CN110994172A - Antenna housing based on wide stop band low frequency multilayer frequency selective surface - Google Patents
Antenna housing based on wide stop band low frequency multilayer frequency selective surface Download PDFInfo
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- CN110994172A CN110994172A CN201911368830.9A CN201911368830A CN110994172A CN 110994172 A CN110994172 A CN 110994172A CN 201911368830 A CN201911368830 A CN 201911368830A CN 110994172 A CN110994172 A CN 110994172A
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- interdigital
- conductive layer
- pcb
- frequency
- structural unit
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- 244000126211 Hericium coralloides Species 0.000 claims abstract description 8
- 239000010410 layer Substances 0.000 description 43
- JAYCNKDKIKZTAF-UHFFFAOYSA-N 1-chloro-2-(2-chlorophenyl)benzene Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1Cl JAYCNKDKIKZTAF-UHFFFAOYSA-N 0.000 description 11
- 101100084627 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) pcb-4 gene Proteins 0.000 description 11
- XOMKZKJEJBZBJJ-UHFFFAOYSA-N 1,2-dichloro-3-phenylbenzene Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1Cl XOMKZKJEJBZBJJ-UHFFFAOYSA-N 0.000 description 9
- 238000004088 simulation Methods 0.000 description 6
- 239000003990 capacitor Substances 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000001939 inductive effect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
- H01Q15/0013—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices said selective devices working as frequency-selective reflecting surfaces, e.g. FSS, dichroic plates, surfaces being partly transmissive and reflective
- H01Q15/0026—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices said selective devices working as frequency-selective reflecting surfaces, e.g. FSS, dichroic plates, surfaces being partly transmissive and reflective said selective devices having a stacked geometry or having multiple layers
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- Waveguide Aerials (AREA)
Abstract
The invention discloses an antenna housing based on a wide stop band low-frequency multilayer frequency selection surface, wherein an upper conductive layer is arranged on the upper surface of an upper PCB (printed circuit board), a middle conductive layer is arranged on the lower surface of the upper PCB, a lower conductive layer is arranged on the lower surface of a lower PCB, the upper conductive layer is composed of a plurality of upper interdigital structural units which are periodically arranged, the middle conductive layer is composed of a plurality of cross-shaped structural units which are periodically arranged, and the lower conductive layer is composed of a plurality of lower interdigital structural units which are periodically arranged, wherein one upper interdigital structural unit corresponds to one cross-shaped structural unit and one lower interdigital structural unit; the upper interdigital structure unit and the lower interdigital structure unit are both composed of two comb tooth structures, wherein the outermost teeth of the two comb tooth structures have the same length and are distributed oppositely, and a gap is reserved between the two outermost teeth; each upper interdigital structure unit is completely aligned with the corresponding cross-shaped structure unit and the corresponding lower interdigital structure unit; the radome has a lower resonant frequency.
Description
Technical Field
The invention belongs to the field of electromagnetic engineering, and relates to an antenna housing based on a wide stop band low-frequency multilayer frequency selective surface.
Background
At present, the frequency selection surface radome required by electronic equipment such as low-frequency (400 MHz-3 GHz) mobile communication, electronic countermeasure, radar and the like has the problems of narrow bandwidth, narrow stop band, higher frequency, closer harmonic to fundamental frequency, larger unit and the like, and has greater difficulty in development. The reason for this is that the subwavelength of the low frequency unit is longer than the subwavelength unit of the high frequency band; the structure size of the frequency selective surface unit is much larger when the frequency selective surface unit works at low frequency; the antenna housing often needs to adopt a plurality of units to simulate an infinite periodic structure, which can result in the size of the whole antenna housing being too large, resulting in large volume, heavy weight, difficult installation and even no application. Furthermore, if the number of elements is too small, the passband of the frequency selective surface may be cracked, and the in-band performance may be deteriorated.
The current design is mainly realized by a mode of folding in a frequency selection surface, a mode of inductive loading of distributed parameters is adopted to realize low frequency and miniaturization of the frequency selection surface, and a mode of inductive loading of centralized parameters is also adopted to realize. Because the frequency selection surface loaded by the inductor adopts a single-layer design, the resonance bandwidth of the frequency selection surface is narrow and a broadband signal cannot be transmitted due to no in-band multi-frequency point resonance; due to inductive loading, the harmonic is closer to the fundamental frequency of resonance, and the wide stop band performance cannot be realized. The multilayer frequency selection surface loaded by the capacitor can realize broadband, but the performance of the frequency selection surface is different from the expected performance due to the dispersion of capacitance values of the capacitor, errors of the patch and the effectiveness of the capacitor; and its machining and welding causes an increase in the cost of the frequency selective surface. In addition, the lumped inductor and capacitor can fail at high temperature, and are not suitable for being used as the antenna housing of various electronic devices.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a radome based on a wide stopband low-frequency multilayer frequency selection surface, wherein the radome has a lower resonant frequency.
In order to achieve the above purpose, the radome based on the wide stop band low-frequency multilayer frequency selective surface of the invention comprises an upper layer PCB and a lower layer PCB which are sequentially distributed from top to bottom, wherein the upper surface of the upper layer PCB is provided with an upper conductive layer, the lower surface of the upper layer PCB is provided with a middle conductive layer, the lower surface of the lower layer PCB is provided with a lower conductive layer, the upper conductive layer is composed of a plurality of upper interdigital structural units which are periodically arranged, the middle conductive layer is composed of a plurality of cross-shaped structural units which are periodically arranged, the lower conductive layer is composed of a plurality of lower interdigital structural units which are periodically arranged, and one upper interdigital structural unit corresponds to one cross-shaped structural unit and one lower interdigital structural unit;
the upper interdigital structure unit and the lower interdigital structure unit are both composed of two comb tooth structures, wherein the outermost teeth of the two comb tooth structures have the same length and are distributed oppositely, and a gap is reserved between the two outermost teeth;
each upper interdigital structure unit is completely aligned with the corresponding cross-shaped structure unit and the corresponding lower interdigital structure unit;
distributed capacitances are formed in the upper conductive layer, the lower conductive layer, between the upper conductive layer and the middle conductive layer, and between the lower conductive layer and the middle conductive layer.
The length, width and thickness of the upper PCB and the lower PCB are respectively 4mm-15mm, 4mm-15mm and 0.2mm-4mm, and the dielectric constants of the upper PCB and the lower PCB are all less than 9.8.
The finger width W1 of the upper interdigital structural unit and the lower interdigital structural unit is 0.05mm-1mm, and the interdigital gap g is 0.05mm-0.5 mm.
The widths W of the four extending parts in the cross-shaped structural unit are all 0.5mm-4 mm.
The thickness of the upper interdigital structural unit, the thickness of the cross-shaped structural unit and the thickness of the lower interdigital structural unit are all 0.018mm-0.054 mm.
Each upper interdigital structure unit, the corresponding cross-shaped structure unit and the corresponding lower interdigital structure unit are symmetrically distributed along the same plane.
The invention has the following beneficial effects:
in addition, each upper interdigital structure unit is completely aligned with the corresponding cross structure unit and the lower interdigital structure unit, so that larger distributed capacitance is formed in the upper conductive layer and the lower conductive layer, and interfacial coupling is formed between the upper conductive layer and the middle conductive layer and between the lower conductive layer and the middle conductive layer so as to form distributed capacitance which has larger coupling capacitance than the traditional frequency selection surface through the coupling capacitance of the edge and the side of the conductor edge, compared with the prior art, the broadband resonance frequency-adjustable broadband resonance circuit has the advantages that the coupling capacitance is larger, the resonance frequency is lower, and the stop band is wider.
Drawings
Fig. 1 is a schematic structural view of an upper interdigital structural element 1 and a lower interdigital structural element 3 in the present invention;
FIG. 2 is a schematic structural view of a cross-shaped structural unit 2 according to the present invention;
FIG. 3 is a schematic structural diagram of the middle and upper layer PCB 4 of the present invention;
fig. 4 is a distribution diagram of the upper interdigital structural unit 1 and the corresponding cross-shaped structural unit 2 and lower interdigital structural unit 3;
FIG. 5 is a diagram of a narrow band simulation result of the first embodiment;
fig. 6 is a diagram of a simulation result of the stop band according to the first embodiment.
Wherein, 1 is an upper interdigital structure unit, 2 is a cross structure unit, 3 is a lower interdigital structure unit, 4 is an upper layer PCB board, and 5 is a lower layer PCB board.
Detailed Description
The invention is described in further detail below with reference to the accompanying drawings:
referring to fig. 1 to 4, the radome based on the wide stop band low frequency multilayer frequency selective surface of the present invention includes an upper PCB 4 and a lower PCB 5 sequentially distributed from top to bottom, wherein an upper conductive layer is disposed on an upper surface of the upper PCB 4, a middle conductive layer is disposed on a lower surface of the upper PCB 4, a lower conductive layer is disposed on a lower surface of the lower PCB 5, the upper conductive layer is composed of a plurality of upper interdigital structural units 1 periodically arranged, the middle conductive layer is composed of a plurality of cross structural units 2 periodically arranged, the lower conductive layer is composed of a plurality of lower interdigital structural units 3 periodically arranged, and one upper interdigital structural unit 1 corresponds to one cross structural unit 2 and one lower interdigital structural unit 3; the upper interdigital structural unit 1 and the lower interdigital structural unit 3 are both composed of two comb tooth structures, wherein the outermost teeth of the two comb tooth structures have the same length and are distributed oppositely, and a gap is reserved between the two teeth; each upper interdigital structural unit 1 is completely aligned with the corresponding cross-shaped structural unit 2 and the corresponding lower interdigital structural unit 3; distributed capacitances are formed in the upper conductive layer, the lower conductive layer, between the upper conductive layer and the middle conductive layer, and between the lower conductive layer and the middle conductive layer. Each upper interdigital structural unit 1, the corresponding cross-shaped structural unit 2 and the corresponding lower interdigital structural unit 3 are symmetrically distributed along the same plane.
The lengths, widths and thicknesses of the upper PCB 4 and the lower PCB 5 are respectively 4mm-15mm, 4mm-15mm and 0.2mm-4mm, and the dielectric constants of the upper PCB 4 and the lower PCB 5 are both less than 9.8; the finger width W1 of the upper interdigital structural unit 1 and the lower interdigital structural unit 3 is 0.05mm-1mm, and the interdigital gap g is 0.05mm-0.5 mm; the widths W of the four extending parts in the cross-shaped structure unit 2 are all 0.5mm-4 mm; the thickness of the upper interdigital structural unit 1, the thickness of the cross-shaped structural unit 2 and the thickness of the lower interdigital structural unit 3 are all 0.018mm-0.054 mm.
During manufacturing, copper is coated on the upper surface and the lower surface of the upper PCB 4 and the lower PCB 5, the upper conducting layer is etched on the upper surface of the upper PCB 4, the conducting layer is etched on the lower surface of the upper PCB 4, the upper surface of the lower PCB 5 is completely etched, the lower conducting layer is etched on the lower surface of the lower PCB 5, and finally the upper PCB 4 and the lower PCB 5 are pressed together.
Example one
In this embodiment, the length of each side of the upper interdigital structural element 1 and the lower interdigital structural element 3 is 6mm, the interdigital gap is 0.204mm, the finger width of the interdigital is 0.36mm, and the length of the interdigital is 5.006 mm; the length of each extension part in the cross-shaped structural unit 2 is 6mm, the width is 2.4mm, the thickness of the upper layer PCB 4 and the thickness of the lower layer PCB 5 are both 2mm, the dielectric constant is 3.2mm, the simulation structure is shown in fig. 5 and 6, in the simulation result, the number of the upper interdigital structural unit 1, the cross-shaped structural unit 2 and the lower interdigital structural unit 3 is assumed to be 30, and as can be seen from the simulation result of fig. 5, the resonant frequency of the radome can be as low as 2500MHzLeft and right, cell size is only equal to λ0/20，λ0The free space wavelength of electromagnetic wave with resonance frequency is about 250 MHz; as can be seen from the simulation results of fig. 6, the stop band is up to 40 GHz.
Claims (6)
1. The antenna housing based on the wide-stopband low-frequency multilayer frequency selection surface is characterized by comprising an upper PCB (4) and a lower PCB (5) which are sequentially distributed from top to bottom, wherein an upper conductive layer is arranged on the upper surface of the upper PCB (4), a middle conductive layer is arranged on the lower surface of the upper PCB (4), a lower conductive layer is arranged on the lower surface of the lower PCB (5), the upper conductive layer is composed of a plurality of upper interdigital structural units (1) which are periodically distributed, the middle conductive layer is composed of a plurality of cross-shaped structural units (2) which are periodically distributed, the lower conductive layer is composed of a plurality of lower interdigital structural units (3) which are periodically distributed, and one upper interdigital structural unit (1) corresponds to one cross-shaped structural unit (2) and one lower interdigital structural unit (3);
the upper interdigital structural unit (1) and the lower interdigital structural unit (3) are both composed of two comb tooth structures, wherein the outermost teeth of the two comb tooth structures have the same length and are distributed oppositely, and a gap is reserved between the two outermost teeth;
each upper interdigital structure unit (1) is completely aligned with the corresponding cross structure unit (2) and the corresponding lower interdigital structure unit (3);
distributed capacitances are formed in the upper conductive layer, the lower conductive layer, between the upper conductive layer and the middle conductive layer, and between the lower conductive layer and the middle conductive layer.
2. The radome based on the wide stop band low-frequency multi-layer frequency selective surface according to claim 1, wherein the lengths, widths and thicknesses of the upper layer PCB (4) and the lower layer PCB (5) are respectively 4mm-15mm, 4mm-15mm and 0.2mm-4mm, and the dielectric constants of the upper layer PCB (4) and the lower layer PCB (5) are less than 9.8.
3. The radome based on the wide stop band low-frequency multilayer frequency selective surface of claim 1, wherein the finger widths W1 in the upper interdigital structural unit (1) and the lower interdigital structural unit (3) are both 0.05mm-1mm, and the finger gaps g are both 0.05mm-0.5 mm.
4. The radome based on the wide stop band low-frequency multi-layer frequency selective surface according to claim 1, wherein the widths W of the four extending parts in the cross-shaped structural unit (2) are all 0.5mm-4 mm.
5. The radome based on the wide stop band low-frequency multilayer frequency selective surface of claim 1 is characterized in that the thickness of the upper interdigital structural element (1), the thickness of the cross-shaped structural element (2) and the thickness of the lower interdigital structural element (3) are all 0.018mm-0.054 mm.
6. The radome based on the wide stop band low frequency multi-layer frequency selective surface of claim 1, wherein each upper interdigital structure unit (1) and the corresponding cross-shaped structure unit (2) and the lower interdigital structure unit (3) are symmetrically distributed along the same plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911368830.9A CN110994172B (en) | 2019-12-26 | 2019-12-26 | Antenna housing based on wide stop band low frequency multilayer frequency selective surface |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911368830.9A CN110994172B (en) | 2019-12-26 | 2019-12-26 | Antenna housing based on wide stop band low frequency multilayer frequency selective surface |
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| Publication Number | Publication Date |
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| CN110994172A true CN110994172A (en) | 2020-04-10 |
| CN110994172B CN110994172B (en) | 2021-04-27 |
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| CN201911368830.9A Expired - Fee Related CN110994172B (en) | 2019-12-26 | 2019-12-26 | Antenna housing based on wide stop band low frequency multilayer frequency selective surface |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114243310A (en) * | 2021-12-23 | 2022-03-25 | 杭州湃腾科技有限公司 | Optical transparent broadband wave absorbing body with high wave absorbing rate |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| EP4348762A1 (en) * | 2021-06-02 | 2024-04-10 | Sony Group Corporation | Multi-layer frequency-selective surface |
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-
2019
- 2019-12-26 CN CN201911368830.9A patent/CN110994172B/en not_active Expired - Fee Related
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| CN114243310A (en) * | 2021-12-23 | 2022-03-25 | 杭州湃腾科技有限公司 | Optical transparent broadband wave absorbing body with high wave absorbing rate |
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