CN111016474A - Method for predicting ink consumption of on-site gravure square cell structure - Google Patents

Method for predicting ink consumption of on-site gravure square cell structure Download PDF

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CN111016474A
CN111016474A CN201911246307.9A CN201911246307A CN111016474A CN 111016474 A CN111016474 A CN 111016474A CN 201911246307 A CN201911246307 A CN 201911246307A CN 111016474 A CN111016474 A CN 111016474A
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size
mesh
net
area
corrosion
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CN111016474B (en
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邢洁芳
董玲
吴霜
左楚
管晓敏
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Nanjing Forestry University
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00Inking and printing with a printer's forme
    • B41M1/10Intaglio printing ; Gravure printing

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Abstract

The invention provides a method for predicting the ink consumption of a square grid hole structure of a field intaglio plate, which comprises the steps of firstly setting the square shape of printing grid points and the size of the exposed grid points, and calculating the area rate of the grid points; in the corrosion, calculating the reserved size of the exposure dots increased due to the corrosion according to the depth of the mesh holes and the corrosion proportion of the side wall of the screen wall, and determining the actual size of the exposure dots; and carrying out chromium plating on the corroded screen hole, and calculating the area rate of the mesh points of the screen hole after chromium plating. In the process, a parameter model of a mesh point structure is established, and finally, the area rate of mesh points, the volume of the mesh points, the consumption of ink and the like are accurately calculated, so that the method is fast and efficient.

Description

Method for predicting ink consumption of on-site gravure square cell structure
Technical Field
The invention relates to the technical field of printing, in particular to a technical background for establishing a field gravure square cell structure parameter model.
Background
With the development of science and technology, the gravure plate making process is greatly changed and successively undergoes a plurality of development stages: the plate making process is developed from the initial manual engraving plate making process to the chemical etching plate making process, and then to the electronic mechanical engraving plate making process and the laser direct engraving plate making process. The gravure plate making technology commonly used in the market at present is electronic engraving plate making and laser engraving plate making, and the electronic engraving plate making and the laser engraving plate making are greatly different. As shown in fig. 1, a is an electronic engraving cell, the electronic engraving can only engrave diamond dots, the cell is pyramid-shaped, and the longitudinal section of the cell is V-shaped, so that ink is easily clamped during ink transfer, and the ink transfer is affected; and b, laser engraving of a mesh point, wherein mesh point shapes of different shapes can be designed according to the requirements of the printed product through laser engraving, the mesh point is columnar, and the longitudinal section of the mesh point is flat U-shaped, so that ink transfer is facilitated. When the opening size and the depth of the net holes with the two structures are the same, the volume of the U-shaped net hole, namely the ink storage capacity, is three times of that of the V-shaped net hole. Therefore, compared with electronic engraving, under the condition of the same ink storage amount, the laser engraving can be made shallower in the depth of the cells, so that the color generation requirement of the ink is met, and the drying problem of the water-based ink in the gravure process is effectively solved, and the problem is more serious in the aspect of gravure solid printing of the water-based ink.
The laser engraving intaglio uses one or more high-energy laser beams to directly ablate and form cells on a material (a metal layer or a base paint layer) to be engraved on the surface of a roller, or ablate the base paint layer to prepare for subsequent processing of the cells. At present, two methods of laser direct engraving and laser ablation mask technology exist, (1) laser direct engraving printing plate means that high-energy laser is used for directly engraving the metal surface of a cylinder to form a gravure cell. It is expensive and the technology is not yet fully mature. (2) The laser ablation mask technology is that a black base paint layer is firstly coated on a copper roller, a hole area is ablated by laser, so that a copper layer at a hole is exposed, a non-hole position is protected by the base paint to resist corrosion, and a concave hole can be obtained after corrosion. This patent uses a laser ablation masking technique.
The laser ablation mask technology is a technology for indirectly generating gravure cells by adopting laser. The basic working principle is as follows: coating the surface of a copper-plated printing plate to form a layer of base paint layer (namely a mask), etching the image-text part on the surface of the printing plate by using laser to expose the copper surface of the image-text part, and after the ablation is finished, carrying out corrosion, chromium plating and post-treatment on the surface of the roller to finally obtain the gravure roller.
The laser etching gravure plate making process flow comprises the following steps: the method comprises the following steps of original manuscript, DTP system, laser etching system workstation, roller grinding and plating, glue spraying, laser etching, corrosion and chrome plating.
The area of the opening of the mesh formed by the laser ablation mask technology is changed along with the shade of the image color, and the depth of the mesh can be set to be a fixed value; however, in the process of roller corrosion, due to the corrosion of the corrosive liquid, the side wall of the mesh hole can be corroded along with the deep corrosion of the mesh hole, so that the width of the mesh wall is narrowed, and the deviation between the size of the mesh hole after chrome plating and the actual size is caused, which brings trouble to the processing process and also increases the possibility of errors.
Disclosure of Invention
In view of the problems in the exposure, corrosion and chromium plating processes, the invention aims to establish an ink usage amount prediction method for a field gravure square cell structure, which establishes a field gravure square cell structure parameter model, can conveniently and accurately calculate the size before and after dot processing, obtains a cell volume value and predicts the ink usage amount.
The invention relates to a method for predicting the ink consumption of a solid gravure square cell structure, which comprises the following steps:
1) determining the number of the screening lines, the angle of the screening lines and the screening mode;
determining the size of each reference screen point according to the number of the screened lines, wherein the diagonal line of each reference screen point is A0
The angle of the network cable is as follows: the included angle between the central connecting line of the adjacent net points and the datum line is set to be 45 degrees;
a screening mode: setting amplitude modulation dots, representing the image layers according to the sizes of the dots, wherein the spacing between the reference dots is fixed, and the sizes of the dots can be changed;
2) size of reference dot:
the area of the reference mesh point is as follows:
Figure BDA0002307789750000021
mesh wall size C, unilateral mesh wall size C1C/2; the wall thickness of the net wall is
Figure BDA0002307789750000022
The value of the exposed dots, i.e. the size of the opening of the cells, is A1=A0-2*c1The area of the net point is
Figure BDA0002307789750000023
3) Actual exposure dot size:
determining the transverse size change and corrosion depth ratio of corrosion as a corrosion transverse-longitudinal ratio k according to a corrosion process;
according to the corrosion depth h of the net holes, calculating the reduction value delta d of the net wall after corrosion to be k h, wherein the net wall of the actual exposure net point is
Figure BDA0002307789750000024
The corresponding net wall value of the actual exposure net point is
Figure BDA0002307789750000025
The diagonal length of the actual exposure dot, i.e. the opening size, is A2=A0-2*c2The actual exposure dot area is
Figure BDA0002307789750000026
4) Mesh size after etching:
after etching, the sharp corner of the lattice point forms a circular arc with a radius of
Figure BDA0002307789750000027
Etched single side Net wall c'1=c2-r1And the diagonal length of the net cave is A'1=A0-2*c'1The area of four non-corroded fillets is delta S1=(2r1)2-πr1 2After etching, the area of the cell opening is S'1=S1-ΔS1And the area ratio of the dots is obtained after calculation
Figure BDA0002307789750000028
5) The size of the mesh after chrome plating is as follows:
assuming that the thickness of the chromium plating layer is t and the size of the single-side fillet net wall after chromium plating is c'3=c'1+ t, the diagonal length of the mesh hole, i.e. the mesh value is A'3=A'12t, corresponding to a diagonal length of the square A3,A3=A0-2d3=A0-2(d1+ t) opposite-vertex net wall size of
Figure BDA0002307789750000029
Thickness of the net wall is d3=d1+ t, radius of the fillet at the apex r2=r1T, area of four fillets after chromium plating is Delta S2=(2r2)2-πr2 2After chromium plating, the opening area of the mesh is
Figure BDA0002307789750000031
The final dot area ratio is
Figure BDA0002307789750000032
The volume of a single net cavity is V ═ S3H; the cell volume of the solid gravure plate is V/S0
6) Calculating the using amount of the printing ink: if the area of the area is S, the total volume of the cells of the solid gravure printing area, namely the theoretical value of the ink consumption is
Figure BDA0002307789750000033
In the method for predicting the ink consumption of the square cell structure of the solid intaglio plate, the number of the solid intaglio plate screen lines is set to be 70l/cm, and the diagonal line of the reference screen point is A0=140μm。
According to the method for predicting the ink consumption of the solid gravure square cell structure, the corrosion transverse-longitudinal ratio is 7: 10.
In the method for predicting the ink consumption of the solid gravure square cell structure, the size of the printing surface is L & ltB & gt, and the area of the printing surface is S & ltL & gtB & gt.
The invention has the beneficial effects that: the square shape of a printing dot and the dot size of an exposure dot are set firstly, and the dot area rate is calculated; in the corrosion, calculating the reserved size of the exposure dots increased due to the corrosion according to the depth of the mesh holes and the corrosion proportion of the side wall of the screen wall, and determining the actual size of the exposure dots; and carrying out chromium plating on the corroded screen hole, and calculating the area rate of the mesh points of the screen hole after chromium plating. In the process, a parameter model of a mesh point structure is established, and finally, the area rate of mesh points, the volume of the mesh points, the consumption of ink and the like are accurately calculated, so that the method is fast and efficient.
Description of the drawings:
FIG. 1 is a schematic diagram of a cell;
FIG. 2 basic structure diagram of the screen dots
FIG. 3 is a graph of exposure dot size settings;
FIG. 4 is a schematic diagram of the cross-to-longitudinal ratio of the grid erosion;
FIG. 5 is a graph of actual exposed dot size;
FIG. 6 is a graph of cell size after etching;
FIG. 7 is a partial enlarged view of a mesh after etching;
FIG. 8 is a diagram showing the dimensions of the cells after chrome plating;
FIG. 9 is a partial enlarged view of a chrome plated mesh;
FIG. 10 is a diagram showing the effect of the arrangement of solid square cells;
figure 11 is a diagonal cross-sectional view of a square cell.
Detailed Description
In order to make the object, technical solution and effect of the present invention clearer and clearer, the method for predicting the amount of ink used in the solid gravure square cell structure of the present invention will be described in further detail below with reference to the accompanying drawings by way of examples.
The invention establishes a field gravure square cell structure parameter model.
The parameter model of the mesh structure is a square structure, and the basic structure is shown in figure 2.
Net value A: the size of the cell opening. Net wall C, net wall D: the interval between the net points plays a supporting role for the scraper. As shown in fig. 2.
Number of screened lines: the number of the solid intaglio screening lines is set to 70l/cm, thereby determining the size of each reference dotDiagonal line of A0. The following algorithm is also applicable to other screening numbers.
The angle of the network cable is as follows: the included angle between the central connecting line of the adjacent lattice points and the datum line is set to be 45 degrees.
A screening mode: setting the image as amplitude modulation mesh points, expressing the image layers by the sizes of the points, wherein the spacing between the reference mesh points is fixed, and the mesh point sizes can be changed.
The area of the reference mesh point is as follows:
Figure BDA0002307789750000041
setting the screen dot size: let the mesh wall size C be 8.00 μm and the single-sided mesh wall size C14.00 μm, wall thickness of net wall
Figure BDA0002307789750000042
Setting the value of the exposure dot, i.e. the opening size of the cells, to A1=A0-2*c1132.00 μm, dot area
Figure BDA0002307789750000043
Having a dot area ratio of
Figure BDA0002307789750000044
The dot exposure size is set as shown in fig. 3.
Corrosion transverse-longitudinal ratio: corrosion is a very important and complex step in the formation of gravure cells. In the etching, as shown in fig. 4, the grid cells etch the side walls of the grid cells simultaneously with the deep etching, which narrows the width of the grid wall and affects the opening area and volume of the grid cells. According to the etching process, the ratio of the lateral dimension change of the etch to the etch depth is
Figure BDA0002307789750000045
Actual exposure dot size: for a diagonal length of A1132.00 is: the exposed dots of (2) have a cell depth of h of 15 μm, a wall erosion variation size Δ d of 10.50 μm, and a wall erosion variation size on one side of the wallIs composed of
Figure BDA0002307789750000046
If the area ratio of the etched dots is to be kept constant, the delta d variation value is added to the corresponding net wall, and then exposure is carried out, i.e. the net wall of the actual exposed dots is
Figure BDA0002307789750000047
The corresponding net wall value of the actual exposure net point is
Figure BDA0002307789750000048
The diagonal length of the actual exposure dot, i.e. the opening size, is A2=A0-2*c2As shown in FIG. 5, the actual exposed dot area is
Figure BDA0002307789750000049
Mesh size after etching: as the corrosive liquid performs uniform infiltration corrosion on the periphery of the mesh point, the sharp corner of the mesh point forms an arc shape after corrosion. Fig. 6 is a diagram showing the size of the etched cells, and fig. 7 is a partially enlarged diagram of the etched cells. Radius of arc of
Figure BDA00023077897500000410
Wherein, the etched single-side net wall c'1=c2-r1And the diagonal length of the net cave is A'1=A0-2*c'1The area reduced at the four round corners is Delta S1=(2r1)2-πr1 2The area of the mesh hole opening is S'1=S1-ΔS1And the area ratio of the dots is obtained after calculation
Figure BDA00023077897500000411
And (3) chromium plating: assuming that the thickness of the chromium plating layer is t-3.00 mu m and the size of the single-side fillet net wall after chromium plating is c'3=c'1+ t, the diagonal length of the mesh hole, i.e. the mesh value is A'3=A'12t, corresponding to a diagonal length of the square A3The size of the opposite-top net wall is
Figure BDA0002307789750000051
Thickness of the net wall is d3=d1+ t, radius of the fillet at the apex r2=r1T, four rounded corners reduced by an area Δ S2=(2r2)2-πr2 2The area of the opening of the mesh hole is
Figure BDA0002307789750000052
FIG. 8 is a diagram showing the size of the cells after chrome plating, FIG. 9 is a partial enlarged view of the rounded corner portions of the dots after chrome plating, and the final dot area ratio calculated is
Figure BDA0002307789750000053
The volume of a single net cavity is V ═ S3*h=114353.96μm3(ii) a The cell volume of the solid gravure plate is V/S0Approximately equal to 7.53 BCM.
And calculating the using amount of the ink. FIG. 10 is a diagram illustrating the effect of the grid cell arrangement in the field; fig. 11 is a diagonal cross-sectional view of a cell. Setting the size of the printing plate as 320mm 450mm, and the area of the printing plate as S320 mm 450mm 144000.00mm2The theoretical value of the total volume of cells, namely the ink consumption, of the solid gravure printing surface is
Figure BDA0002307789750000054

Claims (4)

1. The method for predicting the ink consumption of the solid gravure square cell structure is characterized by comprising the following steps of: the method comprises the following steps:
1) determining the number of the screening lines, the angle of the screening lines and the screening mode;
determining the size of each reference screen point according to the number of the screened lines, wherein the diagonal line of each reference screen point is A0
The angle of the network cable is as follows: the included angle between the central connecting line of the adjacent net points and the datum line is set to be 45 degrees;
a screening mode: setting amplitude modulation dots, representing the image layers according to the sizes of the dots, wherein the spacing between the reference dots is fixed, and the sizes of the dots can be changed;
2) size of reference dot:
the area of the reference mesh point is as follows:
Figure FDA0002307789740000011
mesh wall size C, unilateral mesh wall size C1C/2; the wall thickness of the net wall is
Figure FDA0002307789740000012
The value of the exposed dots, i.e. the size of the opening of the cells, is A1=A0-2*c1The area of the net point is
Figure FDA0002307789740000013
3) Actual exposure dot size:
determining the transverse size change and corrosion depth ratio of corrosion as a corrosion transverse-longitudinal ratio k according to a corrosion process;
according to the corrosion depth h of the net holes, calculating the reduction value delta d of the net wall after corrosion to be k h, wherein the net wall of the actual exposure net point is
Figure FDA0002307789740000014
The corresponding net wall value of the actual exposure net point is
Figure FDA0002307789740000015
The diagonal length of the actual exposure dot, i.e. the opening size, is A2=A0-2*c2The actual exposure dot area is
Figure FDA0002307789740000016
4) Mesh size after etching:
after etching, the sharp corner of the lattice point forms a circular arc with a radius of
Figure FDA0002307789740000017
Etched single side Net wall c'1=c2-r1And the diagonal length of the net cave is A'1=A0-2*c'1The area of each of the four un-corroded rounded corners W1 is Delta S1=(2r1)2-πr1 2After etching, the area of the cell opening is S'1=S1-ΔS1And the area ratio of the dots is obtained after calculation
Figure FDA0002307789740000018
5) The size of the mesh after chrome plating is as follows:
assuming that the thickness of the chromium plating layer is t and the size of the single-side fillet net wall after chromium plating is c'3=c'1+ t, the diagonal length of the mesh hole, i.e. the mesh value is A'3=A'12t, corresponding to a diagonal length of the square A3,A3=A0-2d3=A0-2(d1+ t) opposite-vertex net wall size of
Figure FDA0002307789740000019
Thickness of the net wall is d3=d1+ t, radius of the fillet at the apex r2=r1T, area of four rounded corners W2 after chrome plating is Delta S2=(2r2)2-πr2 2After chromium plating, the opening area of the mesh is
Figure FDA00023077897400000110
The final dot area ratio is
Figure FDA00023077897400000111
The volume of a single net cavity is V ═ S3H; the cell volume of the solid gravure plate is V/S0
6) Calculating the using amount of the printing ink: if the area of the area is S, the total volume of the cells of the solid gravure printing area, namely the theoretical value of the ink consumption is
Figure FDA0002307789740000021
2. The method of predicting ink usage of solid gravure square cell structure of claim 1, wherein:
the number of the grid lines of the solid intaglio is set to be 70l/cm, and the diagonal line of the reference grid point is A0=140μm。
3. The method of predicting ink usage of solid gravure square cell structure of claim 1, wherein:
the corrosion transverse-longitudinal ratio is 7: 10.
4. The method of predicting ink usage of solid gravure square cell structure of claim 1, wherein: the size of the printed product is L & ltB & gt, and the area of the printed product is S & ltL & gtB & gt.
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CN109228611A (en) * 2018-09-13 2019-01-18 南京林业大学 A kind of adjustable gravure pillow network structure design method
JP2019064245A (en) * 2017-10-02 2019-04-25 下村 恭一 Gravure printing plate and preparation method of cell shape formed therein and halftone dot
CN208801711U (en) * 2018-09-13 2019-04-30 南京林业大学 A kind of intaglio printing phenyl ring network structure

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005103889A (en) * 2003-09-30 2005-04-21 Toppan Printing Co Ltd Gravure printing plate
EP1568490B1 (en) * 2004-02-27 2007-08-15 HELL Gravure Systems GmbH & Co. KG Method for the direct engraving of cups for receiving the printing ink in intaglio printing
JP2006026926A (en) * 2004-07-12 2006-02-02 Toppan Printing Co Ltd Gravure printing plate, gravure printed matter and booklet body
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