CN110995355A - Optical module - Google Patents
Optical module Download PDFInfo
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- CN110995355A CN110995355A CN201911361761.9A CN201911361761A CN110995355A CN 110995355 A CN110995355 A CN 110995355A CN 201911361761 A CN201911361761 A CN 201911361761A CN 110995355 A CN110995355 A CN 110995355A
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- temperature
- heating unit
- heating
- module
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/40—Transceivers
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/345—Arrangements for heating
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/50—Transmitters
- H04B10/501—Structural aspects
- H04B10/503—Laser transmitters
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- Engineering & Computer Science (AREA)
- Electromagnetism (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Lasers (AREA)
Abstract
The optical module comprises a shell, a light receiving assembly, a light emitting assembly and a circuit board, wherein the light receiving assembly, the light emitting assembly and the circuit board are arranged in the shell, the light emitting assembly is arranged in the shell, and the circuit board is connected with the light receiving assembly and the light emitting assembly.
Description
Technical Field
The invention relates to an optical module, and belongs to the technical field of optical communication.
Background
China moves in 2019, 9, 3 and discloses an innovative 5G forward-transmission Open-WDM/MWDM scheme for the first time, the 5G forward-transmission promotes a low-cost 25G CWDM DML to a 12-wavelength system, and on the basis of the existing CWDM6 waves, the TEC controls the temperature of each wavelength to be respectively offset by 3.5nm, so that 12 wavelength channels are formed, and meanwhile, the urgency of 5G deployment and the requirement of reusing a CWDM industrial chain are met. The TEC is adopted to realize 12 wavelengths, the characteristic that the wavelengths are not equidistant is realized, an OAM mechanism of an optical module is realized by combining optical layer tuning, and the link budget of a main scene of 5G forward transmission of 10km is met. However, the TEC adopted for temperature control has the following disadvantages: the temperature of the 12 waves needs to be controlled by the TEC, so that the cost for preparing the optical module is increased; the temperature of each CWDM wavelength is controlled to deviate from 3.5nm by the TEC, the corresponding temperature is about 35 ℃, a 5G front light transmission module needs to meet the requirement of working in an industrial temperature range of-40-85 ℃, the temperature change of a heat sink of a laser chip is close to 100 ℃, the wavelength stability is guaranteed by the TEC temperature control in the temperature range, and the thermal management and the power consumption of the TOSA are greatly challenged; the qualified chips are directly selected on the basis of the existing CWDM6 wave, and the wavelength tuning is realized by adjusting the temperature through the TEC, so that the wavelength yield of the DML laser of the single wafer is low, and the cost of the laser chip is indirectly improved.
Disclosure of Invention
The invention aims to provide a 5G front-end transmission optical module which is formed by integrating a heating unit for carrying out temperature compensation on a laser chip in the laser chip so as to realize temperature tuning on the central wavelength of the laser in an industrial temperature range and obtain a wavelength range meeting MWDM.
In order to achieve the purpose, the invention provides the following technical scheme: an optical module comprises a shell, a light receiving assembly, a light emitting assembly and a circuit board, wherein the light receiving assembly and the light emitting assembly are arranged in the shell, and the circuit board is connected with the light receiving assembly and the light emitting assembly. The light emitting component comprises a laser chip, and a heating unit for performing temperature compensation on the laser chip is integrated in the laser chip.
Further, the laser chip comprises an indium phosphide substrate, an active layer, a ridge waveguide, a P-face electrode and an N-face electrode, the heating unit is positioned on one side of the ridge waveguide, and the distance between the heating unit and the ridge waveguide is 10-20 um.
Further, the resistance value of the heating unit is determined by the following formula:
R＝ρ*L/S
wherein R is the resistance value of the heating unit; ρ represents the resistivity of the heating element; l is the length of the heating unit; s is the cross-sectional area of the heating unit perpendicular to the current direction.
Further, the heating unit is a heat resistor formed of Ti metal.
Further, SiO is arranged between the heating unit and the laser chip2An insulating layer.
Further, the laser chip is a DML laser chip.
Further, the optical module further comprises a heating module arranged inside the shell and used for performing temperature compensation on the inside of the shell.
Further, the heating module is an electric heating wire.
Further, the optical module further comprises a temperature sensor for detecting the temperature of the shell and a temperature control unit in signal connection with the temperature sensor, the heating unit and the heating module, and the temperature control unit controls the heating unit and the heating module to be started or closed together or individually according to the shell temperature value detected by the temperature sensor.
Further, the temperature compensation control method for the optical module includes:
the temperature sensor collects the current shell temperature value;
based on the shell temperature value acquired by the temperature sensor, the temperature control unit judges whether the shell temperature value is lower than a preset temperature threshold value;
if the temperature is lower than the preset temperature threshold value, controlling the heating unit and the heating module to start;
and if the temperature is between the preset temperature threshold value, controlling the heating unit to start.
The invention has the beneficial effects that: according to the invention, the heating unit for performing temperature compensation on the laser chip is integrated in the laser chip, so that the center wavelength of the laser chip is tuned, the optical module meeting the MWDM wavelength range is obtained, the wavelength range of the laser chip is widened, the power consumption level of the optical module is reduced, and the yield of the laser chip is improved.
According to the invention, the heating module for performing temperature compensation on the interior of the shell is arranged in the optical module shell, and a two-stage heating mode is formed by the heating module and the heating unit, so that a 5G fronthaul application scene can be realized, the central wavelength of the laser is tuned in an industrial temperature range, and the wavelength range of MWDM is met, thus an expensive TEC is not used for temperature tuning any more, and the material cost of the 5G fronthaul optical module is saved.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical solutions of the present invention more clearly understood and to implement them in accordance with the contents of the description, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings.
Drawings
FIG. 1 is a schematic view of a DML chip incorporating a heating unit according to one embodiment of the present invention;
fig. 2 is a logic diagram of a temperature compensation control method for an optical module.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the mechanism or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
An optical module shown in an embodiment of the present invention includes a housing, a light receiving module and a light emitting module disposed in the housing, a circuit board connected to the light receiving module and the light emitting module, and an interface unit disposed on the housing and in signal connection with the light receiving module and the light emitting module for sending or receiving an electrical signal, wherein the light receiving module is configured to convert a received optical signal into an electrical signal and output the electrical signal to the interface unit; the optical transmission module is used for converting the electric signal sent by the interface unit into an optical signal and outputting the optical signal. The optical module also comprises a control unit in signal connection with the interface unit, the light receiving assembly and the light emitting assembly, and a power supply unit which provides power for the interface unit, the light receiving assembly and the light emitting assembly and controls the on and off of each assembly, wherein the control unit is used for controlling the optical module through the internal communication interface. The structure of the optical module is the existing structure, and the preparation method of the optical module is the prior art, and redundant description is not repeated here.
The light emitting assembly includes a laser chip. In this embodiment, the laser chip is a DML (direct Modulated laser) laser chip integrated with a thermal tuning function of the heating unit, specifically, the DML laser chip is a ridge waveguide structure, the DML laser chip includes a middle ridge waveguide structure, the heating unit located on one side of the ridge waveguide, a positive electrode and a negative electrode located at two ends of the heating unit, and a P-side electrode located on the other side of the ridge waveguide, where the N-side electrode of the chip is on the back side of the chip. The cross section of the laser chip comprises an indium phosphide (InP) substrate, a buffer growth layer, a lower limiting layer, a lower waveguide layer, an active layer (Multi Quantum Well), an upper limiting layer, an upper waveguide layer, an indium phosphide (InP) spacing layer and an ohmic contact layer from bottom to top. The structure of the DML laser chip is the existing structure, and the preparation method of the DML laser chip is the prior art, which is not described herein in detail.
In this embodiment, in order to obtain a 5G fronthaul optical module that meets the MWDM wavelength range and meets the application in the industrial temperature range, a two-stage heating manner that combines a heating module inside a module housing and a heating unit integrated on a laser chip is adopted, so as to implement large-range temperature tuning of the wavelength of the DML laser chip. The heating unit integrated on the laser chip is positioned on one side of the ridge waveguide, and the heating unit is close to the active region of the DML laser chip, so that the temperature transmission is fast, the heat conduction efficiency is high, a larger wavelength tuning range can be realized by using smaller electric power, and the power consumption level of the optical module is reduced.
Referring to fig. 1, a ridge waveguide 1 is a semiconductor inverted mesa structure obtained by combining plasma dry etching and wet etching, and is covered with (from bottom to top) a Ti/Pt/Au three-layer metal material on top and is connected to a chip P-side electrode (pad) 11. A chip P-surface electrode (pad)11 and a heating unit 2 are formed on a passivation layer 3, the distance between the heating unit 2 and the ridge waveguide 1 is 10um, an insulating layer is arranged between the heating unit 2 and the ridge waveguide 1, the insulating layer is a passivation layer 3 material, when the heating unit 2 is electrified, the passivation layer 3 has the function of electrically insulating the heating unit 2 and the ridge waveguide 1, and the passivation layer 3 is SiO2The passivation layer 3, in other embodiments, may be made of other materials with the same function.
The heating element 2 is a thermal resistor 2 formed of Ti metal, and since the resistivity of Ti is much higher than that of Au and Pt, Ti is selected as the resistance material of the thermal resistor 2. The length, width and thickness of the thermal resistor 2 are determined by the required resistance value, specifically, the resistance value of the thermal resistor is determined by the following formula:
R＝ρ*L/S
wherein R is a resistance value of the heating unit 2; ρ represents the resistivity of the heating element 2; l is the length of the heating unit 2; s is the cross-sectional area of the heating unit 2 perpendicular to the direction of current flow.
In this embodiment, the thermal resistor 2 is a cuboid, the thermal resistor 2 has a length of 220um, a width of 8um, and a thickness of 230nm, the maximum current that the thermal resistor 2 can bear is 100mA, the maximum power consumption is about 500mW, and the thermal resistor 2 can heat the DML laser so that the tuning range of the maximum wavelength generated by the DML laser is about 5 nm. It is needless to say that in other embodiments, the shape of the thermal resistor may be other, the thermal resistor may be formed of other metals, and the shape and material of the thermal resistor are not specifically limited herein and may be determined according to actual conditions.
One side of the ridge waveguide 1 is connected with a P-surface electrode (pad)11 for gold wire bonding, and the P-surface electrode (pad)11 is a Ti/Pt/Au (bottom-to-top) three-layer metal structure. The thermal resistor 2 is connected with a positive electrode 21 and a negative electrode 22 at two ends, the numbers of the positive electrode 21 and the negative electrode are not limited herein, the material of the positive electrode 21 and the negative electrode 22 is a Ti/Pt/Au (bottom-up) three-layer metal structure, the areas of the positive electrode 21 and the negative electrode 22 are convenient for bonding with gold wires, in other embodiments, the material of the positive electrode and the negative electrode can be other, and is not specifically limited herein and can be determined according to the actual situation.
In order to alleviate the defect of tuning capability of the heating unit to the wavelength of the DML laser, the optical module further comprises a heating module which is arranged inside the shell and used for performing temperature compensation on the inside of the shell, and when the ambient temperature is low, the heating unit and the heating module work simultaneously to meet the requirement of tuning the wavelength of the center wavelength of the DML laser within a wide temperature range. In this embodiment, the heating module is an electric heating wire, and in other embodiments, the heating module may also be other elements capable of assisting in heating. When the external environment temperature is-40 ℃, the temperature of the inner shell of the optical module is-30 ℃, and the temperature of the inner shell of the optical module can be increased to 10 ℃ by starting the electric heating wire.
In this embodiment, the power of the heating unit and the heating module may be flexibly designed to ensure that the DML laser produced based on a single wafer (wafer) is based on a certain design center wavelength, and under the condition of a positive and negative deviation of 1.5nm, the requirement of 5G fronthaul on the MWDM wavelength range may be satisfied through the thermal tuning of the heating unit and the heating module. For a common 25GDML laser in the industry, the chip wavelength distribution of the whole wafer obtained by the electron beam grating writing process is about 3nm, so that in the chip design stage of the DML laser, a certain lasing center wavelength is accurately calibrated by optimizing parameters such as an active region structure, components and a grating period, and the wavelength yield of the laser can be greatly improved. Compared with the traditional TEC temperature control scheme, the TEC is omitted, the material cost of the optical module is reduced, and the power consumption level of the optical module is reduced, specifically, the material cost of the 5G front-transmission optical module can be reduced by about 20%, and the maximum power consumption is reduced by 10%.
The optical module also comprises a temperature sensor for detecting the temperature of the shell and a temperature control unit in signal connection with the temperature sensor, the heating unit and the heating module; the temperature control unit controls the heating unit and the heating module to be started or closed together or controls the heating unit and the heating module to be started or closed individually according to the shell temperature value detected by the temperature sensor.
The temperature compensation control method for the optical module comprises the following steps:
the temperature sensor collects the current shell temperature value;
based on the shell temperature value acquired by the temperature sensor, the temperature control unit judges whether the shell temperature value is lower than a preset temperature threshold value;
if the temperature is lower than the preset temperature threshold value, the heating unit and the heating module are controlled to be started;
and if the temperature is between the preset temperature threshold value, controlling the heating unit to start, and closing the heating module.
Indeed, when the temperature value of the shell is higher than the preset temperature threshold value, the heating unit and the heating module are controlled to be closed.
Specifically, it is assumed that the temperature inside the housing of the optical module is higher than the temperature outside the housing by 10 ℃, the temperature sensor may acquire a temperature value inside the housing, and may also acquire a temperature value outside the housing, in this embodiment, the case where the temperature sensor acquires the temperature value inside the housing is taken as an example for explanation, please refer to fig. 2, the preset temperature threshold is that the temperature inside the housing is in a range of-5 ℃ to 45 ℃, when the temperature inside the housing of the optical module is higher than 45 ℃, the heating unit and the heating module are turned off, at this time, the wavelength of the laser is determined only by the temperature inside the optical module and the driving current of the laser, and the design value of the wavelength tuning range is 5 nm;
when the temperature inside the shell of the optical module is between-5 ℃ and 45 ℃, the heating unit is started, the heating module is closed, the wavelength of the laser is tuned by adjusting the current of the heating unit, and the design value of the wavelength tuning range of the laser by the heating unit is 5 nm;
when the temperature in the shell of the optical module is lower than minus 5 ℃, the heating unit and the heating module are both started to tune the wavelength of the laser at the same time, and the design value of the wavelength tuning range of the heating module is 4 nm.
It should be noted that the temperature control unit includes at least one logic control circuit, and the at least one logic control circuit determines between the temperature value in the housing and a preset temperature threshold value, and controls the heating unit and the heating module to be started together or to be started or shut down individually.
In summary, in the invention, the heating unit for performing temperature compensation on the laser chip is integrated in the laser chip to tune the center wavelength of the laser chip, so as to obtain the optical module meeting the MWDM wavelength range, widen the wavelength range of the laser chip, reduce the power consumption level of the optical module, and improve the yield of the laser chip.
According to the invention, the heating module for performing temperature compensation on the interior of the shell is arranged in the optical module shell, and a two-stage heating mode is formed by the heating module and the heating unit, so that a 5G fronthaul application scene can be realized, the central wavelength of the laser is tuned in an industrial temperature range, and the wavelength range of MWDM is met, thus an expensive TEC is not used for temperature tuning any more, and the material cost of the 5G fronthaul optical module is saved.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. An optical module comprises a shell, a light receiving assembly, a light emitting assembly and a circuit board, wherein the light receiving assembly and the light emitting assembly are arranged in the shell, and the circuit board is connected with the light receiving assembly and the light emitting assembly. The light emitting component comprises a laser chip, and is characterized in that a heating unit for performing temperature compensation on the laser chip is integrated in the laser chip.
2. The optical module according to claim 1, wherein the laser chip comprises an indium phosphide substrate, an active layer, a ridge waveguide, a P-side electrode, and an N-side electrode, the heating unit is located on one side of the ridge waveguide, and a distance between the heating unit and the ridge waveguide is 10 to 20 um.
3. A light module as claimed in claim 2, characterized in that the resistance value of the heating element is determined by the formula:
R＝ρ*L/S
wherein R is the resistance value of the heating unit; ρ represents the resistivity of the heating element; l is the length of the heating unit; s is the cross-sectional area of the heating unit perpendicular to the current direction.
4. The optical module according to claim 3, wherein the heating unit is a thermal resistor formed of Ti metal.
5. The optical module of claim 2, wherein a SiO is disposed between the heating unit and the laser chip2An insulating layer.
6. The optical module of claim 2, wherein the laser chip is a DML laser chip.
7. The optical module according to claim 1 or 2, characterized in that the optical module further comprises a heating module disposed inside the housing for temperature compensation inside the housing.
8. A light module as claimed in claim 7, characterized in that the heating module is an electric heating wire.
9. The light module as claimed in claim 7, wherein the light module further comprises a temperature sensor for detecting the temperature of the housing and a temperature control unit in signal connection with the temperature sensor, the heating unit and the heating module, wherein the temperature control unit controls the heating unit and the heating module to be turned on or off together or individually according to the temperature value of the housing detected by the temperature sensor.
10. The optical module according to claim 9, wherein a temperature compensation control method for the optical module comprises:
the temperature sensor collects the current shell temperature value;
based on the shell temperature value acquired by the temperature sensor, the temperature control unit judges whether the shell temperature value is lower than a preset temperature threshold value;
if the temperature is lower than the preset temperature threshold value, controlling the heating unit and the heating module to start;
and if the temperature is between the preset temperature threshold value, controlling the heating unit to start.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911361761.9A CN110995355A (en) | 2019-12-26 | 2019-12-26 | Optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911361761.9A CN110995355A (en) | 2019-12-26 | 2019-12-26 | Optical module |
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| CN110995355A true CN110995355A (en) | 2020-04-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201911361761.9A Pending CN110995355A (en) | 2019-12-26 | 2019-12-26 | Optical module |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111323879A (en) * | 2020-04-13 | 2020-06-23 | 易锐光电科技(安徽)有限公司 | Optical module |
| CN113472446A (en) * | 2021-07-08 | 2021-10-01 | 武汉华工正源光子技术有限公司 | Medium wavelength division optical module with operation maintenance management function |
| CN115327713A (en) * | 2022-07-31 | 2022-11-11 | 山东华云光电技术有限公司 | Industrial optical module with temperature compensation function at receiving end |
| CN115327713B (en) * | 2022-07-31 | 2024-06-04 | 山东华云光电技术有限公司 | Industrial-grade optical module with temperature compensation function at receiving end |
-
2019
- 2019-12-26 CN CN201911361761.9A patent/CN110995355A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111323879A (en) * | 2020-04-13 | 2020-06-23 | 易锐光电科技(安徽)有限公司 | Optical module |
| CN113472446A (en) * | 2021-07-08 | 2021-10-01 | 武汉华工正源光子技术有限公司 | Medium wavelength division optical module with operation maintenance management function |
| CN115327713A (en) * | 2022-07-31 | 2022-11-11 | 山东华云光电技术有限公司 | Industrial optical module with temperature compensation function at receiving end |
| CN115327713B (en) * | 2022-07-31 | 2024-06-04 | 山东华云光电技术有限公司 | Industrial-grade optical module with temperature compensation function at receiving end |
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