CN110953989A - Method, device, equipment and medium for measuring product mark position deviation - Google Patents
Method, device, equipment and medium for measuring product mark position deviation Download PDFInfo
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- CN110953989A CN110953989A CN201911254213.6A CN201911254213A CN110953989A CN 110953989 A CN110953989 A CN 110953989A CN 201911254213 A CN201911254213 A CN 201911254213A CN 110953989 A CN110953989 A CN 110953989A
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- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/002—Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates
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Abstract
The invention discloses a method, a device, equipment and a medium for measuring the position offset of a product mark, wherein the method comprises the following steps: when a measuring instruction for measuring the position deviation of a product mark is detected, acquiring a corresponding drawing matrix to be measured; acquiring a first to-be-measured mark area corresponding to the to-be-measured drawing matrix in the non-mark surface of the product and placing the first to-be-measured mark area in a preset image taking position area, so as to perform first image taking on the to-be-measured mark area through a preset first camera to obtain first coordinate information; performing second image taking on a second to-be-measured marking area corresponding to the to-be-measured drawing matrix in the marking surface of the product through a preset second camera to obtain second coordinate information; and obtaining the offset result of the first mark position of the product according to the drawing matrix to be measured, the first coordinate information and the second coordinate information. The invention solves the technical problems of complex operation and high measurement cost in the prior art when the offset measurement is carried out on the imprinted information.
Description
Technical Field
The invention relates to the technical field of marking, in particular to a method, a device, equipment and a medium for measuring product marking position deviation.
Background
At present, the brand, type, model and other information are often required to be printed on a product, particularly a resin (Compound) packaged product, so as to be convenient for a merchant or a user to distinguish the product, and along with the increasingly high requirements of people on the product quality, the printed brand, type, model and other information also have regularity requirements, therefore, after the printed information is printed on the product, whether the printed information is deviated or determined is required to be measured or determined, at present, the printed information is mostly subjected to deviation measurement by using an acrylic surface scribing mode or a high power microscope alignment mode, a plurality of different sets of acrylic inspection fixtures are required to be made according to different products/substrate typesetting and the like by using an acrylic scheme, the problems of easy wear, low accuracy and high measurement cost exist, while the high power microscope alignment method has complex operation and the defect of product design requirement, that is complex operation exists when the printed information is subjected to deviation measurement in the prior art, the measurement cost is high.
Disclosure of Invention
The invention mainly aims to provide a method, a device, equipment and a medium for measuring the offset of a product mark position, and aims to solve the technical problems of complex operation and high measurement cost in the prior art when offset measurement is carried out on imprinted information.
In order to achieve the above object, an embodiment of the present invention provides a method for measuring a product mark position deviation, where the method includes:
when a measuring instruction for measuring the position deviation of a product mark is detected, acquiring a drawing matrix to be measured of the product, which is pointed by the measuring instruction;
acquiring a first mark area to be measured corresponding to the drawing matrix to be measured in the non-mark surface of the product, and placing the mark area to be measured in a preset image taking position area so as to perform first image taking on the mark area to be measured through a preset first camera to obtain first coordinate information of the mark area to be measured;
performing second image taking on a second to-be-measured marking area corresponding to the drawing matrix to be measured in the marking surface of the product through a preset second camera to obtain second coordinate information of a first marking position in the marking area to be measured;
and obtaining the offset result of the first mark position of the product according to the drawing matrix to be measured, the first coordinate information and the second coordinate information.
Optionally, the product is placed in a hollow tray of a preset coordinate acquisition tool;
the step of acquiring a first mark area to be measured corresponding to the drawing matrix to be measured in the non-mark surface of the product, and placing the mark area to be measured in a preset image taking position area, so as to perform first image taking on the mark area to be measured through a preset first camera, and obtain first coordinate information of the mark area to be measured comprises the following steps:
acquiring a first to-be-measured marking area corresponding to the drawing matrix to be measured in the non-marking surface of the product;
moving the first mark area to be measured to a preset image taking position area through a preset motor device, and acquiring moving coordinate information of the first mark area to be measured moving to the preset image taking position area;
performing first image taking on the moved mark area to be measured through a preset first camera to obtain first matrix coordinate information of the moved mark area to be measured;
and calculating the first coordinate information through the moving coordinate information and the first matrix coordinate information.
Optionally, the step of obtaining an offset result of the first mark bit of the product according to the drawing matrix to be measured, the first coordinate information, and the second coordinate information includes:
acquiring second matrix coordinate information of a second mark position in the drawing matrix to be measured, and performing first coordinate fusion on the second matrix coordinate information and the first coordinate information to obtain fused coordinate information;
performing second coordinate fusion on the fusion coordinate information and the second coordinate information to obtain the coincidence degree of the fusion coordinate information and the second coordinate information;
if the coincidence degree is completely coincident, determining that the offset result of the first mark bit of the product is not offset;
and if the coincidence degree is not completely coincident, determining that the offset result of the first mark bit of the product is offset.
Optionally, if the coincidence degree is not completely coincident, the step of determining that the offset result of the first flag bit of the product is an offset includes:
if the contact ratio is not completely contact, acquiring a reference frame matrix formed by the first coordinate information, and acquiring a first coordinate difference value between a most edge coordinate corresponding to the first mark position and a most edge coordinate corresponding to the reference frame matrix;
acquiring a second coordinate difference value of the second mark position and the most frame coordinate;
and determining the offset result of the first mark bit of the product as the offset according to the first coordinate difference value and the second coordinate difference value, and determining the offset value of the offset result.
Optionally, the step of determining the offset value of the offset result is followed by:
judging whether the deviation value is larger than a preset deviation value or not, and if the deviation value is larger than the preset deviation value, measuring the first mark bit again to obtain a re-measurement result;
and if the re-measurement result is inconsistent with the offset result, outputting prompt information.
Optionally, the step of obtaining an offset result of the first mark bit of the product according to the drawing matrix to be measured, the first coordinate information, and the second coordinate information includes:
and identifying the first mark bit with the offset result as the offset.
Optionally, when a measurement instruction for measuring a position offset of a product mark is detected, the step of acquiring a drawing matrix to be measured of the product pointed by the measurement instruction includes:
when a measurement instruction for measuring the position deviation of a product mark is detected, a drawing matrix to be measured of the product, which is pointed by the measurement instruction, is obtained, wherein the drawing matrix to be measured comprises a preset unit drawing matrix or a plurality of preset unit drawing matrices.
The present invention also provides a product marking position deviation measuring apparatus, including:
the detection module is used for acquiring a drawing matrix to be measured of the product, which is pointed by a measurement instruction when the measurement instruction for measuring the position deviation of a product mark is detected;
the first acquisition module is used for acquiring a first mark area to be measured corresponding to the drawing matrix to be measured in the non-mark surface of the product, placing the mark area to be measured in a preset image taking position area, and performing first image taking on the mark area to be measured through a preset first camera to obtain first coordinate information of the mark area to be measured;
the second acquisition module is used for carrying out second image acquisition on a second to-be-measured marking area corresponding to the to-be-measured drawing matrix in the marking surface of the product through a preset second camera so as to obtain second coordinate information of the first marking position in the to-be-measured marking area;
and the third acquisition module is used for acquiring the offset result of the first mark position of the product according to the drawing matrix to be measured, the first coordinate information and the second coordinate information.
Optionally, the product is placed in a hollow tray of a preset coordinate acquisition tool;
the first obtaining module comprises:
the first acquisition unit is used for acquiring a first to-be-measured marking area corresponding to the drawing matrix to be measured in the non-marking surface of the product;
the second acquisition unit is used for moving the first mark area to be measured to a preset object-taking position area through a preset motor device and acquiring moving coordinate information of the first mark area to be measured moving to the preset object-taking position area;
the third acquisition unit is used for carrying out first image taking on the moved mark area to be measured through a preset first camera to obtain first matrix coordinate information of the moved mark area to be measured;
and the calculation unit is used for calculating the first coordinate information through the moving coordinate information and the first matrix coordinate information.
Optionally, the third obtaining module includes:
the fourth acquisition unit is used for acquiring second matrix coordinate information of a second mark bit in the drawing matrix to be measured, and performing first coordinate fusion on the second matrix coordinate information and the first coordinate information to obtain fused coordinate information;
a fifth obtaining unit, configured to perform second coordinate fusion on the fusion coordinate information and the second coordinate information to obtain a coincidence degree of the fusion coordinate information and the second coordinate information;
a first determining unit, configured to determine that a shift result of a first mark bit of the product is not shifted if the coincidence degree is completely coincident;
a second determining unit, configured to determine that the offset result of the first flag bit of the product is an offset if the overlap ratio is not completely overlapped.
Optionally, the second determining unit includes:
the first obtaining subunit is configured to obtain a reference frame matrix formed by the first coordinate information if the overlap ratio is not completely overlapped, and obtain a first coordinate difference between a most edge coordinate corresponding to the first mark bit and a most frame coordinate corresponding to the reference frame matrix;
the second obtaining subunit is configured to obtain a second coordinate difference between the second mark bit and the maximum frame coordinate;
and the determining subunit is configured to determine, according to the first coordinate difference and the second coordinate difference, that the offset result of the first mark bit of the product is an offset, and determine an offset value of the offset result.
Optionally, the product marking position deviation measuring device includes:
the judging module is used for judging whether the deviation value is larger than a preset deviation value or not, and if the deviation value is larger than the preset deviation value, the first mark bit is measured again to obtain a re-measurement result;
and the output module is used for outputting prompt information if the secondary measurement result is inconsistent with the offset result.
Optionally, the product marking position offset measuring device comprises:
and the identification module is used for identifying the first mark bit of which the offset result is offset.
Optionally, the detection module includes:
the fourth acquisition module is used for acquiring a drawing matrix to be measured of the product, which is pointed by the measurement instruction, when the measurement instruction for measuring the position offset of the product mark is detected, wherein the drawing matrix to be measured comprises a preset unit drawing matrix or a plurality of preset unit drawing matrices.
The present invention also provides a medium having a program for measuring a product marking position deviation stored thereon, which program, when executed by a processor, implements the steps of the method for measuring a product marking position deviation as described above.
When a measuring instruction for measuring the position deviation of a product mark is detected, a drawing matrix to be measured of the product, which is pointed by the measuring instruction, is obtained; acquiring a first mark area to be measured corresponding to the drawing matrix to be measured in the non-mark surface of the product, and placing the mark area to be measured in a preset image taking position area so as to perform first image taking on the mark area to be measured through a preset first camera to obtain first coordinate information of the mark area to be measured; and carrying out second image taking on a second to-be-measured marking area corresponding to the drawing matrix to be measured in the marking surface of the product through a preset second camera to obtain second coordinate information of a first marking position in the marking area to be measured, and obtaining an offset result of the first marking position of the product according to the drawing matrix to be measured, the first coordinate information and the second coordinate information. In the application, the first coordinate information and the second coordinate information are accurately obtained, the offset result of the first mark position of the product is obtained according to the drawing matrix to be measured, the first coordinate information and the second coordinate information, that is, after the image is captured by the camera, the marking information of the marking surface and the matrix information of the non-marking surface of the product are synthesized into the same image by using a visual mode to directly observe the offset result, and in the application, automatic inspection can be performed when a measurement instruction for measuring the positional deviation of the mark of the product is detected, and after the mark area to be measured is changed, after the corresponding first coordinate information book and the second coordinate information book are simply and conveniently and automatically acquired, and a deviation result which can be directly observed is generated, so that the problems of complex operation and high measurement cost existing in the conventional mark measurement are solved.
Drawings
FIG. 1 is a schematic flow chart of a first embodiment of a method for measuring the position offset of a product mark according to the present invention;
fig. 2 is a detailed flowchart of a step of acquiring a first mark area to be measured corresponding to the drawing matrix to be measured in the non-mark surface of the product in a second embodiment of the measuring method for the mark position offset of the product, and placing the mark area to be measured in a preset image taking position area to perform first image taking on the mark area to be measured by using a preset first camera to obtain first coordinate information of the mark area to be measured;
FIG. 3 is a schematic diagram of an apparatus architecture of a hardware operating environment to which a method of an embodiment of the invention relates;
FIG. 4 is a schematic diagram of a first scenario of a method for measuring a mark position offset of a product according to the present invention;
fig. 5 is a schematic diagram of a second scenario of the measuring method of the product mark position offset according to the present invention.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The invention provides a method for measuring product mark position deviation, in an embodiment of the method for measuring the product mark position deviation, referring to fig. 1, the method for measuring the product mark position deviation comprises the following steps:
step S10, when a measurement instruction for measuring the position deviation of a product mark is detected, acquiring a drawing matrix to be measured of the product, which is pointed by the measurement instruction;
step S20, acquiring a first mark area to be measured corresponding to the drawing matrix to be measured in the non-mark surface of the product, placing the mark area to be measured in a preset image taking position area, and performing first image taking on the mark area to be measured through a preset first camera to obtain first coordinate information of the mark area to be measured;
step S30, performing second image taking on a second mark area to be measured corresponding to the drawing matrix to be measured in the mark surface of the product through a preset second camera to obtain second coordinate information of a first mark position in the mark area to be measured;
and step S40, obtaining the offset result of the first mark position of the product according to the drawing matrix to be measured, the first coordinate information and the second coordinate information.
The method comprises the following specific steps:
step S10, when a measurement instruction for measuring the position deviation of a product mark is detected, acquiring a drawing matrix to be measured of the product, which is pointed by the measurement instruction;
it should be noted that, in this embodiment, the method for measuring the product mark position deviation is applied to a product mark position deviation measuring device (a preset coordinate collecting tool), as shown in fig. 4, the product mark position deviation measuring device includes a PC, a fixed bracket, a hollow tray, a first camera, a second camera, and other tools, wherein the first camera may be disposed on the first bracket, the second camera may be disposed on the second bracket, of course, the second camera may be disposed on the first bracket, the first camera may be disposed on the second bracket, and no specific limitation is made herein, wherein the first camera and the second camera are in a uniform measurement straight line in the product mark position deviation measuring device, that is, the first camera and the second camera center are in a straight line, and specifically, when the first camera and the second camera are disposed, the first camera and the second camera just can be used to respectively photograph the mark surface and the non-mark surface of the product, and the first camera and the second camera can be used for respectively shooting the equivalent areas of the marking surface and the non-marking surface of the product when being arranged, for example, the first camera shoots the areas (50, 50) - (100 ) of the marking surface of the product, and the second camera just shoots the areas (50, 50) - (100 ) of the non-marking surface of the product under the same arrangement parameters as the first camera.
The step of acquiring a drawing matrix to be measured of the product pointed by the measurement instruction when the measurement instruction for measuring the position deviation of the product mark is detected comprises the following steps:
step S11, when a measurement instruction for measuring the position deviation of a product mark is detected, acquiring a drawing matrix to be measured of the product, which is pointed by the measurement instruction, wherein the drawing matrix to be measured comprises a preset unit drawing matrix or a plurality of preset unit drawing matrices.
When a measurement instruction for measuring the position offset of a product mark is detected, acquiring a drawing matrix to be measured (which may include a plurality of unit matrices) of the product pointed by the measurement instruction, where the measurement product may be an electronic product, and the measurement product may also be a rubber or other resin type product, and the measurement instruction for measuring the position offset of the product mark may be triggered by a user through a click or touch operation on a preset application software corresponding to a PC, and the measurement instruction for measuring the position offset of the product mark carries information of the drawing matrix to be measured, that is, a product drawing is already sketched on the corresponding preset application software, and the user selects or frames the drawing matrix to be measured on the product drawing, where the drawing matrix to be measured may be, for example, a non-unit matrix region between (100, 500) - (100 ) that is, a region of a matrix block, in addition, the drawing matrix to be measured can also be the area of the unit matrix. It should be noted that, because the product includes non-measurement areas such as pins, the purpose of obtaining the product drawing in this embodiment is to filter out irrelevant measurement areas, and in addition, is convenient for the user to select the drawing matrix to be measured.
Step S20, acquiring a first mark area to be measured corresponding to the drawing matrix to be measured in the non-mark surface of the product, placing the mark area to be measured in a preset image taking position area, and performing first image taking on the mark area to be measured through a preset first camera to obtain first coordinate information of the mark area to be measured;
after obtaining the drawing matrix to be measured, acquiring a first marking area to be measured in the non-marking surface of the product, which corresponds to the drawing matrix to be measured, namely, determining the first marking area to be measured in the drawing matrix to be measured in a product real object, and acquiring the first marking area to be measured in the non-marking surface of the product, which corresponds to the drawing matrix to be measured, includes first acquiring an image of a complete product non-marking surface by a camera, identifying the image of the complete product non-marking surface, and further determining the first marking area to be measured in the non-marking surface of the product, which corresponds to the drawing matrix to be measured, it should be noted that determining the first marking area to be measured in the drawing matrix to be measured in the product real object is to determine a reference frame matrix (because the drawing matrix to be measured is framed in the drawing matrix corresponding to the whole product), after the first mark area to be measured is determined, the mark area to be measured is automatically placed in a preset image taking position area, specifically, the mark area to be measured is automatically placed in the preset image taking position area through a motor device, the number of the preset image taking position areas can be multiple or one, wherein matrix information of the preset image taking position area is determined and prestored, after the mark area to be measured is moved, first image taking is carried out on the mark area to be measured through a preset first camera, so that first coordinate information of the mark area to be measured is obtained, wherein the first coordinate information refers to coordinate information corresponding to the mark area to be measured before the mark area to be measured is not moved.
The product is placed in a hollow tray of a preset coordinate acquisition tool;
the step of acquiring a first mark area to be measured corresponding to the drawing matrix to be measured in the non-mark surface of the product, and placing the mark area to be measured in a preset image taking position area, so as to perform first image taking on the mark area to be measured through a preset first camera, and obtain first coordinate information of the mark area to be measured comprises the following steps:
step S21, acquiring a first to-be-measured mark area corresponding to the to-be-measured drawing matrix in the non-mark surface of the product;
step S22, moving the first mark area to be measured to a preset object position area by a preset motor device, and acquiring moving coordinate information of the first mark area to be measured moving to the preset object position area;
in this embodiment, a hollow tray is provided, which cannot block a product, and is controlled by a motor device, after a first mark area to be measured corresponding to the drawing matrix to be measured in the non-mark surface of the product is obtained, the first mark area to be measured is moved to a preset image taking position area by a preset motor device, it should be noted that only one unit matrix in the mark area to be measured can be measured at a time, and in the process of moving the unit matrix of the first mark area to be measured to a preset image taking position area by a preset motor device for multiple times, and in the process of measuring and moving for multiple times, after the hollow tray is moved to the preset image taking position area by a preset motor device, the moving coordinate information of the first mark area to be measured to the preset image taking position area is obtained (automatically recorded by the motor device), the step of moving the first to-be-measured mark region to the preset image taking position region through the preset motor device means that the motor device is controlled to rotate the hollowed-out tray to find the coincidence of the first to-be-measured mark region and the preset image taking position region, wherein the preset image taking position region can mean a region which is determined to be known in matrix position and can be shot by a camera.
Step S23, performing first image taking on the moved mark area to be measured through a preset first camera to obtain first matrix coordinate information of the moved mark area to be measured;
the method comprises the steps of carrying out first image taking on the moved mark area to be measured through a preset first camera to obtain first matrix coordinate information of the moved mark area to be measured, specifically, obtaining matrix coordinates (frame matrix coordinates) of the moved mark area to be measured (formed by each unit matrix) through the preset first camera, and further obtaining the first matrix coordinate information of the moved mark area to be measured.
Step S24, calculating the first coordinate information by the movement coordinate information and the first matrix coordinate information.
And calculating the first coordinate information through the moving coordinate information and the first matrix coordinate information, namely, the moving coordinate is known, the first matrix coordinate is known, namely, the first coordinate of each unit matrix (or unit frame matrix) which is taken in the first to-be-measured mark area in the non-mark surface can be determined, and after the first coordinate of each unit matrix is obtained, the first matrix coordinate of the first to-be-measured mark area is calculated to obtain the first coordinate information.
Step S30, performing second image taking on a second mark area to be measured corresponding to the drawing matrix to be measured in the mark surface of the product through a preset second camera to obtain second coordinate information of a first mark position in the mark area to be measured;
it should be noted that, in this embodiment, the second mark area to be measured corresponding to the drawing matrix to be measured in the mark surface of the product is subjected to second imaging, and in addition to the matrix (frame matrix) corresponding to the second mark area to be measured (the corresponding first coordinate information in the first camera may also be directly used), the first mark bit in the second mark area to be measured is also subjected to mark imaging, as shown in fig. 5, in addition to the frame matrix imaging corresponding to ABC in the drawing, ABC in the drawing is also imaged, that is, in this embodiment, the second coordinate information includes frame matrix coordinates formed by each unit matrix and mark matrix coordinates formed by each first mark position In the label, it should be noted that the flag refers to the label information used to label information such as product name, model number, and type.
The acquisition of the frame matrix coordinates formed by each unit matrix is the same as the acquisition process of the first coordinate information, and no specific description is given here, after the frame matrix coordinates are obtained, the distance between the imaged first mark bit and the frame of the frame matrix is captured by the camera, and the mark matrix coordinates of each first mark bit are correspondingly obtained. Of course, the mark matrix coordinates of each first mark bit may also be obtained by other manners, which are not specifically described herein.
And step S30, obtaining the offset result of the first mark position of the product according to the drawing matrix to be measured, the first coordinate information and the second coordinate information.
After the first coordinate information and the second coordinate information are obtained, obtaining an offset result of a first mark position of the product on preset application software of a computer according to the drawing matrix to be measured, the first coordinate information and the second coordinate information.
Specifically, the step of obtaining the offset result of the first mark position of the product according to the drawing matrix to be measured, the first coordinate information and the second coordinate information includes:
step S41, acquiring second matrix coordinate information of a second mark position in the drawing matrix to be measured, and performing first coordinate fusion on the second matrix coordinate information and the first coordinate information to obtain fused coordinate information;
step S42, carrying out second coordinate fusion on the fusion coordinate information and the second coordinate information to obtain the coincidence degree of the fusion coordinate information and the second coordinate information;
step S43, if the coincidence degree is completely coincident, determining that the offset result of the first mark bit of the product is not offset;
in step S44, if the coincidence degree is not completely coincident, it is determined that the offset result of the first flag bit of the product is an offset.
In this embodiment, first, second matrix coordinate information of a second mark bit or a drawing mark bit (corresponding to a corresponding first mark bit, which may mean if a matrix to which the second mark bit belongs is a 7 th matrix, a matrix to which the first mark bit belongs is also a 7 th matrix, that is, a drawing mark position of the same matrix) in the drawing matrix to be measured is obtained, for example, second matrix coordinate information of ABC in a drawing unit matrix to be measured. And performing first coordinate fusion on the second matrix coordinate information and the first coordinate information, namely, positioning a second mark in the drawing matrix to be measured in a reference frame matrix for comparison. And performing second coordinate fusion on the fusion coordinate information and the second coordinate information, wherein the fusion means that ABC of a certain matrix in the marking surface is compared with ABC of the same matrix of the drawing to be measured, whether the ABC and the ABC are completely overlapped is determined, when the ABC and the ABC are completely overlapped, the deviation result of the first marking position of the product is determined to be not deviated, and when the ABC and the ABC are not completely overlapped, the deviation result of the first marking position of the product is determined to be deviated.
When a measuring instruction for measuring the position deviation of a product mark is detected, a drawing matrix to be measured of the product, which is pointed by the measuring instruction, is obtained; acquiring a first mark area to be measured corresponding to the drawing matrix to be measured in the non-mark surface of the product, and placing the mark area to be measured in a preset image taking position area so as to perform first image taking on the mark area to be measured through a preset first camera to obtain first coordinate information of the mark area to be measured; and carrying out second image taking on a second to-be-measured marking area corresponding to the drawing matrix to be measured in the marking surface of the product through a preset second camera to obtain second coordinate information of a first marking position in the marking area to be measured, and obtaining an offset result of the first marking position of the product according to the drawing matrix to be measured, the first coordinate information and the second coordinate information. In this application, the accuracy obtains first coordinate information and second coordinate information, and according to the volume of awaiting measuring the drawing matrix first coordinate information with second coordinate information obtains the skew result of the first mark position of product, this application is got for instance the back through using the camera promptly, uses the visual mode to synthesize same picture with the mark information of product mark face and the matrix information of non-mark face to direct observation skew result, and in this application, can carry out automatic check when detecting the measuring instruction of measuring product mark position skew, and behind the volume of awaiting measuring mark change, can simply conveniently obtain the first coordinate information that corresponds originally and behind the second coordinate information, the skew result that can direct observation is generated, therefore, there is the operation complicacy when having avoided current mark to measure, problem that measuring cost is high.
Further, based on the foregoing embodiment, the present invention provides another embodiment of the method for measuring a mark position offset of a product, in which if the coincidence degree is not completely coincident, the determining that the offset result of the first mark position of the product is an offset step includes:
step A1, if the contact ratio is not completely contact, acquiring a reference frame matrix formed by the first coordinate information, and acquiring a first coordinate difference value between a most edge coordinate corresponding to the first mark position and a most frame coordinate corresponding to the reference frame matrix;
in this embodiment, if the overlap ratio is not completely overlapped, a reference frame matrix formed by the first coordinate information is obtained, that is, coordinates of each outermost frame of the reference frame matrix are obtained, and after the coordinates of each outermost frame are obtained, a first coordinate difference value between the outermost coordinate corresponding to the first mark bit, for example, the coordinate of the rightmost point, and the outermost frame coordinate (rightmost frame coordinate) corresponding to the reference frame matrix is obtained.
Step A2, obtaining a second coordinate difference value between the second mark position and the most frame coordinate;
step a3, determining the offset result of the first mark bit of the product as an offset according to the first coordinate difference and the second coordinate difference, and determining the offset value of the offset result.
And acquiring a second coordinate difference value between the second mark position and the most frame coordinate, specifically, acquiring a second coordinate difference value between the most frame coordinate corresponding to the second mark position, such as the coordinate of the rightmost point and the most frame coordinate (the rightmost frame coordinate) corresponding to the reference frame matrix, if the first coordinate difference value is different from the second coordinate difference value, determining that the offset result of the first mark position of the product is offset, and determining an offset value of the offset result, where the offset value is a third difference value between the first coordinate difference value and the second coordinate difference value.
The step of determining an offset value of the offset result then comprises:
step B1, judging whether the deviation value is larger than a preset deviation value, if so, measuring the first mark bit again to obtain a re-measurement result;
in order to avoid possible false identification and enhance the fault-tolerant function, in this embodiment, it is determined whether the offset value is greater than a preset offset value, and if the offset value is greater than the preset offset value, the first flag bit is measured again to obtain a re-measurement result.
And step B2, if the re-measurement result is inconsistent with the offset result, outputting prompt information.
If the re-measurement result is inconsistent with the offset result, outputting prompt information such as voice prompt information, and if the re-measurement result is consistent with the offset result, determining that the offset result is correct.
In this embodiment, if the contact ratio is not completely contact, a reference frame matrix formed by the first coordinate information is obtained, and a first coordinate difference between a most edge coordinate corresponding to the first mark bit and a most edge coordinate corresponding to the reference frame matrix is obtained; acquiring a second coordinate difference value of the second mark position and the most frame coordinate; and determining the offset result of the first mark bit of the product as the offset according to the first coordinate difference value and the second coordinate difference value, and determining the offset value of the offset result. The embodiment realizes accurate license plate recognition.
Further, based on the foregoing embodiment, the present invention provides another embodiment of a method for measuring a product mark position offset, where in this embodiment, the step of obtaining an offset result of a first mark position of a product according to the drawing matrix to be measured, the first coordinate information, and the second coordinate information includes:
step S50, performing identification processing on the first flag bit whose offset result is offset.
In this embodiment, after obtaining the offset result, if the offset result is an offset, the first flag bit whose offset result is an offset is identified, and specifically, the first flag bit whose offset result is an offset is also identified by an offset value.
In this embodiment, the first flag bit whose offset result is offset is also identified. In this embodiment, the first flag bit whose offset result is offset is identified, so that subsequent flag adjustment is facilitated.
Referring to fig. 3, fig. 3 is a schematic device structure diagram of a hardware operating environment according to an embodiment of the present invention.
The measuring equipment for the product mark position deviation can be a PC (personal computer), and can also be terminal equipment such as a smart phone, a tablet computer and a portable computer.
As shown in fig. 3, the measuring apparatus of the product marking position deviation may include: a processor 1001, such as a CPU, a memory 1005, and a communication bus 1002. The communication bus 1002 is used for realizing connection communication between the processor 1001 and the memory 1005. The memory 1005 may be a high-speed RAM memory or a non-volatile memory (e.g., a magnetic disk memory). The memory 1005 may alternatively be a memory device separate from the processor 1001 described above.
Optionally, the device for measuring the product mark position offset may further include a target user interface, a network interface, a camera, a Radio Frequency (RF) circuit, a sensor, an audio circuit, a WiFi module, and the like. The target user interface may include a Display screen (Display), an input unit such as a Keyboard (Keyboard), and the selectable target user interfaces may also include standard wired interfaces, wireless interfaces. The network interface optionally may include a standard wired interface, a wireless interface (e.g., WI-FI interface).
Those skilled in the art will appreciate that the configuration of the product marking offset measurement device shown in fig. 3 does not constitute a limitation of the product marking offset measurement device and may include more or fewer components than shown, or some components in combination, or a different arrangement of components.
As shown in fig. 3, a memory 1005, which is a kind of computer storage medium, may include therein an operating system, a network communication module, and a measurement program of product mark position deviation. The operating system is a program that manages and controls the hardware and software resources of the measuring device for product marking position offsets, supports the operation of the measuring program for product marking position offsets, and other software and/or programs. The network communication module is used for realizing communication among components in the memory 1005 and communication with other hardware and software in the measuring equipment of the product marking position offset.
In the product marking position deviation measuring apparatus shown in fig. 3, the processor 1001 is configured to execute a product marking position deviation measuring program stored in the memory 1005, and implement the steps of any one of the product marking position deviation measuring methods described above.
The specific implementation of the device for measuring the product mark position offset is basically the same as that of the embodiments of the method for measuring the product mark position offset, and is not described herein again.
In addition, an embodiment of the present invention further provides a device for measuring a product mark position deviation, where the device for measuring a product mark position deviation includes:
the detection module is used for acquiring a drawing matrix to be measured of the product, which is pointed by a measurement instruction when the measurement instruction for measuring the position deviation of a product mark is detected;
the first acquisition module is used for acquiring a first mark area to be measured corresponding to the drawing matrix to be measured in the non-mark surface of the product, placing the mark area to be measured in a preset image taking position area, and performing first image taking on the mark area to be measured through a preset first camera to obtain first coordinate information of the mark area to be measured;
the second acquisition module is used for carrying out second image acquisition on a second to-be-measured marking area corresponding to the to-be-measured drawing matrix in the marking surface of the product through a preset second camera so as to obtain second coordinate information of the first marking position in the to-be-measured marking area;
and the third acquisition module is used for acquiring the offset result of the first mark position of the product according to the drawing matrix to be measured, the first coordinate information and the second coordinate information.
Optionally, the product is placed in a hollow tray of a preset coordinate acquisition tool;
the first obtaining module comprises:
the first acquisition unit is used for acquiring a first to-be-measured marking area corresponding to the drawing matrix to be measured in the non-marking surface of the product;
the second acquisition unit is used for moving the first mark area to be measured to a preset object-taking position area through a preset motor device and acquiring moving coordinate information of the first mark area to be measured moving to the preset object-taking position area;
the third acquisition unit is used for carrying out first image taking on the moved mark area to be measured through a preset first camera to obtain first matrix coordinate information of the moved mark area to be measured;
and the calculation unit is used for calculating the first coordinate information through the moving coordinate information and the first matrix coordinate information.
Optionally, the third obtaining module includes:
the fourth acquisition unit is used for acquiring second matrix coordinate information of a second mark bit in the drawing matrix to be measured, and performing first coordinate fusion on the second matrix coordinate information and the first coordinate information to obtain fused coordinate information;
a fifth obtaining unit, configured to perform second coordinate fusion on the fusion coordinate information and the second coordinate information to obtain a coincidence degree of the fusion coordinate information and the second coordinate information;
a first determining unit, configured to determine that a shift result of a first mark bit of the product is not shifted if the coincidence degree is completely coincident;
a second determining unit, configured to determine that the offset result of the first flag bit of the product is an offset if the overlap ratio is not completely overlapped.
Optionally, the second determining unit includes:
the first obtaining subunit is configured to obtain a reference frame matrix formed by the first coordinate information if the overlap ratio is not completely overlapped, and obtain a first coordinate difference between a most edge coordinate corresponding to the first mark bit and a most frame coordinate corresponding to the reference frame matrix;
the second obtaining subunit is configured to obtain a second coordinate difference between the second mark bit and the maximum frame coordinate;
and the determining subunit is configured to determine, according to the first coordinate difference and the second coordinate difference, that the offset result of the first mark bit of the product is an offset, and determine an offset value of the offset result.
Optionally, the product marking position deviation measuring device includes:
the judging module is used for judging whether the deviation value is larger than a preset deviation value or not, and if the deviation value is larger than the preset deviation value, the first mark bit is measured again to obtain a re-measurement result;
and the output module is used for outputting prompt information if the secondary measurement result is inconsistent with the offset result.
Optionally, the product marking position offset measuring device comprises:
and the identification module is used for identifying the first mark bit of which the offset result is offset.
Optionally, the detection module includes:
the fourth acquisition module is used for acquiring a drawing matrix to be measured of the product, which is pointed by the measurement instruction, when the measurement instruction for measuring the position offset of the product mark is detected, wherein the drawing matrix to be measured comprises a preset unit drawing matrix or a plurality of preset unit drawing matrices.
The specific implementation of the device for measuring the product mark position offset is basically the same as that of each embodiment of the method for measuring the product mark position offset, and is not described herein again.
In addition, an embodiment of the present invention further provides a device for measuring a product mark position offset, where the device includes: the memory 109, the processor 110, and the program for measuring the product mark position offset, which is stored in the memory 109 and can be run on the processor 110, are executed by the processor 110 to implement the steps of the embodiments of the method for measuring the product mark position offset.
Furthermore, the present invention also provides a computer medium, which stores one or more programs, which can be executed by one or more processors for implementing the steps of the embodiments of the product mark position offset measurement method.
The development content of the specific implementation of the device and medium (i.e., computer medium) of the present invention is basically the same as that of the embodiments of the measurement method for product mark position offset, and is not described herein again.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The above-mentioned serial numbers of the embodiments of the present invention are merely for description and do not represent the merits of the embodiments.
Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solutions of the present invention may be embodied in the form of a software product, which is stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk) and includes instructions for enabling a terminal (such as a mobile phone, a computer, a server, an air conditioner, or a network device) to execute the method according to the embodiments of the present invention.
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. A method of measuring product marking positional deviation, the method comprising:
when a measuring instruction for measuring the position deviation of a product mark is detected, acquiring a drawing matrix to be measured of the product, which is pointed by the measuring instruction;
acquiring a first mark area to be measured corresponding to the drawing matrix to be measured in the non-mark surface of the product, and placing the mark area to be measured in a preset image taking position area so as to perform first image taking on the mark area to be measured through a preset first camera to obtain first coordinate information of the mark area to be measured;
performing second image taking on a second to-be-measured marking area corresponding to the drawing matrix to be measured in the marking surface of the product through a preset second camera to obtain second coordinate information of a first marking position in the marking area to be measured;
and obtaining the offset result of the first mark position of the product according to the drawing matrix to be measured, the first coordinate information and the second coordinate information.
2. The method for measuring the position deviation of the product mark according to claim 1, wherein the product is placed in a hollow tray of a preset coordinate acquisition tool;
the step of acquiring a first mark area to be measured corresponding to the drawing matrix to be measured in the non-mark surface of the product, and placing the mark area to be measured in a preset image taking position area, so as to perform first image taking on the mark area to be measured through a preset first camera, and obtain first coordinate information of the mark area to be measured comprises the following steps:
acquiring a first to-be-measured marking area corresponding to the drawing matrix to be measured in the non-marking surface of the product;
moving the first mark area to be measured to a preset image taking position area through a preset motor device, and acquiring moving coordinate information of the first mark area to be measured moving to the preset image taking position area;
performing first image taking on the moved mark area to be measured through a preset first camera to obtain first matrix coordinate information of the moved mark area to be measured;
and calculating the first coordinate information through the moving coordinate information and the first matrix coordinate information.
3. The method for measuring the product mark position offset according to claim 1, wherein the step of obtaining the offset result of the first mark position of the product according to the drawing matrix to be measured, the first coordinate information and the second coordinate information comprises:
acquiring second matrix coordinate information of a second mark position in the drawing matrix to be measured, and performing first coordinate fusion on the second matrix coordinate information and the first coordinate information to obtain fused coordinate information;
performing second coordinate fusion on the fusion coordinate information and the second coordinate information to obtain the coincidence degree of the fusion coordinate information and the second coordinate information;
if the coincidence degree is completely coincident, determining that the offset result of the first mark bit of the product is not offset;
and if the coincidence degree is not completely coincident, determining that the offset result of the first mark bit of the product is offset.
4. The method for measuring the mark position offset of the product according to claim 1, wherein the step of determining that the offset result of the first mark position of the product is the offset if the coincidence degree is not completely coincident comprises:
if the contact ratio is not completely overlapped, acquiring a reference frame matrix formed by the first coordinate information and acquiring a first coordinate difference value of a most edge coordinate corresponding to the first mark position and a most frame coordinate corresponding to the reference frame matrix;
acquiring a second coordinate difference value of the second mark position and the most frame coordinate;
and determining the offset result of the first mark bit of the product as the offset according to the first coordinate difference value and the second coordinate difference value, and determining the offset value of the offset result.
5. The method of measuring product marking positional offset of claim 4, wherein said step of determining an offset value of said offset result is followed by the steps of:
judging whether the deviation value is larger than a preset deviation value or not, and if the deviation value is larger than the preset deviation value, measuring the first mark bit again to obtain a re-measurement result;
and if the re-measurement result is inconsistent with the offset result, outputting prompt information.
6. The method for measuring the product mark position offset according to any one of claims 1-4, wherein the step of obtaining the offset result of the first mark position of the product according to the drawing matrix to be measured, the first coordinate information and the second coordinate information comprises the following steps:
and identifying the first mark bit with the offset result as the offset.
7. The method for measuring a product mark position deviation according to claim 1, wherein the step of acquiring a drawing matrix to be measured of the product pointed by the measurement instruction upon detection of the measurement instruction for measuring a product mark position deviation comprises:
when a measurement instruction for measuring the position deviation of a product mark is detected, a drawing matrix to be measured of the product, which is pointed by the measurement instruction, is obtained, wherein the drawing matrix to be measured comprises a preset unit drawing matrix or a plurality of preset unit drawing matrices.
8. A product marking offset measurement device, comprising:
the detection module is used for acquiring a drawing matrix to be measured of the product, which is pointed by a measurement instruction when the measurement instruction for measuring the position deviation of a product mark is detected;
the first acquisition module is used for acquiring a first mark area to be measured corresponding to the drawing matrix to be measured in the non-mark surface of the product, placing the mark area to be measured in a preset image taking position area, and performing first image taking on the mark area to be measured through a preset first camera to obtain first coordinate information of the mark area to be measured;
the second acquisition module is used for carrying out second image acquisition on a second to-be-measured marking area corresponding to the to-be-measured drawing matrix in the marking surface of the product through a preset second camera so as to obtain second coordinate information of the first marking position in the to-be-measured marking area;
and the third acquisition module is used for acquiring the offset result of the first mark position of the product according to the drawing matrix to be measured, the first coordinate information and the second coordinate information.
9. A product marking position offset measurement apparatus, the apparatus comprising: memory, a processor and a program for measuring a product marking positional deviation stored on the memory and executable on the processor, which program when executed by the processor implements the steps of the method for measuring a product marking positional deviation as claimed in any one of claims 1 to 7.
10. A medium having stored thereon a program for measuring a product marking positional deviation, which program, when executed by a processor, carries out the steps of the method for measuring a product marking positional deviation as claimed in any one of claims 1 to 7.
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