JPS63290681A - Melting and removing device - Google Patents

Abstract

PURPOSE:To enable removing of a flat pack, etc., mounted by a bonding material such as solder without damaging the same by combining a nozzle which ejects hot air and a pad which sucks and hangs an object to be removed by an air jet without contact. CONSTITUTION:Air flow A is ejected from the nozzle 1 or the pad 2 via a heating body 4 in a case 3 to the outside. A device for changing the air flow A changes the air flow A in the direction of the nozzle 1 or the pad 2 as a rod 14 mounted with an upper valve 9 and a lower valve 8 at both ends connected to a knob 10 via a bar 11 is vertically moved by the vertical movement of the knob 10. The nozzle 1 is brought near to the bonding material bonded to the object 13 to be removed and the bonding material is melted by the heated air flow A, by which the object 13 is removed from a substrate. The nozzle 1 is shut off when the air flow A is changed in the direction of the pad 2. The object 13 is then sucked and hung without contact by a drop of static pressure in the pad 2, by which the object is removed from the substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a melting remover for melting the solder of a flat pack packed with integrated circuits soldered to a board using solder and removing the flat pack from the board.

(Prior technology) A flat pack soldered to a circuit board is heated by heating the airflow sent by a blower or compressor, turning it into hot air to melt the solder stuck to the legs of the flat pack, and then using tweezers to melt the solder stuck to the legs of the flat pack. The flat pack is removed by grasping it or by melting the solder with the board tilted and allowing the flat pack to fall under its own weight.

[Problem to be solved by the invention] However, when removing the solder manually with tweezers after melting the solder,
In some cases, the distance between the legs of the flat pack is less than 1111W, and the legs may be broken or damaged with tweezers, making it difficult to investigate the cause of the defect in the removed flat pack.

Further, even when the solder is melted and the flat pack is allowed to fall under its own weight, the flat pack is damaged when it collides with the drop, making the cause of the failure unclear, and conventional methods have the disadvantage that it is difficult to identify the cause of the failure of the flat pack.

[Purpose of the invention]

The present invention has been made to solve these drawbacks, and the melting remover according to the present invention is capable of removing objects such as defective flat packs. A jetting device that blows out hot air to melt the adhered material with heated air, and a pad that suctions and suspends the object to be removed without contact using an air flow after the adhered material is melted. It is made up of.

[Operation of the Invention] In the present invention, the nozzle is brought to a position where the hot air jetted from the nozzle hits the legs of the object to be removed, which are fixed to the substrate by the fixing material, and the hot air is applied to the legs of the object to be removed. After melting the adhesive material, switch the air flow from the nozzle to the conduit that passes through the band, and then
The object to be removed is suctioned and suspended without contact by the air flow ejected from the board, and the object is removed from the board without causing any damage and transferred to an arbitrary location.

[Embodiments of the invention]

Embodiments of the present invention will be described in detail below with reference to the drawings.

- The first part shows an embodiment of the melting remover of the present invention, in which the case 3 has a pipe line 5 at its upper end leading to a blower 6 or a compressor (not shown), and the case 3 a heating machine 4 for heating the air flow passing through the upper end of the interior;
It has a nozzle 1 at its lower end that ejects airflow to the outside.

Further, a switching device is provided inside to switch the air flow A flowing through the case 3 toward the nozzle 1 direction or the pad 2 direction. This is because when the knob IO provided outside the case 3 moves up and down, a rod 14 connected to the knob 10 via a bar 11 and having a riser 9 and a lower life 8 attached to both ends moves up and down, causing the flow to flow inside the case 3. The air flow A can be switched to the nozzle 1 direction or the bad 2 direction.

The pad 2 is disposed between the two nozzles 1 so that it can be suctioned and suspended immediately after the adhesive material is dissolved.

In FIG. 1, the knob 10 is lowered so that the riser 9 is in close contact with the upper opening of the conduit 7 leading to the pad 2, and the airflow A
This prevents the inflow of

In FIG.
In close contact with the nozzle I, the airflow A is prevented from flowing into the pad 2, and at the same time, the riser 9 is raised, the opening of the conduit 7 is opened, and the airflow A is allowed to flow into the pad 2.

6 and 7 are diagrams showing the details of the pad 2. This pad 2 has a suction function by changing the static pressure of the ejector mechanism and the venturi mechanism, and a pressure type air cushion mechanism that performs the hovercraft function. The repulsion function suctions and suspends the object 13 to be removed without contact.

This pad 2 has an air inlet 15 in the upper part of a box-like body whose upper part is closed and whose lower part is open.
Furthermore, it is formed with a flange-like projecting portion 16 projecting outward from the open lower end.

Further, the box-like body is provided with a wire-like guide 17 to prevent the object 13 to be removed from moving in the horizontal direction.

The above-mentioned pad 2 is almost the same as the pad described in Tokushu No. 60-132650 and Tokushu No. 61-235333 filed by Konishin Kide.

FIGS. 5 and 6 show a knob h-&
An example using .

In the melting remover configured as described above, first, the nozzle 1 is brought close to the adhered material adhered to the object to be removed 13, and the upper end of the pipe line 7 leading to the band 2 is connected to the blower 6 or the compressor (not shown). The air flow A sent through the pipe line 5 is sent into the case 3, heated during the 1ffi period through the heater 4 disposed in the upper part of the case 3, and then discharged from the nozzle 1.
When it hits the fixing material, the fixing material is melted and the object to be removed 13 is separated from the substrate.

Next, raise the knob 10 that operates the upper and lower airflows 9 and 8 that switch the airflow A in the case 3, and raise the knob 10 that operates the upper and lower airflow A, and
When the upper end is released and the air iA is allowed to flow into the nozzle 2, and at the same time the lower end 8 rises, the air flow A flowing into the nozzle 1 is blocked.

The air fLA that has flowed into the pad 2 passes between the object 13 to be removed and the pad 2 and is discharged to the outside, but due to the decrease in static pressure that occurs during this process, the object 13 to be removed is suctioned and suspended without contact. and then completely removed from the board.

In the melting remover configured as described above, the nozzle l
and pad 2 are integrally formed, but it is also possible to arrange them separately and operate them separately.
can achieve the same purpose.

Further, the switching device for the air flow A may be provided externally or an automatic switching valve may be used, and the nozzle 1 and the pad 2 may be provided separately.

It goes without saying that the removable proboscis 13 can also be used not only for flat packs but also for items that are fixed with a heat-meltable adhesive.

[Effects of the Invention] As described above, according to the present invention, by combining a nozzle that blows out hot air and a pad that suctions and suspends the object to be removed without contact with an air jet, solder that melts due to heat can be removed. It is now possible to remove objects such as flat packs that are attached using adhesive materials such as TFL without damaging the TFL, which has the advantage of making it easier to investigate the cause of defects in flat packs and the like.

[Brief explanation of the drawing]

FIG. 1 is a side view of an embodiment of the invention, FIG. 2 is a plan view, FIGS. 4 and 5 are side views of other embodiments, and FIG. 6 is a side view of the pad. FIG. 7 shows a plan view thereof. 1... Nozzle 2... Pad 3... Case 4... Heater 7... Conduit 8... Lower life 9... Upper life 13...
Items to be removed Mi...Box-shaped body 15...Air inlet
16. Overhanging part S exit
Title of the invention Melting remover 3, Relationship to the amended case Patent applicant Hiroshi Akashi Address 2-7-12-4 Kitasakurazuka, Toyonaka-shi, Osaka Prefecture Address of agent Name 5 Date of amendment order July 1988 1st 6, Subject of amendment: “Brief explanation of drawings” column of the specification

Claims (4)

[Claims] (1) A melting remover equipped with an ejection device that heats and ejects airflow, and a pad that suctions and suspends the object to be removed using the airflow without contact. (2) A patent claim in which the pad suctions and suspends the object to be removed without contact, using a suction function based on static pressure changes of the ejector mechanism and the venturi mechanism, and a repulsion function using a pressure-type air cushion mechanism that functions as a hovercraft. The melting remover according to item (1). (3) The pad is a box-like body that is closed at the top and open at the bottom, with an air inlet on the top surface and a flange-shaped overhang that protrudes laterally at the open bottom end. The melting remover according to claim 1, which has a function of sucking and suspending the object to be removed without contact by supplying air through the air inlet. (4) The melting remover according to claim (1), wherein the object to be removed is a flat pack packed with integrated circuits.