CN110993770A - Paster LED lamp pearl supporting structure and light source structure - Google Patents
Paster LED lamp pearl supporting structure and light source structure Download PDFInfo
- Publication number
- CN110993770A CN110993770A CN201911357696.2A CN201911357696A CN110993770A CN 110993770 A CN110993770 A CN 110993770A CN 201911357696 A CN201911357696 A CN 201911357696A CN 110993770 A CN110993770 A CN 110993770A
- Authority
- CN
- China
- Prior art keywords
- boss
- lamp bead
- die bonding
- led lamp
- inner cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011324 bead Substances 0.000 claims abstract description 51
- 239000003292 glue Substances 0.000 claims description 15
- 239000007787 solid Substances 0.000 claims 2
- 230000005611 electricity Effects 0.000 claims 1
- 239000013078 crystal Substances 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 2
- 238000005286 illumination Methods 0.000 description 2
- 241000971683 Maurolicus muelleri Species 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The invention discloses a surface mounted LED lamp bead support structure and a light source structure. The chip LED lamp bead support structure is provided with an inner cavity with an inverted trapezoidal cross section, a crystal fixing boss with a trapezoidal cross section is arranged in the inner cavity, a positive electrode and a negative electrode are arranged on the crystal fixing boss, the crystal fixing boss is used for installing a lamp bead, a distance is arranged between the edge of the bottom of the crystal fixing boss and the edge of the bottom of the inner cavity, and a reflecting layer covers the inner wall of the inner cavity. Light emitted from the bottom edge of the lamp bead is emitted to the reflecting layer on the inner wall of the inner cavity along the inclined edge of the die bonding boss, so that the light shielded in the old structural design can be effectively reflected out of the surface mounted LED lamp bead support structure through the reflecting layer, and the lighting effect is effectively improved.
Description
Technical Field
The invention relates to the field of LEDs, in particular to a surface mounted LED lamp bead support structure.
Background
The surface-mounted LED is a light and thin LED point light source with small size, and various illumination fields of wide application become important components of a general illumination LED light source.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a surface mounted LED lamp bead support structure which can improve the lighting effect.
The technical scheme adopted by the invention for solving the technical problem is that,
according to a first aspect of the invention, a surface mount LED lamp bead support structure is provided with an inner cavity with an inverted trapezoid cross section, a die bonding boss with a trapezoid cross section is arranged in the inner cavity, the die bonding boss is provided with a positive electrode and a negative electrode, the die bonding boss is used for mounting a lamp bead, a distance is arranged between the edge of the bottom of the die bonding boss and the edge of the bottom of the inner cavity, and a reflective layer covers the inner wall of the inner cavity.
The invention has the advantages that the lamp beads are arranged on the die bonding boss, and light emitted from the bottom edge of the lamp beads is emitted to the reflecting layer on the inner wall of the inner cavity along the bevel edge of the die bonding boss, so that the light shielded in the old structural design is effectively reflected out of the surface mount LED lamp bead support structure through the reflecting layer, and the light efficiency is improved.
According to the surface mount LED lamp bead support structure of the first aspect of the invention, the upper surface of the die bonding boss is circular. Because the lamp beads are adhered to the crystal fixing bosses by glue, the glue can overflow when the lamp beads are pressed downwards, and the circular upper surface is matched with the overflowing glue, the glue is prevented from flowing into the support structure of the surface mount LED lamp beads excessively.
According to the surface mounted LED lamp bead support structure of the first aspect of the invention, the included angle between the side edge of the cross section of the die bonding boss and the bottom surface of the inner cavity is set to be 30-45 degrees. The luminous angle of conventional lamp pearl side is roughly between 60 to 90, sets up the contained angle and can cooperate the light-emitting angle for 30 ~ 45, makes most light can both shine on the reflector layer.
According to a second aspect of the invention, a light source structure is provided, which comprises any one of the above-mentioned surface mount LED lamp bead support structures, a lamp bead and a fluorescent glue, wherein the lamp bead is fixed on the die bonding boss, the lamp bead is electrically connected with the positive electrode and the negative electrode, and the fluorescent glue is arranged in the inner cavity and wraps the lamp bead and the die bonding boss.
The invention has the advantages that the lamp beads are arranged on the die bonding boss, and light emitted from the bottom edge of the lamp beads is emitted to the reflecting layer on the inner wall of the inner cavity along the bevel edge of the die bonding boss, so that the light shielded in the old structural design is effectively reflected out of the surface mount LED lamp bead support structure through the reflecting layer, and the light efficiency is improved.
According to the light source structure of the second aspect of the invention, the area of the upper surface of the die bonding boss is 1/5-1/3 larger than that of the lamp bead. The glue that overflows is conveniently accepted to vacant position around the lamp pearl, prevents that glue from falling to the position that sets up the fluorescent glue, influences the light efficiency.
According to the light source structure of the second aspect of the invention, the height of the die bonding boss is 1-1.5 times of the thickness of the lamp bead.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a schematic diagram of a light source structure of the present invention;
FIG. 2 is a schematic structural view of a surface mount LED lamp bead support structure of the present invention;
fig. 3 is a schematic view of the mounting structure of the die bonding boss and the lamp bead of the invention.
Detailed Description
Reference will now be made in detail to the present preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and larger, smaller, larger, etc. are understood as excluding the number, and larger, smaller, inner, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
Referring to fig. 1, the light source structure comprises a surface mount LED lamp bead support structure 10, lamp beads 20 and fluorescent glue 30, wherein the lamp beads 20 are fixed on a die bonding boss 11, the lamp beads 20 are electrically connected with a positive electrode 21 and a negative electrode 22, and the fluorescent glue 30 is arranged in an inner cavity and wraps the lamp beads 20 and the die bonding boss 11.
Referring to fig. 3, the surface mount LED lamp bead support structure 10 is provided with an inner cavity having an inverted trapezoidal cross section, the inner cavity is provided with a die bonding boss 11 having an inverted trapezoidal cross section, the die bonding boss 11 is provided with a positive electrode 21 and a negative electrode 22, the die bonding boss 11 is used for mounting a lamp bead 20, an interval 12 is provided between the edge of the bottom of the die bonding boss 11 and the edge of the bottom of the inner cavity, and the inner wall of the inner cavity is covered with a reflective layer 13.
In actual use, the lamp beads 20 are installed on the die bonding bosses 11, light emitted from the bottom edges of the lamp beads 20 is emitted to the reflective layer 13 on the inner wall of the inner cavity along the bevel edges of the die bonding bosses 11, so that the light shielded in the old structural design can be effectively reflected out of the surface mount LED lamp bead support structure 10 through the reflective layer 13, in addition, the deposition accumulation of fluorescent glue 30 can be effectively prevented by the edges of the bottom of the die bonding bosses 11 and the intervals 12 of the edges of the bottom of the inner cavity, the influence on light paths is avoided, and the light efficiency is effectively improved.
Referring to fig. 2, in the first embodiment, an included angle between a side of a cross section of the die bonding boss 11 and a bottom surface of the inner cavity is set to be 45 °, an area of an upper surface of the die bonding boss 11 is 1/5 larger than an area of the lamp bead 20, and a height of the die bonding boss 11 is 1 time of a thickness of the lamp bead 20. .
In the second embodiment, an included angle between the side of the cross section of the die bonding boss 11 and the bottom surface of the inner cavity is set to be 30 °, the area of the upper surface of the die bonding boss 11 is 1/3 larger than the area of the lamp bead 20, and the height of the die bonding boss 11 is 1.5 times of the thickness of the lamp bead 20. .
The included angle between the side edge of the cross section of the die bonding boss 11 and the bottom surface of the inner cavity is limited to 30-45 degrees, the light emitting angle of the lamp bead 20 can be effectively matched, most of light emitted from the lamp bead 20 can be directly emitted onto the reflecting layer 13, and the light efficiency is further improved.
And the area of the upper surface of the die bonding boss 11 is larger than the area of the lamp bead 20, so that space can be effectively provided for accommodating overflowing glue, and the upper surface of the die bonding boss 11 can be effectively prevented from shielding light rays emitted from the side edge of the lamp bead 20 by controlling the die bonding boss between 1/5-1/3.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (6)
1. The utility model provides a paster LED lamp pearl supporting structure which characterized in that is provided with the transversal inner chamber of personally submitting trapezoidal, be provided with the solid brilliant boss of transversal trapezoidal personally submitting in the inner chamber, gu brilliant boss is provided with positive electrode and negative electrode, gu brilliant boss is used for installing the lamp pearl, gu the edge of brilliant boss bottom with the edge utensil of inner chamber bottom is provided with the interval, the inner wall of inner chamber covers there is the reflector layer.
2. The paster LED lamp bead support structure of claim 1, wherein the upper surface of the die bonding boss is circular.
3. The paster LED lamp bead support structure according to claim 1, wherein the included angle between the side of the cross section of the die bonding boss and the bottom surface of the inner cavity is set to be 30-45 °.
4. A light source structure, characterized by, include paster LED lamp pearl support structure, lamp pearl and fluorescent glue of claim 1, 2 or 3, the lamp pearl is fixed on solid brilliant boss, the lamp pearl with positive electrode and negative electrode electricity are connected, fluorescent glue sets up in the inner chamber and wraps up the lamp pearl and gu brilliant boss.
5. The light source structure of claim 4, wherein the area of the upper surface of the die bonding boss is 1/5-1/3 larger than the area of the lamp bead.
6. The light source structure of claim 5, wherein the height of the die bonding boss is 1-1.5 times of the thickness of the lamp bead.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201911357696.2A CN110993770A (en) | 2019-12-25 | 2019-12-25 | Paster LED lamp pearl supporting structure and light source structure |
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CN201911357696.2A CN110993770A (en) | 2019-12-25 | 2019-12-25 | Paster LED lamp pearl supporting structure and light source structure |
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CN110993770A true CN110993770A (en) | 2020-04-10 |
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CN201911357696.2A Pending CN110993770A (en) | 2019-12-25 | 2019-12-25 | Paster LED lamp pearl supporting structure and light source structure |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103199183A (en) * | 2013-04-08 | 2013-07-10 | 厦门市三安光电科技有限公司 | Packaging structure enhancing brightness of vertical light-emitting diode (LED) chip |
CN208753358U (en) * | 2018-08-24 | 2019-04-16 | 深圳市穗晶光电股份有限公司 | A kind of novel adopting surface mounted LED illuminating source packaging structure |
CN208819911U (en) * | 2018-10-09 | 2019-05-03 | 深圳市领德奥普电子有限公司 | High photosynthetic efficiency integrated LED bracket |
CN109830590A (en) * | 2019-02-03 | 2019-05-31 | 泉州三安半导体科技有限公司 | Light emitting device |
CN209169186U (en) * | 2018-11-28 | 2019-07-26 | 江西鸿利光电有限公司 | A kind of device promoting LED light emission luminance |
CN211350686U (en) * | 2019-12-25 | 2020-08-25 | 广东华辉煌光电科技有限公司 | Paster LED lamp pearl supporting structure and light source structure |
-
2019
- 2019-12-25 CN CN201911357696.2A patent/CN110993770A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103199183A (en) * | 2013-04-08 | 2013-07-10 | 厦门市三安光电科技有限公司 | Packaging structure enhancing brightness of vertical light-emitting diode (LED) chip |
CN208753358U (en) * | 2018-08-24 | 2019-04-16 | 深圳市穗晶光电股份有限公司 | A kind of novel adopting surface mounted LED illuminating source packaging structure |
CN208819911U (en) * | 2018-10-09 | 2019-05-03 | 深圳市领德奥普电子有限公司 | High photosynthetic efficiency integrated LED bracket |
CN209169186U (en) * | 2018-11-28 | 2019-07-26 | 江西鸿利光电有限公司 | A kind of device promoting LED light emission luminance |
CN109830590A (en) * | 2019-02-03 | 2019-05-31 | 泉州三安半导体科技有限公司 | Light emitting device |
CN211350686U (en) * | 2019-12-25 | 2020-08-25 | 广东华辉煌光电科技有限公司 | Paster LED lamp pearl supporting structure and light source structure |
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