CN110976344B - Integrated circuit packaging testing device capable of discharging from two sides - Google Patents
Integrated circuit packaging testing device capable of discharging from two sides Download PDFInfo
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- CN110976344B CN110976344B CN201911262910.6A CN201911262910A CN110976344B CN 110976344 B CN110976344 B CN 110976344B CN 201911262910 A CN201911262910 A CN 201911262910A CN 110976344 B CN110976344 B CN 110976344B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/363—Sorting apparatus characterised by the means used for distribution by means of air
- B07C5/365—Sorting apparatus characterised by the means used for distribution by means of air using a single separation means
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Abstract
The invention discloses an integrated circuit packaging test device with two-side discharging, wherein a rectangular groove-shaped feeding groove is formed on the upper end surface of a support, and a discharging transfer groove is formed on the lower end surface of the support; a pair of rectangular groove-shaped discharging grooves are formed on the upper side wall of the discharging transfer groove; the lower parts of the left side wall and the right side wall of the feeding groove are respectively provided with a discharging moving groove; the testing device comprises a U-shaped testing frame which is arranged on the feeding groove in a lifting mode and is provided with an opening facing downwards; a plurality of probes which are vertically arranged downwards are formed on the lower end face of the horizontal part of the test frame; a mounting support plate is elastically arranged between a pair of vertical parts which are symmetrical front and back of the test frame in a lifting way; the front end and the rear end of the lower side wall of the feeding groove are respectively provided with an avoidance groove for the vertical part of the test jig to vertically pass through; a discharging moving plate is arranged in the discharging moving groove in a left-right sliding manner; the end surfaces of the pair of discharging moving plates close to each other are provided with suction nozzles. The invention ensures that the operator only needs to place the integrated circuit package, thereby reducing the working strength and having high testing efficiency.
Description
Technical Field
The invention relates to the field of integrated circuit packaging test, in particular to an integrated circuit packaging test device with two side discharging.
Background
The semiconductor element is processed into a semiconductor chip package, such as a BGA package, through a series of packaging processes, and the processed semiconductor chip package is subjected to an electrical inspection process before being provided to a customer; in the electrical inspection process, the electrical characteristics of the semiconductor chip package are inspected using the test socket.
The pressurized package test socket in the prior art is composed of an upper cover, a side support, a lower chassis, a fixing screw, a fixing disc, a pressurizing disc and a socket pin (i.e. a probe). An operator firstly puts the ball-shaped pin into the socket from top to bottom, then manually operates the pressurizing disc to press down to make the ball-shaped pin of the package contact with a socket pin (namely a probe), and then after the test is finished, the package is taken out and manually classified according to the test result;
in the process, the operators put in, press, take out and classify the test paper, and the test paper is continuously circulated and operated in sequence, so that the test efficiency is low.
Disclosure of Invention
The invention aims to solve the technical problem of low testing efficiency in the existing equipment, and provides a two-side discharging integrated circuit packaging testing device.
The technical scheme for solving the technical problems is as follows: the integrated circuit packaging test device with two side discharging comprises a bracket and a test device; a rectangular groove-shaped feeding groove is formed in the upper end face of the support, and a discharging transfer groove is formed in the lower end face of the support; a pair of rectangular groove-shaped discharge grooves which are symmetrically arranged left and right are formed on the upper side wall of the discharge transfer groove; the pair of discharge chutes are positioned at the left end and the right end of the feed chute, and the upper side walls of the pair of discharge chutes are higher than the lower side walls of the feed chute; the lower parts of the left side wall and the right side wall of the feeding groove are respectively provided with a discharging moving groove; the discharging moving groove is communicated with the feeding groove and the pair of discharging grooves; the testing device comprises a U-shaped testing frame which is arranged on the feeding groove in a lifting mode and is provided with an opening facing downwards; a plurality of probes which are vertically arranged downwards are formed on the lower end face of the horizontal part of the test frame; a mounting support plate is elastically arranged between a pair of vertical parts which are symmetrical front and back of the test frame in a lifting way; the front end and the rear end of the lower side wall of the feeding groove are respectively provided with an avoidance groove for the vertical part of the test jig to vertically pass through; the distance between the lower side wall of the feeding groove and the lower side wall of the discharging moving groove is the same as the thickness of the mounting support plate; a discharging moving plate is arranged in the discharging moving groove in a left-right sliding manner; suction nozzles are arranged on the end surfaces of the pair of discharging moving plates, which are close to each other; the distance between the pair of vertical portions of the test rack is the same as the front-to-back width of the integrated circuit package; the width between the left side wall and the right side wall of the feed chute is the same as the left width and the right width of the integrated circuit package; the front side wall and the rear side wall of the discharging moving groove are respectively flush with the end faces close to the pair of vertical parts of the pair of test racks; the front and rear side walls of the discharging moving groove are flush with the front and rear side walls of the discharging groove; the upper side wall of the discharging moving groove is flush with the upper side wall of the discharging groove; the height of the discharging moving groove is larger than the thickness of the integrated circuit package; the left and right width of the discharge chute is equal to the left and right width of the integrated circuit package, and the front and back width of the discharge chute is equal to the front and back width of the integrated circuit package; the upper ends of the side walls far away from the discharge grooves are formed with accommodating grooves for inserting the discharge moving plates on the corresponding sides.
Preferably, the end surfaces of the pair of vertical parts of the test frame, which are close to each other, are respectively formed with an elastic lifting groove; the front end surface and the rear end surface of the mounting support plate are respectively provided with an ascending and descending guide block matched with the elastic ascending and descending groove; an elastic adjusting plate is arranged in the elastic lifting groove in a lifting way; a pressure spring is fixed on the lower end face of the elastic adjusting plate; the lower end of the pressure spring is fixed on the upper end surface of the ascending and descending guide block on the corresponding side.
Preferably, the upper end face of the test frame is screwed with an adjusting bolt; the lower end of the adjusting bolt is positioned in the elastic lifting groove on the corresponding side; the lower end of the adjusting bolt is pivoted on the upper end surface of the elastic adjusting plate.
Preferably, the lifting guide grooves are formed in the centers of the front side wall and the rear side wall of the feeding groove respectively; the lower end of the lifting guide groove extends to the side wall of the discharging transfer groove; a lifting screw rod is pivoted between the upper side wall and the lower side wall of the lifting guide groove; a lifting motor is fixed on the lower side wall of the lifting guide groove; the lower end of the lifting screw is fixed at the upper end of an output shaft of the lifting motor; the end surfaces of the pair of vertical parts of the test frame, which are far away from each other, are respectively formed with a lower lifting guide block matched with the lifting guide groove; the lower lifting guide block is screwed on the lifting screw rod on the corresponding side.
Preferably, the upper ends of the front and rear side walls of the discharge chute are respectively formed with left and right guide grooves in the left and right directions; the front end surface and the rear end surface of the discharging moving plate are respectively formed with a left guide block and a right guide block which are matched with the left guide groove and the right guide groove; a left driving groove and a right driving groove are formed on the upper side wall of the discharge groove; the side walls far away from the pair of left and right driving grooves are respectively aligned with the side walls far away from the pair of accommodating grooves; a left driving screw and a right driving screw are pivoted between the left side wall and the right side wall of the left driving groove and the right driving groove; the left and right driving blocks matched with the left and right driving grooves on the corresponding sides are respectively formed at the ends far away from the upper end surfaces of the pair of discharging moving plates; the left and right driving blocks are screwed on the left and right driving screws on the corresponding sides; a left driving motor and a right driving motor are respectively fixed on the side walls far away from the left driving groove and the right driving groove; the output shafts of the left and right driving motors are fixedly connected with the corresponding ends of the left and right driving screws.
Preferably, a qualified discharge conveyor belt and an unqualified conveyor belt are respectively fixed between the front side wall and the rear side wall of the discharge transfer groove; the qualified discharge conveyor belt and the unqualified conveyor belt are distributed in bilateral symmetry and are positioned under the pair of discharge chutes; the qualified discharge conveyor belt conveys the qualified discharge materials from right to left; the unqualified conveyor belt conveys from left to right.
The invention has the beneficial effects that: the operating personnel only need place the integrated circuit encapsulation, reduces working strength, and efficiency of software testing is high.
Drawings
Fig. 1 is a schematic structural view of a cross section of the present invention.
In the figure, 10, the stent; 100. a feed chute; 101. a discharge transfer groove; 102. a discharge chute; 103. a left and right driving groove; 104. a left guide groove and a right guide groove; 105. a receiving groove; 106. a discharging moving groove; 107. an avoidance groove; 108. a lifting guide groove; 20. a testing device; 21. a test jig; 210. an elastic lifting groove; 211. an elastic adjusting plate; 212. adjusting the bolt; 213. a pressure spring; 22. arranging a support plate; 23. a probe; 24. a lifting screw; 26. a discharging moving plate; 261. a left and right driving block; 27. a suction nozzle; 28. driving the screw rods left and right; 281. a left and right driving motor; 30. qualified discharge conveyor belts; 40. and (7) unqualified conveyor belts.
Detailed Description
As shown in FIG. 1, a two-side discharging integrated circuit package testing device comprises a support 10 and a testing device 20; a rectangular groove-shaped feeding groove 100 is formed on the upper end surface of the support 10, and a discharging transfer groove 101 is formed on the lower end surface; a pair of rectangular groove-shaped discharging grooves 102 which are symmetrically arranged at the left and the right are formed on the upper side wall of the discharging transfer groove 101; the pair of discharge chutes 102 are positioned at the left and right ends of the feed chute 100 and the upper side walls of the pair of discharge chutes 102 are higher than the lower side walls of the feed chute 100; the lower parts of the left and right side walls of the feeding chute 100 are respectively provided with a discharging moving chute 106; the discharge moving chute 106 is communicated with the feed chute 100 and the pair of discharge chutes 102; the testing device 20 comprises a U-shaped testing frame 21 which is arranged on the feeding groove 100 in a lifting way and is provided with a downward opening; a plurality of probes 23 which are vertically arranged downwards are formed on the lower end surface of the horizontal part of the test frame 21; a mounting support plate 22 is elastically arranged between a pair of vertical parts of the test frame 21 which are symmetrical in front and back in a lifting way; an avoidance groove 107 for the vertical part of the test jig 21 to vertically pass through is formed at the front end and the rear end of the lower side wall of the feed chute 100 respectively; the distance between the lower side wall of the feeding chute 100 and the lower side wall of the discharging moving chute 106 is the same as the thickness of the mounting support plate 22; the discharging moving plate 26 is arranged in the discharging moving groove 106 in a left-right sliding manner; suction nozzles 27 are arranged on the end surfaces of the pair of discharging moving plates 26 close to each other; the spacing between the pair of vertical portions of the test frame 21 is the same as the front-to-back width of the integrated circuit package; the width between the left and right sidewalls of the feed chute 100 is the same as the left and right width of the integrated circuit package; the front and rear side walls of the discharging moving groove 106 are respectively flush with the end surfaces close to the pair of vertical parts of the test jig 21; the front and rear side walls of the discharge chute 106 are flush with the front and rear side walls of the discharge chute 102; the upper side wall of the discharging moving groove 106 is flush with the upper side wall of the discharging groove 102; the height of the discharging moving groove 106 is larger than the thickness of the integrated circuit package; the left and right width of the discharge chute 102 is equal to the left and right width of the integrated circuit package and the front and back width of the discharge chute 102 is equal to the front and back width of the integrated circuit package; the upper ends of the side walls of the pair of discharging grooves 102, which are far away, are formed with receiving grooves 105 into which the discharging moving plates 26 on the corresponding sides are inserted.
As shown in fig. 1, the end surfaces of the test frame 21 near the pair of vertical portions are respectively formed with elastic lifting grooves 210; the front and rear end surfaces of the installation supporting plate 22 are respectively formed with an ascending and descending guide block matched with the elastic ascending and descending groove 210; an elastic adjusting plate 211 is arranged in the elastic lifting groove 210 in a lifting way; a pressure spring 213 is fixed on the lower end surface of the elastic adjusting plate 211; the lower end of the pressure spring 213 is fixed on the upper end surface of the ascending and descending guide block on the corresponding side.
As shown in fig. 1, an adjusting bolt 212 is screwed on the upper end face of the test frame 21; the lower end of the adjusting bolt 212 is positioned in the elastic lifting groove 210 on the corresponding side; the lower end of the adjusting bolt 212 is pivoted on the upper end surface of the elastic adjusting plate 211.
As shown in fig. 1, the lifting guide grooves 108 are formed at the centers of the front and rear side walls of the feed chute 100; the lower end of the lifting guide groove 108 extends to the side wall of the discharging transfer groove 101; a lifting screw 24 is pivoted between the upper side wall and the lower side wall of the lifting guide groove 108; a lifting motor is fixed on the lower side wall of the lifting guide groove 108; the lower end of the lifting screw 24 is fixed at the upper end of an output shaft of the lifting motor; the end surfaces of the pair of vertical parts of the test frame 21, which are far away from each other, are respectively formed with a lower lifting guide block matched with the lifting guide groove 108; the lower lifting guide block is screwed on the lifting screw rod 24 on the corresponding side.
As shown in fig. 1, left and right guide grooves 104 are formed in left and right directions at upper ends of front and rear side walls of the discharge chute 102, respectively; left and right guide blocks matched with the left and right guide grooves 104 are respectively formed on the front and rear end surfaces of the discharging moving plate 26; a left driving groove 103 and a right driving groove 103 are formed on the upper side wall of the discharge groove 102; the side walls of the pair of left and right driving grooves 103 which are distant from each other are aligned with the side walls of the pair of receiving grooves 105 which are distant from each other, respectively; a left driving screw 28 and a right driving screw 28 are pivoted between the left side wall and the right side wall of the left driving groove 103 and the right driving groove; the ends far away from the upper end surfaces of the pair of discharging moving plates 26 are respectively formed with a left driving block 261 and a right driving block 261 which are matched with the left driving groove 103 and the right driving groove 103 on the corresponding sides; the left and right driving blocks 261 are screwed on the left and right driving screws 28 on the respective sides; a left driving motor 281 and a right driving motor 281 are respectively fixed on the side walls far away from the pair of left and right driving grooves 103; the output shaft of the left and right drive motors 281 is fixedly connected to the respective ends of the left and right drive screws 28.
As shown in fig. 1, a qualified discharge conveyor belt 30 and an unqualified conveyor belt 40 are respectively fixed between the front and rear side walls of the discharge transfer groove 101; the qualified discharge conveyor belts 30 and the unqualified conveyor belts 40 are distributed in bilateral symmetry and are positioned right below the pair of discharge chutes 102; the qualified discharge conveyor belt 30 conveys the qualified discharge material from right to left; the defective conveyor 40 is conveyed from left to right.
The working principle of the integrated circuit packaging and testing device with two side discharging functions is as follows:
initial state: the testing jig 21 is positioned at the uppermost end, the mounting support plate 22 is positioned at the lowermost end relative to the testing jig 21, the testing jig 21 is positioned at the uppermost end, the probes 23 are positioned above the support 10, the mounting support plate 22 is positioned at the lower side of the upper end face of the support 10, the pair of discharging moving plates 26 are closest to each other, and the end faces, close to the pair of discharging moving plates 26, are flush with the left side wall and the right side wall of the feeding groove 100 respectively;
then an operator inserts the BGA package (the ball-shaped pin of the BGA package is upward) into the test jig 21 from the left side or the right side and places the BGA package on the mounting support plate 22, then the test jig 21 descends, the mounting support plate 22 firstly butts against the lower side wall of the feed chute 100, the mounting support plate 22 moves upwards in this way, finally the ball-shaped pin of the BGA package butts against the probe 23 on the horizontal part of the test jig 21, at this time, the test is carried out, after the test is completed, the test jig 21 moves upwards, the mounting support plate 22 can be remained at the bottom of the feed chute 100 due to the existence of the pressure spring 213, if the test is qualified, the suction nozzle 27 on the left side generates suction force, then the discharging moving plate 26 on the left side moves leftwards, and then the suction nozzle 27 loses suction force, so that the BGA package falls from the discharging chute 102 on the left side; if the test is not qualified, the right suction nozzle 27 generates suction force, then the right discharging moving plate 26 moves rightwards, and then the suction nozzle 27 loses suction force, so that the BGA package falls from the right discharging groove 102; finally, the supporting plate 22 is arranged to rise and return under the drive of the test frame 21;
in the process, the operator only carries out BGA packaging and puts in, so that the working strength of the operator is weakened, time is saved, and the testing efficiency is high.
The above description is only a preferred embodiment of the present invention, and for those skilled in the art, the present invention should not be limited by the description herein, since various changes and modifications can be made in the details of the embodiment and the application range according to the spirit of the present invention.
Claims (6)
1. The utility model provides an integrated circuit package testing arrangement of both sides ejection of compact which characterized in that: comprises a bracket (10) and a testing device (20); a rectangular groove-shaped feeding groove (100) is formed on the upper end surface of the support (10), and a discharging transfer groove (101) is formed on the lower end surface of the support; a pair of rectangular groove-shaped discharge grooves (102) which are symmetrically arranged at the left and the right are formed on the upper side wall of the discharge transfer groove (101); the pair of discharge chutes (102) are positioned at the left end and the right end of the feed chute (100), and the upper side walls of the pair of discharge chutes (102) are higher than the lower side walls of the feed chute (100); the lower parts of the left side wall and the right side wall of the feeding groove (100) are respectively provided with a discharging moving groove (106); the discharging moving groove (106) is communicated with the feeding groove (100) and the pair of discharging grooves (102); the testing device (20) comprises a U-shaped testing frame (21) which is arranged on the feeding groove (100) in a lifting way and is provided with an opening facing downwards; a plurality of probes (23) which are vertically arranged downwards are formed on the lower end surface of the horizontal part of the test frame (21); a mounting support plate (22) is elastically lifted and lowered between a pair of vertical parts which are symmetrical front and back of the test frame (21); an avoidance groove (107) for the vertical part of the test rack (21) to vertically pass through is formed at the front end and the rear end of the lower side wall of the feed groove (100) respectively; the distance between the lower side wall of the feeding groove (100) and the lower side wall of the discharging moving groove (106) is the same as the thickness of the mounting support plate (22); a discharging moving plate (26) is arranged in the discharging moving groove (106) in a left-right sliding manner; suction nozzles (27) are arranged on the end surfaces of the pair of discharging moving plates (26) close to each other; the distance between the pair of vertical parts of the test jig (21) is the same as the front-to-back width of the integrated circuit package; the width between the left and right side walls of the feed chute (100) is the same as the left and right width of the integrated circuit package; the front side wall and the rear side wall of the discharging moving groove (106) are respectively flush with the end surfaces close to the pair of vertical parts of the testing frame (21); the front and rear side walls of the discharging moving groove (106) are flush with the front and rear side walls of the discharging groove (102); the upper side wall of the discharging moving groove (106) is flush with the upper side wall of the discharging groove (102); the height of the discharging moving groove (106) is larger than the thickness of the integrated circuit package; the left and right width of the discharge chute (102) is equal to the left and right width of the integrated circuit package, and the front and back width of the discharge chute (102) is equal to the front and back width of the integrated circuit package; the upper ends of the far side walls of the discharge grooves (102) are provided with a receiving groove (105) for inserting the discharge moving plate (26) at the corresponding side.
2. The integrated circuit package testing device with two side discharge according to claim 1, wherein: elastic lifting grooves (210) are respectively formed on the end surfaces of the pair of vertical parts of the test frame (21) close to each other; the front end surface and the rear end surface of the mounting support plate (22) are respectively provided with an ascending and descending guide block matched with the elastic ascending and descending groove (210); an elastic adjusting plate (211) is arranged in the elastic lifting groove (210) in a lifting way; a pressure spring (213) is fixed on the lower end surface of the elastic adjusting plate (211); the lower end of the pressure spring (213) is fixed on the upper end surface of the ascending and descending guide block on the corresponding side.
3. The integrated circuit package testing device with two side discharge according to claim 2, wherein: the upper end surface of the test frame (21) is screwed with an adjusting bolt (212); the lower end of the adjusting bolt (212) is positioned in the elastic lifting groove (210) on the corresponding side; the lower end of the adjusting bolt (212) is pivoted on the upper end surface of the elastic adjusting plate (211).
4. The integrated circuit package testing device with two side discharge according to claim 1, wherein: lifting guide grooves (108) are respectively formed in the centers of the front side wall and the rear side wall of the feeding groove (100); the lower end of the lifting guide groove (108) extends to the side wall of the discharging transfer groove (101); a lifting screw (24) is pivoted between the upper side wall and the lower side wall of the lifting guide groove (108); a lifting motor is fixed on the lower side wall of the lifting guide groove (108); the lower end of the lifting screw (24) is fixed at the upper end of an output shaft of the lifting motor; the end surfaces of the pair of vertical parts of the test frame (21) far away are respectively formed with a lower lifting guide block matched with the lifting guide groove (108); the lower lifting guide block is screwed on the lifting screw rod (24) on the corresponding side.
5. The integrated circuit package testing device with two side discharge according to claim 1, wherein: left and right guide grooves (104) in the left and right directions are respectively formed at the upper ends of the front and rear side walls of the discharge groove (102); left and right guide blocks matched with the left and right guide grooves (104) are respectively formed on the front and rear end surfaces of the discharging moving plate (26); a left driving groove (103) and a right driving groove (103) are formed on the upper side wall of the discharge groove (102); the far side walls of the pair of left and right driving grooves (103) are respectively aligned with the far side walls of the pair of accommodating grooves (105); a left driving screw rod (28) is pivoted between the left side wall and the right side wall of the left driving groove (103); a left driving block (261) and a right driving block (261) which are matched with the left driving groove and the right driving groove (103) on the corresponding side are respectively formed at the ends, far away from the upper end surfaces, of the pair of discharging moving plates (26); the left and right driving blocks (261) are screwed on the left and right driving screws (28) on the corresponding sides; a left driving motor (281) and a right driving motor (281) are respectively fixed on the side walls far away from the left driving groove and the right driving groove (103); the output shaft of the left and right driving motors (281) is fixedly connected with the corresponding ends of the left and right driving screws (28).
6. The integrated circuit package testing device with two side discharge according to claim 1, wherein: a qualified discharge conveyor belt (30) and an unqualified conveyor belt (40) are respectively fixed between the front side wall and the rear side wall of the discharge transfer groove (101); the qualified discharge conveyor belts (30) and the unqualified conveyor belts (40) are distributed in bilateral symmetry and are positioned under the pair of discharge chutes (102); the qualified discharge conveyor belt (30) conveys the qualified discharge materials from right to left; the defective conveyor belt (40) is conveyed from left to right.
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| CN201911262910.6A CN110976344B (en) | 2019-12-11 | 2019-12-11 | Integrated circuit packaging testing device capable of discharging from two sides |
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| CN201911262910.6A CN110976344B (en) | 2019-12-11 | 2019-12-11 | Integrated circuit packaging testing device capable of discharging from two sides |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5510723A (en) * | 1994-03-01 | 1996-04-23 | Micron Custom Manufacturing, Inc. Usa | Diced semiconductor device handler |
| US20080169831A1 (en) * | 2006-06-09 | 2008-07-17 | Visera Technologies Company Limited | Batch-test system with a chip tray |
| CN104267351A (en) * | 2014-09-24 | 2015-01-07 | 驻马店市圣力源科技有限公司 | Automatic battery testing and sorting device |
| CN105334444A (en) * | 2015-11-14 | 2016-02-17 | 苏州光韵达光电科技有限公司 | Detection system of BGA chip |
| CN205720545U (en) * | 2016-03-08 | 2016-11-23 | 浙江乔兴建设集团湖州智能科技有限公司 | A kind of BGA package test jack |
| CN205868853U (en) * | 2016-08-02 | 2017-01-11 | 苏州高通机械科技有限公司 | Detection apparatus for screening product |
| CN109317424A (en) * | 2018-10-10 | 2019-02-12 | 唐兴云 | A kind of chip batch device for fast detecting |
| CN208944633U (en) * | 2018-09-27 | 2019-06-07 | 东莞市广荣电子制品有限公司 | A kind of sorting delivery track of battery |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100938172B1 (en) * | 2007-12-28 | 2010-01-21 | 미래산업 주식회사 | Handler, Method of Transferring Test-tray, and Method of Manufacturing Semiconductor |
| CN206854128U (en) * | 2017-06-13 | 2018-01-09 | 无锡隆基硅材料有限公司 | A kind of silicon chip separator feeding platform goes out chip architecture |
| CN209049748U (en) * | 2018-11-12 | 2019-07-02 | 王艳 | A kind of novel logistics sorting equipment |
| CN110391163A (en) * | 2019-04-09 | 2019-10-29 | 南宁聚信众信息技术咨询有限公司 | A kind of chip sorting equipment easy to operate for wafer working process |
| CN110052428B (en) * | 2019-04-29 | 2021-11-12 | 智科博芯(北京)科技有限公司 | Chip sorting equipment with dust removal function and suction nozzle convenient to replace |
-
2019
- 2019-12-11 CN CN201911262910.6A patent/CN110976344B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5510723A (en) * | 1994-03-01 | 1996-04-23 | Micron Custom Manufacturing, Inc. Usa | Diced semiconductor device handler |
| US20080169831A1 (en) * | 2006-06-09 | 2008-07-17 | Visera Technologies Company Limited | Batch-test system with a chip tray |
| CN104267351A (en) * | 2014-09-24 | 2015-01-07 | 驻马店市圣力源科技有限公司 | Automatic battery testing and sorting device |
| CN105334444A (en) * | 2015-11-14 | 2016-02-17 | 苏州光韵达光电科技有限公司 | Detection system of BGA chip |
| CN205720545U (en) * | 2016-03-08 | 2016-11-23 | 浙江乔兴建设集团湖州智能科技有限公司 | A kind of BGA package test jack |
| CN205868853U (en) * | 2016-08-02 | 2017-01-11 | 苏州高通机械科技有限公司 | Detection apparatus for screening product |
| CN208944633U (en) * | 2018-09-27 | 2019-06-07 | 东莞市广荣电子制品有限公司 | A kind of sorting delivery track of battery |
| CN109317424A (en) * | 2018-10-10 | 2019-02-12 | 唐兴云 | A kind of chip batch device for fast detecting |
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|---|---|
| CN110976344A (en) | 2020-04-10 |
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Effective date of registration: 20210810 Address after: Room 2108, building 5, No. 81, Xiangyin Road, Yangpu District, Shanghai 200082 Applicant after: Shanghai Chengsheng Industrial Co.,Ltd. Address before: Room 1303, building B, Kangxin garden, 569 Wensan Road, Xihu District, Hangzhou City, Zhejiang Province Applicant before: HANGZHOU EZSOFT TECHNOLOGY Co.,Ltd. |
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