CN110991137A - Three-dimensional radio frequency circuit design method - Google Patents
Three-dimensional radio frequency circuit design method Download PDFInfo
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- CN110991137A CN110991137A CN201911317997.2A CN201911317997A CN110991137A CN 110991137 A CN110991137 A CN 110991137A CN 201911317997 A CN201911317997 A CN 201911317997A CN 110991137 A CN110991137 A CN 110991137A
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- 238000000034 method Methods 0.000 title claims abstract description 14
- 230000005540 biological transmission Effects 0.000 claims abstract description 14
- 238000006243 chemical reaction Methods 0.000 claims abstract description 11
- 230000008054 signal transmission Effects 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 238000004080 punching Methods 0.000 claims description 4
- 230000010354 integration Effects 0.000 abstract description 8
- 238000010586 diagram Methods 0.000 description 8
- 239000010410 layer Substances 0.000 description 6
- 239000002356 single layer Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 230000009466 transformation Effects 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000010618 wire wrap Methods 0.000 description 1
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Abstract
The invention relates to a three-dimensional radio frequency circuit design method, which utilizes a straight-through type elastic connector to realize the radio frequency signal interconnection among multilayer radio frequency circuits, utilizes a 90-degree bent angle elastic coaxial connector to realize the signal conversion of radio frequency signals from a horizontal circuit to a vertical side wall circuit, realizes the transmission of the signals in any direction in a three-dimensional space, improves the two-dimensional half-circuit form of the existing laminated structure, and further improves the integration degree and the flexibility of a radio frequency system.
Description
Technical Field
The invention belongs to the technical field of circuits, and particularly relates to a method for realizing three-dimensional radio frequency circuit design.
Background
With the rapid development of the MCM/MMCI technology, the radio frequency circuit system has great progress in the miniaturization and integration direction, and the integration of the radio frequency system in the three-dimensional direction is further promoted by the technical progress of micro coaxial connectors such as fuzz buttons, elastic pins and the like. However, the existing integration technology adopts a two-dimensional half-form of a laminated structure, and its basic structure form, as shown in fig. 1, a gold wire connects an MMIC microwave chip and a planar microstrip transmission line together, then transitions to a stripline portion through impedance transformation, then turns signals to be transmitted upwards or downwards through a quasi-coaxial (dielectric plate punching) form, and then transmits the signals to other radio frequency circuit layers through a coaxial connector with an elastic function, which is a millimeter wave frequency band already covered by the technology. Fig. 2 shows a schematic diagram of the three-dimensional structure of such a circuit. Although this type of structure increases the integration of the system in a horizontal unit area, the stacked structure does not completely realize three-dimensional transmission of signals, and thus, it can be calculated as a two-dimensional half-circuit. If the integration level of the system is further improved, a new design method is required to improve the utilization degree of the existing space and realize real three-dimensional transmission of signals.
Disclosure of Invention
Technical problem to be solved
In order to avoid the defects of the prior art, the invention provides a method for realizing the design of a three-dimensional radio frequency circuit.
Technical scheme
A three-dimensional radio frequency circuit design method is characterized in that: signals on the MMIC chip are connected with the microstrip line through gold wire bonding, then converted into strip line transmission signals through impedance conversion, finally converted into a coaxial-like structure through punching, and connected with the elastic coaxial connector for signal transmission; the elastic coaxial connector comprises an elastic coaxial connector with a through structure and a 90-degree bent coaxial connector, wherein radio-frequency signals can be transmitted among a plurality of radio-frequency circuit layers by using the elastic coaxial connector with the through structure; the 90-degree bent coaxial connector can ensure that signals can be transmitted on a transmission line and a radio frequency chip which are arranged on the metal shell at the bottom, and can also be arranged on the metal wall on any side surface, so that the signals can be transmitted between all surfaces at will, and the real three-dimensional radio frequency circuit structure is finally realized.
The 90-degree bent coaxial connector is a fuzz button or an elastic needle.
Advantageous effects
The invention provides a method for realizing three-dimensional radio frequency circuit design, which realizes the radio frequency signal interconnection among multilayer radio frequency circuits by utilizing a straight-through type elastic connector, realizes the signal conversion between a horizontal circuit and a vertical side wall circuit of a radio frequency signal by utilizing a 90-degree bent angle elastic coaxial connector, realizes the transmission of the signal in any direction in a three-dimensional space, improves the two-dimensional half circuit form of the existing laminated structure, and further improves the integration degree and the flexibility of a radio frequency system.
The invention has the following characteristics:
[1] the conversion of signals from the horizontal direction to the vertical direction of the side wall is realized by using a 90-degree bent coaxial connector.
[2] The circuit adopts microstrip, stripline and similar coaxial structures to realize the conversion of radio frequency signals from the microstrip to the coaxial connector port.
[3] When the signal is transmitted to the direction of the side wall, a new planar circuit is converted, and the signal can be transmitted in any direction in the plane of the side wall.
[3] The method can also realize signal transmission between the side walls and realize transmission in any direction in space.
Drawings
Fig. 1 is a schematic diagram of a two-dimensional half-form radio frequency circuit structure of a stacked structure, mainly explaining a method for designing a signal transmission circuit of a two-dimensional half-form stacked structure, and giving a detailed explanation of each part, each layer being connected by a through coaxial connector.
Fig. 2 is a schematic diagram of a single-layer three-dimensional structure of a radio frequency circuit in the form of two-dimensional halves of a laminated structure, showing a single-layer basic circuit structure form of a signal transmission circuit in the form of two-dimensional halves of a laminated structure, the layers being connected by a through coaxial connector.
Fig. 3 is a schematic structural diagram of a three-dimensional rf circuit, which mainly explains the design of circuits and transmission paths in the three-dimensional rf circuit, and gives a detailed explanation of each part, each layer is connected by a through coaxial connector, and a single-layer internal signal can be transmitted at any position on a sidewall.
Fig. 4 is a single-layer three-dimensional structure diagram of the radio frequency circuit with a three-dimensional structure, which shows a single-layer basic circuit structure form of a signal transmission circuit in a three-dimensional circuit form, and shows a signal conversion and transmission diagram on three surfaces.
Fig. 5 is a schematic diagram of microstrip circuit conversion, which shows a schematic structural form of conversion between microstrip-stripline-like coaxial circuits, thereby realizing conversion of radio frequency signals from plane to three-dimensional transmission.
Detailed Description
The invention will now be further described with reference to the following examples and drawings:
the invention provides a circuit design mode for realizing signal transmission from a horizontal circuit to the vertical direction and the side wall direction by utilizing a linear and 90-degree bent angle coaxial connector (a fuzz button, an elastic needle and the like). As shown in fig. 3 and 4, in addition to the use of a conventional straight-line elastic connector, an elastic connector with a 90 ° bend angle is added to the circuit, so that signals are transmitted directly from a horizontal plane after passing through the bend-type connector to be converted into arbitrary transmission along a 90-vertical sidewall direction. It is also possible to transmit signals between any two adjacent side walls, as shown in fig. 4, from the bottom printed board to the side walls, and from the side walls to the rear wall on the inside. The design method can realize the conversion and transmission of signals in any direction in a three-dimensional space, thereby solving the problems of wiring interference, wire wrapping, bridging and the like of a plurality of signals in the radio frequency circuit system, and greatly improving the integration level and the flexibility of the design of the radio frequency circuit system.
The design method can be applied to a radio frequency circuit form based on an MMIC/MCM technology and a common microstrip circuit form, and only the MMIC radio frequency chip is replaced by a radio frequency chip or a module containing pins, and the welding form is changed from gold wire bonding to surface mounting.
Fig. 5 shows the basic structure of the structure, and it can be seen from the figure that the signal on the MMIC chip is connected with the microstrip line through gold wire bonding, then converted into a stripline transmission signal through impedance transformation (which is convenient for transition to the similar coaxial structure, and can also increase shielding isolation and reduce interference), and finally converted into the similar coaxial structure through punching, and connected with the elastic coaxial connector for signal transmission. Fig. 3 and 4 show schematic circuit diagrams of structural forms of three-dimensional rf circuits, and it can be ensured that rf signals are transmitted between multiple rf circuit layers by using an elastic coaxial connector of a straight-through structure, and signals can be ensured by using a 90-degree bent coaxial connector to be transmitted not only on a transmission line and an rf chip mounted on a metal casing at the bottom, but also on a metal wall on any side surface, so that signals can be transmitted between all surfaces at will, and a true three-dimensional rf circuit structure is finally realized.
Claims (2)
1. A three-dimensional radio frequency circuit design method is characterized in that: signals on the MMIC chip are connected with the microstrip line through gold wire bonding, then converted into strip line transmission signals through impedance conversion, finally converted into a coaxial-like structure through punching, and connected with the elastic coaxial connector for signal transmission; the elastic coaxial connector comprises an elastic coaxial connector with a through structure and a 90-degree bent coaxial connector, wherein radio-frequency signals can be transmitted among a plurality of radio-frequency circuit layers by using the elastic coaxial connector with the through structure; the 90-degree bent coaxial connector can ensure that signals can be transmitted on a transmission line and a radio frequency chip which are arranged on the metal shell at the bottom, and can also be arranged on the metal wall on any side surface, so that the signals can be transmitted between all surfaces at will, and the real three-dimensional radio frequency circuit structure is finally realized.
2. The method of claim 1, wherein the 90 ° bend coaxial connector is a fuzz button or a pogo pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911317997.2A CN110991137A (en) | 2019-12-19 | 2019-12-19 | Three-dimensional radio frequency circuit design method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911317997.2A CN110991137A (en) | 2019-12-19 | 2019-12-19 | Three-dimensional radio frequency circuit design method |
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| CN110991137A true CN110991137A (en) | 2020-04-10 |
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| CN201911317997.2A Pending CN110991137A (en) | 2019-12-19 | 2019-12-19 | Three-dimensional radio frequency circuit design method |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10209720A (en) * | 1997-01-17 | 1998-08-07 | Hitachi Ltd | Multilayer mounted mmic circuit |
| US6597902B1 (en) * | 1999-06-29 | 2003-07-22 | Mitsubishi Denki Kabushiki Kaisha | Radio-frequency circuit module |
| CN102255165A (en) * | 2011-05-16 | 2011-11-23 | 镇江步云电子有限公司 | High-power right-angle radio frequency coaxial connector |
| CN104103612A (en) * | 2014-07-07 | 2014-10-15 | 中国电子科技集团公司第二十研究所 | Perpendicular interconnection transition structure applied to three-dimensional module |
| CN104332413A (en) * | 2014-05-30 | 2015-02-04 | 中国电子科技集团公司第十研究所 | 3D assembling method for integrally integrating chips of T/R assembly |
| CN104733824A (en) * | 2015-03-25 | 2015-06-24 | 中国电子科技集团公司第二十九研究所 | Radio-frequency vertical transformation circuit based on fuzz button |
| CN106783847A (en) * | 2016-12-21 | 2017-05-31 | 中国电子科技集团公司第五十五研究所 | For the three-dimensional bonding stacked interconnected integrated manufacturing method of radio frequency micro-system device |
-
2019
- 2019-12-19 CN CN201911317997.2A patent/CN110991137A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10209720A (en) * | 1997-01-17 | 1998-08-07 | Hitachi Ltd | Multilayer mounted mmic circuit |
| US6597902B1 (en) * | 1999-06-29 | 2003-07-22 | Mitsubishi Denki Kabushiki Kaisha | Radio-frequency circuit module |
| CN102255165A (en) * | 2011-05-16 | 2011-11-23 | 镇江步云电子有限公司 | High-power right-angle radio frequency coaxial connector |
| CN104332413A (en) * | 2014-05-30 | 2015-02-04 | 中国电子科技集团公司第十研究所 | 3D assembling method for integrally integrating chips of T/R assembly |
| CN104103612A (en) * | 2014-07-07 | 2014-10-15 | 中国电子科技集团公司第二十研究所 | Perpendicular interconnection transition structure applied to three-dimensional module |
| CN104733824A (en) * | 2015-03-25 | 2015-06-24 | 中国电子科技集团公司第二十九研究所 | Radio-frequency vertical transformation circuit based on fuzz button |
| CN106783847A (en) * | 2016-12-21 | 2017-05-31 | 中国电子科技集团公司第五十五研究所 | For the three-dimensional bonding stacked interconnected integrated manufacturing method of radio frequency micro-system device |
Non-Patent Citations (3)
| Title |
|---|
| 严伟等: "三维微波多芯片组件垂直微波互联技术" * |
| 刘江洪;刘长江;罗明;王辉;: "基于毛纽扣的板级垂直互连技术" * |
| 田川: "T/R组件小型化关键技术研究" * |
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Application publication date: 20200410 |