CN110964447A - Packaging adhesive film for photovoltaic module - Google Patents
Packaging adhesive film for photovoltaic module Download PDFInfo
- Publication number
- CN110964447A CN110964447A CN201811155589.7A CN201811155589A CN110964447A CN 110964447 A CN110964447 A CN 110964447A CN 201811155589 A CN201811155589 A CN 201811155589A CN 110964447 A CN110964447 A CN 110964447A
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- Prior art keywords
- layer
- adhesive film
- resin
- thickness
- pid
- Prior art date
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- 239000002313 adhesive film Substances 0.000 title claims abstract description 48
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 10
- 239000011347 resin Substances 0.000 claims abstract description 32
- 229920005989 resin Polymers 0.000 claims abstract description 32
- 239000000155 melt Substances 0.000 claims abstract description 14
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 13
- 239000011521 glass Substances 0.000 claims abstract description 8
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 claims abstract description 3
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 claims abstract description 3
- 230000000694 effects Effects 0.000 claims abstract 4
- 239000008393 encapsulating agent Substances 0.000 claims description 7
- PUGOMSLRUSTQGV-UHFFFAOYSA-N 2,3-di(prop-2-enoyloxy)propyl prop-2-enoate Chemical compound C=CC(=O)OCC(OC(=O)C=C)COC(=O)C=C PUGOMSLRUSTQGV-UHFFFAOYSA-N 0.000 claims description 6
- 239000002202 Polyethylene glycol Substances 0.000 claims description 5
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical class C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 claims description 5
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 claims description 5
- 229920001223 polyethylene glycol Polymers 0.000 claims description 5
- GTELLNMUWNJXMQ-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical class OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCC(CO)(CO)CO GTELLNMUWNJXMQ-UHFFFAOYSA-N 0.000 claims description 4
- 229920005651 polypropylene glycol dimethacrylate Polymers 0.000 claims description 4
- 125000004386 diacrylate group Chemical group 0.000 claims description 3
- KNSXNCFKSZZHEA-UHFFFAOYSA-N [3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical class C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C KNSXNCFKSZZHEA-UHFFFAOYSA-N 0.000 claims description 2
- 230000004069 differentiation Effects 0.000 claims description 2
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Chemical compound CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 claims description 2
- 230000010354 integration Effects 0.000 claims description 2
- -1 acrylic ester Chemical class 0.000 claims 1
- 239000000654 additive Substances 0.000 claims 1
- 230000000996 additive effect Effects 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 abstract description 2
- 239000012528 membrane Substances 0.000 description 6
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- 239000002671 adjuvant Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- SFMJNHNUOVADRW-UHFFFAOYSA-N n-[5-[9-[4-(methanesulfonamido)phenyl]-2-oxobenzo[h][1,6]naphthyridin-1-yl]-2-methylphenyl]prop-2-enamide Chemical compound C1=C(NC(=O)C=C)C(C)=CC=C1N1C(=O)C=CC2=C1C1=CC(C=3C=CC(NS(C)(=O)=O)=CC=3)=CC=C1N=C2 SFMJNHNUOVADRW-UHFFFAOYSA-N 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C09J123/0853—Vinylacetate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/101—Esters; Ether-esters of monocarboxylic acids
- C08K5/103—Esters; Ether-esters of monocarboxylic acids with polyalcohols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
Abstract
The invention discloses a packaging adhesive film for a photovoltaic module. It includes an outer layer having high adhesion reliability in contact with glass or a back plate, an inner layer having a low stress effect on a cell, and an intermediate layer having a high PID resistance effect. The whole thickness of the adhesive film is 200-1000 microns, the thickness of the middle layer is 160-750 microns, and the specific value is related to the whole thickness of the adhesive film. The inner layer and the outer layer of the adhesive film are made of EVA resin, the melt flow rate of the resin is 2-16 g/min, and the VA content is 26-32%. The middle layer is POE resin, and the flow rate of the resin melt is 5-25 g/min. And anti-PID auxiliary agents are added in the middle layer and the inner and outer layers, and the auxiliary agents are ethoxy-containing auxiliary agents
Or containing propoxy groups
The addition amount of each layer of the acrylate is 0.3 to 2.1 percent.
Description
Technical Field
The invention relates to a packaging adhesive film for a photovoltaic module, in particular to a multilayer co-extrusion packaging adhesive film capable of improving the PID resistance and outdoor long-term reliability of the photovoltaic module.
Background
The POE packaging material is the best choice for replacing EVA, but the POE has high cost, small friction coefficient, low crosslinking rate and easy occurrence of thermal creep, so that the assembly has the disadvantages of increased cost, reduced capacity and reduced production yield.
Disclosure of Invention
The invention aims to provide a multilayer co-extruded packaging adhesive film for a photovoltaic module, which simultaneously meets the requirements of good bonding reliability of a glass or back plate surface of the photovoltaic module, low stress action of a battery side and PID (proportion integration differentiation) resistance of the photovoltaic module.
The technical scheme adopted by the invention is as follows:
a packaging adhesive film for a photovoltaic module is composed of an outer layer having high adhesion reliability in contact with glass or a back sheet, an inner layer having a low stress action on a cell sheet, and an intermediate layer having a high PID resistance action. The overall thickness of the adhesive film is 200-1000 microns, the thickness of the middle layer is 160-750 microns, and the specific value is related to the overall thickness of the packaging adhesive film.
The inner layer and the outer layer of the adhesive film are made of EVA resin, the melt flow rate of the resin is 2-16 g/min, and the VA content is 26-32%. The middle layer is POE resin with the melt flow rateThe ratio is 5 to 25 g/min. And anti-PID auxiliary agents are added in the middle layer and the inner and outer layers, and the auxiliary agents are ethoxy-containing auxiliary agents
Or containing propoxy groups
The addition amount of each layer of the acrylate is 0.3 to 2.1 percent, calculated by 100 parts of base resin. The PID auxiliary agent is one or a mixture of several of the following components: ethoxylated pentaerythritol triacrylate, propoxylated neopentyl glycol diacrylate, ethoxylated trimethylolpropane triacrylate, ethoxylated pentaerythritol tetraacrylate, propoxylated glycerol triacrylate, polyethylene glycol dimethacrylate, polyethylene glycol diacrylate, polypropylene glycol dimethacrylate.
Drawings
Fig. 1 is a schematic structural diagram of a photovoltaic module in the prior art.
Fig. 2 is a schematic structural view of the encapsulant film for photovoltaic module of the present invention.
Reference numerals
1 outer layer
2 inner layer
3 intermediate layer
4 glass
5. 7 EVA layer
6 Battery sheet layer
8 glass or back plate
Detailed Description
In order to clearly understand the technical contents of the present invention, the following examples are given in detail.
Example 1:
this embodiment provides the glued membrane as figure 2 structure, the glued membrane structure is the three-layer, including skin 1, inlayer 2, intermediate level 3, and the ectonexine is the EVA resin, and the intermediate level is POE resin. The whole thickness of the adhesive film is 500 micrometers, the thickness of the middle layer is 250 micrometers, and the thicknesses of the EVA of the inner layer and the EVA of the outer layer are 125 micrometers. The melt flow rate of the POE resin is 15g/min, the melt flow rate of the EVA resin is 5g/min, and the VA content is 28%. 0.9 part by mass of ethoxylated pentaerythritol triacrylate was added to each layer.
Example 2:
the adhesive film provided by the embodiment is basically the same as the adhesive film in the embodiment 1, except that: the melt flow rate of the EVA resin of the inner layer and the outer layer is 2g/min, the VA content is 26%, and the melt flow rate of the POE resin of the middle layer is 5 g/min. 2.1 parts by mass of propoxylated neopentyl glycol diacrylate were added to each layer.
Example 3:
the adhesive film provided by the embodiment is basically the same as the adhesive film in the embodiment 1, except that: the melt flow rate of the EVA resin of the inner layer and the outer layer is 16g/min, the VA content is 32 percent, and the melt flow rate of the POE resin of the middle layer is 25 g/min. 1.1 parts by mass of ethoxylated trimethylolpropane triacrylate was added to each layer.
Example 4:
the adhesive film provided by the embodiment is basically the same as the adhesive film in the embodiment 1, except that: the melt flow rate of the EVA resin of the inner layer and the melt flow rate of the EVA resin of the outer layer are 2g/min, and the melt flow rate of the POE resin of the middle layer is 25 g/min. 0.3 part by mass of propoxylated glycerol triacrylate was added to each layer.
Example 5:
the adhesive film provided by the embodiment is basically the same as the adhesive film in the embodiment 1, except that: the whole thickness of the adhesive film is 200 microns, the thickness of POE is 160 microns, and the thickness of the inner and outer EVA resin layers is 20 microns. 0.7 parts by mass of polypropylene glycol dimethacrylate was added to each layer.
Example 6:
the adhesive film provided by the embodiment is basically the same as the adhesive film in the embodiment 1, except that: the whole thickness of the adhesive film is 1000 microns, the thickness of POE is 750 microns, and the thickness of the inner and outer EVA resin layers is 125 microns. 0.6 part by mass of propoxylated glycerol triacrylate was added to each layer.
Example 7:
the adhesive film provided by the embodiment is basically the same as the adhesive film in the embodiment 1, except that: the whole thickness of glued membrane is 1000 microns, and POE's thickness is 500 microns, and the thickness of interior outer layer EVA resin is 250 microns. 1.5 parts by mass of polypropylene glycol dimethacrylate was added to each layer.
Example 8:
the adhesive film provided by the embodiment is basically the same as the adhesive film in the embodiment 1, except that: the whole thickness of the adhesive film is 1000 microns, the thickness of POE is 250 microns, and the thickness of the inner and outer EVA resin layers is 375 microns. 1.9 parts by mass of polyethylene glycol diacrylate was added to each layer.
Example 9:
the adhesive film provided by the embodiment is basically the same as the adhesive film in the embodiment 1, except that: the whole thickness of glued membrane is 500 microns, and the thickness of POE is 150 microns, and the thickness of inlayer EVA resin is 250 microns, and the thickness of skin EVA resin is 100 microns. 0.5 part by mass of ethoxylated pentaerythritol triacrylate and 0.7 part by mass of propoxylated glycerol triacrylate were added to each layer.
Example 10:
the adhesive film provided by the embodiment is basically the same as the adhesive film in the embodiment 1, except that: the whole thickness of glued membrane is 500 microns, and the thickness of POE is 200 microns, and the thickness of interior outer layer EVA resin is 150 microns.
Example 11:
the adhesive film provided by the embodiment is basically the same as the adhesive film in the embodiment 1, except that: the whole thickness of glued membrane is 500 microns, and the thickness of POE is 350 microns, and the thickness of interior outer layer EVA resin is 75 microns.
Example 12:
the adhesive film provided by the embodiment is basically the same as the adhesive film in the embodiment 1, except that: 0.3 part by mass of propoxylated glycerol-containing triacrylate was added to each layer.
Example 13:
the adhesive film provided by the embodiment is basically the same as the adhesive film in the embodiment 1, except that: to each layer was added 1.1 parts by mass of a mixed anti-PID adjuvant comprising propoxylated neopentyl glycol diacrylate and 0.5 parts of ethoxylated trimethylolpropane triacrylate.
Example 14:
the adhesive film provided by the embodiment is basically the same as the adhesive film in the embodiment 1, except that: the intermediate layer anti-PID auxiliary agent is 1.1 part by mass of propoxylated glycerol triacrylate, the inner layer anti-PID auxiliary agent is 2.1 parts by mass of propoxylated neopentyl glycol diacrylate, and the outer layer anti-PID auxiliary agent is 0.3 part by mass of ethoxylated pentaerythritol triacrylate.
The photovoltaic module packaging adhesive film described in the above embodiment was tested, and the data thereof is as shown in table 1:
table 1: example 1-14 encapsulant film Performance data for photovoltaic modules
The adhesive film of the above example was cut to the size of a solar photovoltaic module, and laminated in the structural order of glass/adhesive film of this example/N-type cell/adhesive film of this example/glass, and evacuated and laminated at 145 ℃ for 5 minutes and 15 minutes. The power attenuation of the obtained component in PID experiment (85% humidity and 85 deg.C, -1500V, 96hr) is less than 3%. Under the same condition, the power attenuation of the components of which the upper layer and the lower layer both use the common EVA films is more than 10 percent.
The foregoing is only a preferred embodiment of the present invention, and is not intended to limit the scope of the invention, which is defined in the claims of the present application, and any other technical entity or method implemented by another person is encompassed by the claims, if it is identical to or equivalent to the definition of the claims of the present application.
Claims (4)
1. The packaging adhesive film for the photovoltaic module is characterized by comprising an outer layer, an inner layer and an intermediate layer, wherein the outer layer is in contact with glass or a back plate and has high bonding reliability, the inner layer has a low stress effect on a battery piece, and the intermediate layer has a high PID (proportion integration differentiation) resistance effect;
the inner layer and the outer layer are made of EVA resin, the melt flow rate of the EVA resin is 2-16 g/min, the VA content is 26% -32%, the middle layer is made of POE resin, and the melt flow rate of the POE resin is 5-25 g/min;
the anti-PID auxiliary agent is added into the inner layer, the outer layer and the middle layer, the anti-PID auxiliary agent is acrylic ester containing ethoxy or propoxy, and the addition amounts of the anti-PID auxiliary agent in the inner layer, the outer layer and the middle layer are respectively 0.3% -2.1%, calculated by 100 parts of base resin.
2. The encapsulant film as claimed in claim 1, wherein the thickness of the encapsulant film is 200-1000 μm.
3. The encapsulant film as claimed in claim 1, wherein the thickness of the intermediate layer is 160-750 μm and matches the thickness of the encapsulant film.
4. The encapsulant film as claimed in claim 1, wherein the anti-PID additive is one or more selected from ethoxylated pentaerythritol triacrylate, propoxylated neopentyl glycol diacrylate, ethoxylated trimethylolpropane triacrylate, ethoxylated pentaerythritol tetraacrylate, propoxylated glycerol triacrylate, polyethylene glycol dimethacrylate, polyethylene glycol diacrylate or polypropylene glycol dimethacrylate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811155589.7A CN110964447A (en) | 2018-09-30 | 2018-09-30 | Packaging adhesive film for photovoltaic module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811155589.7A CN110964447A (en) | 2018-09-30 | 2018-09-30 | Packaging adhesive film for photovoltaic module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110964447A true CN110964447A (en) | 2020-04-07 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811155589.7A Pending CN110964447A (en) | 2018-09-30 | 2018-09-30 | Packaging adhesive film for photovoltaic module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111793442A (en) * | 2020-07-17 | 2020-10-20 | 常州斯威克光伏新材料有限公司 | Three-layer co-extrusion composite adhesive film for packaging photovoltaic module and preparation method thereof |
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|---|---|---|---|---|
| KR20140090340A (en) * | 2013-01-07 | 2014-07-17 | 에스케이씨 주식회사 | A solar cell sealing sheet and a solar cell module using thereof |
| KR20150050743A (en) * | 2013-10-31 | 2015-05-11 | 도레이첨단소재 주식회사 | Encapsulation sheet for a solarcell using a barrier layer and preparing process thereof |
| CN106221592A (en) * | 2016-07-26 | 2016-12-14 | 苏州爱康薄膜新材料有限公司 | Anti-PID packaging adhesive film and preparation method thereof |
| CN107396640A (en) * | 2015-04-24 | 2017-11-24 | 三井化学东赛璐株式会社 | Diaphragm seal and solar module |
| CN208933261U (en) * | 2018-09-30 | 2019-06-04 | 上海海优威新材料股份有限公司 | Photovoltaic module packaging adhesive film |
-
2018
- 2018-09-30 CN CN201811155589.7A patent/CN110964447A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20140090340A (en) * | 2013-01-07 | 2014-07-17 | 에스케이씨 주식회사 | A solar cell sealing sheet and a solar cell module using thereof |
| KR20150050743A (en) * | 2013-10-31 | 2015-05-11 | 도레이첨단소재 주식회사 | Encapsulation sheet for a solarcell using a barrier layer and preparing process thereof |
| CN107396640A (en) * | 2015-04-24 | 2017-11-24 | 三井化学东赛璐株式会社 | Diaphragm seal and solar module |
| CN106221592A (en) * | 2016-07-26 | 2016-12-14 | 苏州爱康薄膜新材料有限公司 | Anti-PID packaging adhesive film and preparation method thereof |
| CN208933261U (en) * | 2018-09-30 | 2019-06-04 | 上海海优威新材料股份有限公司 | Photovoltaic module packaging adhesive film |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111793442A (en) * | 2020-07-17 | 2020-10-20 | 常州斯威克光伏新材料有限公司 | Three-layer co-extrusion composite adhesive film for packaging photovoltaic module and preparation method thereof |
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