CN110989859A - Touch panel and manufacturing method thereof - Google Patents
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- CN110989859A CN110989859A CN201911135015.8A CN201911135015A CN110989859A CN 110989859 A CN110989859 A CN 110989859A CN 201911135015 A CN201911135015 A CN 201911135015A CN 110989859 A CN110989859 A CN 110989859A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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Abstract
The invention provides a touch panel and a manufacturing method thereof. The array driving circuit layer is arranged on the substrate base plate, the first metal layer is arranged on the array driving circuit layer, the first black light resistor is arranged on the first metal layer, the graph of the first black light resistor is the same as that of the first metal layer, the insulating layer is arranged on the first black light resistor, the second metal layer is arranged on the insulating layer, the second metal layer penetrates through the insulating layer through a first through hole, the first black light resistor is connected with the first metal layer, the second black light resistor is arranged on the second metal layer, and the graph of the second black light resistor is the same as that of the second metal layer.
Description
Technical Field
The invention relates to the technical field of display, in particular to a flexible organic light-emitting diode display panel and a manufacturing method thereof.
Background
While the Polarizer (POL) is effective in reducing the reflectivity of the panel in high light, approximately 58% of the light output is lost. In addition, the polarizer is not easy to dynamically bend due to its large thickness and brittle material, and thus is gradually replaced by a color film, i.e. a non-polarizer (POL-less) technique. However, in recent years, Organic Light Emitting Diode (OLED) display panels have become the mainstream, and for flexible OLEDs, polarizers have more greatly reduced the yield and lifetime of the flexible OLEDs.
With the increasing control demand of people on electronic devices, display devices with touch functions are receiving more and more attention. In the prior art, the OLED touch panel basically adopts an externally-hung touch panel to realize the touch function, that is, a touch module is attached outside the OLED touch panel again, and 9 light masks are required in total. In addition, after the touch panel and the OLED display panel are independently completed, the needed OLED touch panel is formed by bonding the glue substances together, which may cause infirm bonding, and alignment and attachment are needed, which is very easy to cause dislocation, thus resulting in low production yield of the OLED touch panel, increased thickness of the OLED touch panel, reduced light transmittance, and increased manufacturing cost.
Therefore, it is necessary to provide a touch panel and a method for manufacturing the same to solve the problems of the prior art.
Disclosure of Invention
In view of the above, the present invention provides a touch panel and a manufacturing method thereof, so as to solve the problems of complex manufacturing process, time consumption, high cost, and the like caused by the fact that 9 masks are required in the manufacturing process of the touch panel in the prior art.
The invention aims to provide a touch panel, which can solve the problems of poor adhesion, low production yield and short service life of the touch panel in the prior art due to complex processes of adhesion, alignment and the like, and solves the problems of difficult bending of the touch panel due to large thickness, brittle material and the like.
To achieve the above object, an embodiment of the present invention provides a touch panel, including:
a substrate base plate;
the array driving circuit layer is arranged on the substrate base plate;
a first metal layer disposed on the array driving circuit layer;
the first black light resistance is arranged on the first metal layer, and the pattern of the first black light resistance is the same as that of the first metal layer;
the insulating layer is arranged on the first black photoresist;
the second metal layer is arranged on the insulating layer and penetrates through the insulating layer and the first black photoresist through a first through hole to be connected with the first metal layer; and
and the second black light resistor is arranged on the second metal layer, and the pattern of the second black light resistor is the same as that of the second metal layer.
In an embodiment of the invention, the first metal layer has a plurality of "L" shaped patterns.
In an embodiment of the invention, the first metal layer has an opening, and the second metal layer is embedded in the first metal layer through the opening.
In an embodiment of the present invention, the touch panel further includes: and an organic light emitting layer disposed on the array driving circuit layer, the organic light emitting layer including organic self-emissive pixels.
In an embodiment of the present invention, the touch panel further includes: and the packaging layer is arranged between the organic light-emitting layer and the first metal layer.
In an embodiment of the present invention, the encapsulation layer includes: the color filter comprises a first packaging layer, a color filter and a second packaging layer.
In an embodiment of the invention, the color filter is disposed corresponding to the organic self-emissive pixels.
In an embodiment of the present invention, the touch panel further includes: and the optical cement is arranged on the second black photoresist.
Furthermore, another embodiment of the present invention further provides a method for manufacturing a touch panel, including:
step S10: forming a substrate base plate;
step S20: forming an array driving circuit layer on the substrate base plate;
step S30: sequentially forming a first metal layer and a first black photoresist on the array driving circuit layer, and patterning the first metal layer and the first black photoresist through a first photomask to make the patterns of the first metal layer and the first black photoresist identical;
step S40: forming an insulating layer on the first black photoresist and defining a first via hole, wherein the via hole penetrates through the insulating layer and the first black photoresist; and
step S50: and sequentially forming a second metal layer and a second black light resistor on the insulating layer, wherein the second metal layer is connected with the first metal layer through a first via hole, and the second metal layer and the second black light resistor are patterned through a second photomask, so that the patterns of the second metal layer and the second black light resistor are the same.
In an embodiment of the present invention, the manufacturing method further includes:
step S201: forming an organic light emitting layer on the array driving circuit layer, wherein the organic light emitting layer includes organic self-emissive pixels;
step S202: forming a first packaging layer on the organic light-emitting layer, and forming a color filter corresponding to the organic self-luminous pixel through an ink-jet printing process; and
step S203: and forming a second packaging layer on the color filter.
Compared with the prior art, the touch panel and the manufacturing method thereof integrate the non-polarizer technology, and the touch structure is directly manufactured on the packaging layer of the OLED, so that the thickness of the touch panel is reduced, the light-emitting rate is improved, and the touch panel has the advantages of being light, thin, high in transmittance, capable of saving internal space and the like. In addition, the related processes and the costs of the external touch panel and the polaroid are reduced, so that the thickness of the OLED panel is reduced to a great extent, the internal space of the mobile phone is saved, the bending characteristic and the penetration rate are stronger, and the flexible OLED product has higher competitiveness.
In order to make the aforementioned and other objects of the present invention more comprehensible, preferred embodiments accompanied with figures are described in detail below:
drawings
Fig. 1 is a schematic cross-sectional view of a touch panel according to an embodiment of the invention.
Fig. 2 is a schematic structural diagram of a first metal layer according to an embodiment of the invention.
Fig. 3 is a schematic diagram of the first metal layer and the second metal layer after being stacked according to an embodiment of the invention.
Fig. 4 is a schematic structural diagram of a touch panel according to an embodiment of the invention.
Fig. 5 is a manufacturing method of a touch panel according to an embodiment of the invention.
Fig. 6 is a manufacturing method of a touch panel according to another embodiment of the invention.
Detailed Description
The following description of the embodiments refers to the accompanying drawings for illustrating the specific embodiments in which the invention may be practiced. Furthermore, directional phrases used herein, such as, for example, upper, lower, top, bottom, front, rear, left, right, inner, outer, lateral, peripheral, central, horizontal, lateral, vertical, longitudinal, axial, radial, uppermost or lowermost, etc., refer only to the orientation of the attached drawings. Accordingly, the directional terms used are used for explanation and understanding of the present invention, and are not used for limiting the present invention.
The terms "including," having, "and variations thereof, as used herein, mean" including, but not limited to.
The terms "a", "an", and "at least one" as used herein include plural references unless the context clearly dictates otherwise. For example, the term "a process module" or "at least one process module" may include a plurality of process modules, including combinations thereof.
The sizes and values disclosed herein are not to be understood as being strictly limited to the exact numerical values recited. Conversely, unless otherwise indicated, various sizes are intended to indicate the recited value and the range functionally equivalent to the recited value. For example, a disclosed size of "10 microns" means "about 10 microns".
Referring to fig. 1, fig. 1 is a schematic cross-sectional view of a touch panel 20 according to an embodiment of the invention.
The touch panel 20 may include a substrate 30, an array driving circuit layer 40, a first metal layer 70, a first black photoresist 110, an insulating layer 80, a second metal layer 90, and a second black photoresist 111.
The substrate base 30 may be a flexible base, and an example of the material of the substrate base 30 may be a transparent insulating material, such as glass, plastic, or a ceramic material. In the case of a plastic substrate, the material is, for example, Polyimide (Polyimide), polyethylene terephthalate (polyethylene terephthalate), polyester (polyester), polycarbonate (polycarbonates), polyacrylate (polyacrylates) or polystyrene (polystyrene).
The array driving circuit layer 40 is disposed on the substrate 30, and the array driving circuit layer 40 may include a plurality of thin film transistors, which drive the pixels to emit light according to the display signal. For example: in the case of an organic light emitting diode, the plurality of thin film transistors drive the light emitting layer 50 to emit light.
Referring to fig. 2, fig. 2 is a schematic structural diagram of a first metal layer 70 according to an embodiment of the invention. The first metal layer 70 is disposed on the array driving circuit layer 40, and the first metal layer 70 bridges and connects the transmitting electrodes or the receiving electrodes (not shown) of the second metal layer 90, so as to achieve the conduction of the touch electrodes. Examples of the material of the first metal layer 70 include titanium aluminum titanium (TiAlTi), molybdenum (Mo), or a high-transmittance conductive material (such as Indium Tin Oxide (ITO) or graphene), a high-transmittance low-resistance metal, so as to form a mutual capacitance mode metal grid touch electrode. In an embodiment of the invention, the material of the first metal layer 70 is titanium aluminum titanium or indium tin oxide. In an embodiment of the present invention, the first metal layer 70 has a plurality of "L" shaped patterns. In an embodiment of the invention, one or both ends of the first metal layer 70 have an opening 701, 702, and the opening 701, 702 may be formed by etching or drilling.
The first black photoresist 110 is disposed on the first metal layer 70, and the material of the first black photoresist 110 may be a black organic photoresist and/or a black high-precision positive photoresist. Since the first metal layer 70 and the first black photoresist 110 share the same mask, the pattern of the first black photoresist 110 is the same as the pattern of the first metal layer 70, so that one mask can be reduced, and a photoresist stripping (Stripper) process is not required. The first black photoresist 110 can reduce the reflection of the external environment light and the reflection of the first metal layer 70 to the light, thereby achieving a better optical effect.
The insulating layer 80 is disposed on the first black photoresist 110, specifically, the insulating layer 80 covers the first black photoresist 110, and planarizes the structures of the first metal layer 70 and the first black photoresist 110, and isolates the first metal layer 70 from the second metal layer 90.
The second metal layer 90 is disposed on the insulating layer 80, the second metal layer 90 forms a plurality of metal grids, and the second metal layer 90 has a transmitting electrode and a receiving electrode. In an embodiment of the invention, the second metal layer 90 is connected to the first metal layer 70 through the insulating layer 80 and the first black photoresist 110 by a first via 130. The second metal layer 90 is formed. In an embodiment of the invention, the second metal layer 90 is further connected to the first metal layer 70 through a second via 131 passing through the insulating layer 80 and the first black photoresist 110. Examples of the material of the second metal layer 90 include titanium aluminum titanium (TiAlTi), molybdenum (Mo), or a high-transmittance conductive material (such as Indium Tin Oxide (ITO) or graphene), a high-transmittance low-resistance metal, so as to form a mutual capacitance mode metal grid touch electrode. In an embodiment of the invention, the material of the second metal layer 90 is titanium aluminum titanium or indium tin oxide.
In an embodiment of the invention, the second metal layer 90 is embedded in the first metal layer 70 through the openings 701 and 702, so that the first metal layer 70 and the second metal layer 90 are deeply overlapped to form a mortise and tenon structure, the connection strength between the first metal layer 70 and the second metal layer 90 is enhanced, and the risk of breakage of the metal lap joint when the touch panel 20 is bent can be reduced.
Referring to fig. 3, fig. 3 is a schematic diagram illustrating the first metal layer 70 and the second metal layer 90 being stacked according to an embodiment of the invention. The openings 701, 702 in the first metal layer 70 are located at the intersections of the metal mesh formed by the second metal layer 90, and the openings 701, 702 in the first metal layer 70 serve as bridge points connected to the second metal layer 90. The first metal layer 70 is overlapped with the second metal layer 90, so that the first metal layer 70 can bridge the second metal layer 90 without affecting the aperture opening ratio, and the touch electrode is conducted.
Referring to fig. 4, fig. 4 is a schematic structural diagram of a touch panel 20 according to an embodiment of the invention. The second black photoresist 111 is disposed on the second metal layer 90, and the material of the second black photoresist 111 may be a black organic photoresist and/or a black high-precision positive photoresist. Since the second metal layer 90 and the second black photoresist 111 share the same mask, the pattern of the second black photoresist 111 is the same as that of the second metal layer 90, so that one mask can be reduced, and a photoresist stripping (Stripper) process is not required. The second black photoresist 111 can reduce the reflection of the external environment light and the reflection of the second metal layer 90 to the light, thereby achieving a better optical effect. The first black color resist 110 and the second black color resist 111 constitute a black matrix 100, and define light emitting regions of the plurality of color filters 611, 612, and 613.
In an embodiment of the invention, the touch panel 20 further includes an optical adhesive 120, and the optical adhesive 120 is disposed on the second black photoresist 111 and used for reducing ambient light reflection, enhancing display contrast, and achieving the effects of dust prevention and moisture prevention.
In the embodiment of the present invention, the touch panel 20 is an Organic Light Emitting Diode (OLED) touch panel 20. The touch panel 20 further includes: an organic light emitting layer 50 and an encapsulation layer 60.
The organic light emitting layer 50 is disposed on the array driving circuit layer 40, a plurality of organic self- luminous pixels 511, 512, 513 are disposed on the organic light emitting layer 50, and the plurality of organic light emitting layers 50 may be fabricated according to the prior art, for example, the organic self- luminous pixels 511, 512, 513 may include an anode, a light emitting material layer, and a cathode. Additionally, the organic self- emissive pixels 511, 512, 513 may include a hole injection layer, a hole transport layer, an electron blocking layer, a hole blocking layer, an electron transport layer, and/or an electron injection layer.
The encapsulation layer 60 is disposed on the organic light emitting layer 50, and in an embodiment of the present invention, the encapsulation layer 60 is disposed between the first metal layer 70 and the encapsulation layer 60. In an embodiment of the invention, the encapsulation layer 60 includes a first encapsulation layer 601, a plurality of color filters 611, 612, 613 and a second encapsulation layer 602, and the encapsulation layer 60 can protect other film layers from being damaged easily, and can not be scratched during transportation and use, thereby enhancing the structural stability of the touch panel 20 and ensuring stable signal transmission. The material of the first package layer 601 and the second package layer 602 may be silicon nitride (SiN)x) Or silicon oxide (SiO)x). In an embodiment of the invention, the thickness of the first encapsulation layer 601 and the second encapsulation layer 602 may be 1 to 2 micrometers (μm). In an embodiment of the invention, the thickness of the color filters 611, 612 and 613 may be 1.5 to 2 μm.
In an embodiment of the invention, a planarization layer may be further disposed between the color filters 611, 612, 613 and the second encapsulation layer 602, and the planarization layer may be an organic layer. In an embodiment of the present invention, the thickness of the planarization layer may be 8 to 10 μm.
As shown in fig. 4, fig. 4 is a schematic structural diagram of a touch panel 20 according to an embodiment of the invention. In an embodiment of the invention, the color filters 611, 612, 613 are disposed corresponding to the organic self- emissive pixels 511, 512, 513. In an embodiment of the invention, the size of the color filters 611, 612, 613 is equal to the size of the organic self- luminous pixels 511, 512, 513. In an embodiment of the present invention, the size of the color filters 611, 612, 613 is larger than that of the organic self- emissive pixels 511, 512, 513, so as to ensure that the aperture ratio of the lower organic self-emissive pixels is sufficiently large. The color filters 611, 612, 613 may be selected from red (R)612, green (G)613, blue (B) color filters 611, and Black Matrix (BM), respectively corresponding to the organic self- emissive pixels 511, 512, 513 representing red, green, and blue 511 of the light-emitting layer 50.
The touch panel 20 of the present invention integrates the OLED encapsulation layer 60 with the touch electrode layer, thereby eliminating an optical layer between the conventional OLED encapsulation layer 60 and the touch electrode layer, and thus eliminating the manufacturing cost of a mask for the optical layer. In addition, the encapsulation layer 60 prevents the touch electrode layer and the OLED display layer from affecting each other when transmitting signals, and simultaneously, can also play a role in bearing the subsequently formed OLED display layer, and also prevents the problem of low production yield caused by complex processes such as adhesion and alignment.
Referring to fig. 5 and fig. 6 together, fig. 5 is a manufacturing method of the touch panel 20 according to an embodiment of the invention, and fig. 6 is a manufacturing method of the touch panel 20 according to another embodiment of the invention. The present invention also provides a manufacturing method of the touch panel 20, including:
step S10: a base substrate 30 is formed. Wherein the substrate base plate 30 may be a flexible base plate, and an example of the material of the substrate base plate 30 may be a transparent insulating material, such as glass, plastic, or a ceramic material. In the case of a plastic substrate, the material is, for example, Polyimide (Polyimide), polyethylene terephthalate (polyethylene terephthalate), polyester (polyester), polycarbonate (polycarbonates), polyacrylate (polyacrylates) or polystyrene (polystyrene).
Step S20: an array driving circuit layer 40 is formed on the base substrate 30. The array driving circuit layer 40 is disposed on the substrate 30, and the array driving circuit layer 40 may include a plurality of thin film transistors, which drive the pixels to emit light according to the display signal.
Step S30: a first metal layer 70 and a first black photoresist 110 are sequentially formed on the array driver circuit layer 40. In an embodiment of the invention, the first black photoresist 110 is patterned by a first mask, and then the first metal layer 70 is patterned by using the first black photoresist 110 as a mask, so that the first metal layer 70 and the first black photoresist 110 have the same pattern. In another embodiment of the present invention, the first metal layer 70 and the first black photoresist 110 are patterned by a first mask, so that the first metal layer 70 and the first black photoresist 110 have the same pattern.
Step S40: an insulating layer 80 is formed on the first black photoresist 110 and a first via 130 is defined, which penetrates the insulating layer 80 and the first black photoresist 110. Wherein the first via 130 may be formed by drilling or etching, which may be dry etching.
Step S50: a second metal layer 90 and a second black photoresist 111 are sequentially formed on the insulating layer 80, and the second metal layer 90 is connected to the first metal layer 70 through a first via 130. In an embodiment of the invention, the second black photoresist 111 is patterned by a second mask, and then the second metal layer 90 is patterned by using the second black photoresist 111 as a mask, so that the first metal layer 70 and the first black photoresist 110 have the same pattern. In another embodiment of the present invention, the second metal layer 90 and the second black photoresist 111 are patterned by a second mask, so that the patterns of the second metal layer 90 and the second black photoresist 111 are the same.
In an embodiment of the present invention, the manufacturing method further includes:
step S201: an organic light emitting layer 50 is formed on the array driving circuit layer 40, wherein the organic light emitting layer 50 includes organic self- emissive pixels 511, 512, 513.
Step S202: a first encapsulation layer 601 is formed on the organic light emitting layer 50, and color filters 611, 612, 613 corresponding to the organic self- light emitting pixels 511, 512, 513 are formed through an inkjet printing process. Wherein the material of the first encapsulation layer 601 may be silicon nitride (SiN)x) Or silicon oxide (SiO)x) The thickness of the first encapsulation layer 601 may be 1 to 2 micrometers (μm). In an embodiment of the present invention, a planarization layer is formed by an inkjet printing process, and the planarization layer covers the color filters 611, 612, 613, and the thickness of the planarization layer may be 8 to 10 μm. .
Step S203: a second encapsulation layer 602 is formed on the color filters 611, 612, 613. In one embodiment of the present invention. It is composed ofThe second encapsulation layer 602 may be silicon nitride (SiN)x) Or silicon oxide (SiO)x) The thickness of the second encapsulation layer 602 may be 1 to 2 micrometers (μm).
The first black photoresist 110 has the same pattern as the first metal layer 70, so that a mask can be reduced without performing a photoresist stripping (Stripper) process. The first black photoresist 110 can reduce the reflection of the external environment light and the reflection of the first metal layer 70 to the light, thereby achieving a better optical effect.
The term "patterning process" (i.e., a photolithography process) used in the present specification is one of patterning processes, and may include, for example: pretreating, forming a bottom film, coating photoresist, baking, exposing, developing, etching and the like. For example, the pre-processing generally includes: wet cleaning, deionized water cleaning, dehydration baking and the like; for example, the formation of the base film can be achieved by vapor deposition, magnetron sputtering, or the like; for example, applying the photoresist may be achieved by static gumming, or dynamic gumming; baking may be used to remove the solvent in the photoresist or after development. Further, for example, the photolithography process may further include: hard film baking, development inspection and the like. The steps in the photolithography process and the number of times of use of each step used in forming the white photoresist layer and the black photoresist layer are not limited in this specification, and the white photoresist layer and the black photoresist layer can be formed. For example, the photolithography process may also include several of the above steps, including, for example, coating a photoresist, exposing, developing, and the like.
Compared with the prior art, the touch panel and the manufacturing method thereof integrate the non-polarizer technology, and the touch structure is directly manufactured on the packaging layer of the OLED, so that the thickness of the touch panel is reduced, the light-emitting rate is improved, and the touch panel has the advantages of being light, thin, high in transmittance, capable of saving internal space and the like. In addition, the related processes and the costs of the external touch panel and the polaroid are reduced, so that the thickness of the OLED touch panel is reduced to a great extent, the internal space of the mobile phone is saved, the bending characteristic and the penetration rate are stronger, and the flexible OLED product is more competitive.
In the touch panel and the manufacturing method thereof, the touch structure, the first metal layer and the first black light resistor share the same light shield, the second metal layer and the second black light resistor share the same light shield, and the red, green and blue color filters corresponding to the organic self-luminous pixels are printed by ink-jet printing, so that five light shields are omitted, the manufacturing cost is reduced, and the mass production is facilitated.
In addition, the first metal layer and the second metal layer in the touch panel and the manufacturing method thereof realize deep overlapping to form a mortise and tenon structure, so that the connection strength of M1 and M2 is enhanced, and the risk of metal overlapping fracture when the panel is bent can be reduced.
It is appreciated that certain features of the invention, which are, for clarity, described in the context of separate embodiments, may also be provided in combination in a single embodiment. Conversely, various features of the invention, which are, for brevity, described in the context of a single embodiment, may also be provided separately or in any suitable subcombination or in any other described embodiment suitable for use with the invention. The particular features described herein in the context of the various embodiments are not considered essential features of those embodiments, unless the embodiment is inoperative without those elements.
While the invention has been described in conjunction with specific embodiments thereof, it is to be understood that many alternatives, modifications, and variations will be apparent to those skilled in the art. Accordingly, it is intended to embrace all such alternatives, modifications, and variations that fall within the scope of the included claims.
Claims (10)
1. A touch panel, comprising: the touch panel includes:
a substrate base plate;
the array driving circuit layer is arranged on the substrate base plate;
a first metal layer disposed on the array driving circuit layer;
the first black light resistance is arranged on the first metal layer, and the pattern of the first black light resistance is the same as that of the first metal layer;
the insulating layer is arranged on the first black photoresist;
the second metal layer is arranged on the insulating layer and penetrates through the insulating layer and the first black photoresist through a first through hole to be connected with the first metal layer; and
and the second black light resistor is arranged on the second metal layer, and the pattern of the second black light resistor is the same as that of the second metal layer.
2. The touch panel of claim 1, wherein: the first metal layer has a plurality of 'L' -shaped patterns.
3. The touch panel of claim 1, wherein: the first metal layer has an opening through which the second metal layer is embedded in the first metal layer.
4. The touch panel of claim 1, wherein: the touch panel further includes: and an organic light emitting layer disposed on the array driving circuit layer, the organic light emitting layer including organic self-emissive pixels.
5. The touch panel of claim 4, wherein: the touch panel further includes: and the packaging layer is arranged between the organic light-emitting layer and the first metal layer.
6. The touch panel of claim 5, wherein: the encapsulation layer includes: the color filter comprises a first packaging layer, a color filter and a second packaging layer.
7. The touch panel of claim 6, wherein: the color filter is arranged corresponding to the organic self-luminous pixel.
8. The touch panel of claim 1, wherein: the touch panel further includes: and the optical cement is arranged on the second black photoresist.
9. A method for manufacturing a touch panel is characterized in that: the manufacturing method comprises the following steps:
step S10: forming a substrate base plate;
step S20: forming an array driving circuit layer on the substrate base plate;
step S30: sequentially forming a first metal layer and a first black photoresist on the array driving circuit layer, and patterning the first metal layer and the first black photoresist through a first photomask to make the patterns of the first metal layer and the first black photoresist identical;
step S40: forming an insulating layer on the first black photoresist and defining a first via hole, wherein the via hole penetrates through the insulating layer and the first black photoresist; and
step S50: and sequentially forming a second metal layer and a second black light resistor on the insulating layer, wherein the second metal layer is connected with the first metal layer through a first via hole, and the second metal layer and the second black light resistor are patterned through a second photomask, so that the patterns of the second metal layer and the second black light resistor are the same.
10. The manufacturing method according to claim 9, wherein: the manufacturing method further includes:
step S201: forming an organic light emitting layer on the array driving circuit layer, wherein the organic light emitting layer includes organic self-emissive pixels;
step S202: forming a first packaging layer on the organic light-emitting layer, and forming a color filter corresponding to the organic self-luminous pixel through an ink-jet printing process; and
step S203: and forming a second packaging layer on the color filter.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111326082A (en) * | 2020-04-14 | 2020-06-23 | Tcl华星光电技术有限公司 | Backboard unit, manufacturing method thereof and display device |
| US11526079B2 (en) | 2020-04-14 | 2022-12-13 | Tcl China Star Optoelectronics Technology Co., Ltd. | Backplane unit and its manufacturing method and display device |
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