CN220324682U - Radio frequency signal transmission structure - Google Patents

Abstract

The application discloses a radio frequency signal transmission structure, which comprises a circuit board, a waveguide and a conduction assembly; the surface of the circuit board is provided with a coupling area, the waveguide is provided with a conducting cavity and an opening communicated with the conducting cavity, the waveguide is fixed on the circuit board, and the opening is opposite to the coupling area; the conduction assembly comprises a first flying disc, a second flying disc and a conduction rod, wherein the first flying disc and the second flying disc are respectively and fixedly connected with two ends of the conduction rod, one side of the first flying disc, which is away from the conduction rod, is fixed in the coupling area, gaps are reserved between the periphery of the first flying disc and the periphery of the coupling area, and the conduction rod and the second flying disc are accommodated in the conduction cavity. In the application, the radio frequency signal can be coupled to the first flying disc in the coupling area and transmitted to the second flying disc along the conducting rod, and the second flying disc can couple the radio frequency signal to the conducting cavity; or, the radio frequency signal can be coupled to the second flying disc from the conducting cavity and transmitted to the first flying disc along the conducting rod, and the first flying disc can couple the radio frequency signal to the coupling area, so that the signal energy loss is small.

Description

Radio frequency signal transmission structure

Technical Field

The application relates to the technical field of waveguides, in particular to a radio frequency signal transmission structure.

Background

Waveguides and microstrip lines are two important transmission modes in millimeter wave circuits and systems. The former has low loss characteristics and is widely used as a component in feedhorns and low loss power distribution/combining networks. The latter has the advantage of compact size and is an important component in hybrid microwave integrated circuit and monolithic microwave integrated circuit applications. In order to achieve a compact and high performance microwave or millimeter wave system, rectangular waveguides and microstrip lines are often used in combination. Therefore, the problem of switching between these two transmission media must be well resolved to effectively integrate the waveguide with the microstrip circuit.

Disclosure of Invention

An object of the present application is to provide a radio frequency signal transmission structure, so as to solve the above problem, and achieve good signal transmission between two different media by adopting a flying disc structure.

The radio frequency signal transmission structure comprises a circuit board, a waveguide and a conduction assembly; the surface of the circuit board is provided with a coupling area, the waveguide is provided with a conducting cavity and an opening communicated with the conducting cavity, the waveguide is fixed on the circuit board, and the opening is opposite to the coupling area; the conduction assembly comprises a first flying disc, a second flying disc and a conduction rod, wherein the first flying disc and the second flying disc are respectively and fixedly connected with two ends of the conduction rod, one side of the first flying disc, which is away from the conduction rod, is fixed in the coupling area, gaps are reserved between the periphery of the first flying disc and the periphery of the coupling area, and the conduction rod and the second flying disc are accommodated in the conduction cavity.

In some embodiments, the conductive cavity comprises a first cavity and a second cavity which are communicated with each other, the first cavity is provided with a bottom wall, the opening is arranged on the bottom wall, and the bottom wall is fixedly attached to the circuit board; the conducting rod comprises a first connecting section and a second connecting section which are fixedly connected, the first flying disc is fixed at the end part of the first connecting section, which is far away from the second connecting section, the end part of the second connecting section, which is far away from the first connecting section, extends into the second cavity, and the second flying disc is fixed at the end part of the second connecting section, which is far away from the first connecting section.

In some embodiments, the first flying disc includes first and second surfaces opposite each other in a thickness direction thereof, the first surface fixedly connected to the coupling region, the second surface fixedly connected to an end of the first connection section remote from the second connection section; the second flying disc comprises a third surface and a fourth surface which are opposite along the thickness direction of the second flying disc, the third surface is fixedly connected with the end part of the second connecting section far away from the first connecting section, and the fourth surface is perpendicular to the extending direction of the second cavity.

In some embodiments, the center point of the first surface and the center point of the coupling region coincide; alternatively, the center point of the first surface and the center point of the coupling region are offset from each other.

In some embodiments, the radio frequency signal transmission structure further includes a microstrip line, and the circuit board includes a first metal layer, a substrate, and a second metal layer that are sequentially stacked; the coupling area is positioned on the surface of the substrate facing the first metal layer, the first metal layer is provided with an avoidance port, and the coupling area is exposed from the avoidance port; the waveguide is fixed on the first metal layer, and the opening corresponds to the avoidance opening; the microstrip line is fixed on the substrate, the microstrip line and the second metal layer are positioned on the same side surface of the circuit board, the orthographic projection of the second metal layer on the substrate is at least partially overlapped with the coupling area, the orthographic projection of the first metal layer on the substrate covers the orthographic projection of the microstrip line on the substrate, and the radio frequency signal is transmitted between the first metal layer and the microstrip line.

In some embodiments, the width of the orthographic projection of the first metal layer on the substrate is more than three times the width of the orthographic projection of the microstrip line on the substrate.

In some embodiments, the first metal layer completely covers the surface of the side of the substrate where the coupling region is provided.

In some embodiments, the coupling region is covered by the orthographic projection of the second metal layer on the substrate, and the microstrip line is connected to the second metal layer.

In some embodiments, the radio frequency signal transmission structure further includes a first shield penetrating the substrate and connecting the first metal layer and the second metal layer and enclosing a first shielding region, and a second shield penetrating the substrate and connecting the first metal layer and the second metal layer and enclosing a second shielding region; the first shielding region and the second shielding region are communicated with each other; at least part of the microstrip line is positioned in the first shielding region, and the coupling region is positioned in the second shielding region.

In some embodiments, the coupling region is covered by the orthographic projection part of the second metal layer on the substrate, and the second metal layer is provided with an avoidance channel, and the orthographic projection of the avoidance channel on the substrate is at least partially overlapped with the coupling region; the microstrip line is arranged on one side surface of the substrate, which is close to the second metal layer, and extends from the avoidance channel to the coupling area, and a gap exists between the microstrip line and the periphery of the avoidance channel.

In some embodiments, the radio frequency signal transmission structure further includes a first shielding member penetrating the substrate and connecting the first metal layer and the second metal layer, and enclosing a first shielding region; the coupling region is located in the first shielding region.

In some embodiments, the front projection of the opening on the substrate coincides with the front projection of the relief opening on the substrate.

In some embodiments, the radio frequency signal transmission structure further comprises a microstrip line; the circuit board comprises a first metal layer, a substrate and a second metal layer which are sequentially stacked; the coupling area is positioned on the surface of the substrate facing the first metal layer, the first metal layer is provided with an avoidance port, and the coupling area is exposed from the avoidance port; the waveguide is fixed on the first metal layer, and the opening corresponds to the avoidance opening; the microstrip line is fixed on the substrate, the microstrip line and the first metal layer are positioned on the same side surface of the circuit board, the orthographic projection of the second metal layer on the substrate completely covers the orthographic projection and the coupling area of the microstrip line on the substrate, and radio frequency signals are transmitted between the microstrip line and the second metal layer.

Another aspect of the present application also provides a waveguide antenna, including any one of the above radio frequency signal transmission structures.

The radio frequency signal transmission structure comprises a circuit board, a waveguide and a conduction assembly; the surface of the circuit board is provided with a coupling area, the waveguide is provided with a conducting cavity and an opening communicated with the conducting cavity, the waveguide is fixed on the circuit board, and the opening is opposite to the coupling area; the conduction assembly comprises a first flying disc, a second flying disc and a conduction rod, wherein the first flying disc and the second flying disc are respectively and fixedly connected with two ends of the conduction rod, one side of the first flying disc, which is away from the conduction rod, is fixed in the coupling area, gaps are reserved between the periphery of the first flying disc and the periphery of the coupling area, and the conduction rod and the second flying disc are accommodated in the conduction cavity.

In the application, the radio frequency signal can be coupled to the first flying disc in the coupling area and transmitted to the second flying disc along the conducting rod, and the second flying disc can couple the radio frequency signal to the conducting cavity; alternatively, the radio frequency signal can be coupled from the conductive cavity to the second flying disc and transmitted along the conductive rod to the first flying disc, which can couple the radio frequency signal to the coupling region. In this application, radio frequency signal passes through first flying disc, conducting rod and second flying disc and transmits between circuit board and waveguide, and signal energy loss is little.

Drawings

In order to more clearly illustrate the technical solutions of the present application, the drawings that are required to be used in the embodiments will be briefly described below.

Fig. 1 is a schematic structural diagram of an rf signal transmission structure according to a first embodiment of the present disclosure.

Fig. 2 is a schematic diagram of microstrip line installation in the first embodiment of the present application.

Fig. 3 is a bottom view of fig. 2.

Fig. 4 is a top view of fig. 2.

Fig. 5 is a schematic diagram of the overall structure of a conductive component in the rf signal transmission structure according to the embodiment of the present application.

Fig. 6 is a schematic diagram of the overall structure of a waveguide in the radio frequency signal transmission structure according to the embodiment of the present application.

Fig. 7 is a schematic diagram of test results of the first embodiment of the present application.

Fig. 8 is a schematic structural diagram of an rf signal transmission structure according to a second embodiment of the present disclosure.

Fig. 9 is a bottom view of a microstrip line installation of a second embodiment of the present application.

Fig. 10 is a top view of fig. 9.

Reference numerals illustrate: 100-a circuit board; 110-a coupling region; 120-substrate; 130-a first metal layer; 140-a second metal layer; 150-avoiding the channel; 200-conductive assembly; 210-a first flying disc; 220-a second flying disc; 230-a conductive rod; 231-a first connection section; 232-a second connection section; 300-waveguide; 310-conducting cavity; 320-opening; 330-a bottom wall; 400-microstrip lines; 500-a first shielding region; 510-a second shielding region; 520-metal probe.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.

Referring to fig. 1, 6 and 8, a radio frequency signal transmission structure provided in an embodiment of the present application includes a circuit board 100, a waveguide 300 and a conductive component 200; the surface of the circuit board 100 is provided with a coupling region 110, the waveguide 300 is provided with a conducting cavity 310 and an opening 320 communicated with the conducting cavity 310, the waveguide 300 is fixed on the circuit board 100, and the opening 320 is opposite to the coupling region 110.

Referring to fig. 5 for a detailed view of the conductive assembly 200, the conductive assembly 200 includes a first flying disc 210, a second flying disc 220 and a conductive rod 230, wherein the first flying disc 210 and the second flying disc 220 are respectively and fixedly connected to two ends of the conductive rod 230, one side of the first flying disc 210 facing away from the conductive rod 230 is fixed to the coupling area 110, a gap is formed between the first flying disc 210 and the periphery of the coupling area 110, and the conductive rod 230 and the second flying disc 220 are accommodated in the conductive cavity 310. Those skilled in the art will appreciate that there is no contact between second flying disc 220 and the inner wall of conductive cavity 310.

In this embodiment, the rf signal in the circuit board 100 can be coupled to the first flying disc 210 at the coupling area 110 and transmitted to the second flying disc 220 along the conductive rod 230, and the second flying disc 220 can couple the rf signal to the conductive cavity 310 and then transmit through the conductive cavity 310.

And the radio frequency signal received by waveguide 300 can be coupled from conductive cavity 310 to second flying disc 220 and transmitted along conductive rod 230 to first flying disc 210, where first flying disc 210 is conducted through opening 320 in circuit board 100 to coupling region 110 in circuit board 100 and then through coupling region 110 to microstrip line 400 on circuit board 100.

In this embodiment, through the first flying disc 210, the conducting rod 230 and the second flying disc 220, transmission between two different mediums from the circuit board 100 to the waveguide 300 of radio frequency signals is realized, loss of signal energy is reduced, and signal transmission is guaranteed to be good.

In embodiments of the present application, the conductive assembly 200 and the waveguide 300 may be fabricated separately. In this way, for the conductive assembly 200 with higher precision requirements, that is, the first flying disc 210, the conductive rod 230 and the second flying disc 220 are processed with high precision, so that energy loss is reduced in the coupling process of the first flying disc 210 and the circuit board 100, signal strength in the signal transmission process is ensured, and meanwhile, processing precision of the conductive rod 230 and the second flying disc 220 is improved, and efficiency of signals in the transmission and receiving processes can be ensured. And for the waveguide 300 with lower precision requirement, the plastic part can be processed by electroplating and other modes, so that the processing difficulty is reduced, and the cost is saved.

In this embodiment, the first flying disc 210 is coupled to the coupling region 110 of the circuit board 100, so that the transmission of the radio frequency signal between two different mediums is realized. The coupling from the waveguide directly to the circuit board by windowing is either more lossy, requires a larger cavity, requires other complex structures, and may occupy a larger area than in the prior art without the conductive assembly 200.

Further, in the embodiment of the present application, the first flying disc 210 is coupled with the circuit board 100, and no probe is needed for coupling, so that the structure or the production mode of bonding, welding, etc. is avoided, the complex assembly process of the waveguide 300 and the circuit board 100 is avoided, and even the multi-layer radio frequency board is needed to meet the production process requirement. In this embodiment, only the first flying disc 210 is required to be attached to the coupling area 110 of the circuit board 100, so that the assembly is convenient and the structure is simple.

On the other hand, in the embodiment of the present application, since the first flying disc 210 is coupled to the circuit board 100, the shape of the first flying disc 210 may be determined according to the shape of the coupling area 110 of the circuit board 100, and no fixed shape is required, for example, in the embodiment of the present application, the shape of the first flying disc 210 may be a circle, triangle, square, pentagon, or the like, and those skilled in the art may specifically set according to practical situations. In the embodiment of the application, since the production modes such as bonding and welding are not required, the fixing mode of the relative position between the first flying disc 210 and the circuit board 100 can be a relatively flexible mode according to different end products, which is much simpler than the prior art, and the requirement can be met by using a double-layer radio frequency board without using a multi-layer radio frequency board.

In the present embodiment, the waveguide 300 is fixed to the circuit board 100, and specifically, the face of the waveguide 300 provided with the opening 320 is fixed to the circuit board 100. In the embodiment of the present application, the waveguide 300 may be fixed to the circuit board 100 by soldering or the like. Since the waveguide 300 is fixed on the circuit board 100, the waveguide 300 and the circuit board 100 can be integrated into a whole, and the storage and the subsequent use can be facilitated.

Referring to fig. 5 and 6, in some embodiments, the conductive cavity 310 includes a first cavity and a second cavity that are mutually communicated, the first cavity has a bottom wall 330, the opening 320 is disposed on the bottom wall 330, and the bottom wall 330 is fixed to the circuit board 100 in a fitting manner; the conductive rod 230 includes a first connection section 231 and a second connection section 232 that are fixedly connected, the first flying disc 210 is fixed at an end of the first connection section 231 far away from the second connection section 232, the end of the second connection section 232 far away from the first connection section 231 extends into the second cavity, and the second flying disc 220 is fixed at an end of the second connection section 232 far away from the first connection section 231. It will be appreciated by those skilled in the art that the specific configuration of the conductive cavity 310 is mainly determined by looking at the position of the radio frequency signal transceiver, and the specific structure of the conductive cavity 310 is not limited in the embodiment of the present application.

For the waveguide 300 with a relatively complex structure, the shape of the conductive rod 230 may be changed, that is, the conductive rod 230 is divided into the first connection section 231 and the second connection section 232, so that the second flying disc 220 is located at a preferred position, and thus the radio frequency signal may be better coupled to the waveguide 300, or the radio frequency signal may be coupled from the waveguide 300 to the second flying disc 220, so that a relatively small coupling energy loss between the second flying disc 220 and the waveguide 300 may be ensured. Specifically, the first connection section 231 and the second connection section 232 may form a certain angle, which may be determined according to the angles of the first cavity and the second cavity, and only the second flying disc 220 is required to be located in the second cavity, so that flexibility of the conductive rod 230 is increased by arranging the first connection section 231 and the second connection section 232, and it is further understood by those skilled in the art that the first connection section 231 and the second connection section 232 are integrally formed. Of course, it is also possible for a person skilled in the art to arrange second flying disc 220 in the first cavity, i.e. conducting rod 230 has only first connecting section 231, and second flying disc 220 is fixed to the end of first connecting section 231 remote from first flying disc 210. The specific shape of the conductive rod 230 needs to be dependent on the shape or orientation of the waveguide.

Referring to fig. 1, 5 and 8, in some embodiments, first flying disc 210 includes a first surface and a second surface opposite to each other along a thickness direction thereof, the first surface being fixedly connected to coupling region 110, the second surface being fixedly connected to an end of first connection section 231 remote from second connection section 232; the second flying disc 220 includes a third surface and a fourth surface opposite to each other in the thickness direction thereof, the third surface being fixedly connected to an end of the second connection section 232 remote from the first connection section 231, the fourth surface being perpendicular to the extending direction of the second cavity. Those skilled in the art will appreciate that in the embodiments of the present application, the extending direction of the second cavity refers to the transmission direction of the radio frequency signal in the waveguide 300 after the radio frequency signal is coupled from the second flying disc 220 to the waveguide 300.

Referring to fig. 1 and 8, in some embodiments, the center point of the first surface coincides with the center point of the coupling region 110. In this embodiment, the center point of the first surface coincides with the center point of the coupling region 110, and in actual operation, there may be a certain error between the two. It should be appreciated by those skilled in the art that the energy loss during coupling of the rf signal is minimal when the center point of the first surface is fully coincident with the center point of the coupling region 110.

In other embodiments, the center point of the first surface and the center point of the coupling region 110 may be offset, so long as the coupling region 110 is capable of mounting the conductive component 200, and the first flying disc 210 of the conductive component 200 has a gap with the edge of the coupling region 110.

Referring to fig. 1 and 8, in some embodiments, the rf signal transmission structure further includes a microstrip line 400, and the circuit board 100 includes a first metal layer 130, a substrate 120, and a second metal layer 140 stacked in order; the coupling area 110 is positioned on the surface of the substrate 120 facing the first metal layer 130, the first metal layer 130 is provided with an avoidance port, and the coupling area 110 is exposed from the avoidance port; the waveguide 300 is fixed on the first metal layer 130, and the opening 320 corresponds to the avoiding opening; the microstrip line 400 is fixed on the substrate 120, and the microstrip line 400 and the second metal layer 140 are located on the same side surface of the circuit board 100, the orthographic projection of the second metal layer 140 on the substrate 120 at least partially coincides with the coupling region 110, the orthographic projection of the first metal layer 130 on the substrate 120 covers the orthographic projection of the microstrip line 400 on the substrate 120, and the radio frequency signal is transmitted between the first metal layer 130 and the microstrip line 400. In this embodiment, the first metal layer 130 may be a copper, silver conductive metal layer, or the like, and in this embodiment, a copper layer is preferred, and copper has excellent conductivity and is inexpensive.

In this embodiment, the bottom surface of the waveguide 300 is directly welded on the first metal layer 130, so that the circuit board 100 of the waveguide 300 is integrated, and the first metal layer 130 can also become the ground wire of the waveguide 300, so that the ground wire does not need to be separately arranged on the waveguide 300, and the structure and the process are simplified. First flying disc 210 is secured to coupling region 110, and may be specifically secured by welding or the like. It will be appreciated by those skilled in the art that the presence of a gap between first flying disc 210 and the perimeter of coupling region 110 means that there is no contact between first flying disc 210 and first metal layer 130, so that the rf signal is guaranteed to couple between first flying disc 210 and circuit board 100. In this embodiment, the orthographic projection of the first metal layer 130 on the substrate 120 covers the orthographic projection of the microstrip line 400 on the substrate 120, so that the transmission of the radio frequency signal between the microstrip line 400 and the first metal layer 130 can be ensured, and the radio frequency signal is prevented from overflowing, thereby ensuring the strength of the radio frequency signal.

In some embodiments, the width of the orthographic projection of the first metal layer 130 on the substrate 120 is more than three times the width of the orthographic projection of the microstrip line 400 on the substrate 120. The width of the microstrip line 400 in the present application refers to the dimension of the microstrip line 400 perpendicular to the transmission direction of the radio frequency signal. It will be appreciated by those skilled in the art that the microstrip line 400 should be located in the middle of the width direction of the first metal layer 130 in the width direction of the substantially orthographic projection, so that the first metal layers 130 located at two sides of the width direction of the microstrip line 400 are symmetrical, so as to ensure the strength of the radio frequency signal. Those skilled in the art will also appreciate that the wider the front projection of the first metal layer 130 on the substrate 120, the less signal is spilled, and that the radio frequency signal is minimally lost during transmission when the width of the front projection of the first metal layer 130 on the substrate 120 is more than three times the width of the front projection of the microstrip line 400 on the substrate 120, as tested.

In some embodiments, the first metal layer 130 completely covers the surface of the substrate 120 on the side where the coupling region 110 is disposed. Thus, the processing of the circuit board 100 can be facilitated, and the processing difficulty of the circuit board 100 can be reduced.

In this embodiment, the rf signal is transmitted to the coupling region 110 along the microstrip line 400, and the microstrip line 400 has various connection modes. The present application will disclose different connection manners of the microstrip line 400 through different embodiments, but it will be understood by those skilled in the art that the microstrip line 400 may also be provided by a manner different from the embodiments provided in the present application.

Referring to fig. 1, 2, 3 and 4, a first embodiment of a microstrip line 400 is disclosed in this embodiment. In the first embodiment provided in the present application, the front projection of the second metal layer 140 on the substrate 120 covers the coupling region 110, and the microstrip line 400 is connected to the second metal layer 140. Typically, the second metal layer 140 covers half of the substrate 120 as a ground line of the substrate 120 for convenience of processing. In this embodiment of the present utility model, in one embodiment,

in some embodiments, the radio frequency signal transmission structure further includes a first shielding member and a second shielding member, the first shielding member penetrates the substrate 120 and connects the first metal layer 130 and the second metal layer 140, and encloses a first shielding region 500, and the second shielding member penetrates the substrate 120 and connects the first metal layer 130 and the second metal layer 140, and encloses a second shielding region 510; the first shielding region 500 and the second shielding region 510 communicate with each other; at least part of the microstrip line 400 is located in the first shielding region 500, and the coupling region 110 is located in the second shielding region 510.

In this embodiment, the first shielding member and the second shielding member are both communicated with the first metal layer 130 and the second metal layer 140, which is equivalent to that the waveguide 300 and the substrate 120 have the same ground wire, so that the transmission efficiency of the radio frequency signal can be enhanced, and the loss of energy of the radio frequency signal in the transmission process is avoided. Further, in the embodiment of the present application, the first shielding region 500 and the second shielding region 510 are provided, and the structure similar to the waveguide 300 can be formed by combining the substrate 120, so that the transmission strength of the radio frequency signal can be ensured, and the radio frequency signal can be transmitted along the required direction, so that the energy loss of the radio frequency signal is avoided.

Referring to fig. 7, for the microstrip line mounting structure in the first embodiment, in this embodiment, by taking the requirement of the 76-77 GHz radar as an example, simulation results are shown in fig. 7, and it can be found that the return loss is less than-15 dB, and the conventional return loss parameter requirement can be completely satisfied.

Referring to fig. 8, 9 and 10, the present application further provides a second embodiment, in which a front projection portion of the second metal layer 140 on the substrate 120 covers the coupling region 110, the second metal layer 140 is provided with an avoidance channel 150, and the front projection of the avoidance channel 150 on the substrate 120 at least partially coincides with the coupling region 110; the microstrip line 400 is disposed on a surface of the substrate 120 near the second metal layer 140, and the microstrip line 400 extends from the avoidance channel 150 to the coupling region 110, where there is a space between the microstrip line 400 and the periphery of the avoidance channel 150. In this embodiment, the microstrip line 400 is not in contact with the second metal layer 140. The microstrip line 400 arrangement provided in the first embodiment or the microstrip line 400 arrangement provided in the second embodiment may be rotated as required by a person skilled in the art.

In some embodiments, the radio frequency signal transmission structure further includes a first shielding member penetrating the substrate 120 and connecting the first metal layer 130 and the second metal layer 140, and enclosing a first shielding region 500; the coupling region 110 is located at the first shielding region 500. In this embodiment of the present application, since the microstrip line 400 extends to the coupling region 110, only the first shielding member is required to enclose the coupling region 110 to form the first shielding region 500, so that stable transmission of radio frequency signals can be ensured, and energy loss is reduced.

It will be appreciated by those skilled in the art that the first shield and the second shield may each be comprised of a plurality of metal pins. Specifically, the plurality of metal pins penetrate through the first metal layer 130 and the second metal layer 140 and are communicated, and the distance between two adjacent probes is smaller than one tenth of a wavelength (i.e. radio frequency signal), so that the radio frequency signal is surrounded by the first metal layer 130, the second metal layer 140 and the metal probe 520, and is enclosed in an enclosed area formed by the metal probe 520, the first metal layer 130 and the second metal layer 140, thereby achieving the effect of preventing the radio frequency signal from leaking.

It will be appreciated that during transmission of the rf signal, there is an rf signal not just at the coupling region 110, but also within the area enclosed by the metal probe 520.

The microstrip line 400 arrangement provided in the first embodiment or the microstrip line 400 arrangement provided in the second embodiment may be rotated as required by a person skilled in the art. Of course, other microstrip line 400 configurations may be rotated by those skilled in the art.

In some embodiments, the front projection of the opening 320 onto the substrate 120 coincides with the front projection of the relief opening onto the substrate 120. This is provided to further reduce energy losses during transmission of the radio frequency signal. In general, however, the opening 320 may be sized slightly larger than the coupling region 110 for ease of installation. It should be noted by those skilled in the art that the larger the size difference between the opening 320 and the coupling region 110, the more energy is lost during transmission of the rf signal.

The present application also provides a third embodiment of the arrangement mode of the microstrip line 400, in this embodiment, the radio frequency signal transmission structure further includes the microstrip line 400; the circuit board 100 includes a first metal layer 130, a substrate 120, and a second metal layer 140 stacked in this order; the coupling area 110 is positioned on the surface of the substrate 120 facing the first metal layer 130, the first metal layer 130 is provided with an avoidance port, and the coupling area 110 is exposed from the avoidance port; the waveguide 300 is fixed on the first metal layer 130, and the opening 320 corresponds to the avoiding opening; the microstrip line 400 is fixed on the substrate 120, and the microstrip line 400 and the first metal layer 130 are located on the same side surface of the circuit board 100, and the orthographic projection of the second metal layer 140 on the substrate 120 completely covers the orthographic projection of the microstrip line 400 on the substrate 120 and the coupling area 110, and the radio frequency signal is transmitted between the microstrip line 400 and the second metal layer 140. In this embodiment, the microstrip line 400 is disposed on the side of the substrate 120 where the first metal layer 130 is disposed, and it should be noted that there is no contact between the microstrip line 400 and the first metal layer 130, that is, there is a gap between the microstrip line 400 and the first metal layer 130. It will be appreciated by those skilled in the art that, in this embodiment, a shielding region may also be provided, and specific reference may be made to the first embodiment and/or the second embodiment, which are not described herein.

The foregoing has outlined rather broadly the more detailed description of embodiments of the present application, wherein specific examples are provided herein to illustrate the principles and embodiments of the present application, and wherein the above examples are provided to assist in the understanding of the methods and concepts of the present application.

Claims (13)

1. The radio frequency signal transmission structure is characterized by comprising a circuit board, a waveguide and a conduction assembly;

the surface of the circuit board is provided with a coupling area, the waveguide is provided with a conducting cavity and an opening communicated with the conducting cavity, the waveguide is fixed on the circuit board, and the opening is opposite to the coupling area;

the conduction assembly comprises a first flying disc, a second flying disc and a conduction rod, wherein the first flying disc and the second flying disc are respectively and fixedly connected with two ends of the conduction rod, one side, deviating from the conduction rod, of the first flying disc is fixed in the coupling area, gaps are reserved between the periphery of the first flying disc and the periphery of the coupling area, and the conduction rod and the second flying disc are accommodated in the conduction cavity.

2. The radio frequency signal transmission structure according to claim 1, wherein the conductive cavity comprises a first cavity and a second cavity which are communicated with each other, the first cavity is provided with a bottom wall, the opening is arranged on the bottom wall, and the bottom wall is fixedly attached to the circuit board;

the conducting rod comprises a first connecting section and a second connecting section which are fixedly connected, the first flying disc is fixed at the end part of the first connecting section, which is far away from the second connecting section, the second connecting section is far away from the end part of the first connecting section, which extends into the second cavity, and the second flying disc is fixed at the end part of the second connecting section, which is far away from the first connecting section.

3. The radio frequency signal transmission structure according to claim 2, wherein the first flying disc includes a first surface and a second surface opposite to each other in a thickness direction thereof, the first surface being fixedly connected to the coupling region, the second surface being fixedly connected to an end of the first connection section remote from the second connection section;

the second flying disc comprises a third surface and a fourth surface which are opposite to each other along the thickness direction of the second flying disc, the third surface is fixedly connected with the end part of the second connecting section, which is far away from the first connecting section, and the fourth surface is perpendicular to the extending direction of the second cavity.

4. A radio frequency signal transmission structure according to claim 3, wherein the centre point of the first surface and the centre point of the coupling region coincide; alternatively, the center point of the first surface and the center point of the coupling region are offset from each other.

5. The radio frequency signal transmission structure according to any one of claims 1 to 4, further comprising a microstrip line, wherein the circuit board comprises a first metal layer, a substrate, and a second metal layer, which are sequentially stacked;

the coupling area is positioned on the surface of the substrate facing the first metal layer, the first metal layer is provided with an avoidance port, and the coupling area is exposed from the avoidance port;

the waveguide is fixed on the first metal layer, and the opening corresponds to the avoidance opening;

the microstrip line is fixed on the substrate, the microstrip line and the second metal layer are positioned on the same side surface of the circuit board, the orthographic projection of the second metal layer on the substrate is at least partially overlapped with the coupling area, the orthographic projection of the first metal layer on the substrate covers the orthographic projection of the microstrip line on the substrate, and radio frequency signals are transmitted between the first metal layer and the microstrip line.

6. The radio frequency signal transmission structure according to claim 5, wherein a width of the orthographic projection of the first metal layer on the substrate is more than three times a width of the orthographic projection of the microstrip line on the substrate.

7. The structure of claim 5, wherein the first metal layer completely covers a surface of the substrate on a side where the coupling region is provided.

8. The radio frequency signal transmission structure according to claim 5, wherein the coupling region is covered by an orthographic projection of the second metal layer on the substrate, and the microstrip line is connected to the second metal layer.

9. The radio frequency signal transmission structure according to claim 8, further comprising a first shield penetrating the substrate and connecting the first metal layer and the second metal layer and enclosing a first shield area, and a second shield penetrating the substrate and connecting the first metal layer and the second metal layer and enclosing a second shield area; the first shielding region and the second shielding region are communicated with each other;

at least part of the microstrip line is positioned in the first shielding region, and the coupling region is positioned in the second shielding region.

10. The radio frequency signal transmission structure according to claim 5, wherein the coupling region is covered by an orthographic projection portion of the second metal layer on the substrate, and an avoidance channel is provided on the second metal layer, and the orthographic projection of the avoidance channel on the substrate is at least partially overlapped with the coupling region; the microstrip line is arranged on one side surface of the substrate, which is close to the second metal layer, and extends from the avoidance channel to the coupling region, and a gap exists between the microstrip line and the periphery of the avoidance channel.

11. The radio frequency signal transmission structure according to claim 10, further comprising a first shield penetrating the substrate and connecting the first metal layer and the second metal layer and enclosing a first shielding region; the coupling region is located in the first shielding region.

12. The radio frequency signal transmission structure according to claim 5, wherein the orthographic projection of the opening on the substrate and the orthographic projection of the relief opening on the substrate coincide.

13. The radio frequency signal transmission structure according to any one of claims 1 to 4, wherein the radio frequency signal transmission structure further comprises a microstrip line; the circuit board comprises a first metal layer, a substrate and a second metal layer which are sequentially stacked;

the coupling area is positioned on the surface of the substrate facing the first metal layer, the first metal layer is provided with an avoidance port, and the coupling area is exposed from the avoidance port;

the waveguide is fixed on the first metal layer, and the opening corresponds to the avoidance opening;

the microstrip line is fixed on the substrate, the microstrip line and the first metal layer are positioned on the same side surface of the circuit board, the orthographic projection of the second metal layer on the substrate completely covers the orthographic projection and the coupling area of the microstrip line on the substrate, and the radio frequency signals are transmitted between the microstrip line and the second metal layer.