CN110957310A - Backlight source, backlight module and manufacturing method of backlight source - Google Patents
Backlight source, backlight module and manufacturing method of backlight source Download PDFInfo
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- CN110957310A CN110957310A CN201911203610.0A CN201911203610A CN110957310A CN 110957310 A CN110957310 A CN 110957310A CN 201911203610 A CN201911203610 A CN 201911203610A CN 110957310 A CN110957310 A CN 110957310A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
Abstract
The invention provides a backlight source, a backlight module and a manufacturing method of the backlight source. The backlight module comprises a backlight source, wherein the backlight source comprises a substrate and a light-emitting unit arranged on the substrate; the luminous unit includes at least two kinds of emitting diode who sends different colour points and colour gamut light, is used for through control emitting diode of different colour points and colour gamut light is lighted the light source that provides different colour points and colour gamut, has satisfied different use occasions and crowd and to the different requirements of display colour and colour gamut, has realized different colour point and has switched over, thereby has provided the backlight of a changeable colour point and colour gamut function, has strengthened the differentiation performance of product, and then has promoted user's use experience and terminal product competitiveness.
Description
Technical Field
The invention relates to the field of display, in particular to a backlight source, a backlight module and a manufacturing method of the backlight source.
Background
Light Emitting Diode (LED) backlight modules have received much attention because of their advantages such as high brightness, ultra-narrow bezel, special shape and ability to implement local dimming designs.
At present, the color point of the backlight source of the backlight module after being assembled is fixed, and the color point and the color gamut of the backlight module are not changed in a normal working state. While everyone has different preferences for screen color and color gamut, for example, average european and american users prefer a screen with white-plus-pink color points, asian users prefer white-plus-blue color points, female users prefer a screen with white-plus-pink color points, male users prefer white-plus-blue color points, users prefer white-plus-white color points in the daytime, and users prefer white-plus-grey color points at night.
With the development of display technology, different use occasions and people have different requirements on display colors and color gamut.
Therefore, a new backlight source, a backlight module and a method for manufacturing the backlight source are needed to solve the problem.
Disclosure of Invention
The invention aims to provide a backlight source, a backlight module and a manufacturing method of the backlight source, which meet different requirements of different use occasions and crowds on display colors and color gamuts and realize different color point switching, thereby providing the backlight source with switchable color points and color gamut functions, enhancing the differentiation performance of products and further improving the use experience of users and the competitiveness of terminal products.
In order to achieve the above object, the present invention provides a backlight including a substrate and a light emitting unit disposed on the substrate; the light-emitting unit comprises at least two light-emitting diodes emitting light rays with different color points and color gamuts, and is used for providing light sources with different color points and color gamuts by controlling the light-emitting diodes emitting the light rays with the different color points and the color gamuts to be lightened.
Further, the light emitting diode comprises a shell bracket, a light emitting chip and a fluorescent glue coating; the shell bracket is arranged on the substrate, and a groove is formed in the upper surface of the shell bracket; the light-emitting chip is arranged in the groove and connected with the shell bracket; the fluorescent glue coating is arranged in the groove and completely covers the light-emitting chip.
Further, the fluorescent glue coating comprises fluorescent powder and packaging glue.
Further, the fluorescent powder comprises one or a mixture of more of red fluorescent powder, orange fluorescent powder, yellow fluorescent powder and green fluorescent powder; the packaging adhesive is composed of silica gel or epoxy resin.
Further, the light emitting diodes emitting light rays with different color points and color gamuts comprise a first light emitting diode and a second light emitting diode; the first light emitting diodes are arranged on the substrate in an array manner; the second light emitting diode and the first light emitting diode are arranged on the substrate at intervals.
Further, the phosphor of the first light emitting diode is different from the phosphor of the second light emitting diode in material.
Further, the first light emitting diodes are arranged on the substrate in odd-numbered rows, and the second light emitting diodes are arranged on the substrate in even-numbered rows; and/or the first light emitting diodes are arranged on the substrate in odd rows, and the second light emitting diodes are arranged on the substrate in even rows.
The invention also provides a manufacturing method of the backlight source, which is characterized by comprising the following steps:
providing a substrate; and
manufacturing a light emitting unit on the substrate; the light-emitting unit comprises at least two light-emitting diodes emitting light rays with different color points and color gamuts, and is used for providing light sources with different color points and color gamuts by controlling the light-emitting diodes emitting the light rays with the different color points and the color gamuts to be lightened.
Further, the step of manufacturing the light emitting unit includes:
manufacturing a shell support on the substrate, wherein a groove is formed in the upper surface of the shell support;
manufacturing a light-emitting chip in the groove, wherein the light-emitting chip is connected with the shell bracket; and
and coating a fluorescent glue coating in the groove, wherein the fluorescent glue coating completely covers the light-emitting chip.
The invention also provides a backlight module comprising the backlight source.
The backlight source, the backlight module and the manufacturing method of the backlight source have the advantages that the light emitting diodes with different color points and color gamuts are arranged on the backlight source of the backlight module, the light sources are provided by controlling the light emitting diodes with different color points and color gamuts to be lightened, the color point and color gamut switching function is realized, different requirements of different use occasions and crowds on display colors and color gamuts are met, different color point switching is realized, the backlight source with the color point and color gamut switching function is provided, the differentiation performance of products is enhanced, and further the use experience of users and the competitiveness of terminal products are improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
FIG. 1 is a schematic structural diagram of a backlight source according to an embodiment of the disclosure;
FIG. 2 is a flowchart illustrating a method for manufacturing a backlight according to an embodiment of the invention;
FIG. 3 is a flow chart of the steps of fabricating the light emitting cell of FIG. 2;
fig. 4 is a schematic structural diagram of a display module according to an embodiment of the invention.
The components in the figure are identified as follows:
1. a substrate, 2, a light emitting unit, 20, a light emitting diode, 21, a housing support,
22. a light emitting chip 23, a fluorescent glue coating 100, a backlight source 101, a light guide plate,
102. a diffusion sheet 103, a brightness enhancement sheet 201, a first light emitting diode,
202. second light emitting diode, 200, backlight module, 211, recess.
Detailed Description
The following description of the various embodiments refers to the accompanying drawings that illustrate specific embodiments in which the invention may be practiced. The directional terms mentioned in the present invention, such as [ upper ], [ lower ], [ front ], [ rear ], [ left ], [ right ], [ inner ], [ outer ], [ side ], are only referring to the directions of the attached drawings. Accordingly, the directional terms used are used for explanation and understanding of the present invention, and are not used for limiting the present invention. In the drawings, elements having similar structures are denoted by the same reference numerals.
In the drawings, the thickness of layers and regions are exaggerated for clarity. For example, the thicknesses and sizes of elements in the drawings are arbitrarily shown for convenience of description, and thus, the described technical scope is not limited by the drawings.
In addition, it is also to be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Referring to fig. 1, in an embodiment of the present invention, a backlight source 100 is provided, where the backlight source 100 adopts a direct-type manner, and includes a substrate 1 and a light emitting unit 2 disposed on the substrate 1; the light-emitting unit 2 includes at least two light-emitting diodes 20 emitting light rays with different color points and color gamuts, and is configured to provide light sources with different color points and color gamuts by controlling the light-emitting diodes 20 emitting light rays with different color points and color gamuts to be turned on, so that the backlight source 100 with color point and color gamut switchable function is provided, differentiation performance of products is enhanced, and market competitiveness of the products is improved.
Color gamut is a method for encoding a color, and refers to the sum of colors that a technical system can produce. In computer graphics processing, a color gamut is some complete subset of colors. The colors at different coordinate positions of the color gamut are color points.
Referring to fig. 1, in the present embodiment, the light emitting diode 20 includes a housing support 21, a light emitting chip 22 and a fluorescent glue coating 23; the shell support 21 is arranged on the substrate 1, and a groove 211 is formed in the upper surface of the shell support 21; the light emitting chip 22 is arranged in the groove 211 and connected with the shell bracket 21; the fluorescent glue coating 23 is disposed in the groove 211 and completely covers the light emitting chip 22. Wherein the fluorescent glue coating 23 is used for encapsulating the light emitting chip 22 and emitting light under the excitation of the light emitting chip 22.
In this embodiment, the fluorescent glue coating 23 includes fluorescent powder and packaging glue.
In this embodiment, the phosphor is composed of one or a mixture of several of red phosphor, orange phosphor, yellow phosphor and green phosphor; the packaging adhesive is composed of silica gel or epoxy resin.
Referring to fig. 1, in the present embodiment, the light emitting diodes 20 emitting light rays with different color points and color gamuts include a first light emitting diode 201 and a second light emitting diode 202; the first light emitting diodes 201 are arranged on the substrate 1 in an array manner; the second light emitting diode 202 and the first light emitting diode 201 are arranged on the substrate 1 at an interval.
In this embodiment, the phosphor of the first light emitting diode 201 is different from the phosphor of the second light emitting diode 202 in material. Light rays of different color points and color gamuts are generated by excitation in phosphors of different materials. Preferably, the phosphor of the first light emitting diode 201 is of the YG series, which can achieve 72% color gamut, and the phosphor of the second light emitting diode 202 is of the RG series, which can achieve 85% color gamut.
In this embodiment, the first light emitting diodes 201 are arranged in odd-numbered rows on the substrate 1, and the second light emitting diodes 202 are arranged in even-numbered rows on the substrate 1; and/or the first light emitting diodes 201 are arranged in odd columns on the substrate 1, and the second light emitting diodes 202 are arranged in even columns on the substrate 1. The arrangement is such that the first light emitting diode 201 or the second light emitting diode 202 emitting light of different color points and color gamuts is uniform.
In the using process, when the color point and color gamut light of the first light emitting diode 201 need to be emitted, the first light emitting diode 201 is electrified to work, when the color point and color gamut light of the second light emitting diode 202 is emitted, the second light emitting diode 202 is electrified to work, and the light sources providing different color points and color gamuts are lightened by controlling the light emitting diodes 20 emitting different color points and color gamut light, so that the color point and color gamut switching function is realized. In this embodiment, the first light emitting diode 201 or the second light emitting diode 202 is preferably independently turned on, but the first light emitting diode 201 and the second light emitting diode 202 may be simultaneously turned on.
Referring to fig. 2, the present invention further provides a method for manufacturing a backlight source 100, which includes the steps of:
s1, providing a substrate 1; and
s2, forming a light emitting unit 2 on the substrate 1; the light emitting unit 2 includes at least two kinds of light emitting diodes 20 emitting light of different color points and color gamuts, and is configured to provide light sources of different color points and color gamuts by controlling the light emitting diodes 20 emitting light of different color points and color gamuts to be turned on.
Referring to fig. 3, in the present embodiment, the step of manufacturing the light emitting unit 2 includes:
s21, manufacturing a shell support 21 on the substrate 1, wherein the upper surface of the shell support 21 is provided with a groove 211;
s22, manufacturing a light-emitting chip 22 in the groove 211, wherein the light-emitting chip 22 is connected with the shell support 21; and
s23, coating a fluorescent glue coating 23 in the groove 211, wherein the fluorescent glue coating 23 completely covers the light-emitting chip 22; wherein the fluorescent glue coating 23 is used for encapsulating the light emitting chip 22 and emitting light under the excitation of the light emitting chip 22.
Referring to fig. 4, the present invention further provides a backlight module 200 including the backlight source 100. Compared with the prior art, the beneficial effects of the backlight module 200 provided by the embodiment of the invention are the same as the beneficial effects of the backlight source 100 provided by the technical scheme, and are not described herein again.
In this embodiment, the backlight module 200 further includes a light guide plate 101, a diffusion sheet 102, and a brightness enhancement sheet 103 sequentially disposed on the backlight source 100, so that the light of the light module is uniform.
The backlight module 200 is applied to a display device for providing backlight, and the display device may be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, or a navigator.
The backlight source, the backlight module and the manufacturing method of the backlight source have the advantages that the light emitting diodes with different color points and color gamuts are arranged on the backlight source of the backlight module, the light sources are provided by controlling the light emitting diodes with different color points and color gamuts to be lightened, the color point and color gamut switching function is realized, different requirements of different use occasions and crowds on display colors and color gamuts are met, different color point switching is realized, the backlight source with the color point and color gamut switching function is provided, the differentiation performance of products is enhanced, and further the use experience of users and the competitiveness of terminal products are improved.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A backlight, comprising:
a substrate; and
a light emitting unit disposed on the substrate;
the light-emitting unit comprises at least two light-emitting diodes emitting light rays with different color points and color gamuts, and is used for providing light sources with different color points and color gamuts by controlling the light-emitting diodes emitting the light rays with the different color points and the color gamuts to be lightened.
2. The backlight of claim 1, wherein the light emitting diodes comprise:
the shell bracket is arranged on the substrate, and a groove is formed in the upper surface of the shell bracket;
the light-emitting chip is arranged in the groove and connected with the shell bracket; and
and the fluorescent glue coating is arranged in the groove and completely covers the light-emitting chip.
3. The backlight of claim 2, wherein the phosphor coating comprises phosphor and encapsulant.
4. The backlight source of claim 3, wherein the phosphor comprises one or more of red phosphor, orange phosphor, yellow phosphor and green phosphor; the packaging adhesive is composed of silica gel or epoxy resin.
5. The backlight of claim 1, wherein the leds emitting light of different color points and color gamuts comprise:
the first light emitting diodes are arranged on the substrate in an array manner; and
and the second light-emitting diode and the first light-emitting diode are arranged on the substrate at intervals.
6. The backlight of claim 5, wherein the phosphor of the first light emitting diode is a different material than the phosphor of the second light emitting diode.
7. The backlight of claim 5, wherein the first LEDs are arranged in odd rows on the substrate and the second LEDs are arranged in even rows on the substrate; and/or the first light emitting diodes are arranged on the substrate in odd rows, and the second light emitting diodes are arranged on the substrate in even rows.
8. A method for manufacturing a backlight source is characterized by comprising the following steps:
providing a substrate; and
manufacturing a light emitting unit on the substrate; the light-emitting unit comprises at least two light-emitting diodes emitting light rays with different color points and color gamuts, and is used for providing light sources with different color points and color gamuts by controlling the light-emitting diodes emitting the light rays with the different color points and the color gamuts to be lightened.
9. The method for manufacturing a backlight according to claim 8, wherein the step of manufacturing the light emitting unit comprises:
manufacturing a shell support on the substrate, wherein a groove is formed in the upper surface of the shell support;
manufacturing a light-emitting chip in the groove, wherein the light-emitting chip is connected with the shell bracket; and
and coating a fluorescent glue coating in the groove, wherein the fluorescent glue coating completely covers the light-emitting chip.
10. A backlight module comprising the backlight of any one of claims 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911203610.0A CN110957310A (en) | 2019-11-29 | 2019-11-29 | Backlight source, backlight module and manufacturing method of backlight source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911203610.0A CN110957310A (en) | 2019-11-29 | 2019-11-29 | Backlight source, backlight module and manufacturing method of backlight source |
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| Publication Number | Publication Date |
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| CN110957310A true CN110957310A (en) | 2020-04-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201911203610.0A Pending CN110957310A (en) | 2019-11-29 | 2019-11-29 | Backlight source, backlight module and manufacturing method of backlight source |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103234149A (en) * | 2013-03-29 | 2013-08-07 | 京东方科技集团股份有限公司 | Backlight module, liquid crystal display and backlight drive control method |
| TW201418839A (en) * | 2012-11-05 | 2014-05-16 | Innocom Tech Shenzhen Co Ltd | Backlight module |
| CN105700230A (en) * | 2016-01-29 | 2016-06-22 | 京东方科技集团股份有限公司 | Backlight source, backlight module and display device |
| CN105717701A (en) * | 2016-01-30 | 2016-06-29 | 贵阳海信电子有限公司 | Backlight module for large-screen LCM and large-screen LCM |
| CN207834348U (en) * | 2017-11-27 | 2018-09-07 | 广东晶科电子股份有限公司 | A kind of encapsulating structure, white light emitting diode and backlight module |
| CN109164632A (en) * | 2018-08-31 | 2019-01-08 | 华南师范大学 | A kind of high colour gamut LCD backlight mould group and preparation method thereof |
| CN109709716A (en) * | 2019-02-11 | 2019-05-03 | 深圳扑浪创新科技有限公司 | A kind of backlight module, display device and its driving method |
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2019
- 2019-11-29 CN CN201911203610.0A patent/CN110957310A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201418839A (en) * | 2012-11-05 | 2014-05-16 | Innocom Tech Shenzhen Co Ltd | Backlight module |
| CN103234149A (en) * | 2013-03-29 | 2013-08-07 | 京东方科技集团股份有限公司 | Backlight module, liquid crystal display and backlight drive control method |
| CN105700230A (en) * | 2016-01-29 | 2016-06-22 | 京东方科技集团股份有限公司 | Backlight source, backlight module and display device |
| CN105717701A (en) * | 2016-01-30 | 2016-06-29 | 贵阳海信电子有限公司 | Backlight module for large-screen LCM and large-screen LCM |
| CN207834348U (en) * | 2017-11-27 | 2018-09-07 | 广东晶科电子股份有限公司 | A kind of encapsulating structure, white light emitting diode and backlight module |
| CN109164632A (en) * | 2018-08-31 | 2019-01-08 | 华南师范大学 | A kind of high colour gamut LCD backlight mould group and preparation method thereof |
| CN109709716A (en) * | 2019-02-11 | 2019-05-03 | 深圳扑浪创新科技有限公司 | A kind of backlight module, display device and its driving method |
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