CN111016475B - Method for predicting ink consumption of on-site intaglio hexagonal cell structure - Google Patents
Method for predicting ink consumption of on-site intaglio hexagonal cell structure Download PDFInfo
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- CN111016475B CN111016475B CN201911246311.5A CN201911246311A CN111016475B CN 111016475 B CN111016475 B CN 111016475B CN 201911246311 A CN201911246311 A CN 201911246311A CN 111016475 B CN111016475 B CN 111016475B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/10—Intaglio printing ; Gravure printing
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Abstract
The invention provides a method for predicting the ink consumption of an on-site intaglio hexagonal cell structure, which comprises the steps of firstly setting the hexagonal shape of printing dots and the dot size of exposed dots, and calculating the dot area rate; in the corrosion, calculating the reserved size of the exposure dots increased due to the corrosion according to the depth of the mesh holes and the corrosion proportion of the side wall of the screen wall, and determining the actual size of the exposure dots; and carrying out chromium plating on the corroded screen hole, and calculating the area rate of the mesh points of the screen hole after chromium plating. In the process, a parameter model of a mesh point structure is established, and finally, the area rate of mesh points, the volume of the mesh points, the consumption of ink and the like are accurately calculated, so that the method is fast and efficient.
Description
Technical Field
The invention relates to the technical field of printing, in particular to establishment of an on-site intaglio hexagonal cell structure parameter model.
Background
With the development of science and technology, the gravure plate making process is greatly changed and successively undergoes a plurality of development stages: the plate making process is developed from the initial manual engraving plate making process to the chemical etching plate making process, and then to the electronic mechanical engraving plate making process and the laser direct engraving plate making process. The gravure plate making technology commonly used in the market at present is electronic engraving plate making and laser engraving plate making, and the electronic engraving plate making and the laser engraving plate making are greatly different. As shown in fig. 1, a is an electronic engraving cell, which can only engrave hexagonal dots (including square dots), and the cell is pyramid-shaped, and has a V-shaped longitudinal section, so that ink is easily clamped during ink transfer, which affects ink transfer; and b, laser engraving of a mesh point, wherein mesh point shapes of different shapes can be designed according to the requirements of the printed product through laser engraving, the mesh point is columnar, and the longitudinal section of the mesh point is flat U-shaped, so that ink transfer is facilitated. When the opening size and the depth of the net holes with the two structures are the same, the volume of the U-shaped net hole, namely the ink storage capacity, is three times of that of the V-shaped net hole. Therefore, compared with electronic engraving, under the condition of the same ink storage amount, the laser engraving can be made shallower in the depth of the cells, so that the color generation requirement of the ink is met, and the drying problem of the water-based ink in the gravure process is effectively solved, and the problem is more serious in the aspect of gravure solid printing of the water-based ink.
The laser engraving intaglio uses one or more high-energy laser beams to directly ablate and form cells on a material (a metal layer or a base paint layer) to be engraved on the surface of a roller, or ablate the base paint layer to prepare for subsequent processing of the cells. Currently, there are two ways of laser direct engraving and laser ablation masking techniques: (1) the laser direct engraving printing plate means that high-energy laser is used for directly engraving the metal surface of a cylinder to form intaglio cells. It is expensive and the technology is not yet fully mature. (2) The laser ablation mask technology is that a black base paint layer is firstly coated on a copper roller, a hole area is ablated by laser, so that a copper layer at a hole is exposed, a non-hole position is protected by the base paint to resist corrosion, and a concave hole can be obtained after corrosion. This patent uses a laser ablation masking technique.
The laser ablation mask technology is a technology for indirectly generating gravure cells by laser. The basic working principle is as follows: coating the surface of a copper-plated printing plate to form a layer of base paint layer (namely a mask), etching the image-text part on the surface of the printing plate by using laser to expose the copper surface of the image-text part, and after the ablation is finished, carrying out corrosion, chromium plating and post-treatment on the surface of the roller to finally obtain the gravure roller.
The laser etching gravure plate making process flow comprises the following steps: the method comprises the following steps of original manuscript, DTP system, laser etching system workstation, roller grinding and plating, glue spraying, laser etching, corrosion and chrome plating.
The area of the opening of the mesh formed by the laser ablation mask technology is changed along with the shade of the image color, and the depth of the mesh can be set to be a fixed value; however, in the process of roller corrosion, due to the corrosion of the corrosive liquid, the side wall of the mesh hole can be corroded along with the deep corrosion of the mesh hole, so that the width of the mesh wall is narrowed, and the deviation between the size of the mesh hole after chrome plating and the actual size is caused, which brings trouble to the processing process and also increases the possibility of errors.
Disclosure of Invention
In view of the problems in the exposure, corrosion and chromium plating processes, the invention aims to establish an ink usage amount prediction method for an on-site intaglio hexagonal cell structure, which establishes an on-site intaglio hexagonal cell structure parameter model, can conveniently and accurately calculate the size before and after dot processing, obtain a cell volume value and predict the ink usage amount.
The invention relates to a method for predicting the ink consumption of an on-site intaglio hexagonal cell structure, which comprises the following steps of:
1) determining the angle of a network cable, the number of the network cables and the network adding mode;
determining the diagonal length A of each hexagonal reference mesh point according to the number of the added mesh lines0;
The angle of the network cable is as follows: the included angle between the central connecting line of the adjacent net points and the datum line is set to be 60 degrees;
a screening mode: setting amplitude modulation dots, representing the image layers according to the sizes of the dots, wherein the spacing between the reference dots is fixed, and the sizes of the dots can be changed;
2) size of reference dot:
side length of reference dotArea of reference dotMesh wall size C, unilateral mesh wall size C1C/2; the wall thickness of the net wall isThe value of the exposed dots, i.e. the size of the openings of the hexagonal cells, is A1=A0-C with an edge length ofArea of
3) Actual exposure dot size:
determining the transverse size change and corrosion depth ratio of corrosion as a corrosion transverse-longitudinal ratio k according to a corrosion process;
according to the corrosion depth h of the net holes, calculating the reduction value delta d of the net wall after corrosion to be k h, wherein the net wall of the actual exposure net point isThe corresponding net wall value of the actual exposure net point isMajor axis A of actual exposure dot2=A0-2*c2The net value of the actual exposure net point is A2=A0-2*c2The side length of the hexagon isThe area of the actual exposed dot is
4) Mesh size after etching:
after etching, the sharp corner of the lattice point forms a circular arc with a radius ofEtched single side Net wall c'1=c2-r1And the net value after etching is A'1=A0-2*c'1The area of six non-corroded round corners isThe open area of the mesh hole after etching is S'1=S1-ΔS1And the area ratio of the dots is obtained after calculation
5) The size of the mesh after chrome plating is as follows:
assuming that the thickness of the chromium plating layer is t and the size of the single-side fillet net wall after chromium plating is c'3=c'1+ t, the diagonal length of the mesh hole, i.e. the mesh value is A'3=A'12t, corresponding hexagonal net value A3,A3=A0-2C3Side length ofThe net wall is d3=d2+ t, phaseNet wallRadius of fillet r at the apex2=r1T, area of six fillets after chromium plating isAfter chromium plating, the opening area of the mesh isThe final dot area ratio isThe volume of a single net cavity is V ═ S3H; the cell volume of the solid gravure plate is V/S0;
6) Calculating the using amount of the printing ink: if the area of the area is S, the total volume of the cells of the solid gravure printing area, namely the theoretical value of the ink consumption is
In the method for predicting the ink consumption of the hexagonal cell structure of the solid intaglio, the number of the screen lines of the solid intaglio is set to be 80l/cm, and the diagonal length of the reference screen point is A0=122μm。
According to the method for predicting the ink consumption of the solid gravure hexagonal cell structure, the corrosion transverse-longitudinal ratio is 7: 10.
In the method for predicting the ink consumption of the solid intaglio hexagonal cell structure, the size of the printing surface is L & ltB & gt, and the area of the printing surface is S & ltL & gtB & gt.
The invention has the beneficial effects that: the method comprises the steps of firstly setting the hexagonal shape of printing dots and the dot size of exposure dots, and calculating the dot area rate; in the corrosion, calculating the reserved size of the exposure dots increased due to the corrosion according to the depth of the mesh holes and the corrosion proportion of the side wall of the screen wall, and determining the actual size of the exposure dots; and carrying out chromium plating on the corroded screen hole, and calculating the area rate of the mesh points of the screen hole after chromium plating. In the process, a parameter model of a mesh point structure is established, and finally, the area rate of mesh points, the volume of the mesh points, the consumption of ink and the like are accurately calculated, so that the method is fast and efficient.
Drawings
FIG. 1 is a schematic diagram of a cell;
FIG. 2 basic structure diagram of the screen dots
FIG. 3 is a graph of exposure dot size settings;
FIG. 4 is a schematic diagram of the cross-to-longitudinal ratio of the grid erosion;
FIG. 5 is a graph of actual exposed dot size;
FIG. 6 is a graph of cell size after etching;
FIG. 7 is a partial enlarged view of a mesh after etching;
FIG. 8 is a diagram showing the dimensions of the cells after chrome plating;
FIG. 9 is a partial enlarged view of a chrome plated mesh;
FIG. 10 is a diagram illustrating the effect of a hexagonal cell arrangement;
fig. 11 is a diagonal cross-sectional view of hexagonal cells.
Detailed Description
In order to make the object, technical solution and effect of the present invention clearer and clearer, the method for predicting the amount of ink used in the solid gravure hexagonal cell structure of the present invention will be described in further detail below with reference to the accompanying drawings by way of examples.
The invention establishes an on-site intaglio hexagonal cell structure parameter model.
The parameter model of the mesh structure is hexagonal. The basic structure is shown in fig. 2.
Net value A: the size of the cell opening. Net wall C, net wall D: the interval between the net points plays a supporting role for the scraper. As shown in FIG. 2
Number of screened lines: the number of the solid intaglio screening lines is set to 80l/cm, thereby determining the size of each reference screen dot, and the diagonal line is A0. The following algorithm is also applicable to other screening numbers.
The angle of the network cable is as follows: the included angle between the central connecting line of the adjacent lattice points and the datum line is set to be 60 degrees.
A screening mode: setting the image as amplitude modulation mesh points, expressing the image layers by the sizes of the points, wherein the spacing between the reference mesh points is fixed, and the mesh point sizes can be changed.
In the gravure solid printing plate, since the ink in the cells must be supported by the walls, there is a problem in that the area ratio of the cells of the solid printing plate is occupied. The values of the exposure, corrosion and chromium plating process parameters are correspondingly changed along with the adjustment of the exposure, corrosion and chromium plating process parameters.
Size of reference dot: when the number of the added grids is 80l/cm, the diagonal length of the reference grid point is about A0122.00 μm, standard dot side lengthThe area of the reference mesh point is as follows:
setting the screen dot size: let the mesh wall size C be 8.00 μm, and the mesh wall on one side be C14.00 μm, wall thickness of net wallThe value of the exposure dot, i.e. the size of the opening of the hexagonal cells, is set to A1=A0-2*c1114.00 μm with a side length ofArea ofThe area ratio of the mesh point is calculated to beThe dot exposure size is set as shown in fig. 3.
Corrosion transverse-longitudinal ratio: corrosion is a very important and complex step in the formation of gravure cells. In the etching, as shown in fig. 4, the grid cells etch the side walls of the grid cells simultaneously with the deep etching, which narrows the width of the grid wall and affects the opening area and volume of the grid cells. According to the etching process, the ratio of the lateral dimension change of the etch to the etch depth is
Actual exposure dot size: for a diagonal length of A1In the case of an exposed dot of 114 μm, when the depth of etching of the cell is 15 μm, the wall etching variation size Δ d is 10.50 μm, and in the case of a hexagon, the variation value of one-sided wall is 10.50 μmIf the area ratio of the dots before and after etching is to be kept constant, the delta d change value should be added to the walls of the exposed dots before etching, and then exposure is carried out, i.e. the single-sided walls of the actual exposed dots should beThe corresponding dimension of the net wall of the actual exposure net point isThe net value of the actual exposure net point is A2=A0-2*c2The side length of the hexagon isAs shown in FIG. 5, the area of the actual exposed dot is
Mesh size after etching: as the corrosive liquid performs uniform infiltration corrosion on the periphery of the mesh point, the sharp corner of the mesh point forms an arc shape after corrosion. Fig. 6 is a diagram showing the size of the etched cells, and fig. 7 is a partially enlarged diagram of the etched cells. Radius of arc ofWherein the single-side net wall of the net holes after corrosion is c'1=c2-r1And the net value after etching is A'1=A0-2*c'1Six rounded corners W1 reducing the areaHas an opening area of S'1=S1-ΔS1And the area ratio of the dots is obtained after calculation
And (3) chromium plating: assuming that the thickness of the chromium plating layer is t-3.00 mu m and the size of the single-side fillet net wall after chromium plating is c'3=c'1+ t is 7.81 μm, and the diagonal length of the mesh cells, i.e. the mesh value, is A'3=A'1-2t, web wall d3=d2+ t, corresponding net wallThe net value of the corresponding hexagon is A3,A3=A0-2C3Side length ofRadius of fillet r at the apex2=r1T, area reduction at six rounded cornersCalculating the value of the opening area of the net hole asFig. 8 is a detail view showing the size of the cells after chrome plating, and fig. 9 is a detail view showing the cells after chrome plating. The final dot area rate is obtained by calculationThe volume of a single net cavity is V ═ S3*h=111670.41μm3(ii) a The cell volume of the solid gravure plate is V/S0Approximately equal to 7.45 BCM.
And calculating the using amount of the ink. Fig. 10 is a diagram showing the effect of the arrangement of hexagonal cells on the spot, and fig. 11 is a cross-sectional view of the cell diagonal. Setting the size of the printing plate as 320mm 450mm, and the area of the printing plate as S320 mm 450mm 144000.00mm2The theoretical value of the total volume of cells, namely the ink consumption, of the solid gravure printing surface is
Claims (4)
1. The method for predicting the ink consumption of the solid gravure hexagonal cell structure is characterized by comprising the following steps of: the method comprises the following steps:
1) determining the angle of a network cable, the number of the network cables and the network adding mode;
determining the diagonal length A of each hexagonal reference mesh point according to the number of the added mesh lines0;
The angle of the network cable is as follows: the included angle between the central connecting line of the adjacent net points and the datum line is set to be 60 degrees;
a screening mode: setting amplitude modulation dots, representing the image layers according to the sizes of the dots, wherein the spacing between the reference dots is fixed, and the sizes of the dots can be changed;
2) size of reference dot:
side length of reference dotArea of reference dotMesh wall size C, unilateral mesh wall size C1C/2; the wall thickness of the net wall isThe value of the exposed dots, i.e. the size of the openings of the hexagonal cells, is A1=A0-C with an edge length ofArea of
3) Actual exposure dot size:
determining the transverse size change and corrosion depth ratio of corrosion as a corrosion transverse-longitudinal ratio k according to a corrosion process;
according to the corrosion depth h of the mesh holesCalculating the reduction value delta d of the net wall after corrosion, wherein the net wall of the actual exposure net point isThe corresponding net wall value of the actual exposure net point isMajor axis A of actual exposure dot2=A0-2*c2The net value of the actual exposure net point is A2=A0-2*c2The side length of the hexagon isThe area of the actual exposed dot is
4) Mesh size after etching:
after etching, the sharp corner of the lattice point forms a circular arc with a radius ofEtched single side Net wall c'1=c2-r1And the net value after etching is A'1=A0-2*c'1The area of six non-corroded round corners isThe open area of the mesh hole after etching is S'1=S1-ΔS1And the area ratio of the dots is obtained after calculation
5) The size of the mesh after chrome plating is as follows:
assuming that the thickness of the chromium plating layer is t and the size of the single-side fillet net wall after chromium plating is c'3=c'1+ t, the diagonal length of the mesh hole, i.e. the mesh value is A'3=A'1-2t,Corresponding hexagonal net value of A3,A3=A0-2C3Side length ofThe net wall is d3=d2+ t, corresponding net wallRadius of fillet r at the apex2=r1T, area of six fillets after chromium plating isAfter chromium plating, the opening area of the mesh isThe final dot area ratio isThe volume of a single net cavity is V ═ S3H; the volume of the cells of the solid intaglio plate is V/S0;
2. The method of predicting ink usage of solid gravure hexagonal cell structure of claim 1, wherein:
the number of the grid lines of the solid intaglio plate is set to be 80l/cm, and the diagonal length of the reference net point is A0=122μm。
3. The method of predicting ink usage of solid gravure hexagonal cell structure of claim 1, wherein: the corrosion transverse-longitudinal ratio is 7: 10.
4. The method of predicting ink usage of solid gravure hexagonal cell structure of claim 1, wherein: the size of the printed product is L & ltB & gt, and the area of the printed product is S & ltL & gtB & gt.
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JP2005103889A (en) * | 2003-09-30 | 2005-04-21 | Toppan Printing Co Ltd | Gravure printing plate |
EP1568490B1 (en) * | 2004-02-27 | 2007-08-15 | HELL Gravure Systems GmbH & Co. KG | Method for the direct engraving of cups for receiving the printing ink in intaglio printing |
JP4020107B2 (en) * | 2004-07-12 | 2007-12-12 | 凸版印刷株式会社 | Gravure printing plate |
JP4020109B2 (en) * | 2004-07-23 | 2007-12-12 | 凸版印刷株式会社 | Gravure printing plates, gravure prints, and booklets |
CN101402275A (en) * | 2008-10-16 | 2009-04-08 | 泉州运城制版有限公司 | Method for manufacturing gravure printing roller with electronic carving method |
CN203876359U (en) * | 2013-11-01 | 2014-10-15 | 上海英内电子标签有限公司 | Gravure plate roller |
KR102528799B1 (en) * | 2015-02-06 | 2023-05-08 | 가부시키가이샤 유에이씨제이 포일 | gravure printing rolls |
JP6319859B1 (en) * | 2017-10-02 | 2018-05-09 | 下村 恭一 | Gravure printing plate and cell shape and halftone dot forming method formed there |
CN108454223A (en) * | 2018-02-09 | 2018-08-28 | 东莞智源彩印有限公司 | A kind of production method that laser directly carves gravure |
CN208801711U (en) * | 2018-09-13 | 2019-04-30 | 南京林业大学 | A kind of intaglio printing phenyl ring network structure |
CN109228611B (en) * | 2018-09-13 | 2023-05-09 | 南京林业大学 | Design method of adjustable gravure plate pillow net-shaped structure |
CN108909151A (en) * | 2018-09-13 | 2018-11-30 | 南京林业大学 | A kind of intaglio printing phenyl ring network structure |
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