CN111016159A - 一种基于mem的光纤光栅传感器封装方法及装置 - Google Patents

一种基于mem的光纤光栅传感器封装方法及装置 Download PDF

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Publication number
CN111016159A
CN111016159A CN201911262656.XA CN201911262656A CN111016159A CN 111016159 A CN111016159 A CN 111016159A CN 201911262656 A CN201911262656 A CN 201911262656A CN 111016159 A CN111016159 A CN 111016159A
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CN
China
Prior art keywords
printing
fiber grating
mem
sensor
model
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Pending
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CN201911262656.XA
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English (en)
Chinese (zh)
Inventor
孙丽
张春巍
梁天琦
李闯
赵子豪
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Shenyang Jianzhu University
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Shenyang Jianzhu University
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Priority to CN201911262656.XA priority Critical patent/CN111016159A/zh
Publication of CN111016159A publication Critical patent/CN111016159A/zh
Priority to PCT/CN2020/097451 priority patent/WO2021114603A1/fr
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/118—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using filamentary material being melted, e.g. fused deposition modelling [FDM]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30—Auxiliary operations or equipment
    • B29C64/386—Data acquisition or data processing for additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/40—Structures for supporting 3D objects during manufacture and intended to be sacrificed after completion thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00—Data acquisition or data processing for additive manufacturing

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
CN201911262656.XA 2019-12-11 2019-12-11 一种基于mem的光纤光栅传感器封装方法及装置 Pending CN111016159A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201911262656.XA CN111016159A (zh) 2019-12-11 2019-12-11 一种基于mem的光纤光栅传感器封装方法及装置
PCT/CN2020/097451 WO2021114603A1 (fr) 2019-12-11 2020-06-22 Procédé et dispositif d'encapsulation de capteur à réseau de fibres à base de mem

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911262656.XA CN111016159A (zh) 2019-12-11 2019-12-11 一种基于mem的光纤光栅传感器封装方法及装置

Publications (1)

Publication Number Publication Date
CN111016159A true CN111016159A (zh) 2020-04-17

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CN201911262656.XA Pending CN111016159A (zh) 2019-12-11 2019-12-11 一种基于mem的光纤光栅传感器封装方法及装置

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CN (1) CN111016159A (fr)
WO (1) WO2021114603A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021114603A1 (fr) * 2019-12-11 2021-06-17 青岛理工大学 Procédé et dispositif d'encapsulation de capteur à réseau de fibres à base de mem
CN113618870A (zh) * 2021-08-13 2021-11-09 中国科学院武汉岩土力学研究所 三维打印水泥基模型的传感器植入装置及方法
CN113752541A (zh) * 2021-04-08 2021-12-07 长江水利委员会长江科学院 一种基于3d打印制备光纤光栅模型土工格栅的装置及方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12011875B1 (en) 2021-03-09 2024-06-18 Resnent, Llc Secondary object integration options for 3D electrophotography based additive manufacturing
CN117380974B (zh) * 2023-12-07 2024-03-01 西安赛隆增材技术股份有限公司 一种锆铌合金增材制造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103496166A (zh) * 2013-10-16 2014-01-08 西安科技大学 一种基于快速成型技术的微纳传感器制造方法及装置
CN103660300B (zh) * 2013-12-04 2017-01-18 北京太尔时代科技有限公司 一种自动调平的3d打印机及其打印方法
CN104260358A (zh) * 2014-10-24 2015-01-07 姚川 一种3d打印方法
KR102356699B1 (ko) * 2017-04-28 2022-01-27 한국전자통신연구원 3d 프린팅을 이용한 센서 제작 방법 및 그 3d 프린터
CN107187030A (zh) * 2017-06-13 2017-09-22 哈尔滨工业大学 利用3d打印技术制作传感器的方法
CN109813458A (zh) * 2019-01-05 2019-05-28 西安科技大学 一种基于3d打印技术的光纤光栅温度传感器及其组装方法
CN209495788U (zh) * 2019-01-05 2019-10-15 西安科技大学 一种光纤光栅温度传感器
CN111016159A (zh) * 2019-12-11 2020-04-17 沈阳建筑大学 一种基于mem的光纤光栅传感器封装方法及装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021114603A1 (fr) * 2019-12-11 2021-06-17 青岛理工大学 Procédé et dispositif d'encapsulation de capteur à réseau de fibres à base de mem
CN113752541A (zh) * 2021-04-08 2021-12-07 长江水利委员会长江科学院 一种基于3d打印制备光纤光栅模型土工格栅的装置及方法
CN113752541B (zh) * 2021-04-08 2023-07-18 长江水利委员会长江科学院 一种基于3d打印制备光纤光栅模型土工格栅的装置及方法
CN113618870A (zh) * 2021-08-13 2021-11-09 中国科学院武汉岩土力学研究所 三维打印水泥基模型的传感器植入装置及方法

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