CN110989859B - Touch panel and manufacturing method thereof - Google Patents
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- CN110989859B CN110989859B CN201911135015.8A CN201911135015A CN110989859B CN 110989859 B CN110989859 B CN 110989859B CN 201911135015 A CN201911135015 A CN 201911135015A CN 110989859 B CN110989859 B CN 110989859B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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Abstract
The invention provides a touch panel and a manufacturing method thereof. The array driving circuit layer is arranged on the substrate, the first metal layer is arranged on the array driving circuit layer, the first black photoresist is arranged on the first metal layer, the pattern of the first black photoresist is identical with that of the first metal layer, the insulating layer is arranged on the first black photoresist, the second metal layer is arranged on the insulating layer, the second metal layer passes through the insulating layer through a first via hole and is connected with the first metal layer, the second black photoresist is arranged on the second metal layer, and the pattern of the second black photoresist is identical with that of the second metal layer.
Description
Technical Field
The invention relates to the technical field of display, in particular to a flexible organic light-emitting diode display panel and a manufacturing method thereof.
Background
Although the Polarizer (POL) can effectively reduce the reflectivity of the panel under strong light, it loses nearly 58% of light. In addition, the polarizer is gradually replaced by a color film due to the fact that the thickness is large, the material is fragile, and dynamic bending is not facilitated, namely, the technology of no polarizer (POL-less) is adopted. However, in recent years, organic Light Emitting Diode (OLED) display panels have become mainstream, and for flexible OLEDs, polarizers greatly reduce the yield and lifetime of the flexible OLED.
With the increasing demands of people for controlling electronic devices, display devices with touch control function are receiving more and more attention. In the prior art, an external hanging type touch panel is basically adopted for realizing the touch function of the OLED touch panel, namely, the touch module is attached to the outside of the OLED touch panel again, and 9 light covers are required in total. In addition, since the touch panel and the OLED display panel are independently finished and then are bonded together by the glue material to form the required OLED touch panel, the bonding may be unstable, alignment and lamination are required, and dislocation is easily caused.
Therefore, it is necessary to provide a touch panel and a manufacturing method thereof to solve the problems of the prior art.
Disclosure of Invention
In view of this, the present invention provides a touch panel and a method for manufacturing the same, so as to solve the problems of complicated manufacturing process, time-consuming and high cost caused by 9 masks in the manufacturing process of the touch panel in the prior art.
The invention aims to provide a touch panel capable of solving the problems of weak adhesion, low production yield and service life caused by complex processes such as adhesion, alignment and the like in the prior art, and solving the problems of difficult bending and the like of the touch panel due to large thickness and brittle material.
In order to achieve the foregoing object of the present invention, an embodiment of the present invention provides a touch panel, the touch panel comprising:
a substrate base;
an array driving circuit layer disposed on the substrate base plate;
the first metal layer is arranged on the array driving circuit layer;
the first black photoresist is arranged on the first metal layer, and the pattern of the first black photoresist is the same as that of the first metal layer;
an insulating layer disposed on the first black photoresist;
the second metal layer is arranged on the insulating layer, and penetrates through the insulating layer through a first via hole and the first black photoresist to be connected with the first metal layer; a kind of electronic device with high-pressure air-conditioning system
And the second black photoresist is arranged on the second metal layer, and the pattern of the second black photoresist is the same as that of the second metal layer.
In one embodiment of the present invention, the first metal layer has a plurality of "L" shaped patterns.
In one embodiment of the present invention, the first metal layer has an opening through which the second metal layer is embedded in the first metal layer.
In an embodiment of the invention, the touch panel further includes: and an organic light emitting layer disposed on the array driving circuit layer, the organic light emitting layer including organic self-luminous pixels.
In an embodiment of the invention, the touch panel further includes: and the packaging layer is arranged between the organic light-emitting layer and the first metal layer.
In an embodiment of the present invention, the encapsulation layer includes: the first packaging layer, the color filter and the second packaging layer.
In an embodiment of the present invention, the color filter is disposed corresponding to the organic self-luminous pixel.
In an embodiment of the invention, the touch panel further includes: and the optical adhesive is arranged on the second black photoresist.
Furthermore, another embodiment of the present invention provides a method for manufacturing a touch panel, including:
step S10: forming a substrate;
step S20: forming an array driving circuit layer on the substrate base plate;
step S30: sequentially forming a first metal layer and a first black photoresist on the array driving circuit layer, and patterning the first metal layer and the first black photoresist through a first photomask to enable the patterns of the first metal layer and the first black photoresist to be the same;
step S40: forming an insulating layer on the first black photoresist and defining a first via hole penetrating through the insulating layer and the first black photoresist; a kind of electronic device with high-pressure air-conditioning system
Step S50: and sequentially forming a second metal layer and a second black photoresist on the insulating layer, wherein the second metal layer is connected with the first metal layer through a first via hole, and the second metal layer and the second black photoresist are patterned through a second photomask, so that the patterns of the second metal layer and the second black photoresist are the same.
In an embodiment of the invention, the manufacturing method further includes:
step S201: forming an organic light emitting layer on the array driving circuit layer, wherein the organic light emitting layer includes organic self-luminous pixels;
step S202: forming a first packaging layer on the organic light-emitting layer, and forming a color filter corresponding to the organic self-luminous pixel through an inkjet printing process; a kind of electronic device with high-pressure air-conditioning system
Step S203: and forming a second packaging layer on the color filter.
Compared with the prior art, the touch panel and the manufacturing method thereof integrate the polaroid-free technology, and the touch structure is directly manufactured on the encapsulation layer of the OLED, so that the thickness of the touch panel is reduced, the light extraction rate is improved, and the touch panel has the advantages of light weight, high transmittance, internal space saving and the like. In addition, the thickness of the OLED panel is reduced to a great extent due to the reduction of the related process and cost of the externally hung touch panel and polaroid, the internal space of the mobile phone is saved, the bending characteristic and the penetration rate are stronger, and the flexible OLED product is more competitive.
In order to make the above and other objects of the present invention more comprehensible, preferred embodiments accompanied with figures are described in detail below:
drawings
Fig. 1 is a schematic cross-sectional view of a touch panel according to an embodiment of the invention.
Fig. 2 is a schematic structural diagram of a first metal layer according to an embodiment of the invention.
Fig. 3 is a schematic diagram of the first metal layer and the second metal layer after being stacked according to an embodiment of the present invention.
Fig. 4 is a schematic structural diagram of a touch panel according to an embodiment of the invention.
Fig. 5 is a manufacturing method of a touch panel according to an embodiment of the invention.
Fig. 6 is a manufacturing method of a touch panel according to another embodiment of the invention.
Detailed Description
The following description of the embodiments refers to the accompanying drawings, which illustrate specific embodiments in which the invention may be practiced. Furthermore, directional terms, such as upper, lower, top, bottom, front, rear, left, right, inner, outer, side, surrounding, center, horizontal, transverse, vertical, longitudinal, axial, radial, uppermost or lowermost, etc., as used herein are used with reference to the accompanying drawings. Accordingly, directional terminology is used to describe and understand the invention and is not limiting of the invention.
The terms "comprising," having, "and variations thereof as used herein, mean" including but not limited to.
The terms "a," "an," and "at least one" as used herein include plural references unless the context clearly dictates otherwise. For example, the term "a process module" or "at least one process module" may include a plurality of process modules, including combinations thereof.
The magnitudes and values disclosed herein are not intended to be construed as being strictly limited to the exact numerical values recited. Conversely, unless otherwise indicated, various sizes are intended to represent the recited values and ranges functionally equivalent to the recited values. For example, a size of "10 microns" is disclosed as meaning "about 10 microns".
Referring to fig. 1, fig. 1 is a schematic cross-sectional view of a touch panel 20 according to an embodiment of the invention.
The touch panel 20 may include a substrate base 30, an array driving circuit layer 40, a first metal layer 70, a first black photoresist 110, an insulating layer 80, a second metal layer 90, and a second black photoresist 111.
The substrate 30 may be a flexible substrate, and examples of the material of the substrate 30 may be a transparent insulating material such as glass, plastic or ceramic material. In the case of plastic substrates, the material is, for example, polyimide (Polyimide), polyethylene terephthalate (polyethylene terephthalate), polyester (polyester), polycarbonate (polycarbonates), polyacrylate (polyacrylate) or polystyrene (polystyrene).
The array driving circuit layer 40 is disposed on the substrate base 30, and the array driving circuit layer 40 may include a plurality of thin film transistors driving the pixels to emit light according to the display signals. For example: in the case of an organic light emitting diode, the plurality of thin film transistors drive the light emitting layer 50 to emit light.
Referring to fig. 2 together, fig. 2 is a schematic structural diagram of a first metal layer 70 according to an embodiment of the invention. The first metal layer 70 is disposed on the array driving circuit layer 40, and the first metal layer 70 bridges the transmitting electrode or the receiving electrode (not shown) of the second metal layer 90 to realize the conduction of the touch electrode. Examples of the material of the first metal layer 70 include titanium aluminum titanium (TiAlTi), molybdenum (Mo), or a high-transmittance conductive material (e.g., indium Tin Oxide (ITO) or graphene), a high-transmittance low-resistance metal, to form a mutual capacitance mode metal mesh touch electrode. In an embodiment of the present invention, the material of the first metal layer 70 is titanium aluminum titanium or indium tin oxide. In one embodiment of the present invention, the first metal layer 70 has a plurality of "L" -shaped patterns. In an embodiment of the present invention, one or both ends of the first metal layer 70 have an opening 701, 702, and the opening 701, 702 may be formed by etching or drilling.
The first black photoresist 110 is disposed on the first metal layer 70, and the material of the first black photoresist 110 may be a black organic photoresist and/or a black high-precision positive photoresist. Since the first metal layer 70 and the first black photoresist 110 share the same mask, the pattern of the first black photoresist 110 is the same as the pattern of the first metal layer 70, so that one mask can be reduced, and a photoresist removing (Stripper) process is not required. The first black photoresist 110 can reduce the reflection of the external environment light and the reflection of the first metal layer 70 to achieve a better optical effect.
The insulating layer 80 is disposed on the first black photoresist 110, specifically, the insulating layer 80 covers the first black photoresist 110, and planarizes the structures of the first metal layer 70 and the first black photoresist 110, isolating the first metal layer 70 and the second metal layer 90.
The second metal layer 90 is disposed on the insulating layer 80, the second metal layer 90 forms a plurality of metal grids, and the second metal layer 90 has a transmitting electrode and a receiving electrode. In an embodiment of the present invention, the second metal layer 90 is connected to the first metal layer 70 through the insulating layer 80 and the first black photoresist 110 by a first via 130. The second metal layer 90 is formed. In an embodiment of the present invention, the second metal layer 90 is further connected to the first metal layer 70 through the insulating layer 80 and the first black photoresist 110 by a second via 131. Examples of the material of the second metal layer 90 include titanium aluminum titanium (TiAlTi), molybdenum (Mo), or a high-transmittance conductive material (e.g., indium Tin Oxide (ITO) or graphene), a high-transmittance low-resistance metal, to form a mutual capacitive mode metal mesh touch electrode. In an embodiment of the present invention, the material of the second metal layer 90 is titanium aluminum titanium or indium tin oxide.
In an embodiment of the present invention, the second metal layer 90 is embedded into the first metal layer 70 through the openings 701 and 702, so that the first metal layer 70 and the second metal layer 90 are in deep overlap joint to form a "mortise and tenon" structure, so as to enhance the connection strength between the first metal layer 70 and the second metal layer 90, and reduce the risk of breaking the metal overlap joint when the touch panel 20 is bent.
Referring to fig. 3 together, fig. 3 is a schematic diagram of the first metal layer 70 and the second metal layer 90 stacked together according to an embodiment of the invention. The openings 701, 702 in the first metal layer 70 are located at the intersections of the metal mesh formed by the second metal layer 90, and the openings 701, 702 in the first metal layer 70 serve as bridging points connecting with the second metal layer 90. The first metal layer 70 is overlapped with the second metal layer 90, so that the first metal layer 70 can bridge the second metal layer 90 without affecting the aperture ratio, thereby realizing the conduction of the touch electrode.
Referring to fig. 4, fig. 4 is a schematic structural diagram of a touch panel 20 according to an embodiment of the invention. The second black photoresist 111 is disposed on the second metal layer 90, and the material of the second black photoresist 111 may be a black organic photoresist and/or a black high-precision positive photoresist. Since the second metal layer 90 and the second black photoresist 111 share the same photomask, the pattern of the second black photoresist 111 is the same as the pattern of the second metal layer 90, and thus, one photomask can be reduced, and a photoresist removing (Stripper) process is not required. The second black photoresist 111 can reduce the reflection of the external environment light and the reflection of the second metal layer 90 to achieve a better optical effect. The first black resist 110 and the second black resist 111 form a black matrix 100, and define light emitting regions of the plurality of color filters 611, 612, 613.
In an embodiment of the present invention, the touch panel 20 further includes an optical adhesive 120, and the optical adhesive 120 is disposed on the second black photoresist 111, so as to reduce reflection of ambient light, enhance contrast of display, and achieve effects of dust prevention and moisture prevention.
In an embodiment of the present invention, the touch panel 20 is an Organic Light Emitting Diode (OLED) touch panel 20. The touch panel 20 further includes: an organic light emitting layer 50 and an encapsulation layer 60.
The organic light emitting layer 50 is disposed on the array driving circuit layer 40, and a plurality of organic self-emitting pixels 511, 512, 513 are disposed on the organic light emitting layer 50, and the plurality of organic light emitting layers 50 can be fabricated with reference to the prior art, for example, the organic self-emitting pixels 511, 512, 513 can include an anode, a light emitting material layer, and a cathode. Additionally, the organic self-luminous pixels 511, 512, 513 may include a hole injection layer, a hole transport layer, an electron blocking layer, a hole blocking layer, an electron transport layer, and/or an electron injection layer.
The encapsulation layer 60 is disposed on the organic light emitting layer 50, and in one embodiment of the present invention, the encapsulation layer 60 is disposed between the first metal layer 70. In an embodiment of the present invention, the encapsulation layer 60 includes a first encapsulation layer 601, a plurality of color filters 611, 612, 613 and a second encapsulation layer 602, and the encapsulation layer 60 can protect other film layers from being damaged, and is not scratched during transportation and use, so as to enhance structural stability of the touch panel 20 and ensure stable signal transmission. The material of the first package layer 601 and the second package layer 602 may be silicon nitride (SiN) x ) Or silicon oxide (SiO) x ). In an embodiment of the present invention, the thickness of the first encapsulation layer 601 and the second encapsulation layer 602 may be 1 to 2 micrometers (μm). In an embodiment of the present invention, the thickness of the plurality of color filters 611, 612, 613 may be 1.5 to 2 μm.
In an embodiment of the present invention, a planarization layer may be further disposed between the color filters 611, 612, 613 and the second encapsulation layer 602, and the planarization layer may be an organic layer. In an embodiment of the present invention, the thickness of the planarization layer may be 8 to 10 μm.
As shown in fig. 4, fig. 4 is a schematic structural diagram of a touch panel 20 according to an embodiment of the invention. In an embodiment of the present invention, the color filters 611, 612, 613 are disposed corresponding to the organic self-luminous pixels 511, 512, 513. In an embodiment of the present invention, the size of the color filters 611, 612, 613 is equal to the size of the organic self-luminous pixels 511, 512, 513. In an embodiment of the present invention, the size of the color filters 611, 612, 613 is larger than the size of the organic self-luminous pixels 511, 512, 513, thus ensuring that the aperture ratio of the underlying organic light-emitting pixels is sufficiently large. The color filters 611, 612, 613 may be selected from red (R) 612, green (G) 613, blue (B) color resistors 611 and Black Matrixes (BM), and correspond to the organic self-luminous pixels 511, 512, 513 of the light-emitting layer 50 representing red 512, green 513 and blue 511, respectively.
The touch panel 20 of the present invention integrates the OLED encapsulation layer 60 with the touch electrode layer, eliminating the optical layer between the conventional OLED encapsulation layer 60 and the touch electrode layer, and thus eliminating the manufacturing cost of the mask for the optical layer. In addition, the packaging layer 60 prevents the mutual influence when the touch electrode layer and the OLED display layer transmit signals, and meanwhile, the packaging layer can also have a bearing function on the OLED display layer formed later, and the problem of lower production yield caused by complex processes such as adhesion, alignment and the like is avoided.
Referring to fig. 5 and fig. 6 together, fig. 5 is a manufacturing method of a touch panel 20 according to an embodiment of the invention, and fig. 6 is a manufacturing method of a touch panel 20 according to another embodiment of the invention. The present invention also provides a manufacturing method of the touch panel 20, the manufacturing method including:
step S10: a substrate base 30 is formed. Wherein the substrate 30 may be a flexible substrate, examples of the material of the substrate 30 may be a transparent insulating material, such as glass, plastic or ceramic material. In the case of plastic substrates, the material is, for example, polyimide (Polyimide), polyethylene terephthalate (polyethylene terephthalate), polyester (polyester), polycarbonate (polycarbonates), polyacrylate (polyacrylate) or polystyrene (polystyrene).
Step S20: an array driving circuit layer 40 is formed on the substrate base 30. Wherein the array driving circuit layer 40 is disposed on the substrate base 30, the array driving circuit layer 40 may include a plurality of thin film transistors driving the pixels to emit light according to the display signals.
Step S30: a first metal layer 70 and a first black photoresist 110 are sequentially formed on the array driving circuit layer 40. In an embodiment of the present invention, the first black photoresist 110 is patterned by a first mask, and then the first metal layer 70 is patterned by using the first black photoresist 110 as a mask, so that the patterns of the first metal layer 70 and the first black photoresist 110 are the same. In another embodiment of the present invention, the first metal layer 70 and the first black photoresist 110 are patterned by a first photomask, so that the patterns of the first metal layer 70 and the first black photoresist 110 are the same.
Step S40: an insulating layer 80 is formed over the first black photoresist 110 and defines a first via 130 that extends through the insulating layer 80 and the first black photoresist 110. Wherein the first via 130 may be formed by drilling or etching, which may be dry etching.
Step S50: a second metal layer 90 and a second black photoresist 111 are sequentially formed on the insulating layer 80, and the second metal layer 90 is connected to the first metal layer 70 through a first via 130. In an embodiment of the present invention, the second black photoresist 111 is patterned by a second photomask, and then the second metal layer 90 is patterned by using the second black photoresist 111 as a photomask, so that the patterns of the first metal layer 70 and the first black photoresist 110 are the same. In another embodiment of the present invention, the second metal layer 90 and the second black photoresist 111 are patterned by a second photomask, so that the patterns of the second metal layer 90 and the second black photoresist 111 are the same.
In an embodiment of the invention, the manufacturing method further includes:
step S201: an organic light emitting layer 50 is formed on the array driving circuit layer 40, wherein the organic light emitting layer 50 includes organic self-luminous pixels 511, 512, 513.
Step S202: a first encapsulation layer 601 is formed on the organic light emitting layer 50, and color filters 611, 612, 613 corresponding to the organic self-luminous pixels 511, 512, 513 are formed through an inkjet printing process. Wherein the material of the first encapsulation layer 601 may be silicon nitride (SiN) x ) Or silicon oxide (SiO) x ) The thickness of the first encapsulation layer 601 may be 1 to 2 micrometers (μm). In an embodiment of the present invention, a planarization layer is formed by an inkjet printing process, the planarization layer covers the color filters 611, 612, 613, and the thickness of the planarization layer may be 8 to 10 μm. .
Step S203: a second encapsulation layer 602 is formed over the color filters 611, 612, 613. In one embodiment of the invention. Wherein the second encapsulation layer 602 may be silicon nitride (SiN) x ) Or silicon oxide (SiO) x ) The thickness of the second encapsulation layer 602 may be 1 to 2 micrometers (μm).
The pattern of the first black photoresist 110 is the same as the pattern of the first metal layer 70, so that a photomask can be reduced, and a photoresist removing (Stripper) process is not required. The first black photoresist 110 can reduce the reflection of the external environment light and the reflection of the first metal layer 70 to achieve a better optical effect.
The term "patterning process" (i.e., photolithographic process) as used herein is one type of patterning process and may include, for example: pretreatment, forming a bottom film, coating photoresist, baking, exposure, development, etching and the like. For example, preprocessing generally includes: wet cleaning, deionized water cleaning, dehydration baking and the like; for example, formation of the base film may be achieved by vapor deposition, magnetron sputtering, or the like; for example, the application of photoresist may be accomplished by static or dynamic photoresist application; baking may be used to remove the solvent from the photoresist or the solvent after development. Further, for example, the photolithography process may further include: and curing, developing, checking and the like. The present specification is not limited to the steps in the photolithography process used in forming the white light resist layer and the black light resist layer and the number of times of use of each step, as long as the white light resist layer and the black light resist layer can be formed. For example, the lithographic process may also include several of the above steps, including, for example, photoresist coating, exposure, development, and the like.
Compared with the prior art, the touch panel and the manufacturing method thereof integrate the polaroid-free technology, and the touch structure is directly manufactured on the encapsulation layer of the OLED, so that the thickness of the touch panel is reduced, the light extraction rate is improved, and the touch panel has the advantages of light weight, high transmittance, internal space saving and the like. In addition, the thickness of the OLED touch panel is reduced to a great extent due to the reduction of the related process and cost of the externally hung touch panel and polaroid, the internal space of the mobile phone is saved, the bending characteristic and the penetration rate are stronger, and the flexible OLED product is more competitive.
In the touch panel and the manufacturing method thereof, the touch structure, the first metal layer and the first black photoresist share the same photomask by directly manufacturing the packaging layer, the second metal layer and the second black photoresist share the same photomask, and the five photomasks are omitted altogether by printing red, green and blue color filters corresponding to the organic self-luminous pixels through ink-jet printing, so that the manufacturing cost is reduced, and the mass production is facilitated.
In addition, the first metal layer and the second metal layer in the touch panel and the manufacturing method thereof realize deep lap joint to form a mortise and tenon structure, so that the connection strength of M1 and M2 is enhanced, and the metal lap joint fracture risk during panel bending can be reduced.
It is appreciated that certain features of the invention, which are, for clarity, described in the context of separate embodiments, may also be provided in combination in a single embodiment. Conversely, various features of the invention which are, for brevity, described in the context of a single embodiment, may also be provided separately or in any suitable sub-combination or in any other described embodiment suitable for use in the invention. The particular features described in the context of the various examples are not considered essential features of those embodiments unless the examples do not function without those elements.
While the invention has been described in conjunction with specific embodiments thereof, it is to be understood that many alternatives, modifications, and variations will be apparent to those skilled in the art. Accordingly, it is intended to embrace all such alternatives, modifications and variations as fall within the scope of the appended claims.
Claims (9)
1. A touch panel, characterized in that: the touch panel includes:
a substrate base;
an array driving circuit layer disposed on the substrate base plate;
the first metal layer is arranged on the array driving circuit layer and is provided with a plurality of L-shaped patterns;
the first black photoresist is arranged on the first metal layer, and the pattern of the first black photoresist is the same as that of the first metal layer;
an insulating layer disposed on the first black photoresist;
the second metal layer is arranged on the insulating layer, and penetrates through the insulating layer through a first via hole and the first black photoresist to be connected with the first metal layer; a kind of electronic device with high-pressure air-conditioning system
And the second black photoresist is arranged on the second metal layer, and the pattern of the second black photoresist is the same as that of the second metal layer.
2. The touch panel of claim 1, wherein: the first metal layer has an opening through which the second metal layer is embedded in the first metal layer.
3. The touch panel of claim 1, wherein: the touch panel further includes: and an organic light emitting layer disposed on the array driving circuit layer, the organic light emitting layer including organic self-luminous pixels.
4. A touch panel as claimed in claim 3, wherein: the touch panel further includes: and the packaging layer is arranged between the organic light-emitting layer and the first metal layer.
5. The touch panel of claim 4, wherein: the encapsulation layer includes: the first packaging layer, the color filter and the second packaging layer.
6. The touch panel of claim 5, wherein: the color filter is disposed corresponding to the organic self-luminous pixel.
7. The touch panel of claim 1, wherein: the touch panel further includes: and the optical adhesive is arranged on the second black photoresist.
8. A manufacturing method of a touch panel is characterized in that: the manufacturing method comprises the following steps:
step S10: forming a substrate;
step S20: forming an array driving circuit layer on the substrate base plate;
step S30: sequentially forming a first metal layer and a first black photoresist on the array driving circuit layer, and patterning the first metal layer and the first black photoresist through a first photomask to enable the patterns of the first metal layer and the first black photoresist to be the same, wherein the first metal layer is provided with a plurality of L-shaped patterns;
step S40: forming an insulating layer on the first black photoresist and defining a first via hole penetrating through the insulating layer and the first black photoresist; a kind of electronic device with high-pressure air-conditioning system
Step S50: and sequentially forming a second metal layer and a second black photoresist on the insulating layer, wherein the second metal layer is connected with the first metal layer through a first via hole, and the second metal layer and the second black photoresist are patterned through a second photomask, so that the patterns of the second metal layer and the second black photoresist are the same.
9. The method of manufacturing as set forth in claim 8, wherein: the manufacturing method further comprises the steps of:
step S201: forming an organic light emitting layer on the array driving circuit layer, wherein the organic light emitting layer includes organic self-luminous pixels;
step S202: forming a first packaging layer on the organic light-emitting layer, and forming a color filter corresponding to the organic self-luminous pixel through an inkjet printing process; a kind of electronic device with high-pressure air-conditioning system
Step S203: and forming a second packaging layer on the color filter.
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| US11526079B2 (en) | 2020-04-14 | 2022-12-13 | Tcl China Star Optoelectronics Technology Co., Ltd. | Backplane unit and its manufacturing method and display device |
| CN111326082B (en) * | 2020-04-14 | 2021-08-03 | Tcl华星光电技术有限公司 | Backboard unit, manufacturing method thereof and display device |
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