CN110977082A - Semiconductor integrated chip dismounting device - Google Patents
Semiconductor integrated chip dismounting device Download PDFInfo
- Publication number
- CN110977082A CN110977082A CN202010002403.5A CN202010002403A CN110977082A CN 110977082 A CN110977082 A CN 110977082A CN 202010002403 A CN202010002403 A CN 202010002403A CN 110977082 A CN110977082 A CN 110977082A
- Authority
- CN
- China
- Prior art keywords
- sliding
- sliding rod
- cavity
- end wall
- rotating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Abstract
The invention relates to the field of integrated chips, in particular to a semiconductor integrated chip dismounting device which comprises a machine body and sliding frames arranged on the left side and the right side of the machine body, first sliding grooves are symmetrically arranged in the left end wall and the right end wall of the machine body, a first sliding rod fixedly connected with the sliding frame is arranged in the first sliding grooves in a sliding manner, a first spring is arranged between the first sliding rod and the end wall of the first sliding groove, a second sliding groove which is communicated up and down is arranged in the machine body, the second sliding rod is arranged in the second sliding groove in a sliding manner, the semiconductor integrated chip dismounting device provided by the invention realizes the automatic dismounting of the semiconductor chip, the equipment can automatically adsorb the semiconductor chip, and meanwhile, the soldering tin at the pin of the chip is continuously heated, so that the semiconductor chip is separated from the circuit board, and the equipment is convenient to operate.
Description
Technical Field
The invention relates to the field of integrated chips, in particular to a semiconductor integrated chip dismounting device.
Background
When carrying out circuit board restoration, often need dismantle the semiconductor chip who damages, nevertheless often because the chip pin is more, it is very inconvenient to melt all pin soldering tin simultaneously, and the mode efficiency of traditional manual dismantlement is lower, and the temperature heating is inhomogeneous, leads to the circuit board damage easily, consequently needs to set up a semiconductor integrated chip dismounting device and improves above-mentioned problem.
Disclosure of Invention
The invention aims to provide a semiconductor integrated chip dismounting device which can overcome the defects in the prior art, so that the practicability of equipment is improved.
The technical scheme adopted by the invention for solving the technical problems is as follows: the invention relates to a semiconductor integrated chip dismounting device, which comprises a machine body and sliding frames arranged at the left side and the right side of the machine body, wherein first sliding grooves are symmetrically arranged in the left end wall and the right end wall of the machine body, a first sliding rod fixedly connected with the sliding frames is slidably arranged in the first sliding grooves, a first spring is arranged between the first sliding rod and the end wall of the first sliding groove, a second sliding groove which is communicated up and down is arranged in the machine body, a second sliding rod is slidably arranged in the second sliding groove, a second spring is arranged between a stop block fixedly arranged at the top of the second sliding rod and the top wall of the machine body, locking devices for locking the second sliding rod are arranged in the left end wall and the right end wall of the second sliding groove, a sucker for adsorbing a chip is fixedly arranged at the tail end of the bottom of the second sliding rod, and a rotating frame which is rotatably connected with the second sliding rod is arranged between the sucker and the machine body, a rotating cavity is arranged in the rotating frame, a first bevel gear is fixedly arranged on the outer surface of the second sliding rod in the rotating cavity, a rotating device for driving the rotating frame to rotate around the second sliding rod is arranged in the end wall at the left side of the rotating cavity, a fixed frame capable of moving left and right is arranged at the left side of the rotating frame, a third sliding groove with a left opening is arranged in the end wall at the left side of the rotating frame, a third sliding rod fixedly connected with the fixed frame is arranged in the third sliding groove in a sliding manner, a moving device for driving the fixed frame to move left and right is arranged in the top wall of the third sliding groove, a hot air blower for heating is fixedly arranged in the bottom wall of the fixed frame, a fourth sliding groove with a downward opening is arranged in the bottom wall of the fixed frame, a magnetic suction block and a fourth sliding rod positioned, the fourth slide bar with be provided with between the end wall about the fourth sliding tray the fourth slide bar drives after shifting the resetting means that the fourth slide bar resets, fixed be provided with on the fourth slide bar roof with inhale piece complex electro-magnet, on the fourth slide bar diapire fixed be provided with bilateral symmetry two with the contact of electro-magnet electricity federation, control two the contact is simultaneously with when chip pin butt, the electro-magnet circular telegram is adsorbed the piece is inhaled downwards to the magnetism, thereby drives switching device that sets up in the mount realizes rotating device with power switching between the mobile device.
Furthermore, the locking device comprises fifth sliding grooves symmetrically arranged in the left and right end walls of the second sliding groove, a fifth sliding rod extending into clamping grooves arranged in the left and right end walls of the second sliding rod is slidably arranged in the fifth sliding groove, one side of the fifth sliding rod, which is far away from the second sliding rod, is provided with a first rack, a third spring is arranged between the first rack and the fifth sliding rod, hydraulic holes with outward openings are arranged in the left and right end walls of the machine body, a second rack is slidably arranged in the hydraulic holes, a gear cavity is communicated between the hydraulic holes and the fifth sliding groove, a first gear meshed with the second rack and the first rack is rotatably arranged in the gear cavity, a winding cavity is arranged in the sliding frame, and a winding shaft is rotatably arranged in the winding cavity, the spool with be provided with first torsional spring between wire winding chamber end wall, the carriage is close to be provided with the spacing groove in the fuselage side end wall, the slidable of spacing inslot is provided with the supporting rod, the supporting rod with be provided with the carriage between the spacing groove, the spacing groove with the intercommunication between the hydraulic pressure hole be provided with convolute in the hydraulic pressure pipe of spool surface, be provided with in the fifth sliding groove bottom wall and run through the sixth sliding groove in hydraulic pressure hole, slidable is provided with the top in the sixth sliding groove and stretches into the sixth sliding bar that the opening that sets up in the fifth sliding bar diapire locked the inslot, the sixth sliding bar with be provided with the fourth spring between the sixth sliding groove bottom wall, be provided with about in the sixth sliding bar and control the inclined hole that link up.
Further, the rotating device comprises a sliding cavity arranged in the end wall of the left side of the rotating cavity, a first spline shaft is arranged between the sliding cavity and the rotating cavity in a rotating mode, a second bevel gear meshed with the first bevel gear is fixedly arranged at the tail end of the first spline shaft in the rotating cavity, a supporting block is arranged in the sliding cavity in a sliding mode, a driving motor is fixedly arranged in the supporting block, a spline housing is fixedly arranged at the tail end of an output shaft of the driving motor in a extending mode towards the left side and the right side, and the spline housing on the right side is meshed with the first spline shaft.
Further, the mobile device comprises a transmission cavity with a downward opening and arranged in the top wall of the third sliding groove, a first rotating shaft is rotatably arranged in the transmission cavity, a second gear meshed with the third sliding rod and a worm wheel positioned between the front gear and the rear gear are fixedly arranged on the outer surface of the first rotating shaft, a worm meshed with the worm wheel is rotatably arranged in the transmission cavity, and a second spline shaft meshed with the spline sleeve is fixedly arranged at the tail end of the right side of the worm.
Further, auto-change over device includes the meshing chamber that sets up in the mount, be provided with in the mount and run through the spout that leads in meshing chamber, slidable is provided with the third rack in the spout, the end runs through on third rack right side the through-hole that sets up in the end wall of sliding chamber left side stretches into the sliding cavity intracavity, the third rack with supporting shoe fixed connection, the rotatable second pivot that is provided with of meshing intracavity, the second pivot with be provided with the second torsional spring around the cavity between the end wall, second pivot external fixation be provided with third rack toothing's sector gear and be located the reel of sector gear one side, the reel surface around be equipped with magnetism inhale piece fixed connection's acting as go-between.
Furthermore, a seventh sliding groove is formed in the top wall of the sliding cavity, a seventh sliding rod matched with a groove formed in the top wall of the supporting block is slidably arranged in the seventh sliding groove, and the seventh sliding rod can be upwards attracted by the machine body when the distance between the seventh sliding rod and the machine body is short.
The invention has the beneficial effects that: according to the semiconductor integrated chip dismounting device provided by the invention, the semiconductor chip is automatically dismounted, the device can automatically adsorb the semiconductor chip, and meanwhile, soldering tin at the pin position of the chip is continuously heated, so that the semiconductor chip is separated from a circuit board, and the device is convenient to operate.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the invention, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a schematic diagram of an overall structure of a semiconductor integrated chip detachment apparatus according to the present invention.
Fig. 2 is an enlarged schematic view of a in fig. 1.
Fig. 3 is an enlarged schematic view of B in fig. 1.
Fig. 4 is a schematic diagram of the structure C-C in fig. 2.
Detailed Description
The invention will now be described in detail with reference to fig. 1-4, wherein for ease of description the orientations described hereinafter are now defined as follows: the up, down, left, right, and front-back directions described below correspond to the up, down, left, right, and front-back directions in the projection relationship of fig. 1 itself.
Referring to fig. 1-4, a semiconductor integrated chip detaching device includes a body 10 and sliding frames 26 disposed on the left and right sides of the body 10, first sliding grooves 29 are symmetrically disposed in the left and right end walls of the body 10, first sliding rods 31 fixedly connected to the sliding frames 26 are slidably disposed in the first sliding grooves 29, first springs 30 are disposed between the first sliding rods 31 and the end walls of the first sliding grooves 29, second sliding grooves 11 penetrating up and down are disposed in the body 10, second sliding rods 13 are slidably disposed in the second sliding grooves 11, second springs 14 are disposed between stoppers 12 fixedly disposed on the tops of the second sliding rods 13 and the top wall of the body 10, locking devices 99 for locking the second sliding rods 13 are disposed in the left and right end walls of the second sliding grooves 11, suction cups 50 for sucking chips are fixedly disposed at the bottom ends of the second sliding rods 13, a rotating frame 51 connected with the second sliding rod 13 in a rotating manner is arranged between the suction cup 50 and the machine body 10, a rotating cavity 52 is arranged in the rotating frame 51, a first bevel gear 53 is fixedly arranged on the outer surface of the second sliding rod 13 in the rotating cavity 52, a rotating device 98 for driving the rotating frame 51 to rotate around the second sliding rod 13 is arranged in the end wall of the left side of the rotating cavity 52, a fixed frame 37 capable of moving left and right is arranged on the left side of the rotating frame 51, a third sliding groove 48 with a leftward opening is arranged in the end wall of the left side of the rotating frame 51, a third sliding rod 49 fixedly connected with the fixed frame 37 is slidably arranged in the third sliding groove 48, a moving device 97 for driving the fixed frame 37 to move left and right is arranged in the top wall of the third sliding groove 48, and a hot air heater 40 for heating is fixedly arranged in the bottom wall of, a fourth sliding groove 41 with a downward opening is arranged in the bottom wall of the fixed frame 37, a magnetic block 64 and a fourth sliding rod 77 positioned below the magnetic block 64 are slidably arranged in the fourth sliding groove 41, a reset device 43 is disposed between the fourth sliding rod 77 and the left and right end walls of the fourth sliding groove 41 for driving the fourth sliding rod 77 to reset after the fourth sliding rod 77 is displaced, an electromagnet 42 matched with the magnetic suction block 64 is fixedly arranged on the top wall of the fourth sliding rod 77, the bottom wall of the fourth sliding rod 77 is fixedly provided with two bilaterally symmetrical contacts 44 electrically connected with the electromagnet 42, when the two contacts 44 are abutted to the chip pins at the same time, the electromagnet 42 is electrified to adsorb the magnetic suction block 64 to move downwards, thereby driving the switching device 96 arranged in the fixed frame 37 to realize the power switching between the rotating device 98 and the moving device 97.
Beneficially, the locking device 99 includes fifth sliding grooves 16 symmetrically disposed in left and right end walls of the second sliding groove 11, fifth sliding rods 17 extending into the clamping grooves 15 disposed in left and right end walls of the second sliding rod 13 are slidably disposed in the fifth sliding grooves 16, a first rack 19 is disposed on one side of the fifth sliding rod 17 away from the second sliding rod 13, a third spring 76 is disposed between the first rack 19 and the fifth sliding rod 17, hydraulic holes 20 with outward openings are disposed in left and right end walls of the body 10, a second rack 32 is slidably disposed in the hydraulic holes 20, a gear cavity 34 is disposed in communication between the hydraulic holes 20 and the fifth sliding grooves 20, a first gear 35 engaged with the second rack 32 and the first rack 19 is rotatably disposed in the gear cavity 34, a winding cavity 21 is disposed in the sliding frame 26, the winding shaft 24 is rotatably arranged in the winding cavity 21, a first torsion spring is arranged between the winding shaft 24 and the end wall of the winding cavity 21, the sliding frame 26 is close to a limiting groove 28 which is arranged in the end wall of one side of the machine body 10, a clamping rod 27 is slidably arranged in the limiting groove 28, the sliding frame 26 is arranged between the clamping rod 27 and the limiting groove 28, a hydraulic pipe 25 which is wound on the outer surface of the winding shaft 24 is communicated between the limiting groove 28 and the hydraulic hole 20, a sixth sliding groove 73 which penetrates through the hydraulic hole 20 is arranged in the bottom wall of the fifth sliding groove 20, a sixth sliding rod 71 of which the top extends into a locking groove 75 which is arranged in the bottom wall of the fifth sliding rod 17 and is provided with a downward opening is slidably arranged in the sixth sliding groove 73, and a fourth spring 72 is arranged between the sixth sliding rod 71 and the bottom wall of the sixth sliding groove 73, the sixth slide bar 71 is provided with a right and left through inclined hole 74.
Advantageously, the rotating device 98 includes a sliding cavity 57 disposed in the left end wall of the rotating cavity 52, a first spline shaft 55 is rotatably disposed between the sliding cavity 57 and the rotating cavity 52, a second bevel gear 54 engaged with the first bevel gear 53 is fixedly disposed at the end of the first spline shaft 55 in the rotating cavity 52, a supporting block 58 is slidably disposed in the sliding cavity 57, a driving motor 47 is fixedly disposed in the supporting block 58, a spline housing 56 is fixedly disposed at the end of the output shaft of the driving motor 47 extending to the left and right, and the spline housing 56 on the right is engaged with the first spline shaft 55.
Advantageously, the moving device 97 includes a transmission cavity 62 with a downward opening, which is arranged in the top wall of the third sliding groove 48, a first rotating shaft 60 is rotatably arranged in the transmission cavity 62, a second gear 45 engaged with the third sliding rod 49 and a worm wheel 46 positioned between the front and rear second gears 45 are fixedly arranged on the outer surface of the first rotating shaft 60, a worm 61 engaged with the worm wheel 46 is rotatably arranged in the transmission cavity 62, and a second spline shaft 59 engaged with the spline housing 56 on the left side is fixedly arranged at the right end of the worm 61.
Advantageously, said switching means 96 comprise an engagement chamber 36 provided in said fixed frame 37, a guide chute 39 penetrating through the meshing cavity 36 is arranged in the fixed frame 37, a third rack 38 is slidably arranged in the guide chute 39, the right end of the third rack 38 extends into the sliding cavity 57 through a through hole 63 arranged in the left end wall of the sliding cavity 57, the third rack 38 is fixedly connected with the supporting block 58, a second rotating shaft 68 is rotatably arranged in the meshing cavity 36, a second torsion spring 67 is arranged between the second rotating shaft 68 and the front and rear end walls of the cavity 65, a sector gear 66 engaged with the third rack 38 and a reel 69 positioned on one side of the sector gear 66 are fixedly arranged on the outer surface of the second rotating shaft 68, the outer surface of the reel 69 is wound with a pull wire 70 fixedly connected with the magnetic block 64.
Advantageously, a seventh sliding groove 33 is provided in the top wall of the sliding cavity 57, a seventh sliding rod 23 matching with the groove 22 provided in the top wall of the supporting block 58 is slidably provided in the seventh sliding groove 33, and the seventh sliding rod 23 can be attracted upwards by the body 10 when the seventh sliding rod 23 is close to the body 10.
The fixing and connecting method in this embodiment includes, but is not limited to, bolting, welding, and the like.
As shown in fig. 1 to 4, in the initial state of the apparatus of the present invention, the second spring 14 is in a compressed state, the second spline shaft 59 is spline-fitted to the spline housing 56 on the left side, and the spline housing 56 on the right side is separated from the first spline shaft 55.
Sequence of mechanical actions of the whole device:
when the device of the present invention works, the suction cup 50 is attached to the chip to be detached, the sliding frame 26 is pulled to the left and right sides, the clamping rod 27 is clamped to the left and right sides of the circuit board to which the chip is soldered, at this time, the clamping rod 27 presses the hydraulic oil in the limiting groove 28, so as to press the second rack 32 to move, the second rack 32 moves to drive the first rack 19 to move, so as to stretch the third spring 76, when the second rack 32 moves to abut against the sixth sliding rod 71, the sixth sliding rod 71 moves down out of the locking groove 75, at this time, the fifth sliding rod 17 moves out of the slot 15 under the action of the third spring 76, at this time, the second sliding rod 13 moves up under the action of the second spring 14, so as to pull the chip upward through the suction cup 50, at this time, the contact 44 abuts against the top of the chip, the driving motor 47 is started to drive the second spline shaft 59 to rotate, so as to drive the worm 61 to rotate, so as to drive the worm wheel 46 to rotate, so as to drive the first rotating shaft 60 to rotate, so as to drive the second gear 45 to rotate, so as to drive the third sliding rod 49 to move, so as to drive the fixed frame 37 to move, the fixed frame 37 to move and drive the fourth sliding rod 77 to move, when the fourth sliding rod 77 moves and drive the contact 44 to move to be abutted against the chip pin, the electromagnet 42 is electrified to drive the magnetic attraction block 64 to move downwards, the magnetic attraction block 64 moves downwards to drive the reel 69 to rotate, so as to drive the sector gear 66 to rotate, so as to drive the third rack 38 to move rightwards, so as to drive the support block 58 to move rightwards, so as to drive the second spline shaft 59 to be separated from the left spline housing 56, the spline housing 56 on the right side is spline-fitted to the first spline shaft 55, and when the grooves 22 are aligned with the seventh sliding grooves 33, the seventh sliding rod 23 is inserted into the groove 22 to lock the supporting block 58, at this time, the driving motor 47 is started to drive the first spline shaft 55 to rotate, the first spline shaft 55 rotates to drive the rotating frame 51 to rotate around the first bevel gear 53, thereby driving the hot air blower 40 to rotate, starting the hot air blower 40 to blow air to the chip pins, moving the chip up under the action of the suction cup 50 after the soldering tin at the pin welding position is melted, thus being separated from the circuit board, thereby accomplishing the chip detachment, when the seventh slide bar 23 is moved to be close to the body 10, the seventh slide bar 23 moves up and out of the groove 22, and at this time, the supporting block 58 moves to the left, and the device returns to the original state.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (6)
1. The utility model provides a semiconductor integrated chip dismounting device, includes the fuselage and set up in the carriage of the fuselage left and right sides, its characterized in that: first sliding grooves are symmetrically arranged in the left end wall and the right end wall of the machine body, a first sliding rod fixedly connected with the sliding frame is slidably arranged in the first sliding groove, a first spring is arranged between the first sliding rod and the end wall of the first sliding groove, a second sliding groove which is communicated up and down is arranged in the machine body, a second sliding rod is slidably arranged in the second sliding groove, a second spring is arranged between a stop block fixedly arranged at the top of the second sliding rod and the top wall of the machine body, locking devices used for locking the second sliding rod are arranged in the left end wall and the right end wall of the second sliding groove, a sucking disc used for sucking a chip is fixedly arranged at the tail end of the bottom of the second sliding rod, a rotating frame connected with the second sliding rod in a rotating manner is arranged between the sucking disc and the machine body, a rotating cavity is arranged in the rotating frame, and a first bevel gear is fixedly arranged on the outer surface of the second sliding rod in the rotating, a rotating device for driving the rotating frame to rotate around the second sliding rod is arranged in the end wall of the left side of the rotating cavity, a fixed frame capable of moving left and right is arranged on the left side of the rotating frame, a third sliding groove with a leftward opening is arranged in the end wall of the left side of the rotating frame, a third sliding rod fixedly connected with the fixed frame is slidably arranged in the third sliding groove, a moving device for driving the fixed frame to move left and right is arranged in the top wall of the third sliding groove, a hot air heater for heating is fixedly arranged in the bottom wall of the fixed frame, a fourth sliding groove with a downward opening is arranged in the bottom wall of the fixed frame, a magnetic suction block and a fourth sliding rod positioned below the magnetic suction block are slidably arranged in the fourth sliding groove, and a reset device for driving the fourth sliding rod to reset after the fourth sliding rod shifts is arranged between the fourth sliding rod and the left and right end, the electromagnetic attraction device comprises a fourth sliding rod, a fourth sliding rod and a power switching device, wherein the fourth sliding rod is fixedly provided with an electromagnet matched with a magnetic attraction block, the fourth sliding rod is fixedly provided with two contacts which are bilaterally symmetrical and are electrically connected with the electromagnet, the contacts are connected with chip pins in an abutting mode simultaneously, the electromagnet is electrified and adsorbed, the magnetic attraction block moves downwards, and therefore the power switching device in the fixing frame is driven to achieve power switching between the rotating device and the moving device.
2. A semiconductor integrated chip detachment apparatus according to claim 1, wherein: the locking device comprises fifth sliding grooves symmetrically arranged in the left end wall and the right end wall of the second sliding groove, a fifth sliding rod extending into clamping grooves arranged in the left end wall and the right end wall of the second sliding rod is slidably arranged in the fifth sliding groove, a first rack is arranged on one side of the fifth sliding rod, which is far away from the second sliding rod, a third spring is arranged between the first rack and the fifth sliding rod, hydraulic holes with outward openings are arranged in the left end wall and the right end wall of the machine body, a second rack is slidably arranged in the hydraulic holes, a gear cavity is communicated between the hydraulic holes and the fifth sliding groove, a first gear meshed with the second rack and the first rack is rotatably arranged in the gear cavity, a winding cavity is arranged in the sliding frame, a winding shaft is rotatably arranged in the winding cavity, and a first torsion spring is arranged between the winding shaft and the end wall of the winding cavity, the carriage is close to be provided with the spacing groove in the fuselage side end wall, slidable is provided with the supporting rod in the spacing groove, the supporting rod with be provided with the carriage between the spacing groove, the spacing groove with the intercommunication between the hydraulic pressure hole be provided with convolute in the hydraulic pressure pipe of spool surface, be provided with in the fifth sliding groove bottom wall and run through the sixth sliding tray in the hydraulic pressure hole, slidable is provided with the top in the sixth sliding tray and stretches into the sixth sliding bar that the decurrent locking of opening that sets up in the fifth sliding bar diapire is locked up the inslot, the sixth sliding bar with be provided with the fourth spring between the sixth sliding tray bottom wall, be provided with about in the sixth sliding bar and control the inclined hole that link up.
3. A semiconductor integrated chip detachment apparatus according to claim 1, wherein: the rotating device comprises a sliding cavity arranged in the end wall of the left side of the rotating cavity, a first spline shaft is arranged between the sliding cavity and the rotating cavity in a rotating mode, the tail end of the first spline shaft in the rotating cavity is fixedly provided with a second bevel gear meshed with the first bevel gear, a supporting block is arranged in the sliding cavity in a sliding mode, a driving motor is fixedly arranged in the supporting block, the output shaft of the driving motor extends towards the left side and the right side, the tail end of the output shaft of the driving motor is fixedly provided with a spline housing, and the spline housing on the right side is meshed with the.
4. A semiconductor integrated chip detachment apparatus according to claim 1, wherein: the mobile device comprises a transmission cavity with a downward opening, which is arranged in the top wall of the third sliding groove, a first rotating shaft is rotatably arranged in the transmission cavity, a second gear meshed with the third sliding rod and a worm wheel positioned between the second gear are fixedly arranged on the outer surface of the first rotating shaft, a worm meshed with the worm wheel is rotatably arranged in the transmission cavity, and a second spline shaft meshed with the spline sleeve is fixedly arranged at the tail end of the right side of the worm.
5. A semiconductor integrated chip detachment apparatus according to claim 1, wherein: switching device includes the meshing chamber that sets up in the mount, be provided with in the mount and run through the spout that leads in meshing chamber, slidable is provided with the third rack in the spout, third rack right side end runs through the through-hole that sets up in the end wall of sliding chamber left side stretches into the sliding cavity intracavity, the third rack with supporting shoe fixed connection, the rotatable second pivot that is provided with of meshing intracavity, the second pivot with be provided with the second torsional spring between the end wall around the cavity, second pivot external fixation be provided with third rack toothing's sector gear and be located the reel of sector gear one side, the reel surface around be equipped with magnetism inhale piece fixed connection act as go-between.
6. A semiconductor integrated chip detachment apparatus according to claim 1, wherein: a seventh sliding groove is formed in the top wall of the sliding cavity, a seventh sliding rod matched with a groove formed in the top wall of the supporting block is slidably arranged in the seventh sliding groove, and the seventh sliding rod can be upwards attracted by the machine body when the distance between the seventh sliding rod and the machine body is short.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010002403.5A CN110977082B (en) | 2020-01-02 | 2020-01-02 | Semiconductor integrated chip dismounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010002403.5A CN110977082B (en) | 2020-01-02 | 2020-01-02 | Semiconductor integrated chip dismounting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110977082A true CN110977082A (en) | 2020-04-10 |
| CN110977082B CN110977082B (en) | 2020-09-25 |
Family
ID=70080597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010002403.5A Active CN110977082B (en) | 2020-01-02 | 2020-01-02 | Semiconductor integrated chip dismounting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110977082B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111515485A (en) * | 2020-05-18 | 2020-08-11 | 济南通呗灯具有限公司 | Maintenance erection equipment of LED lamp pearl |
| CN112338487A (en) * | 2020-11-05 | 2021-02-09 | 闻德亮 | Computer host circuit board fan bracket demolishs device |
| CN112355936A (en) * | 2020-11-12 | 2021-02-12 | 抚州盛宏电子有限公司 | Chip fixing device for electronic product maintenance |
| CN113319693A (en) * | 2021-06-15 | 2021-08-31 | 苏州双荣橡塑有限公司 | Polishing and cleaning equipment for handheld dust collector shell mold |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63290681A (en) * | 1987-05-22 | 1988-11-28 | Hiroshi Akashi | Melting and removing device |
| JP2010205957A (en) * | 2009-03-04 | 2010-09-16 | Fujitsu Ltd | Device and method of removing solder |
| CN206519631U (en) * | 2016-12-30 | 2017-09-26 | 深圳铭达康科技有限公司 | Surface mount elements provision for disengagement |
| CN109637386A (en) * | 2019-01-29 | 2019-04-16 | 恩利克（浙江）智能装备有限公司 | A kind of prosthetic device and restorative procedure of LED display |
-
2020
- 2020-01-02 CN CN202010002403.5A patent/CN110977082B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63290681A (en) * | 1987-05-22 | 1988-11-28 | Hiroshi Akashi | Melting and removing device |
| JP2010205957A (en) * | 2009-03-04 | 2010-09-16 | Fujitsu Ltd | Device and method of removing solder |
| CN206519631U (en) * | 2016-12-30 | 2017-09-26 | 深圳铭达康科技有限公司 | Surface mount elements provision for disengagement |
| CN109637386A (en) * | 2019-01-29 | 2019-04-16 | 恩利克（浙江）智能装备有限公司 | A kind of prosthetic device and restorative procedure of LED display |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111515485A (en) * | 2020-05-18 | 2020-08-11 | 济南通呗灯具有限公司 | Maintenance erection equipment of LED lamp pearl |
| CN112338487A (en) * | 2020-11-05 | 2021-02-09 | 闻德亮 | Computer host circuit board fan bracket demolishs device |
| CN112355936A (en) * | 2020-11-12 | 2021-02-12 | 抚州盛宏电子有限公司 | Chip fixing device for electronic product maintenance |
| CN113319693A (en) * | 2021-06-15 | 2021-08-31 | 苏州双荣橡塑有限公司 | Polishing and cleaning equipment for handheld dust collector shell mold |
| CN113319693B (en) * | 2021-06-15 | 2022-03-08 | 苏州双荣橡塑有限公司 | Polishing and cleaning equipment for handheld dust collector shell mold |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110977082B (en) | 2020-09-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110977082B (en) | Semiconductor integrated chip dismounting device | |
| CN110239943B (en) | Cup printing machine equipment | |
| CN109921254B (en) | Equipment for welding and connecting conducting wires | |
| CN111817080A (en) | Socket device for mechanically assisting plug pulling and inserting | |
| CN110142560A (en) | A kind of solar panels circuit fixing device used for welding | |
| CN110625213A (en) | Semiconductor device extracting tool | |
| CN112719507A (en) | Electronic component separator for waste circuit boards | |
| CN110837063B (en) | Accurate positioner of wire fault point that opens circuit | |
| CN111015038A (en) | Aluminum alloy tubular product splicing apparatus | |
| CN110707476B (en) | Plug and socket of protection against electric shock | |
| CN111780499A (en) | Quick drying device of welding rod that wets | |
| CN110040512B (en) | Automatic positioning mechanism of multistation PCB board | |
| CN111037680A (en) | Device for fixing wire plane | |
| CN111761358A (en) | Diode pin polishing and bending device for circuit board welding equipment | |
| CN112193949A (en) | Automatic winding device of welding electrode copper wire with moisture-proof function | |
| CN220846520U (en) | Automatic sewing safety control device | |
| CN109244831A (en) | Gas lightning arrester | |
| CN216213272U (en) | Electronic component processing stabilizer blade crimping device | |
| CN217344195U (en) | Clamping frame for double-side welding of circuit board | |
| CN112396713B (en) | ETC card machine capable of automatically resetting smart card | |
| CN220068176U (en) | Adsorption mechanism of SMT chip mounter | |
| CN112396972B (en) | Display capable of automatically switching panels according to use scenes | |
| CN114012200B (en) | Soldering tin device convenient for taking and placing integrated circuit board | |
| CN111326337A (en) | Rapid Assembly equipment of transformer core | |
| CN219203633U (en) | Current connector |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221109 Address after: 528425 1st Floor, Building 1, No. 27, Jinyi South Road, Dongxing Community, Dongfeng Town, Zhongshan City, Guangdong Province Patentee after: Zhongshan Youdi Intelligent Technology Co.,Ltd. Address before: No.107, Fujiang Road, Wenxi Town, Qingtian County, Lishui City, Zhejiang Province Patentee before: Qingtian Linxin Semiconductor Technology Co.,Ltd. |