CN111036802A

CN111036802A - LED pin processing device

Info

Publication number: CN111036802A
Application number: CN201911399701.6A
Authority: CN
Inventors: 王丽春
Original assignee: Individual
Current assignee: Individual
Priority date: 2019-12-30
Filing date: 2019-12-30
Publication date: 2020-04-21

Abstract

The invention discloses an LED pin processing device which comprises a base, a bending mechanism and a cutting mechanism, wherein the bending mechanism is arranged on the base; the LED lamp holder is characterized in that a lower die holder is fixedly connected to the base, a placing groove is formed in the lower die holder, an LED chip is nested in the placing groove, and pins are fixedly connected to two sides of the LED chip; the lower die holder is provided with a symmetrical moulding through groove, and a bending mechanism is arranged above the moulding through groove. According to the LED chip bending device, the side pressing plates with the bending grooves and the lower die holder with the shaping through grooves are arranged, pins are efficiently bent, meanwhile, the inner pressing plates are arranged, the front sections of the bending positions of the pins are clamped and fixed, stress at the connecting positions of the pins and the LED chips is reduced, the LED chips are prevented from being damaged, stability in bending operation is improved, and bending quality is improved; through being equipped with cut groove, movable block, elevator, lead screw and the side pressure board that has the rectangle and lead to the groove with moulding logical groove intercommunication, conveniently cut the pin after buckling to conveniently adjust the length of cutting, have good adaptability.

Description

LED pin processing device

Technical Field

The invention relates to the field of LED processing equipment, in particular to an LED pin processing device.

Background

The LED chip is in the course of working, need buckle the LED chip, the follow-up processing of being convenient for, the traditional mode of buckling is through two clamping piece centre gripping pins, directly buckle, complete in-process, there is the atress condition pin and LED chip junction, stability is not good when the operation of buckling, the quality of buckling is not high, cause the pin to become flexible even LED chip to damage easily, cause the LED chip to scrap, need cut the overlength pin after buckling, need other equipment to handle, buckle and cut the course of operation not concentrated, and the production efficiency is reduced.

Disclosure of Invention

The present invention is directed to an LED pin processing apparatus to solve the above problems.

In order to achieve the purpose, the invention provides the following technical scheme:

an LED pin processing device comprises a base, a bending mechanism and a cutting mechanism; the LED lamp holder is characterized in that a lower die holder is fixedly connected to the base, a placing groove is formed in the lower die holder, LED chips are nested in the placing groove, and pins which are distributed at equal intervals are fixedly connected to two sides of each LED chip; the lower die base is provided with symmetrically arranged shaping through grooves, a bending mechanism is arranged above the shaping through grooves and comprises side pressing plates, the upper ends of the side pressing plates are fixedly connected with fixing plates, and the upper ends of the fixing plates are fixedly connected with vertical hydraulic cylinders; the bending groove of vertical setting is seted up to the side pressure board lower extreme, and side pressure inboard nested has the interior clamp plate, and interior clamp plate edge sets up the clamp groove with the pin adaptation, and interior clamp plate upper end fixedly connected with removes the frame, and the cover is equipped with the reset spring that distributes about two sets of on removing the frame.

As a further scheme of the invention: the lower die holder is provided with a cutting groove communicated with the shaping through groove, the cutting groove is a horizontal groove, a moving block is nested in the cutting groove, a cutting knife is nested in the moving block, the moving block is connected with a horizontal hydraulic cylinder, and the side pressure plate is located above the bending groove and provided with a rectangular through groove.

As a further scheme of the invention: a lifting block is nested in the moving block, the cutoff knife is fixedly connected with the lifting block, a vertical chute matched with the lifting block is arranged in the moving block, a lead screw is arranged in the vertical chute, and the lead screw penetrates through the lifting block and is in threaded connection with the lifting block; the lead screw extends to the upper part of the moving block and is fixedly connected with an adjusting wheel.

As a further scheme of the invention: the base is internally provided with a communicating groove communicated with the shaping through groove, and a fragment box is arranged below the communicating groove.

As a further scheme of the invention: the shaping through groove is positioned below the pins.

As a further scheme of the invention: the movable frame penetrates through the fixed plate and is in sliding connection with the fixed plate.

As a further scheme of the invention: the bending grooves are arranged in one-to-one correspondence with the pins.

Compared with the prior art, the invention has the beneficial effects that: according to the LED chip bending device, the side pressing plates with the bending grooves and the lower die holder with the shaping through grooves are arranged, pins are efficiently bent, meanwhile, the inner pressing plates are arranged, the front sections of the bending positions of the pins are clamped and fixed, stress at the connecting positions of the pins and the LED chips is reduced, the LED chips are prevented from being damaged, stability in bending operation is improved, and bending quality is improved; through being equipped with cut groove, movable block, elevator, lead screw and the side pressure board that has the rectangle and lead to the groove with moulding logical groove intercommunication, conveniently cut the pin after buckling to conveniently adjust the length of cutting, have good adaptability.

Drawings

FIG. 1 is a schematic diagram of an internal structure of an LED pin processing device;

FIG. 2 is an enlarged view taken at A in FIG. 1;

FIG. 3 is a perspective view of a side press plate in the LED pin processing apparatus;

FIG. 4 is a perspective view of an inner pressure plate in the LED pin processing apparatus;

FIG. 5 is an enlarged view at B of FIG. 1;

fig. 6 is a schematic top view of the middle and lower die bases of the LED pin processing apparatus.

In the figure: 1-a base; 2-a lower die holder; 3-placing the groove; 4-LED chip; 5-pin; 6-shaping through grooves; 7-an inner pressing plate; 8-moving the frame; 9-fixing the plate; 10-a return spring; 11-side pressing plates; 12-a bending groove; 13-a clamping groove; 14-rectangular through grooves; 15-cutting grooves; 16-a moving block; 17-a cutter; 18-a lifting block; 19-a screw rod; 20-a regulating wheel; 21-horizontal hydraulic cylinder; 22-a communication groove; 23-a crumb box; 24-vertical hydraulic cylinder.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example 1

Referring to fig. 1-6, in an embodiment of the present invention, an LED pin processing apparatus includes a base 1, a bending mechanism and a cutting mechanism; the LED packaging structure is characterized in that a lower die holder 2 is fixedly connected to the base 1, a placing groove 3 is formed in the lower die holder 2, the placing groove 3 is used for placing an LED chip 4, pins 5 which are distributed equidistantly are fixedly connected to two sides of the LED chip 4, and the LED chip 4 and the pins 5 are fixed by the placing groove 3, so that subsequent bending is facilitated; the lower die holder 2 is provided with symmetrically arranged shaping through grooves 6, and the shaping through grooves 6 are positioned below the pins 5; a bending mechanism is arranged above the shaping through groove 6 and comprises a side pressure plate 11, the upper end of the side pressure plate 11 is fixedly connected with a fixed plate 9, the upper end of the fixed plate 9 is fixedly connected with a vertical hydraulic cylinder 24, the vertical hydraulic cylinder 24 drives the side pressure plate 11 to move downwards, the side pressure plate 11 is in butt fit with the inner side wall of the shaping through groove 6, and the pins 5 are extruded and bent; the lower end of the side pressing plate 11 is provided with a vertically arranged bending groove 12, and the bending grooves 12 are arranged in one-to-one correspondence with the pins 5; specifically, when the side pressing plates 11 move downwards, the pins 5 are nested in the bending grooves 12 and are bent along with the downward movement of the side pressing plates 11, so that the forming capability is good, and the bending effect is guaranteed.

An inner pressing plate 7 is nested on the inner side of the side pressing plate 11, the inner pressing plate 7 is in sliding fit with the side pressing plate 11, a clamp groove 13 matched with the pins 5 is formed in the edge of the inner pressing plate 7, a moving frame 8 is fixedly connected to the upper end of the inner pressing plate 7, the moving frame 8 penetrates through the fixed plate 9 and is in sliding connection with the fixed plate 9, and two groups of reset springs 10 which are distributed up and down are sleeved on the moving frame 8; specifically, when the vertical hydraulic cylinder 24 drives the fixed plate 9 and the side pressure plate 11 to move downwards, the inner pressure plate 7 is driven to move downwards, when the inner pressure plate 7 abuts against the lower die holder 2, the front sections of the pins 5 are nested in the clamping grooves 13, the inner pressure plate 7 is used for clamping and fixing the LED chips 4 and the pins 5, so that the pins 5 are kept stable, when the side pressure plate 11 is used for bending the pins 5, the front sections of the pins 5 are clamped and limited by the clamping grooves of the inner pressure plate 7, so that the stress of the pins 5 is uniform, the stress points of the pins 5 are moved from the connection positions of the pins 5 and the LED chips 4 to the bending positions of the pins 5, the connection positions of the pins 5 and the LED chips 4 are prevented from being stressed, the pins 5 and the LED chips 4 are prevented from being damaged, the stability during bending is improved; along with side pressure plate 11 continues the downstream, reset spring 10 of below is compressed gradually, side pressure plate 11 slides with moulding inside wall butt that leads to groove 6, buckle pin 5, make pin 5 buckle 90 degrees, bending groove 12 extrudees the pin gradually simultaneously, make pin 5 warp to buckle completely, improve the quality of buckling, after buckling and cutting the completion, vertical pneumatic cylinder 24 drives side pressure plate 11 and reciprocates, under reset spring 10's effect, initial position is got back to interior clamp 7, the operation of buckling next time of being convenient for, it is convenient to fix

LED chip

4 and 5 joints of pin.

In order to realize the truncation of the overlong pin 5; the lower die holder 2 is provided with a cutting groove 15 communicated with the shaping through groove 6, the cutting groove 15 is a horizontal groove, a moving block 16 is nested in the cutting groove 15, the moving block 16 is connected with the cutting groove 15 in a sliding manner, a cutter 17 is nested in the moving block 16, the cutter 17 extends to the outer side of the moving block 16, the moving block 16 is connected with a horizontal hydraulic cylinder 21, and a rectangular through groove 14 is formed in the side pressure plate 11 above the bending groove 12, so that the pins 5 are exposed, and the cutter 17 can conveniently pass through; specifically, the horizontal hydraulic cylinder 21 drives the moving block 16 and the cutoff knife 17 to move, the cutoff knife 17 penetrates through the rectangular through groove 14 to cut off the pins 5, the ultra-long pins 5 are cut off, after the cutting is finished, the horizontal hydraulic cylinder 21 drives the moving block 16 and the cutoff knife 17 to return to the initial positions, the vertical hydraulic cylinder 24 drives the side pressure plate 11 to return to the initial positions, and then the LED chips 4 are taken out.

Example 2

This example differs from example 1 in that: in order to adjust the cutting length of the pin 5 conveniently, a lifting block 18 is embedded in a moving block 16, a cutting knife 17 is fixedly connected with the lifting block 18, a vertical sliding groove matched with the lifting block 18 is formed in the moving block 16, a lead screw 19 is arranged in the vertical sliding groove, and the lead screw 19 penetrates through the lifting block 18 and is in threaded connection with the lifting block 18; the lead screw 19 extends to the upper part of the moving block 16 and is fixedly connected with an adjusting wheel 20, the lead screw 19 drives the lifting block 18 and the cutting knife 17 on the lifting block to move up and down by screwing the adjusting wheel 20, the cutting position of the cutting knife 17 is changed, the adjustment of the cutting length of the ultra-long pin 5 is further changed, the lead screw has good adaptability, and different production requirements are met.

In order to collect the broken pin slag after cutting, a communicating groove 22 communicated with the shaping through groove 6 is formed in the base 1, and a scrap box 23 is arranged below the communicating groove 22, so that the pin scraps can be collected conveniently.

The following are specifically mentioned: in the application, a cutting knife, a horizontal hydraulic cylinder and a vertical hydraulic cylinder are in the prior art; the lower die base is provided with a placing groove and comprises a side pressing plate, an inner pressing plate, a shaping through groove, a bending groove, a clamping groove, a rectangular through groove, a lifting block and a moving block, and the innovation point of the application is that the lower die base comprises the side pressing plate, the inner pressing plate, the shaping through groove, the bending groove, the clamping groove, the rectangular through groove; the pins are efficiently bent by the side pressing plate with the bending groove and the lower die holder with the shaping through groove, meanwhile, the front sections of the bending positions of the pins are clamped and fixed by the inner pressing plate, the stress at the connecting positions of the pins and the LED chip is reduced, the LED chip is prevented from being damaged, the stability during bending operation is improved, and the bending quality is improved; through being equipped with cut groove, movable block, elevator, lead screw and the side pressure board that has the rectangle and lead to the groove with moulding logical groove intercommunication, conveniently cut the pin after buckling to conveniently adjust the length of cutting, have good adaptability.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. An LED pin processing device comprises a base (1), a bending mechanism and a cutting mechanism; the LED packaging structure is characterized in that a lower die holder (2) is fixedly connected to the base (1), a placing groove (3) is formed in the lower die holder (2), LED chips (4) are nested in the placing groove (3), and pins (5) which are distributed at equal intervals are fixedly connected to two sides of each LED chip (4); the lower die holder (2) is provided with symmetrically arranged shaping through grooves (6), a bending mechanism is arranged above the shaping through grooves (6), the bending mechanism comprises side pressing plates (11), the upper ends of the side pressing plates (11) are fixedly connected with fixing plates (9), and the upper ends of the fixing plates (9) are fixedly connected with vertical hydraulic cylinders (24); the side pressure plate is characterized in that a vertically-arranged bending groove (12) is formed in the lower end of the side pressure plate (11), an inner pressure plate (7) is nested in the inner side of the side pressure plate (11), a clamp groove (13) matched with pins (5) is formed in the edge of the inner pressure plate (7), a movable frame (8) is fixedly connected to the upper end of the inner pressure plate (7), and two sets of reset springs (10) which are distributed up and down are sleeved on the movable frame (8).

2. The LED pin processing device according to claim 1, wherein the lower die holder (2) is provided with a cutting groove (15) communicated with the shaping through groove (6), the cutting groove (15) is a horizontal groove, a moving block (16) is nested in the cutting groove (15), a cutting knife (17) is nested in the moving block (16), the moving block (16) is connected with a horizontal hydraulic cylinder (21), and a rectangular through groove (14) is formed in the side pressure plate (11) above the bending groove (12).

3. The LED pin processing device according to claim 2, wherein a lifting block (18) is embedded in the moving block (16), the cutoff knife (17) is fixedly connected with the lifting block (18), a vertical sliding groove matched with the lifting block (18) is formed in the moving block (16), a lead screw (19) is arranged in the vertical sliding groove, and the lead screw (19) penetrates through the lifting block (18) and is in threaded connection with the lifting block (18); the screw rod (19) extends to the upper part of the moving block (16) and is fixedly connected with an adjusting wheel (20).

4. The LED pin processing device according to claim 1, wherein a communication groove (22) communicated with the shaping through groove (6) is formed in the base (1), and a scrap box (23) is arranged below the communication groove (22).

5. The LED pin processing apparatus according to claim 1, wherein the shaping channel (6) is located below the pin (5).

6. The LED pin processing device according to claim 1, wherein the movable frame (8) penetrates through the fixed plate (9) and is slidably connected with the fixed plate (9).

7. The LED pin processing device according to claim 1, wherein the bending grooves (12) are arranged in one-to-one correspondence with the pins.