CN110959316B - Connection film, method for manufacturing shielded printed wiring board, and shielded printed wiring board - Google Patents
Connection film, method for manufacturing shielded printed wiring board, and shielded printed wiring board Download PDFInfo
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- CN110959316B CN110959316B CN201880051684.4A CN201880051684A CN110959316B CN 110959316 B CN110959316 B CN 110959316B CN 201880051684 A CN201880051684 A CN 201880051684A CN 110959316 B CN110959316 B CN 110959316B
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention relates to a connecting film, a method for manufacturing a shielding printed wiring board and a shielding printed wiring board, the connection film of the present invention is a connection film for electrically connecting a ground circuit and a shield layer in a shielded printed wiring board, the shielded printed wiring board comprises a base film including a base film, a printed circuit including the ground circuit and disposed on the base film, and a cover film covering the printed circuit, and a shielding film including an insulating adhesive layer, the shielding layer laminated on the insulating adhesive layer, and an insulating protective layer laminated on the shielding layer, wherein the insulating adhesive layer is bonded to the cover film, the connecting film contains a resin composition and a conductive filler, the connecting film contains a flat portion and a convex portion formed of the conductive filler, and the diameter of the conductive filler is larger than the thickness of the flat portion.
Description
Technical Field
The invention relates to a connecting film, a method for manufacturing a shielded printed wiring board, and a shielded printed wiring board.
Background
A conventional technique is known in which an electromagnetic wave shielding film is attached to a printed wiring board such as a flexible printed wiring board (FPC) to shield an electromagnetic wave from the outside.
Such a shield printed wiring board has been proposed, for example, as follows.
Fig. 16 is a schematic cross-sectional view of an example of a conventional shield printed wiring board.
That is, as shown in fig. 16, there is proposed a shield printed wiring board 501 (patent document 1 and patent document 2) in which the shield printed wiring board 501 includes: a base film 550 including a base film 551, a printed circuit 552 including a ground circuit 552a disposed on the base film 551, and a cover film 553 covering the printed circuit 552; a shield film 560 including an adhesive layer 561 including a conductive filler 530, a shield layer 562 laminated on the adhesive layer 561, and an insulating protective layer 563 laminated on the shield layer 562; the cover film 553 has an opening formed directly above the ground circuit 552a, and the shielding film 560 is attached to the base film 550 such that the adhesive layer 561 is connected to the ground circuit 552a through the opening.
When the adhesive layer of the shielding film includes the conductive filler, the relative dielectric constant of the entire adhesive layer is high.
Therefore, when such an adhesive layer containing a conductive filler is disposed in the vicinity of a printed circuit, there is also a problem that transmission loss of a signal transmitted through the printed circuit is large.
In particular, with the recent increase in signal transmission speed, the frequency of an electric signal transmitted to a printed circuit has increased, and this problem has become more significant.
In order to solve such a problem, patent document 3 proposes a printed wiring board in which a conductive filler is contained only in the opening portion of a cover film located immediately above a ground circuit in a bonding layer of a shield film.
[ Prior art documents ]
[ patent document ]
[ patent document 1 ] Japanese patent laid-open No. 2000-269632;
[ patent document 2 ] Japanese patent laid-open No. 2010-177472;
[ patent document 3 ] Japanese patent laid-open No. 2013-26322.
Disclosure of Invention
[ problem to be solved by the invention ]
In the printed wiring board disclosed in patent document 3, although the problem of the decrease in the transfer characteristics and the like can be solved, the position of the opening of the cover film and the position of the adhesive layer containing the conductive filler need to be determined in advance, and the degree of freedom in design is limited.
In addition, in the actual production of a product using a shield printed wiring board, there are various design constraints, and it is not realistic to determine the position of the opening of the cover film and the position of the adhesive layer containing the conductive filler in advance.
The present invention has been made to solve the above problems, and an object of the present invention is to provide a connection film for disposing a conductive filler only between a ground circuit of a base film and a shield layer of a shield film in manufacturing a shielded printed wiring board, a method for manufacturing a shielded printed wiring board using the connection film, and a shielded printed wiring board using the connection film.
[ MEANS FOR SOLVING THE PROBLEMS ] A method for producing a semiconductor device
The connection film of the present invention is a connection film for electrically connecting the ground circuit and the shield layer in a shielded printed wiring board including a base film, a printed circuit including a ground circuit disposed on the base film, and a base film covering a cover film of the printed circuit, and a shield film including an insulating adhesive layer, a shield layer laminated on the insulating adhesive layer, and an insulating protective layer laminated on the shield layer, wherein the insulating adhesive layer is bonded to the cover film, the connection film includes a resin composition and a conductive filler, the connection film includes a flat portion and a convex portion formed of the conductive filler, and a diameter of the conductive filler is larger than a thickness of the flat portion.
The connection film of the present invention is used for manufacturing a shielded printed wiring board by bonding a shielding film to a base film.
In this case, the connection film of the present invention is first disposed above the ground circuit of the base film. Then, the shielding film is disposed, and the insulating adhesive layer of the shielding film is bonded to the cover film of the base film and the connecting film, thereby producing a base film-shielding film laminate.
Then, the base film-shielding film laminate is pressed and the conductive filler of the connection film is brought into contact with the ground circuit of the base film and the shielding layer of the shielding film.
By manufacturing the shield printed wiring board in this way, it is possible to easily dispose only the conductive filler between the ground circuit of the base film and the shield layer of the shield film.
By disposing only the conductive filler between the ground circuit of the base film and the shielding layer of the shielding film, it is possible to prevent the transmission characteristics from being lowered in the manufactured shielded printed wiring board.
In the method of manufacturing a shielded printed wiring board, the connecting film may be disposed at an arbitrary position above the ground circuit. Therefore, the degree of freedom in designing the shield printed wiring board and the degree of freedom in designing a product using the shield printed wiring board are hardly impaired.
In the film for connection of the present invention, the diameter of the conductive filler is larger than the thickness of the flat portion.
Therefore, the conductive filler is not buried in the resin composition.
When the conductive filler is buried in the resin composition, the conductive filler is difficult to contact with the ground circuit of the base film and the shielding layer of the shielding film in the production of the shielded printed wiring board. Therefore, the electrical connection between the ground circuit and the shield layer is easily broken.
However, as described above, in the connection film of the present invention, the conductive filler is not buried in the resin composition. Therefore, in the shielded printed wiring board using the connection film of the present invention, it is difficult to cut off the electrical connection between the ground circuit and the shield layer.
In the connection film of the present invention, it is preferable that: the height of the convex part is larger than the thickness of the insulating adhesive layer of the shielding film in the printed wiring board on which the connecting film is arranged.
When the height of the convex portion of the connection film is larger than the thickness of the insulating adhesive layer of the printed wiring board on which the connection film is disposed, the conductive filler easily penetrates through the insulating adhesive layer when the base film, the connection film, and the shielding film are disposed in this order and pressed. Therefore, the conductive filler and the shield layer can be sufficiently electrically connected.
In the film for connection of the present invention, the thickness of the flat portion is preferably 1 to 100 μm.
If the thickness of the flat portion is less than 1 μm, the strength of the connection film is weak and the connection film is easily broken.
When the thickness of the flat portion exceeds 100 μm, the connecting film is too thick, and therefore it is difficult to bring the base film and the shielding film into close contact with each other in the production of a shielded printed wiring board.
In the film for connection of the present invention, the diameter of the conductive filler is preferably 2 to 200 μm.
When the diameter of the conductive filler is less than 2 μm, the conductive filler is easily separated from the ground circuit and/or the shield layer. Therefore, the electrical contact between the ground circuit and the shield layer is easily cut.
When the diameter of the conductive filler exceeds 200 μm, the conductive filler becomes too large, and it becomes difficult to bring the base film and the shielding film into close contact with each other in the production of the shielded printed wiring board.
In the film for connection of the present invention, it is preferable that the conductive filler contains at least 1 kind selected from the group consisting of copper powder, silver powder, nickel powder, silver-coated copper powder, gold-coated copper powder, silver-coated nickel powder, and gold-coated nickel powder.
These conductive fillers have good conductivity and are therefore suitable for electrically connecting a ground circuit and a shield layer.
In the connection film of the present invention, it is preferable that the resin composition contains at least 1 selected from the group consisting of thermosetting resins and thermoplastic resins.
In the connecting film of the present invention, both a thermosetting resin and a thermoplastic resin can be used as the resin composition.
The manufacturing method of the shielded printed wiring board of the present invention is a method of manufacturing a printed wiring board including: a base film including a base film, a printed circuit including a ground circuit disposed on the base film, and a cover film covering the printed circuit; a shielding film including an insulating adhesive layer, a shielding layer laminated on the insulating adhesive layer, and an insulating protective layer laminated on the shielding layer; the manufacturing method of the shielding printed circuit board comprises the following steps: a connection film disposing step of preparing the base film and disposing the connection film of the present invention above a ground circuit of the base film; a base film-shielding film laminate production step of preparing the shielding film, disposing the shielding film, and joining an insulating adhesive layer of the shielding film to the cover film of the base film and the connection film to produce a base film-shielding film laminate; and a pressing step of pressing the base film-shielding film laminate so that the conductive filler of the connection film is in contact with the ground circuit and the shielding layer.
In the method for manufacturing a shielded printed wiring board of the present invention, a shielding film is manufactured using the above-described film for connection of the present invention.
Therefore, the conductive filler can be easily disposed only between the ground circuit of the base film and the shielding layer of the shielding film.
In this way, the transmission characteristics can be prevented from being lowered in the manufactured shielded printed wiring board.
The manufacturing method of the shielding printed circuit board can adopt the following technical scheme: in the connecting film disposing step, the connecting film is disposed as follows: the ground circuit of the base film is exposed, and the convex portion of the connecting film is brought into contact with the ground circuit.
By disposing the connecting film in this manner, the conductive filler and the ground circuit can be reliably brought into contact with each other.
The manufacturing method of the shielding printed circuit board can adopt the following technical scheme: in the pressing step, the base film-shielding film laminate is pressed so that the conductive filler of the connection film penetrates the insulating adhesive layer of the shielding film and comes into contact with the shielding layer of the shielding film.
By performing the pressing as described above, the conductive filler and the shielding layer can be brought into contact with each other regardless of the position where the connection film is disposed.
The shielded printed wiring board of the present invention comprises: a base film including a base film, a printed circuit including a ground circuit disposed on the base film, and a cover film covering the printed circuit; a shielding film including an insulating adhesive layer, a shielding layer laminated on the insulating adhesive layer, and an insulating protective layer laminated on the shielding layer, wherein the insulating adhesive layer is bonded to the cover film, the connection film of the present invention is further disposed between the ground circuit and the shielding layer, and the conductive filler of the connection film is in contact with the ground circuit and the shielding layer to electrically connect the ground circuit and the shielding layer.
The connection film of the present invention is used for a shielded printed wiring board of the present invention. Therefore, the ground circuit and the shield layer can be easily electrically connected when the shield printed wiring board is manufactured.
In the shielded printed wiring board according to the present invention, it is preferable that the connection film is disposed only between the ground circuit and the shielding layer.
When the connection film is disposed only between the ground circuit and the shield layer, the transfer characteristic can be prevented from being lowered.
[ Effect of the invention ]
By manufacturing a shielded printed wiring board using the connection film of the present invention, the conductive filler can be easily disposed only between the ground circuit of the base film and the shielding layer of the shielding film.
Therefore, the transfer characteristic can be prevented from being lowered in the manufactured shield printed wiring board.
In addition, when a shielded printed wiring board is manufactured using the connection film of the present invention, the connection film of the present invention can be disposed at an arbitrary position above a ground circuit, and thus the degree of freedom in designing the shielded printed wiring board and the degree of freedom in designing a product using the shielded printed wiring board are hardly impaired.
Drawings
Fig. 1 is a schematic cross-sectional view of an example of a connection film according to a first embodiment of the present invention;
fig. 2 is a schematic view of a connecting film arranging step in a step of manufacturing a shield printed wiring board using the connecting film according to the present invention;
fig. 3 (a) and (b) are schematic diagrams of a base film-shielding film laminate manufacturing process of a process of manufacturing a shielding printed wiring board using the connecting film of the present invention;
fig. 4 (a) and (b) are schematic views of a pressing process of a process of manufacturing a shielded printed wiring board using the connecting film of the present invention;
fig. 5 is a schematic view of a connection film arrangement process of a process of manufacturing a shield printed wiring board using the connection film of the present invention;
fig. 6 (a) and (b) are schematic diagrams of a base film-shielding film laminate manufacturing process of a process of manufacturing a shielding printed wiring board using the connecting film of the present invention;
fig. 7 (a) and (b) are schematic views of a pressing process of a process of manufacturing a shielded printed wiring board using the connecting film of the present invention;
FIG. 8 is a schematic cross-sectional view of an example of a connecting film according to a second embodiment of the present invention;
fig. 9 is a schematic view of a connection film arrangement process of a process of manufacturing a shield printed wiring board using the connection film of the present invention;
fig. 10 (a) and (b) are schematic diagrams of a base film-shielding film laminate manufacturing process in a process of manufacturing a shielding printed wiring board using the connecting film of the present invention;
fig. 11 (a) and (b) are schematic views showing a pressing process of a process for manufacturing a shield printed wiring board using the connecting film of the present invention;
fig. 12 is a schematic cross-sectional view of an example of a connection film according to a third embodiment of the present invention;
fig. 13 is a schematic view of a connection film arrangement process of a process of manufacturing a shield printed wiring board using the connection film of the present invention;
fig. 14 (a) and (b) are schematic diagrams of a base film-shielding film laminate manufacturing process in a process of manufacturing a shielding printed wiring board using the connecting film of the present invention;
fig. 15 (a) to (c) are schematic views of a pressing process of a process of manufacturing a shielded printed wiring board using the connecting film of the present invention;
fig. 16 is a schematic cross-sectional view of an example of a conventional shielded printed wiring board.
Detailed Description
The connection film of the present invention will be specifically described below. However, the present invention is not limited to the following embodiments, and can be applied with appropriate modifications within a range not changing the gist of the present invention.
The connection film of the present invention is a connection film for electrically connecting the ground circuit and the shield layer in a shielded printed wiring board including a base film, a printed circuit including a ground circuit disposed on the base film, and a base film covering a cover film of the printed circuit, and a shield film including an insulating adhesive layer, a shield layer laminated on the insulating adhesive layer, and an insulating protective layer laminated on the shield layer, wherein the insulating adhesive layer is bonded to the cover film, the connection film includes a resin composition and a conductive filler, the connection film includes a flat portion and a convex portion formed of the conductive filler, and a diameter of the conductive filler is larger than a thickness of the flat portion.
(first embodiment)
The connection film according to the first embodiment of the present invention will be described in detail below with reference to the drawings.
Fig. 1 is a schematic cross-sectional view of an example of a connection film according to a first embodiment of the present invention.
As shown in fig. 1, a connection film 10, which is an example of a connection film of the present invention, includes a resin composition 20 and a conductive filler 30.
The connecting film 10 comprises a flat part 11 and a convex part 12 formed by the conductive filler 30, and the diameter D of the conductive filler 301Thickness T greater than flat portion 111。
The convex portions 12 are formed on both surfaces of the connection film 10.
In the connecting film 10, the conductive filler 30 forms the convex portion 12 in an exposed state.
The connection film 10 is used for manufacturing a shielded printed wiring board by bonding a shielding film to a base film.
The method for manufacturing a shielded printed wiring board using the connecting film 10 includes (1) a connecting film arranging step, (2) a base film-shielding film laminate manufacturing step, and (3) a pressing step.
A method for manufacturing a shielded printed wiring board using the connection film 10 will be described with reference to the drawings.
Fig. 2 is a schematic view of a connecting film arranging step in a step of manufacturing a shielded printed wiring board using the connecting film of the present invention.
Fig. 3 (a) and (b) are schematic diagrams of a base film-shielding film laminate manufacturing process of a process for manufacturing a shielded printed wiring board using the connecting film of the present invention.
Fig. 4 (a) and (b) are schematic diagrams of a pressing step of a step of manufacturing a shielded printed wiring board using the connecting film of the present invention.
(1) Connecting film disposing step
As shown in fig. 2, first, a base film 50 including a base film 51, a printed circuit 52 including a ground circuit 52a disposed on the base film 51, and a cover film 53 covering the printed circuit 52 is prepared. Then, the connection film 10 is disposed above the ground circuit 52a of the base film 50.
(2) Process for producing substrate film-shielding film laminate
Next, as shown in fig. 3 (a), a shield film 60 including an insulating adhesive layer 61, a shield layer 62 laminated on the insulating adhesive layer 61, and an insulating protective layer 63 laminated on the shield layer 62 is prepared.
Then, as shown in fig. 3 (b), the shielding film 60 is disposed, and the insulating adhesive layer 61 of the shielding film 60 is bonded to the cover film 53 of the base film 50 and the connection film 10, thereby producing a base film-shielding film laminate 70.
(3) Pressing process
Next, as shown in fig. 4 (a), the base film-shielding film laminate 70 is pressed, and the conductive filler 30 of the connection film 10 is brought into contact with the ground circuit 52a and the shielding layer 62.
During this pressing, the conductive filler 30 penetrates the cover film 53 of the base film 50 and the insulating adhesive layer 61 of the shield film 60.
Through the above steps, the shielded printed wiring board 1 shown in fig. 4 (b) can be manufactured.
In the shield printed wiring board 1, the ground circuit 52a and the shield layer 62 are electrically connected through the conductive filler 30 of the connecting film 10.
By manufacturing the shielded printed wiring board 1 as described above, the conductive filler 30 can be easily disposed only between the ground circuit 52a of the base film 50 and the shielding layer 62 of the shielding film 60.
By disposing the conductive filler 30 only between the ground circuit 52a of the base film 50 and the shielding layer 62 of the shielding film 60, the transmission characteristics of the shielded printed wiring board 1 can be prevented from being degraded.
The shielded printed wiring board 1 thus manufactured is also the shielded printed wiring board of the present invention.
That is, the shielded printed wiring board 1 includes a base film 50 including a base film 51, a printed circuit 52 including a ground circuit 52a disposed on the base film 51, and a cover film 53 covering the printed circuit 52, and a shield film 60 including an insulating adhesive layer 61, a shield layer 62 laminated on the insulating adhesive layer 61, and an insulating protective layer 63 laminated on the shield layer 62, wherein the insulating adhesive layer 61 is joined to the cover film 53, the connection film 10 is further disposed between the ground circuit 52a and the shield layer 62, and the conductive filler 30 of the connection film 10 is in contact with the ground circuit 52a and the shield layer 62 to electrically connect the ground circuit 52a and the shield layer 62.
In the shield printed wiring board 1, the connection film 10 is disposed only between the ground circuit 52a and the shield layer 62.
In the shield printed wiring board 1, since the connection film 10 is disposed only between the ground circuit 52a and the shield layer 62, it is possible to prevent a decrease in transmission characteristics.
In the method of manufacturing the shielded printed wiring board 1, the connection film 10 can be arranged at an arbitrary position above the ground circuit 52 a. Therefore, the degree of freedom in designing the shield printed wiring board 1 and the degree of freedom in designing a product using the shield printed wiring board 1 are hardly lost.
In the film 10 for connection, the height H of the convex portion 12 on the shielding film 60 side is preferably set1(see FIG. 3 (a)) is larger than the thickness T of the insulating adhesive layer 61 of the shielding film 602. Height H of convex portion 12 of film 10 for connection on shielding film 60 side1Thickness T of insulating adhesive layer 61 larger than shielding film 602Referring to fig. 3 (a), when the base film 50, the connecting film 10, and the shielding film 60 are sequentially disposed and pressed, the conductive filler 30 easily penetrates through the insulating adhesive layer 61. Therefore, the conductive filler 30 and the shield layer 62 can be sufficiently electrically connected.
In the connection film 10, the height H of the projection 12 on the shielding film 60 side is preferably set to be higher than that of the projection 12 on the shielding film 60 side1Thickness T less than the entirety of shielding film 603(see FIG. 3 (a)).
Height H of projection 12 on shielding film 60 side1At the whole thickness T of the shielding film 603As described above, the conductive filler 30 easily penetrates the insulating protective layer 63 of the shielding film 60.
As a result, the conductive filler 30 is easily contacted with other electronic components and short-circuited.
In the film 10 for connection, the height H of the convex portion 12 on the base film 50 side is preferably set2(refer to FIG. 2) is larger than the thickness T of the cover film 53 above the ground circuit 52a of the base film 504(refer to fig. 2).
Height H of convex portion 12 of connection film 10 on base film 50 side2Is larger than the thickness T of the cover film 53 above the ground circuit 52a of the base film 504When the base film 50, the connection film 10, and the shielding film 60 are arranged in this order and pressed, the conductive filler 30 easily penetrates the cover film 53 of the base film 50. Therefore, the conductive filler 30 and the ground circuit 52a can be sufficiently electrically contacted.
In the film 10 for connection, the thickness T of the flat portion 11 is preferably set11 to 100 μm.
Thickness T of flat portion 111If the thickness is less than 1 μm, the strength of the connection film 10 is weak and the connection film is easily broken.
Thickness T of flat portion 111If the thickness exceeds 100 μm, the connecting film 10 becomes too thick, and therefore it is difficult to bring the base film 50 and the shielding film 60 into close contact with each other in the production of the shielded printed wiring board 1.
In the connecting film 10, the diameter D of the conductive filler 301Thickness T greater than flat portion 111。
Therefore, the conductive filler 30 is not buried by the resin composition 20.
When the conductive filler 30 is buried in the resin composition 20, the conductive filler 30 is less likely to contact the ground circuit 52a of the base film 50 and the shield layer 62 of the shield film 60 in the production of the shielded printed wiring board 1. Therefore, the electrical connection between the ground circuit 52a and the shield layer 62 is easily broken.
However, as described above, in the connection film 10, the conductive filler 30 is not buried in the resin composition 20. Therefore, in the shielded printed wiring board 1 using the connection film 10, it is difficult to cut off the electrical connection between the ground circuit 52a and the shield layer 62.
In the connecting film 10, the thickness T of the flat portion 111And diameter D of the conductive filler 301Is preferably the thickness T1: diameter D11: 1.5-1: 8, more preferably 1: 2-1: 5.
relative to thickness T1In other words, the diameter D1The shielding property of the shielding printed wiring board is lowered when the size is too small, and the close adhesion of the connecting film, the shielding film and the printed wiring board when the size is too largeThe compatibility may decrease.
In the connecting film 10, the diameter of the conductive filler 30 is preferably 2 to 200 μm.
If the diameter of the conductive filler 30 is less than 2 μm, the contact between the conductive filler 30 and the ground circuit 52a and/or the contact between the conductive filler 30 and the shield layer 62 are easily separated. Therefore, the electrical contact between the ground circuit 52a and the shield layer 62 is easily cut. When the diameter of the conductive filler 30 exceeds 200 μm, the conductive filler 30 becomes too large, and it becomes difficult to bring the base film 50 and the shielding film 60 into close contact with each other in the production of the shielded printed wiring board 1.
In the connecting film 10, the material of the conductive filler 30 is not particularly limited, and preferably at least 1 selected from the group consisting of copper powder, silver powder, nickel powder, silver-coated copper powder, gold-coated copper powder, silver-coated nickel powder, and gold-coated nickel powder is contained.
These conductive fillers have good conductivity and are therefore suitable for electrically connecting the ground circuit 52a and the shield layer 62.
The resin composition 20 in the connecting film 10 is not particularly limited, and preferably contains at least 1 selected from the group consisting of thermosetting resins and thermoplastic resins.
In the connecting film 10, both a thermosetting resin and a thermoplastic resin can be used as the resin composition 20.
As the thermosetting resin, a styrene resin composition, a vinyl acetate resin composition, a polyester resin composition, a polyethylene resin composition, a polypropylene resin composition, an imide resin composition, an amide resin composition, or the like can be used.
As the thermoplastic resin, a thermoplastic resin composition such as an acrylic resin composition, a phenol resin composition, an epoxy resin composition, a urethane resin composition, a melamine resin composition, an alkyd resin composition, or the like can be used.
In the film 10 for connection, the content of the conductive filler 30 in the resin composition 20 is preferably 20 to 90 wt%.
If the content of the conductive filler is less than 20 wt%, the connection stability between the ground circuit 52a and the shield layer 62 is impaired.
When the content of the conductive filler exceeds 90 wt%, it is not preferable from the viewpoint of the cost of raw materials.
The connecting film 10 may contain, as other materials, a curing accelerator, a tackifier, an antioxidant, a pigment, a dye, a plasticizer, an ultraviolet absorber, an antifoaming agent, a leveling agent, a filler, a flame retardant, a viscosity improver, and the like.
The material of the base film 51 of the base film 50 is not particularly limited, and may be polyimide or the like.
The material of the printed circuit 52 of the base film 50 is not particularly limited, and may be a copper foil, a cured product of a conductive paste, or the like.
The material of the cover film 53 of the base film 50 is not particularly limited, and may be polyimide or the like.
The material (adhesive composition) of the insulating adhesive layer 61 of the shielding film 60 can be the same as the material of the resin composition 20.
The material of the shielding layer 62 of the shielding film 60 is not particularly limited, and may be copper, nickel, silver, tin, gold, palladium, aluminum, chromium, titanium, zinc, an alloy thereof, or the like.
The material of the insulating protective layer 63 of the shielding film 60 is not particularly limited, and may be a polyolefin resin, a polyester resin, a polyimide resin, a polyphenylene sulfide resin, or the like.
The adhesive composition constituting the insulating adhesive layer 61 preferably has a relative dielectric constant of 2.0 to 4.0, more preferably 2.5 to 3.3, and still more preferably 2.7 to 3.0 at 1 GHz.
The adhesive composition constituting the insulating adhesive layer 61 preferably has a loss tangent of 0.0015 to 0.0040, more preferably 0.0015 to 0.0026 at 1 GHz.
When the relative permittivity and loss tangent of the insulating adhesive layer 61 at 1GHz are within the above ranges, the transmission loss of a high-frequency signal (for example, 10 GHz) transmitted through a printed circuit can be suppressed.
Next, a method for manufacturing another shielded printed wiring board using the connection film 10 will be described.
Fig. 5 is a schematic view of a connecting film arranging step in a step of manufacturing a shielded printed wiring board using the connecting film of the present invention.
Fig. 6 (a) and (b) are schematic diagrams of a base film-shielding film laminate manufacturing process of a process for manufacturing a shielded printed wiring board using the connecting film of the present invention.
Fig. 7 (a) and (b) are schematic diagrams of a pressing step of a step of manufacturing a shielded printed wiring board using the connecting film of the present invention.
(1) Connecting film disposing step
As shown in fig. 5, first, a base film 50 including a base film 51, a printed circuit 52 including a ground circuit 52a disposed on the base film 51, and a cover film 53 covering the printed circuit 52 is prepared.
Then, the cover film 53 above the ground circuit 52a is removed to expose the ground circuit 52 a.
Then, the connection film 10 is disposed on the ground circuit 52a of the base film 50.
By disposing the connecting film 10 in this manner, the conductive filler 30 and the ground circuit 52a can be reliably brought into contact with each other.
(2) Process for producing substrate film-shielding film laminate
Next, as shown in fig. 6 (a), a shield film 60 including an insulating adhesive layer 61, a shield layer 62 laminated on the insulating adhesive layer 61, and an insulating protective layer 63 laminated on the shield layer 62 is prepared.
Next, as shown in fig. 6 (b), the shielding film 60 is disposed, and the insulating adhesive layer 61 of the shielding film 60 is bonded to the cover film 53 of the base film 50 and the connection film 10, thereby producing a base film-shielding film laminate 71.
(3) Pressing step
Next, as shown in fig. 7 (a), the base film-shielding film laminate 71 is pressed, and the conductive filler 30 of the connection film 10 is brought into contact with the ground circuit 52a and the shielding layer 62.
During this pressing, the conductive filler 30 penetrates the insulating adhesive layer 61 of the shielding film 60.
Through the above steps, the shielded printed wiring board 2 shown in fig. 7 (b) can be manufactured.
Next, a method for producing the above-described connection film will be described.
(1) Process for producing resin composition sheet
First, the resin composition is molded into a sheet form to prepare a resin composition sheet.
(2) Through hole forming process
Then, through holes are formed in the resin composition sheet. At this time, the opening diameter of the through hole cannot pass through the conductive filler. The size of the opening diameter of the through hole is preferably 50 to 90% of the diameter of the conductive filler.
As described later, the conductive filler is inserted into the through hole, and if the size of the opening diameter of the through hole is less than 50% of the diameter of the conductive filler, it is difficult to insert the conductive filler. If the size of the opening diameter of the through hole exceeds 90% of the diameter of the conductive filler, the conductive filler is likely to fall.
The method for forming the through-hole is not particularly limited, and the through-hole may be formed by a laser or by pressing an emboss roller.
(3) Conductive filler insertion step
Then, the conductive filler is inserted into the through hole.
The connection film according to the first embodiment can be produced through the above steps.
(second embodiment)
Next, a connection film according to a second embodiment of the present invention will be described in detail with reference to the drawings.
Fig. 8 is a schematic cross-sectional view of an example of a connection film according to a second embodiment of the present invention.
As shown in fig. 8, a connection film 110, which is an example of a connection film of the present invention, includes a resin composition 120 and a conductive filler 130.
The connecting film 110 includes a flat portion 111 and a convex portion 112 formed of a conductive filler 130, and the diameter D of the conductive filler 130101Thickness T larger than flat portion 111101。
The convex portions 112 are formed on both surfaces of the connection film 110.
In the connecting film 110, the conductive filler 130 is covered with the resin composition 120 to form the convex portion 112.
The connection film 110 is used for manufacturing a shielded printed wiring board by bonding a shielding film to a base film.
A method for manufacturing a shielded printed wiring board using the connection film 110 will be described with reference to the drawings.
Fig. 9 is a schematic view of a connecting film arranging step in a step of manufacturing a shielded printed wiring board using the connecting film of the present invention.
Fig. 10 (a) and (b) are schematic diagrams of a base film-shielding film laminate manufacturing process of a process for manufacturing a shielded printed wiring board using the connecting film of the present invention.
Fig. 11 (a) and (b) are schematic diagrams of a pressing step of a step of manufacturing a shielded printed wiring board using the connecting film of the present invention.
(1) Connecting film disposing step
As shown in fig. 9, first, a base film 50 including a base film 51, a printed circuit 52 including a ground circuit 52a disposed on the base film 51, and a cover film 53 covering the printed circuit 52 is prepared. Then, the connection film 110 is disposed above the ground circuit 52a of the base film 50.
(2) Process for producing substrate film-shielding film laminate
Next, as shown in fig. 10 (a), a shield film 60 including an insulating adhesive layer 61, a shield layer 62 laminated on the insulating adhesive layer 61, and an insulating protective layer 63 laminated on the shield layer 62 is prepared.
Next, as shown in fig. 10 (b), the shielding film 60 is disposed, and the insulating adhesive layer 61 of the shielding film 60 is bonded to the cover film 53 of the base film 50 and the connection film 110, thereby producing a base film-shielding film laminate 170.
(3) Pressing step
Next, as shown in fig. 11 (a), the base film-shielding film laminate 170 is pressed, and the conductive filler 130 of the connection film 110 is inserted through the resin composition 120 covering the conductive filler 130, the cover film 53 of the base film 50, and the insulating adhesive layer 61 of the shielding film 60, and is in contact with the ground circuit 52a and the shielding layer 62.
The shielded printed wiring board 101 shown in fig. 11 (b) can be manufactured through the above steps.
In the shield printed wiring board 101, the ground circuit 52a and the shield layer 62 are electrically connected through the conductive filler 130 of the connection film 110.
By manufacturing the shielded printed wiring board 101 in this manner, the conductive filler 130 can be easily disposed only between the ground circuit 52a of the base film 50 and the shielding layer 62 of the shielding film 60.
By disposing the conductive filler 130 only between the ground circuit 52a of the base film 50 and the shielding layer 62 of the shielding film 60, the transmission characteristics can be prevented from being degraded in the shielded printed wiring board 101.
In the connecting film 110, the preferable thickness of the flat portion 111 is the same as the preferable thickness of the flat portion 11 of the connecting film 10.
In the connecting film 110, the preferable size and material of the conductive filler 130 are the same as those of the conductive filler 30.
In the connecting film 110, the preferable material of the resin composition 120 is the same as the preferable material of the resin composition 20 described above.
In the connection film 110, the content of the conductive filler 130 in the resin composition 120 is preferably 20 wt% to 90 wt%.
If the content of the conductive filler is less than 20 wt%, the connection stability between the ground circuit 52a and the shield layer 62 is impaired.
When the content of the conductive filler exceeds 90% by weight, it is not preferable from the viewpoint of the cost of raw materials.
The connection film 110 may contain, as other materials, a curing accelerator, a tackifier, an antioxidant, a pigment, a dye, a plasticizer, an ultraviolet absorber, an antifoaming agent, a leveling agent, a filler, a flame retardant, a viscosity modifier, and the like.
Next, a method for producing such a connection film will be described.
(1) Resin composition sheet production step
First, the resin composition is molded into a sheet form to prepare a resin composition sheet.
(2) Through hole forming process
Then, through holes are formed in the resin composition sheet. At this time, the opening diameter of the through hole cannot pass through the conductive filler. The size of the opening diameter of the through hole is preferably 50 to 90% of the diameter of the conductive filler.
As described later, the conductive filler is inserted into the through hole, and if the size of the opening diameter of the through hole is less than 50% of the diameter of the conductive filler, it is difficult to insert the conductive filler. If the size of the opening diameter of the through hole exceeds 90% of the diameter of the conductive filler, the conductive filler is likely to fall.
The method for forming the through-hole is not particularly limited, and the through-hole may be formed by a laser or by pressing an emboss roller.
(3) Conductive filler insertion step
Next, the conductive filler is inserted into the through hole to produce a resin composition sheet containing the conductive filler.
(4) Resin coating film formation step
Next, a resin coating is formed on the conductive filler-containing resin composition sheet so as to cover the conductive filler.
The conductive filler can be prevented from falling off from the connection film by forming the resin coating film.
The material of the resin coating is not particularly limited, and may be the same as that of the resin composition 20.
The thickness of the resin coating is not particularly limited, but is preferably 0.1 to 10 μm.
When the thickness of the resin coating is 0.1 μm or more, the conductive filler can be inhibited from being oxidized by moisture, oxygen, or the like in the air. If the thickness of the resin coating is 10 μm or less, the conductive filler is easily connected to the ground circuit 52a in the pressing step.
The connection film according to the second embodiment of the present invention can be produced through the above steps.
The connection film according to the second embodiment of the present invention is used in the production of a shielded printed wiring board by bonding a shielding film to a base film, similarly to the connection film according to the first embodiment of the present invention.
In the production of the shield printed wiring board as described above, the connection film according to the second embodiment of the present invention can be used instead of the connection film according to the first embodiment of the present invention.
When a shielded printed wiring board is manufactured using the connection film according to the second embodiment of the present invention, the connection film is disposed on the base film.
In this case, the connection film may be disposed in a state where the ground circuit of the base film is covered with the cover film as shown in fig. 2, or may be disposed in a state where the ground circuit of the base film is exposed from the cover film as shown in fig. 5.
(third embodiment)
Next, a connection film according to a third embodiment of the present invention will be described in detail with reference to the drawings.
Fig. 12 is a schematic cross-sectional view of an example of a connection film according to a third embodiment of the present invention.
As shown in fig. 12, a connection film 210, which is an example of a connection film according to the present invention, includes a resin composition 220 and a conductive filler 230.
The connecting film 210 includes a flat portion 211 and a convex portion 212 formed of the conductive filler 230, and the diameter D of the conductive filler 230201Thickness T greater than flat portion 211201。
The convex portion 212 is formed only on one surface of the connection film 210.
The connecting film 210 is used when a shielding film is bonded to a base film to manufacture a shielded printed wiring board.
A method for manufacturing a shielded printed wiring board using the connection film 210 will be described with reference to the drawings.
Fig. 13 is a schematic view of a connecting film arranging step in a step of manufacturing a shielded printed wiring board using the connecting film of the present invention.
Fig. 14 (a) and (b) are schematic diagrams of a base film-shielding film laminate manufacturing process of a process for manufacturing a shielded printed wiring board using the connecting film of the present invention.
Fig. 15 (a) to (c) are schematic diagrams of a pressing step of a step of manufacturing a shielded printed wiring board using the connecting film of the present invention.
(1) Connecting film disposing step
As shown in fig. 13, first, a base film 50 including a base film 51, a printed circuit 52 including a ground circuit 52a disposed on the base film 51, and a cover film 53 covering the printed circuit 52 is prepared. Then, a connecting film 210 is disposed above the ground circuit 52a of the base film 50. At this time, the convex portion 212 of the connection film 210 faces the opposite side of the base film 50.
(2) Process for producing substrate film-shielding film laminate
Next, as shown in fig. 14 (a), a shield film 60 including an insulating adhesive layer 61, a shield layer 62 laminated on the insulating adhesive layer 61, and an insulating protective layer 63 laminated on the shield layer 62 is prepared.
Next, as shown in fig. 14 (b), the shielding film 60 is disposed, and the insulating adhesive layer 61 of the shielding film 60 is bonded to the cover film 53 of the base film 50 and the connection film 210, thereby producing a base film-shielding film laminate 270.
(3) Pressing step
Next, as shown in fig. 15 (a), the base film-shielding film laminate 270 is pressed so that the conductive filler 230 of the connection film 210 penetrates the insulating adhesive layer 61 of the shielding film 60 and comes into contact with the shielding layer 62.
Next, as shown in fig. 15 (b), pressing is continued until the conductive filler 230 of the connection film 210 penetrates through the resin composition 220 of the connection film 210 and penetrates through the cover film 53 of the base film 50.
Through the above steps, the shield printed wiring board 201 shown in fig. 15 (c) can be manufactured.
In the shield printed wiring board 201, the ground circuit 52a and the shield layer 62 are electrically connected through the conductive filler 230 of the connection film 210.
In addition, by manufacturing the shield printed wiring board 201 as described above, the conductive filler 230 can be easily disposed only between the ground circuit 52a of the base film 50 and the shield layer 62 of the shield film 60.
By disposing the conductive filler 230 only between the ground circuit 52a of the base film 50 and the shielding layer 62 of the shielding film 60, it is possible to prevent the transmission characteristics from being lowered in the shielded printed wiring board 201.
In the connecting film 210, the preferable thickness of the flat portion 211 is the same as the preferable thickness of the flat portion 11 of the connecting film 10.
In the connecting film 210, the preferable size and material of the conductive filler 230 are the same as those of the conductive filler 30 described above.
In the connecting film 210, the preferable material of the resin composition 220 is the same as the preferable material of the resin composition 20 described above.
In the connecting film 210, the content of the conductive filler 230 in the resin composition 220 is preferably 20 wt% to 90 wt%.
If the content of the conductive filler is less than 20 wt%, the connection stability between the ground circuit 52a and the shield layer 62 is impaired.
When the content of the conductive filler exceeds 90 wt%, it is not preferable from the viewpoint of the cost of raw materials.
The connecting film 210 may contain, as other materials, a curing accelerator, a tackifier, an antioxidant, a pigment, a dye, a plasticizer, an ultraviolet absorber, an antifoaming agent, a leveling agent, a filler, a flame retardant, a viscosity improver, and the like.
Next, a method for producing such a connecting film will be described.
(1) Laminate forming step
A coating film containing a resin composition is formed on the surface of a support film whose surface has been subjected to a release treatment, and a laminate containing the support film and the resin composition is produced.
(2) Conductive filler burying step
Next, the conductive filler 230 is pressed against the surface of the resin composition so that a part of the conductive filler is buried by the resin composition 220.
The connection film according to the third embodiment of the present invention can be produced by the above steps.
The connection film according to the third embodiment of the present invention is used for manufacturing a shielded printed wiring board by bonding a shielding film to a base film, similarly to the connection film according to the first embodiment of the present invention.
In manufacturing such a shielded printed wiring board, the connection film according to the third embodiment of the present invention may be used instead of the connection film according to the first embodiment of the present invention.
When a shielded printed wiring board is manufactured using the connection film according to the third embodiment of the present invention, the connection film is disposed on the base film.
In this case, the connection film may be disposed in a state where the ground circuit of the base film is covered with the cover film as shown in fig. 2, or may be disposed in a state where the ground circuit of the base film is exposed from the cover film as shown in fig. 5.
[ examples ] A
The present invention will be described in detail below with reference to examples, but the present invention is not limited to the following.
Electromagnetic wave shielding films and connection film pairs according to examples 1 to 4 and electromagnetic wave shielding films according to comparative examples 1 to 3 were prepared by the following methods.
(example 1)
< production of electromagnetic wave shielding film >
First, a polyethylene terephthalate film having a peeling treatment applied to one surface thereof was prepared as a release film.
Then, the surface of the release film subjected to the release treatment was coated with an epoxy resin, and the resultant was heated at 100 ℃ for 2 minutes in an electric oven to produce an insulating protective layer having a thickness of 10 μm.
Thereafter, a copper layer of 2 μm was formed on the insulating protective layer by electroless plating. The copper layer is a shielding layer.
Next, an adhesive composition made of propylene-ethylene copolymer resin was applied to the surface of the copper layer opposite to the insulating protective layer, and the adhesive composition was cured by heating at 100 ℃ for 2 minutes using an electric oven to form an insulating adhesive layer having a thickness of 15 μm, thereby producing an electromagnetic wave shielding film.
The relative permittivity and loss tangent at 1GHz of the adhesive composition constituting the insulating adhesive layer were 2.23 and 0.0047, respectively.
< production of Membrane for connection >
An epoxy resin is used as the resin composition of the film for connection. Further, spherical tin-coated copper powder (average particle size 40 μm) was blended as a conductive filler in the resin composition to make it 62 wt%, to obtain a conductive resin composition.
Next, the obtained conductive resin composition was applied to the surface of a polyethylene terephthalate film having one surface thereof subjected to a peeling treatment, and the film was heated at 100 ℃ for 2 minutes in an electric oven, thereby forming a connecting film on the surface of the polyethylene terephthalate film. The cross section of the connecting film was measured by an optical microscope, and the thickness of the flat portion of the connecting film was 10 μm.
(example 2)
< production of electromagnetic wave shielding film >
An electromagnetic wave shielding film was produced in the same manner as in example 1, except that a cresol (novolac) type epoxy resin was used as the adhesive composition.
In the electromagnetic wave-shielding film according to example 2, the relative permittivity and loss tangent at 1GHz of the adhesive composition constituting the insulating adhesive layer were 4.20 and 0.015, respectively.
< production of Membrane for connection >
A connecting film was produced in the same manner as in example 1.
(example 3)
< production of electromagnetic wave shielding film >
An electromagnetic wave shielding film was produced in the same manner as in example 1.
< production of Membrane for connection >
An epoxy resin is used as the resin composition of the connecting film. Further, spherical silver-coated nickel powder (average particle diameter 23 μm) was blended as a conductive filler in the resin composition to make it 35 wt%, to obtain a conductive resin composition.
Next, the obtained conductive resin composition was applied to the surface of a polyethylene terephthalate film having a peeling treatment applied to one surface thereof, and heated at 100 ℃ for 2 minutes using an electric oven, thereby forming a connecting film on the surface of the polyethylene terephthalate film. The cross section of the connecting film was measured by an optical microscope, and the thickness of the flat portion of the connecting film was 10 μm.
(example 4)
< production of electromagnetic wave shielding film >
An electromagnetic wave shielding film was produced in the same manner as in example 2.
< production of film for connection >
A connecting film was produced in the same manner as in example 3.
Comparative example 1
< production of electromagnetic wave shielding film >
First, a polyethylene terephthalate film having a peeling treatment applied to one surface thereof was prepared as a release film.
Then, the release-treated surface of the release film was coated with an epoxy resin, and the resultant was heated at 100 ℃ for 2 minutes in an electric oven to prepare an insulating protective layer having a thickness of 10 μm.
Thereafter, a copper layer of 2 μm was formed on the insulating protective layer by electroless plating. The copper layer is a shielding layer.
Next, an adhesive composition made of cresol (novolac) type epoxy resin containing dendritic silver-coated copper powder was applied to the surface of the copper layer opposite to the insulating protective layer, and the adhesive composition was cured by heating at 100 ℃ for 2 minutes using an electric oven to form a conductive adhesive layer having a thickness of 15 μm, thereby producing an electromagnetic wave shielding film.
The proportion of the dendritic silver-coated copper powder in the conductive adhesive layer was 15 wt% with respect to the cresol (novolac) type epoxy resin.
The relative permittivity and loss tangent at 1GHz of the adhesive composition constituting the conductive adhesive layer were 4.20 and 0.015, respectively.
The conductive adhesive layer exhibits anisotropic conductivity.
< production of film for connection >
No connecting film was prepared.
Comparative example 2
< Process for producing electromagnetic wave shielding film >
An electromagnetic wave shielding film was produced in the same manner as in example 2.
< production of Membrane for connection >
No connecting film was prepared.
Comparative example 3
< production of electromagnetic wave shielding film >
An electromagnetic wave shielding film was produced in the same manner as in example 3.
< production of Membrane for connection >
No connecting film was prepared.
< evaluation of Shielding characteristics >
The adhesive layer and the connecting film of the electromagnetic wave shielding film of each example were stacked, and heated and pressed at 170 ℃ and 3.0MPa for 1 minute using a press, and then heated and pressed at the same temperature and pressure for 3 minutes to peel the polyethylene terephthalate film from the insulating protective layer of the electromagnetic wave shielding film, thereby obtaining a laminate of the electromagnetic wave shielding film and the connecting film.
The electric field shielding properties of the obtained laminate were measured by the KEC method.
The electric field shielding properties of the electromagnetic wave shielding films of the respective comparative examples were also measured by the KEC method.
The results are shown in Table 1.
< evaluation of transmission loss of shielded printed wiring board >
As a printed wiring board for evaluation, a copper plating layer having a thickness of 12 μm was deposited on the surface of a polyimide film having a thickness of 25 μm, a length of 105mm and a width of 3cm, and 2 signal lines and 2 ground lines parallel to the signal lines on the outer side thereof were formed by etching to obtain a circuit for evaluation. The width of the signal lines was 50 μm and the space between the lines was 100 μm.
Then, the circuit for evaluation was covered with a polyimide coating film having a thickness of 37 μm to obtain a printed wiring board for evaluation. At this time, the evaluation circuit was exposed from both ends of the polyimide cover film.
Next, the connection film and the electromagnetic wave shielding film (length 100 mm) according to each example were laminated on a printed wiring board, and heated and pressed for 1 minute at 170 ℃ and 3.0MPa using a press, and then heated and pressed for 3 minutes at the same temperature and pressure to obtain a shielded printed wiring board according to each example.
The electromagnetic wave shielding films (length: 100 mm) according to the comparative examples were laminated on a printed wiring board, and heated and pressed at 170 ℃ and 3.0MPa for 1 minute using a press, and then heated and pressed at the same temperature and pressure for 3 minutes to obtain the shielded printed wiring boards according to the comparative examples.
Next, the exposed evaluation circuit of the shield printed wiring board was connected to a network analyzer (KEYSIGHT corporation, N5232A) via a probe (scade Microtech, Z20-XD-GSSG), and a signal in the range of 10MHz to 20GHz was sent to the signal line, and the transmission loss of the shield printed wiring board according to each example and each comparative example was measured. The results are shown in Table 1. The transmission loss evaluation in table 1 describes the value of the loss at 10 GHz.
[ TABLE 1 ]
As is clear from the results in table 1, in the examples using the connection film of the present invention, the transmission loss of the high-frequency signal was successfully suppressed more greatly than the conventional shielded printed wiring boards (comparative examples 1 to 3), and the shielding characteristics were evaluated to be good.
Further, when a resin composition having a small relative permittivity and a small loss tangent was used as an adhesive composition for an insulating adhesive layer constituting an electromagnetic wave shielding film, it was succeeded in further suppressing the transmission loss of a high-frequency signal (examples 1 and 3).
[ NUMBER DEFINITION ]
1. 2, 101, 201 shield printed wiring board
10. 110, 210 connecting film
11. 111, 211 flat part
12. 112, 212 convex part
20. 120, 220 resin composition
30. 130, 230 conductive filler
50 matrix film
51 base film
52 printed circuit
52a ground circuit
53 cover film
60 shielding film
61 insulating adhesive layer
62 Shielding layer
63 insulating protective layer
70. 71, 170, 270 base film-shielding film laminate
Claims (11)
1. A connecting film characterized by:
the connection film is a connection film for electrically connecting a ground circuit and a shield layer in a shielded printed wiring board, the shielded printed wiring board includes a base film including a base film, a printed circuit including the ground circuit disposed on the base film, and a cover film covering the printed circuit, and a shield film including an insulating adhesive layer, the shield layer laminated on the insulating adhesive layer, and an insulating protective layer laminated on the shield layer, and the insulating adhesive layer is joined to the cover film,
the connecting film comprises a resin composition and a conductive filler,
the connecting film contains a flat portion and a convex portion formed of the conductive filler,
the diameter of the conductive filler is larger than the thickness of the flat portion,
the conductive filler is exposed to form the convex part or covered by a resin coating film,
the conductive filler is disposed only between the ground circuit of the base film and the shielding layer of the shielding film.
2. The connecting film according to claim 1, wherein:
the height of the projection is larger than the thickness of the insulating adhesive layer of the shielding film in the printed wiring board on which the connecting film is disposed.
3. The connecting film according to claim 1 or 2, characterized in that:
the thickness of the flat portion is 1 to 100 μm.
4. The connecting film according to claim 1 or 2, characterized in that:
the diameter of the conductive filler is 2-200 μm.
5. The connecting film according to claim 1 or 2, characterized in that:
the conductive filler contains at least 1 selected from the group consisting of copper powder, silver powder, nickel powder, silver-coated copper powder, gold-coated copper powder, silver-coated nickel powder, and gold-coated nickel powder.
6. The connecting film according to claim 1 or 2, characterized in that:
the resin composition contains at least 1 selected from the group consisting of thermosetting resins and thermoplastic resins.
7. A manufacturing method of a shielding printed circuit board is characterized in that:
the method is a method of manufacturing a printed wiring board including: a base film including a base film, a printed circuit including a ground circuit disposed on the base film, and a cover film covering the printed circuit; a method for manufacturing a shielded printed wiring board, which comprises a shielding film comprising an insulating adhesive layer, a shielding layer laminated on the insulating adhesive layer, and an insulating protective layer laminated on the shielding layer, the method comprising the steps of:
a connection film disposing step of preparing the base film and disposing the connection film according to claim 1 above a ground circuit of the base film,
a base film-shielding film laminate production step of preparing the shielding film, disposing the shielding film, and joining an insulating adhesive layer of the shielding film to the cover film of the base film and the connection film to produce a base film-shielding film laminate,
and a pressing step of pressing the base film-shielding film laminate so that the conductive filler of the connection film is in contact with the ground circuit and the shielding layer.
8. The manufacturing method of a shielded printed wiring board according to claim 7, characterized in that:
in the connecting film disposing step, the connecting film is disposed as follows: the ground circuit of the base film is exposed, and the convex portion of the connecting film is brought into contact with the ground circuit.
9. The manufacturing method of a shielded printed wiring board according to claim 7 or 8, characterized in that:
in the pressing step, the base film-shielding film laminate is pressed so that the conductive filler of the connection film penetrates through the insulating adhesive layer of the shielding film and comes into contact with the shielding layer of the shielding film.
10. A shielded printed wiring board characterized in that:
the shielding printed wiring board includes:
a base film including a base film, a printed circuit including a ground circuit disposed on the base film, and a cover film covering the printed circuit,
a shielding film including an insulating adhesive layer, a shielding layer laminated on the insulating adhesive layer, and an insulating protective layer laminated on the shielding layer, the insulating adhesive layer being bonded to the cover film,
the film for connection according to claim 1 is further disposed between the ground circuit and the shield layer,
the conductive filler of the connection film is in contact with the ground circuit and the shield layer to electrically connect the ground circuit and the shield layer.
11. The shielded printed wiring board of claim 10, wherein:
the connecting film is disposed only between the ground circuit and the shielding layer.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017154532 | 2017-08-09 | ||
| JP2017-154532 | 2017-08-09 | ||
| PCT/JP2018/029803 WO2019031555A1 (en) | 2017-08-09 | 2018-08-08 | Connection film, production method for shielded printed wiring board, and shielded printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110959316A CN110959316A (en) | 2020-04-03 |
| CN110959316B true CN110959316B (en) | 2022-07-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880051684.4A Active CN110959316B (en) | 2017-08-09 | 2018-08-08 | Connection film, method for manufacturing shielded printed wiring board, and shielded printed wiring board |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6946437B2 (en) |
| KR (1) | KR102422104B1 (en) |
| CN (1) | CN110959316B (en) |
| TW (1) | TWI725334B (en) |
| WO (1) | WO2019031555A1 (en) |
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2018
- 2018-08-08 CN CN201880051684.4A patent/CN110959316B/en active Active
- 2018-08-08 JP JP2019535704A patent/JP6946437B2/en active Active
- 2018-08-08 KR KR1020207006593A patent/KR102422104B1/en active IP Right Grant
- 2018-08-08 WO PCT/JP2018/029803 patent/WO2019031555A1/en active Application Filing
- 2018-08-09 TW TW107127818A patent/TWI725334B/en active
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2019031555A1 (en) | 2019-02-14 |
| CN110959316A (en) | 2020-04-03 |
| KR102422104B1 (en) | 2022-07-15 |
| TW201921628A (en) | 2019-06-01 |
| JP6946437B2 (en) | 2021-10-06 |
| JPWO2019031555A1 (en) | 2020-07-09 |
| KR20200035450A (en) | 2020-04-03 |
| TWI725334B (en) | 2021-04-21 |
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