts;
the piezoelectric spring (3) consists of a spring structure and a piezoelectric element integrated on the spring structure, and the piezoelectric element is used for changing the equivalent stiffness of the spring structure and the equivalent damping in the telescopic oscillation process;
the control system (5) changes the equivalent stiffness and damping of the spring structure by controlling the voltage across the piezoelectric element.
2. The piezoelectric intelligent dynamic vibration absorber according to claim 1, wherein the control system (5) forms an equivalent LC tank by means of an inductor and a piezoelectric element, and adjusts the voltage across the piezoelectric element by means of the on/off of an electronic switch in the equivalent LC tank;
the electronic switch is a field effect transistor switch or a triode switch.
3. The piezoelectric intelligent dynamic vibration absorber according to claim 1, wherein the microprocessor in the control system (5) is configured to monitor the vibration state of the piezoelectric intelligent dynamic vibration absorber, and output a driving level or a driving current to trigger the electronic switch to be turned "on" or "off" after a logical judgment is performed by a preset control algorithm.
4. Piezoelectric intelligent dynamic vibration absorber according to claim 1, wherein the piezoelectric dynamic vibration absorber structure is suspended from the base structure (1) by a coupling (2).
5. The piezoelectric intelligent dynamic vibration absorber according to claim 1 or 4, wherein the mechanical vibration generated by the base structure (1) is low frequency vibration in the horizontal plane, and the vibration frequency does not exceed 5 Hz;
and/or the mechanical vibration generated by the base structure (1) is low-frequency vibration in a vertical plane, and the vibration frequency is not more than 10 Hz;
wherein, the spring pendulum structure includes 2 degrees of freedom: the degree of freedom of oscillation and the degree of freedom of spring expansion and contraction oscillation.
6. The piezoelectric intelligent dynamic vibration absorber according to claim 1, wherein the head and tail ends of the piezoelectric spring (3) are connected to the base structure (1) and the mass block (4) respectively through T-shaped pins, the piezoelectric spring (3) is composed of metal clamping pieces and U-shaped metal pins, piezoelectric elements are attached to the inner surface and the outer surface of each metal clamping piece, and the number of the metal clamping pieces composing the piezoelectric spring (3) is greater than or equal to 1.
7. The piezoelectric intelligent dynamic vibration absorber according to claim 6, wherein the metal clip is formed by bending or punching a metal sheet, the cross section of the metal clip forms an unsealed triangle, and the metal clip comprises at least n bent planes, each plane comprises an inner surface and an outer surface, and the total number of the planes is 2n, wherein n is a positive integer;
each surface is pasted with a piezoelectric element, the equivalent rigidity of the piezoelectric spring (3) is lower than that of the piezoelectric element, and the piezoelectric element is a piezoelectric ceramic piece.
8. The piezoelectric intelligent dynamic vibration absorber according to claim 1, wherein said piezoelectric element is a piezoelectric stack element;
the piezoelectric spring (3) is composed of a piezoelectric stack element with a displacement amplification mechanism, the displacement amplification mechanism is respectively connected with the coupler (2) and the mass block (4) through a pair of flexible hinges, the expansion direction of the displacement amplification mechanism is the expansion oscillation direction of the spring, and the flexible hinges of the displacement amplification mechanism, the coupler (2) and the mass block (4) are fixed through threaded holes and bolts.
9. The piezoelectric intelligent dynamic vibration absorber according to claim 8, wherein: the flexible hinge is used for counteracting bending moment applied to the displacement amplification mechanism in the swinging process of the structure; in the installation process of the displacement amplification mechanism, pre-pressure is firstly applied to the piezoelectric stack element, so that the piezoelectric stack element is always in a pressed state when the free end of the displacement amplification mechanism is in telescopic change.
10. The piezoelectric intelligent dynamic vibration absorber according to claim 1, wherein the piezoelectric element converts its own vibration mechanical energy into electrical energy and supplies power to the control system (5).
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