CN111029315A - Chip flexible heat transfer mechanism - Google Patents
Chip flexible heat transfer mechanism Download PDFInfo
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- CN111029315A CN111029315A CN201911134403.4A CN201911134403A CN111029315A CN 111029315 A CN111029315 A CN 111029315A CN 201911134403 A CN201911134403 A CN 201911134403A CN 111029315 A CN111029315 A CN 111029315A
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- heat transfer
- chip
- heat conduction
- transfer mechanism
- heat
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a chip flexible heat transfer mechanism which is arranged on a chip and a heat conduction pad, wherein the heat transfer mechanism comprises a cold plate and a heat conduction block which are arranged up and down, the cold plate and the heat conduction block are connected by adopting an adjustable bolt, triangular inclined plane areas in multiple directions are symmetrically arranged by taking the heat conduction block as a center at the butt joint edge of the cold plate and the heat conduction block, an elastic triangular prism sliding mechanism is respectively arranged in each triangular inclined plane area, and flexible interconnection with a vertical heat transfer path of the chip is realized through the sliding of the elastic triangular prism sliding mechanism in the triangular inclined plane areas. According to the invention, flexible interconnection of a vertical heat transfer path is realized by designing the four-side elastic wedge block and the sliding mechanism, the problem of chip overvoltage or unsmooth heat transfer existing in rigid connection is solved, and compared with the heat dissipation performance of the conventional rigid heat transfer path, the heat dissipation capacity of 10-20% can be improved by the flexible heat transfer mechanism with the side length of 20mm, and the module installation and heat dissipation reliability is greatly improved.
Description
Technical Field
The invention belongs to the technical field of mechanical structures of electronic equipment, and relates to a chip flexible heat transfer mechanism.
Background
The current chip heat dissipation eliminates the assembly error of cold plate processing and modules through the deformation of the heat conducting pad, and the heat conducting pad has the phenomenon that the heat conducting pad is not tightly attached or extrudes the chip too tightly due to the limited deformation of the heat conducting pad, so that the heat transfer path is not smooth, and the risk of overheating the chip exists.
Disclosure of Invention
The purpose of the invention is as follows: the invention provides a chip flexible heat transfer mechanism, which aims to solve the problem of poor chip heat dissipation between a chip and a heat dissipation cold plate due to the fact that the chip is not tightly adhered or is pressed too tightly by a heat conduction pad due to the fact that the deformation of the heat conduction pad is limited.
The technical scheme of the invention is as follows: the flexible heat transfer mechanism of chip installs on chip and heat conduction pad, heat transfer mechanism is including cold drawing, the heat conduction piece that sets up from top to bottom, adopts adjustable bolted connection between cold drawing, the heat conduction piece, and the edge department that docks cold drawing and heat conduction piece has the triangle inclined plane region of a plurality of directions as central symmetry with the heat conduction piece, and every triangle inclined plane is regional to be installed elasticity triangular prism slide mechanism respectively, realizes the flexible interconnection with the vertical heat transfer route of chip through the regional slip in triangle inclined plane of elasticity triangular prism slide mechanism.
Preferably, the triangular prism sliding mechanism is formed by a triangular prism sliding block with the transversely arranged front end and an elastic mechanism at the inner side in a contact mode, and the elastic mechanism provides pre-tightening pressure to ensure that a heat transfer path is smooth.
Preferably, the heat conducting block is designed to have a moving space of 0-2 mm along the vertical direction, and can be compatible with most chip packaging errors, electric devices and assembly accumulated errors.
Preferably, the triangular inclined plane areas in four directions are symmetrically arranged by taking the heat conduction block as a center, so that the structure is more stable.
Preferably, the elastic mechanism is a spring or an arc-shaped elastic sheet.
The invention has the advantages and effects that: according to the invention, by designing the elastic triangular prism sliding mechanism and the triangular inclined plane area, flexible interconnection of a vertical heat transfer path is realized, the problem of excessive pressure or unsmooth heat transfer of a chip in rigid connection is solved, compared with the traditional rigid heat dissipation, the heat dissipation capacity can be improved by 10% -20% by the flexible heat transfer mechanism with the side length of 20mm, and the effect is good after the verification of actual use of a product.
Drawings
Fig. 1 is a schematic structural view (cross section) of a chip flexible heat transfer mechanism.
Fig. 2 is a schematic structural view (perspective) of the chip flexible heat transfer mechanism.
Fig. 3 is a schematic view of the connection between the arc-shaped spring plate and the heat conducting block and the cushion block.
In the figure, 1-cold plate, 2-heat conducting block, 3-triangular prism slide block, 4-cushion block, 5-circular arc spring, 6-heat conducting pad, 7-chip and 8-PCB plate.
Detailed Description
The chip flexible heat transfer mechanism shown in fig. 1 and 2 is installed on a chip 7 and a heat conducting pad 6, the heat transfer mechanism comprises a cold plate 1 and a heat conducting block 2 which are arranged up and down, adjustable bolt connection is adopted between the cold plate 1 and the heat conducting block 2, triangular inclined plane areas in multiple directions are symmetrically arranged with the heat conducting block 2 as a center at the edge where the cold plate 1 is butted with the heat conducting block 2, an elastic triangular prism sliding mechanism is respectively installed in each triangular inclined plane area, and flexible interconnection with a vertical heat transfer path of the chip 7 is realized through the sliding of the elastic triangular prism sliding mechanism in the triangular inclined plane areas.
The triangular prism sliding mechanism is formed by a triangular prism slide block 3 with the front end transversely arranged and an elastic mechanism at the inner side in a contact mode.
The heat conducting block 2 is designed to have a moving space of 0-2 mm along the vertical direction, the cushion block 4 is fixedly arranged on the heat conducting block 2, and the cushion block 4 is responsible for fixing the arc-shaped elastic sheet 5, as shown in fig. 3.
Triangular inclined plane areas in four directions are symmetrically arranged by taking the heat conduction block 2 as a center.
The elastic mechanism is a spring or an arc-shaped elastic sheet 5. The arc-shaped elastic sheet 5 is made of beryllium bronze, and other parts are made of aluminum alloy, so that the heat-conducting property is improved.
Claims (5)
1. Chip flexible heat transfer mechanism installs on chip (7) and heat conduction pad (6), its characterized in that: the heat transfer mechanism is including cold board (1), heat conduction piece (2) that set up from top to bottom, adopt adjustable bolted connection between cold board (1), heat conduction piece (2), the triangle inclined plane region that has a plurality of directions has been arranged as central symmetry in edge department heat conduction piece (2) of cold board (1) and heat conduction piece (2) butt joint, every triangle inclined plane region is installed elasticity triangular prism slide mechanism respectively, realize the flexible interconnection with the vertical heat transfer route of chip (7) through the regional slip of elasticity triangular prism slide mechanism at triangle inclined plane.
2. The chip flexible heat transfer mechanism of claim 1, wherein: the triangular prism sliding mechanism is formed by a triangular prism sliding block (3) with the front end transversely arranged and an elastic mechanism at the inner side in a contact mode.
3. The chip flexible heat transfer mechanism of claim 1, wherein: the heat conducting block (2) is designed to have a moving space of 0-2 mm along the vertical direction.
4. The chip flexible heat transfer mechanism of claim 1, wherein: triangular inclined plane areas in four directions are symmetrically arranged by taking the heat conduction block (2) as a center.
5. The chip flexible heat transfer mechanism of claim 1, wherein: the elastic mechanism is a spring or a circular arc-shaped elastic sheet (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911134403.4A CN111029315B (en) | 2019-11-19 | 2019-11-19 | Chip flexible heat transfer mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911134403.4A CN111029315B (en) | 2019-11-19 | 2019-11-19 | Chip flexible heat transfer mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111029315A true CN111029315A (en) | 2020-04-17 |
| CN111029315B CN111029315B (en) | 2021-09-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911134403.4A Active CN111029315B (en) | 2019-11-19 | 2019-11-19 | Chip flexible heat transfer mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111029315B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6411513B1 (en) * | 1999-12-10 | 2002-06-25 | Jacques Normand Bedard | Compliant thermal interface devices and method of making the devices |
| CN201119232Y (en) * | 2007-10-19 | 2008-09-17 | 讯凯国际股份有限公司 | Heat conduction device |
| CN201191959Y (en) * | 2008-03-17 | 2009-02-04 | 讯凯国际股份有限公司 | Heat conducting construction |
| CN102142407A (en) * | 2010-11-04 | 2011-08-03 | 聚信科技有限公司 | Heat conducting pad |
| JP2015073054A (en) * | 2013-10-04 | 2015-04-16 | 三菱電機株式会社 | Heat radiator |
| US20170363371A1 (en) * | 2016-06-15 | 2017-12-21 | Mellanox Technologies Ltd. | Self-adjusting cooling module |
| CN108430188A (en) * | 2018-02-12 | 2018-08-21 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Electronic module plug-in unit high efficiency and heat radiation wedge lock mechanism |
| CN209416117U (en) * | 2018-11-05 | 2019-09-20 | 新乡航空工业(集团)有限公司 | A kind of cold plate of high strengthening heat transfer structure |
-
2019
- 2019-11-19 CN CN201911134403.4A patent/CN111029315B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6411513B1 (en) * | 1999-12-10 | 2002-06-25 | Jacques Normand Bedard | Compliant thermal interface devices and method of making the devices |
| CN201119232Y (en) * | 2007-10-19 | 2008-09-17 | 讯凯国际股份有限公司 | Heat conduction device |
| CN201191959Y (en) * | 2008-03-17 | 2009-02-04 | 讯凯国际股份有限公司 | Heat conducting construction |
| CN102142407A (en) * | 2010-11-04 | 2011-08-03 | 聚信科技有限公司 | Heat conducting pad |
| JP2015073054A (en) * | 2013-10-04 | 2015-04-16 | 三菱電機株式会社 | Heat radiator |
| US20170363371A1 (en) * | 2016-06-15 | 2017-12-21 | Mellanox Technologies Ltd. | Self-adjusting cooling module |
| CN108430188A (en) * | 2018-02-12 | 2018-08-21 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Electronic module plug-in unit high efficiency and heat radiation wedge lock mechanism |
| CN209416117U (en) * | 2018-11-05 | 2019-09-20 | 新乡航空工业(集团)有限公司 | A kind of cold plate of high strengthening heat transfer structure |
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| Publication number | Publication date |
|---|---|
| CN111029315B (en) | 2021-09-21 |
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