CN111010127A - 一种薄膜体声波谐振器及其制备方法 - Google Patents
一种薄膜体声波谐振器及其制备方法 Download PDFInfo
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- CN111010127A CN111010127A CN201911333656.4A CN201911333656A CN111010127A CN 111010127 A CN111010127 A CN 111010127A CN 201911333656 A CN201911333656 A CN 201911333656A CN 111010127 A CN111010127 A CN 111010127A
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- piezoelectric material
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- bulk acoustic
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- 238000002360 preparation method Methods 0.000 title abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 76
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 239000010408 film Substances 0.000 claims description 21
- 238000005530 etching Methods 0.000 claims description 15
- 238000000151 deposition Methods 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 239000010409 thin film Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims 1
- 230000001902 propagating effect Effects 0.000 abstract description 2
- 239000000725 suspension Substances 0.000 abstract description 2
- 238000004891 communication Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000010897 surface acoustic wave method Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02015—Characteristics of piezoelectric layers, e.g. cutting angles
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/173—Air-gaps
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
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CN201911333656.4A CN111010127B (zh) | 2019-12-23 | 2019-12-23 | 一种薄膜体声波谐振器及其制备方法 |
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CN201911333656.4A CN111010127B (zh) | 2019-12-23 | 2019-12-23 | 一种薄膜体声波谐振器及其制备方法 |
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CN111010127A true CN111010127A (zh) | 2020-04-14 |
CN111010127B CN111010127B (zh) | 2021-07-02 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112260659A (zh) * | 2020-10-26 | 2021-01-22 | 武汉大学 | 一种高q值薄膜体声波谐振器及其制备方法 |
CN113364423A (zh) * | 2021-05-27 | 2021-09-07 | 天津大学 | 压电mems谐振器及其形成方法、电子设备 |
CN113810016A (zh) * | 2021-09-23 | 2021-12-17 | 武汉敏声新技术有限公司 | 一种体声波谐振器和体声波滤波器 |
WO2022012438A1 (zh) * | 2020-07-14 | 2022-01-20 | 中芯集成电路(宁波)有限公司 | 薄膜体声波谐振器及其制造方法 |
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US20020014933A1 (en) * | 2000-06-27 | 2002-02-07 | Murata Manufacturing Co., Ltd | Piezoelectric filter and manufacturing method therefor |
US20080157629A1 (en) * | 2004-01-26 | 2008-07-03 | Motohisa Noguchi | Piezoelectric element, piezoelectric actuator, ink jet recording head, ink jet printer, surface acoustic wave element, frequency filter, oscillator, electronic circuit, thin film piezoelectric resonator, and electronic apparatus |
US20100019864A1 (en) * | 2008-02-15 | 2010-01-28 | Fujitsu Limited | Film bulk acoustic resonator, filter, communication module and communication device |
CN104202010A (zh) * | 2014-08-28 | 2014-12-10 | 中国工程物理研究院电子工程研究所 | 一种镂空空腔型薄膜体声波谐振器及其制作方法 |
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WO2018125165A1 (en) * | 2016-12-29 | 2018-07-05 | Intel Corporation | Resonator structure encapsulation |
CN109474252A (zh) * | 2018-10-29 | 2019-03-15 | 武汉大学 | 可提高q值的空腔薄膜体声波谐振器及其制备方法 |
CN110166012A (zh) * | 2019-05-15 | 2019-08-23 | 上海科技大学 | 二维耦合的射频压电谐振器及其制备方法 |
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2019
- 2019-12-23 CN CN201911333656.4A patent/CN111010127B/zh active Active
Patent Citations (8)
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US20020014933A1 (en) * | 2000-06-27 | 2002-02-07 | Murata Manufacturing Co., Ltd | Piezoelectric filter and manufacturing method therefor |
US20080157629A1 (en) * | 2004-01-26 | 2008-07-03 | Motohisa Noguchi | Piezoelectric element, piezoelectric actuator, ink jet recording head, ink jet printer, surface acoustic wave element, frequency filter, oscillator, electronic circuit, thin film piezoelectric resonator, and electronic apparatus |
US20100019864A1 (en) * | 2008-02-15 | 2010-01-28 | Fujitsu Limited | Film bulk acoustic resonator, filter, communication module and communication device |
CN104202010A (zh) * | 2014-08-28 | 2014-12-10 | 中国工程物理研究院电子工程研究所 | 一种镂空空腔型薄膜体声波谐振器及其制作方法 |
CN106353702A (zh) * | 2016-09-14 | 2017-01-25 | 广东顺德中山大学卡内基梅隆大学国际联合研究院 | 一种基于面内伸缩模态谐振器的mems磁场传感器及制备方法 |
WO2018125165A1 (en) * | 2016-12-29 | 2018-07-05 | Intel Corporation | Resonator structure encapsulation |
CN109474252A (zh) * | 2018-10-29 | 2019-03-15 | 武汉大学 | 可提高q值的空腔薄膜体声波谐振器及其制备方法 |
CN110166012A (zh) * | 2019-05-15 | 2019-08-23 | 上海科技大学 | 二维耦合的射频压电谐振器及其制备方法 |
Non-Patent Citations (3)
Title |
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ZHAO, ZINAN等: "Frequency Spectra of Coupling Vibration in High-Frequency Thickness-Shear ZnO Thin Film Resonator Applied in Sensing Field Based on the Hamilton Principle", 《IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL》 * |
彭霄等: "LiNbO3单晶薄膜体声波谐振器的研制", 《压电与声光》 * |
李彦睿等: "薄膜体声波滤波器结构和设计", 《压电与声光》 * |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022012438A1 (zh) * | 2020-07-14 | 2022-01-20 | 中芯集成电路(宁波)有限公司 | 薄膜体声波谐振器及其制造方法 |
CN112260659A (zh) * | 2020-10-26 | 2021-01-22 | 武汉大学 | 一种高q值薄膜体声波谐振器及其制备方法 |
CN113364423A (zh) * | 2021-05-27 | 2021-09-07 | 天津大学 | 压电mems谐振器及其形成方法、电子设备 |
CN113364423B (zh) * | 2021-05-27 | 2023-11-10 | 广州乐仪投资有限公司 | 压电mems谐振器及其形成方法、电子设备 |
CN113810016A (zh) * | 2021-09-23 | 2021-12-17 | 武汉敏声新技术有限公司 | 一种体声波谐振器和体声波滤波器 |
CN113810016B (zh) * | 2021-09-23 | 2023-07-11 | 武汉敏声新技术有限公司 | 一种体声波谐振器和体声波滤波器 |
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Effective date of registration: 20220408 Address after: 315832 e2025, zone a, Room 401, building 1, No. 88, Meishan Qixing Road, Beilun District, Ningbo, Zhejiang Province Patentee after: Ningbo Huazhang enterprise management partnership (L.P.) Address before: 430072 Hubei Province, Wuhan city Wuchang District of Wuhan University Luojiashan Patentee before: WUHAN University |
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Effective date of registration: 20220824 Address after: No.01, 4th floor, building D7, phase 3, Wuhan Software New Town, No.9 Huacheng Avenue, Donghu New Technology Development Zone, Wuhan City, Hubei Province, 430000 Patentee after: Wuhan Minsheng New Technology Co.,Ltd. Address before: 315832 e2025, zone a, Room 401, building 1, No. 88, Meishan Qixing Road, Beilun District, Ningbo, Zhejiang Province Patentee before: Ningbo Huazhang enterprise management partnership (L.P.) |