CN110987041A

CN110987041A - Ultrasonic sensor and shell thereof

Info

Publication number: CN110987041A
Application number: CN201911418415.XA
Authority: CN
Inventors: 叶鹏; 陈富
Original assignee: Audiowell Electronics Guangdong Co ltd
Current assignee: Audiowell Electronics Guangdong Co ltd
Priority date: 2019-12-31
Filing date: 2019-12-31
Publication date: 2020-04-10

Abstract

The invention relates to an ultrasonic sensor and a shell thereof. The lateral wall with the diapire links to each other, the lateral wall winds the circumference setting of diapire, the lateral wall is close to be equipped with the breach in the one end of diapire. The notch is arranged around the circumference of the bottom wall, and the opening wall of the notch and the bottom wall are enclosed to form an annular lateral groove. According to the ultrasonic sensor and the shell thereof, the notch is arranged at one end of the side wall close to the bottom wall, the notch is arranged around the circumferential direction of the bottom wall, and the opening wall of the notch and the bottom wall are enclosed to form the annular lateral groove, so that on one hand, the vibration area of the piezoelectric ceramic plate arranged on the bottom wall is increased, the vibration frequency can be improved, and the emission angle to the periphery is reduced; on the other hand, the whole thickness of the side wall is not thinned, so that the rigidity can be ensured, and the long-term normal work can be ensured.

Description

Ultrasonic sensor and shell thereof

Technical Field

The present invention relates to a sensor, and more particularly, to an ultrasonic sensor and a housing thereof.

Background

The conventional ultrasonic sensor includes a housing and a piezoelectric ceramic material disposed inside the housing. Generally, the outer volume of the housing is constant, as well as the overall volume of the piezoceramic material. When piezoceramics material is to when the transmission angle all around, then need increase ultrasonic sensor's shell inner wall size, will lead to the wall thickness of attenuate shell under the unchangeable condition of the outside volume size of shell like this to reduce the rigidity of shell, and then influence ultrasonic sensor's normal working life.

Disclosure of Invention

Accordingly, there is a need to overcome the disadvantages of the prior art and to provide an ultrasonic sensor and a housing thereof, which can reduce the emitting angle to the periphery while ensuring the rigidity.

The technical scheme is as follows: a housing for an ultrasonic sensor, comprising: diapire and lateral wall, the lateral wall with the diapire links to each other, the lateral wall winds the circumference setting of diapire, the lateral wall is close to in the one end of diapire is equipped with the breach, the breach winds the circumference setting of diapire, the oral wall of breach with the diapire encloses and forms annular side direction groove.

According to the shell of the ultrasonic sensor, the notch is arranged at one end, close to the bottom wall, of the side wall, the notch is arranged around the circumferential direction of the bottom wall, and the opening wall of the notch and the bottom wall are surrounded to form the annular lateral groove, so that on one hand, the vibration area of the piezoelectric ceramic piece placed on the bottom wall is increased, the vibration frequency can be improved, and the emission angle to the periphery is reduced; on the other hand, the whole thickness of the side wall is not thinned, so that the rigidity can be ensured, and the long-term normal work can be ensured.

In one embodiment, the mouth wall of the notch is a bevel disposed obliquely with respect to the bottom wall.

In one embodiment, the included angle between the inclined plane and the bottom wall is 30-60 degrees; the bottom wall and the side wall are of an integrated structure; the bottom wall and the side wall are both metal walls.

The ultrasonic sensor comprises a shell of the ultrasonic sensor and a piezoelectric ceramic plate arranged on the bottom wall.

According to the ultrasonic sensor, the notch is arranged at one end, close to the bottom wall, of the side wall, the notch is arranged around the circumferential direction of the bottom wall, and the opening wall of the notch and the bottom wall are enclosed to form the annular lateral groove, so that on one hand, the vibration area of the piezoelectric ceramic plate placed on the bottom wall is increased, the vibration frequency can be improved, and the emission angle to the periphery is reduced; on the other hand, the whole thickness of the side wall is not thinned, so that the rigidity can be ensured, and the long-term normal work can be ensured.

In one embodiment, the ultrasonic sensor further comprises a sound absorption material layer, an adapter plate and a first potting adhesive layer; the sound absorbing material layer set up in on the piezoceramics piece, the keysets with piezoceramics piece electric connection, the keysets passes through the power cord and is connected with external power source equipment, the keysets with first encapsulating glue film all set up in ultrasonic sensor's casing in, just the keysets is located first encapsulating glue film with between the sound absorbing material layer.

In one embodiment, the sound-absorbing material layers are more than two layers, and the more than two sound-absorbing material layers are sequentially stacked.

In one embodiment, the bottom surface of the sound-absorbing material layer at the bottommost layer is tightly attached to the piezoelectric ceramic sheet, and the edge of the sound-absorbing material layer is tightly attached to the side wall.

In one embodiment, the ultrasonic sensor further includes a second potting adhesive layer, the second potting adhesive layer is disposed between the sound-absorbing material layer and the interposer, and the interposer is disposed between the second potting adhesive layer and the first potting adhesive layer.

In one embodiment, the ultrasonic sensor further includes a hard partition plate, the hard partition plate is disposed between the sound-absorbing material layer and the adapter plate, and the adapter plate is disposed between the hard partition plate and the first potting adhesive layer; the hard partition board is connected with the first pouring sealant layer.

In one embodiment, a circumferential stepped surface is arranged at one end, away from the bottom wall, of the side wall, and the edge of the second potting adhesive layer or the edge of the hard partition plate is erected on the stepped surface; ultrasonic sensor still include mounting and two wires, ultrasonic sensor's casing is the metal-back, one of them electrode of piezoceramics piece passes through one of them the wire with keysets electric connection, another electrode of piezoceramics piece with metal-back electric connection, another the one end of wire with keysets electric connection, another the other end of wire passes through the mounting is fixed in on the ladder face.

Drawings

Fig. 1 is a schematic structural diagram of a housing of an ultrasonic sensor according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of an ultrasonic sensor according to an embodiment of the present invention;

fig. 3 is a diagram illustrating a sound pressure angle test result of an ultrasonic sensor according to an embodiment of the present invention.

Reference numerals:

10. a housing of the ultrasonic sensor; 11. a bottom wall; 12. a side wall; 121. a notch; 122. a step surface; 123. mounting holes; 124. a bevel; 20. piezoelectric ceramic plates; 30. a sound absorbing material layer; 40. an adapter plate; 50. a first potting adhesive layer; 60. a power line; 61. a plug; 70. a second potting adhesive layer; 80. a fixing member; 90. and (4) conducting wires.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

In the description of the present invention, it is to be understood that the terms "first", "second" and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the description of the present invention, it should be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly connected" to another element, there are no intervening elements present.

In one embodiment, referring to fig. 1 and 2, a housing 10 of an ultrasonic sensor includes a bottom wall 11 and a side wall 12. The side wall 12 with diapire 11 links to each other, side wall 12 is around the circumference setting of diapire 11, side wall 12 is close to the one end of diapire 11 is equipped with breach 121. The notch 121 is arranged around the circumference of the bottom wall 11, and the opening wall of the notch 121 and the bottom wall 11 enclose to form an annular lateral groove.

In the case 10 of the ultrasonic sensor, since the notch 121 is formed at one end of the side wall 12 close to the bottom wall 11, the notch 121 is formed around the circumference of the bottom wall 11, and the opening wall of the notch 121 and the bottom wall 11 enclose to form an annular lateral groove, on one hand, the vibration area of the piezoelectric ceramic plate 20 placed on the bottom wall 11 is increased, so that the vibration frequency can be increased, and the emission angle to the periphery is reduced; on the other hand, the whole thickness of the side wall 12 is not thinned, so that the rigidity can be ensured, and the long-term normal operation can be ensured.

Further, referring to fig. 1 and fig. 2, the opening wall of the gap 121 is an inclined surface 124 that is inclined relative to the bottom wall 11. That is, the notch 121 is a bevel notch, which facilitates the manufacturing process, and particularly, prevents the polishing pin from being caught in the bevel notch during the polishing step. Of course, as an alternative, the notch 121 may also be a right-angle notch, and one wall surface of the opening wall of the right-angle notch is parallel to the bottom wall 11, and the other wall surface is perpendicular to the bottom wall 11. The bevel notches are easier to manufacture than the right-angled notches.

Further, referring to fig. 1 and fig. 2, an included angle between the inclined plane 124 and the bottom wall 11 is 30 ° to 60 °; the bottom wall 11 and the side wall 12 are of an integrated structure; the bottom wall 11 and the side wall 12 are both metal walls. Specifically, the angle between the inclined surface 124 and the bottom wall 11 is 45 °.

In one embodiment, referring to fig. 1 and fig. 2, an ultrasonic sensor includes a housing 10 of the ultrasonic sensor according to any one of the above embodiments, and further includes a piezoelectric ceramic plate 20 disposed on the bottom wall 11.

In the ultrasonic sensor, the notch 121 is arranged at one end of the side wall 12 close to the bottom wall 11, the notch 121 is arranged around the circumference of the bottom wall 11, and the opening wall of the notch 121 and the bottom wall 11 surround to form an annular lateral groove, so that on one hand, the vibration area of the piezoelectric ceramic plate 20 arranged on the bottom wall 11 is increased, the vibration frequency can be improved, and the emission angle to the periphery is reduced; on the other hand, the whole thickness of the side wall 12 is not thinned, so that the rigidity can be ensured, and the long-term normal operation can be ensured.

Further, referring to fig. 1 and 2, the ultrasonic sensor further includes a sound-absorbing material layer 30, an interposer 40, and a first potting adhesive layer 50. The sound-absorbing material layer 30 is disposed on the piezoelectric ceramic sheet 20. The adapter plate 40 with piezoceramics piece 20 electric connection, the adapter plate 40 passes through the power cord 60 and is connected with external power supply equipment, the adapter plate 40 with first encapsulating glue layer 50 all set up in ultrasonic sensor's casing 10 in, just the adapter plate 40 is located first encapsulating glue layer 50 with between the sound absorbing material layer 30. Specifically, the power supply line 60 is, for example, a twisted pair. One end of the power line 60 is electrically connected to the adapter plate 40, and the other end of the power line 60 is provided with a plug 61. Therefore, on one hand, when the piezoelectric ceramic piece 20 vibrates, the sound absorption material layer 30 contacts with the sound absorption material layer 30, the sound absorption material layer 30 can absorb the vibration quantity of the piezoelectric ceramic piece 20, the vibration of the piezoelectric ceramic piece 20 is reduced, the detection of ultrasonic signals is sensitive, and meanwhile, the noise can be reduced; on the other hand, the first potting adhesive layer 50 encapsulates the interposer 40, the sound absorbing material layer 30 and the piezoelectric ceramic sheet 20 in the housing 10 of the ultrasonic sensor, and the structural stability is good.

Further, referring to fig. 1 and 2, the sound-absorbing material layer 30 has two or more layers, and the two or more layers of sound-absorbing material layers 30 are sequentially stacked. Specifically, the sound-absorbing material layer 30 has two, three, or other layers. Thus, compared with the sound absorbing material layer 30 provided with only one layer, the sound absorbing material layer 30 with more than two layers has higher sensitivity, and is more favorable for ultrasonic signal detection.

Further, referring to fig. 1 and 2, the bottom surface of the sound-absorbing material layer 30 at the bottom layer is tightly attached to the piezoelectric ceramic plate 20, and the edge of the sound-absorbing material layer 30 is tightly attached to the side wall 12. Thus, the sound absorbing material layer 30 is contacted with the piezoelectric ceramic sheet 20 when the piezoelectric ceramic sheet 20 vibrates, and the sound absorbing material layer 30 can absorb the vibration amount of the piezoelectric ceramic sheet 20 well, thereby reducing the vibration of the piezoelectric ceramic sheet 20, being more sensitive to the detection of ultrasonic signals, and reducing noise.

In one embodiment, referring to fig. 1 and 2, the ultrasonic sensor further includes a second potting adhesive layer 70. The second potting adhesive layer 70 is disposed between the sound-absorbing material layer 30 and the interposer 40, and the interposer 40 is disposed between the second potting adhesive layer 70 and the first potting adhesive layer 50. Thus, after the piezoelectric ceramic plate 20 is mounted on the bottom wall 11 of the casing 10 of the ultrasonic sensor, the sound-absorbing material layer 30 is pressed into the casing 10 of the ultrasonic sensor, the sound-absorbing material layer 30 is tightly attached to the piezoelectric ceramic plate 20, and then a glue layer is poured into the casing 10 of the ultrasonic sensor, so that a second potting glue layer 70 is formed on the side surface of the sound-absorbing material layer 30, which is opposite to the bottom wall 11, and the sound-absorbing material layer 30 and the piezoelectric ceramic plate 20 are stably mounted in the casing 10 of the ultrasonic sensor. Before the step of disposing the sound-absorbing material layer 30 in the housing 10 of the ultrasonic sensor, one end of the wire 90 is welded to the electrode of the piezoelectric ceramic plate 20, and the other end of the wire 90 is welded to the interposer 40, so that the wire 90 is embedded in the second potting adhesive layer 70.

Further, referring to fig. 1 and fig. 2, a circumferential stepped surface 122 is disposed at an end of the side wall 12 away from the bottom wall 11, and an edge of the second potting adhesive layer 70 is overlapped on the stepped surface 122. Thus, the second potting adhesive layer 70 has a good effect of encapsulating the sound-absorbing material layer 30 and the piezoelectric ceramic sheet 20, so that the sound-absorbing material layer 30 and the piezoelectric ceramic sheet 20 are stably mounted in the housing 10 of the ultrasonic sensor.

In another embodiment, the ultrasonic sensor further comprises a rigid spacer. The hard partition plate is arranged between the sound absorbing material layer 30 and the adapter plate 40, and the adapter plate 40 is arranged between the hard partition plate and the first potting adhesive layer 50. So, the stereoplasm baffle can realize that sound absorbing material layer 30 and keysets 40 separate each other, avoids keysets 40 and first encapsulating glue layer 50 to cause the influence to the vibration of sound absorbing material layer 30, and the vibration volume on sound absorbing material layer 30 also can not transmit keysets 40 and first encapsulating glue layer 50 to can improve the detectivity to ultrasonic signal. Further, a gap is formed between the hard partition plate and the sound absorption material layer 30, and the hard partition plate is further connected with the first potting adhesive layer 50. In this way, the sound-absorbing material layer 30 can be prevented from transmitting the vibration amount to the hard partition as much as possible, and the detection sensitivity for the ultrasonic signal can be greatly improved compared to the case of using the second potting adhesive layer 70.

Further, one end of the bottom wall 11, which is far away from the side wall 12, is provided with a circumferential stepped surface 122, and the edge of the hard partition board is lapped on the stepped surface 122. Therefore, on one hand, the hard partition plate can be conveniently and stably arranged on the stepped surface 122, and the installation is convenient and the stability is good; on the other hand, the hard spacer can achieve a relatively stable mounting of the sound absorbing material layer 30 and the piezoelectric ceramic sheet 20 in the case 10 of the ultrasonic sensor.

Further, referring to fig. 1 and 2, the ultrasonic sensor further includes a fixing member 80 and two wires 90. The housing 10 of the ultrasonic sensor is a metal shell. One electrode of the piezoelectric ceramic piece 20 is electrically connected to the interposer 40 through one of the wires 90, the other electrode of the piezoelectric ceramic piece 20 is electrically connected to the metal shell, and one end of the other wire 90 is electrically connected to the interposer 40. The other end of the other wire 90 is fixed to the stepped surface 122 by the fixing member 80.

Specifically, the fixing member 80 is a screw, a rivet, a bolt, a screw rod, a pin, or the like. When the fixing member 80 is, for example, a screw, the stepped surface 122 is provided with a screw hole corresponding to the screw. When the screw presses the end of the wire 90 against the screw hole on the stepped surface 122, the wire 90 can be electrically connected to the metal shell, so that the adapter plate 40 is electrically connected to the other electrode of the piezoelectric ceramic plate 20. When the fixing member 80 is a rivet, for example, a rivet hole corresponding to the rivet is provided in the stepped surface 122, and the rivet can also press the end of the wire 90 against the rivet hole in the stepped surface 122.

Further, the thickness of the side wall 12 is increased to increase the area of the stepped surface 122, and the area of the stepped surface 122 is large enough, so that the installation hole 123 corresponding to the fixing member 80 can be conveniently formed in the stepped surface 122, and the fixing member 80 can be conveniently used for fixing the end of the wire 90 on the stepped surface 122 in a pressing manner.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A housing for an ultrasonic sensor, comprising:

diapire and lateral wall, the lateral wall with the diapire links to each other, the lateral wall winds the circumference setting of diapire, the lateral wall is close to in the one end of diapire is equipped with the breach, the breach winds the circumference setting of diapire, the oral wall of breach with the diapire encloses and forms annular side direction groove.

2. The ultrasonic sensor housing of claim 1, wherein the mouth wall of the notch is a sloped surface disposed obliquely relative to the bottom wall.

3. The ultrasonic sensor housing according to claim 2, wherein the angle between the inclined surface and the bottom wall is 30 ° to 60 °; the bottom wall and the side wall are of an integrated structure; the bottom wall and the side wall are both metal walls.

4. An ultrasonic sensor comprising a housing of the ultrasonic sensor according to any one of claims 1 to 3, and further comprising a piezoceramic sheet disposed on the bottom wall.

5. The ultrasonic sensor of claim 4, further comprising a sound absorbing material layer, an interposer, and a first potting adhesive layer; the sound absorbing material layer set up in on the piezoceramics piece, the keysets with piezoceramics piece electric connection, the keysets passes through the power cord and is connected with external power source equipment, the keysets with first encapsulating glue film all set up in ultrasonic sensor's casing in, just the keysets is located first encapsulating glue film with between the sound absorbing material layer.

6. The ultrasonic sensor according to claim 5, wherein the sound-absorbing material layer has two or more layers, and the two or more layers are stacked in this order.

7. The ultrasonic sensor according to claim 6, wherein a bottom surface of the sound-absorbing material layer at the lowermost layer is in close contact with the piezoelectric ceramic plate, and an edge of the sound-absorbing material layer is in close contact with the side wall.

8. The ultrasonic sensor of claim 5, further comprising a second potting adhesive layer, wherein the second potting adhesive layer is disposed between the sound absorbing material layer and the interposer, and the interposer is disposed between the second potting adhesive layer and the first potting adhesive layer.

9. The ultrasonic sensor according to claim 5, further comprising a hard spacer disposed between the sound-absorbing material layer and the interposer, the interposer being disposed between the hard spacer and the first potting adhesive layer; the hard partition board is connected with the first pouring sealant layer.

10. The ultrasonic sensor according to claim 8 or 9, wherein one end of the side wall, which is far away from the bottom wall, is provided with a circumferential stepped surface, and an edge of the second potting adhesive layer or an edge of the hard partition plate is overlapped on the stepped surface; ultrasonic sensor still include mounting and two wires, ultrasonic sensor's casing is the metal-back, one of them electrode of piezoceramics piece passes through one of them the wire with keysets electric connection, another electrode of piezoceramics piece with metal-back electric connection, another the one end of wire with keysets electric connection, another the other end of wire passes through the mounting is fixed in on the ladder face.