CN110951433A - Formula and preparation method of adhesive for pipeline sealing - Google Patents
Formula and preparation method of adhesive for pipeline sealing Download PDFInfo
- Publication number
- CN110951433A CN110951433A CN201911248352.8A CN201911248352A CN110951433A CN 110951433 A CN110951433 A CN 110951433A CN 201911248352 A CN201911248352 A CN 201911248352A CN 110951433 A CN110951433 A CN 110951433A
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- CN
- China
- Prior art keywords
- component
- parts
- curing agent
- pipeline
- sealing
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0856—Iron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/18—Applications used for pipes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Abstract
The invention discloses a formula of an adhesive for sealing a pipeline and a preparation method thereof, relates to the technical field of chemical industry, and provides a scheme aiming at the problem of poor sealing performance of the existing adhesive to the pipeline, wherein the formula comprises a component A and a component B, wherein the component A comprises, by weight, 130 parts of epoxy resin 100, 5-15 parts of an additive, 10-15 parts of an active diluent and 10-40 parts of a filler; the component B comprises 8-40 parts of curing agent and 5-15 parts of non-reactive diluent; the weight ratio of the component A to the component B is 3-5: 1. the prepared adhesive for sealing the pipeline is applied to an online pipeline sealing assembly, has excellent performances such as high elastic modulus, high tensile strength, high creep resistance and the like, can reduce stress and strain at the position of a pipeline defect, recovers and improves the bearing capacity of the pipeline, and has excellent corrosion resistance and excellent adhesion performance with pipelines made of various materials.
Description
Technical Field
The invention relates to the technical field of chemical industry, in particular to a formula of an adhesive for sealing a pipeline and a preparation method thereof.
Background
The pipeline generates a plurality of defects due to corrosion, mechanical damage and the like in the service process, the defects reduce the strength of the pipeline, the bearing capacity of the pipeline cannot reach the original design pressure, and the pipeline generates radial expansion due to internal pressure to generate hoop tensile stress in the pipe wall. Stress concentrations can develop in thinned areas of the tube wall (e.g., corrosion pits) where fracture failure and leakage occur when the stress is greater than the tensile strength limit of the material.
At present, the commonly used pipeline repairing technology, such as welding scar repairing, sleeve repairing or pipe replacement, needs to be fired or stopped for transportation, has higher economic cost and social cost, and in addition, although the clamp repairing method has obvious advantages for treating the leaked pipeline, the defects of complex operation, long time (needing to process a clamp), higher cost and the like exist.
The company develops an online pipeline sealing assembly (medium-low pressure) which consists of three parts, namely high-strength fibers, high-strength filler and high-performance adhesive. When repairing the defect, firstly, filling and leveling the defect part by using the filler, and then winding the high-density composite material formed by compounding the high-strength fiber cloth and the viscose outside the pipeline. The high-density composite material has extremely high tensile strength and elastic modulus after being cured, can effectively control the deformation of the pipeline at the defective part, and realizes the reinforcement and repair of the pipeline defect. The high-performance adhesive is a core part, and the sealing requirements of various pipelines cannot be met by using the conventional common adhesive.
Disclosure of Invention
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention relates to an adhesive formula for sealing a pipeline, which comprises a component A and a component B, wherein the component A comprises 130 parts by weight of epoxy resin 100, 5-15 parts by weight of an additive, 10-15 parts by weight of an active diluent and 10-40 parts by weight of a filler; the component B comprises 8-40 parts of curing agent and 5-15 parts of non-reactive diluent; the weight ratio of the component A to the component B is 3-5: 1.
preferably, the epoxy resin is one or a combination of more than two of glycidyl ether epoxy resin, novolac epoxy resin, glycidyl amine epoxy resin or p-aminophenol triglycidyl epoxy resin; further, one or a combination of two or more of bisphenol a type epoxy resin, bisphenol F monoglycidyl ether, and double AD diglycidyl ether is preferable.
Preferably, the additive is one or a combination of more than two of polysulfide rubber, cyanoacrylate, liquid butyronitrile or polyamide.
Preferably, the reactive diluent is one or a combination of more than two of propylene oxide butyl ether, diglycidyl ether, alkylene glycidyl ether, ethylene glycol diglycidyl ether and o-tolyl glycidyl ether.
Preferably, the filler is one or a combination of more than two of titanium dioxide, iron powder, steel powder, white carbon black, polyurethane plastic, ceramic powder and alumina powder.
Preferably, the curing agent is one or the combination of more than two of aliphatic amine curing agent andor epoxy curing agent; the epoxy curing agent is polythiol epoxy curing agent or low molecular weight polyamide curing agent, and the aliphatic amine curing agent is N, N-dimethylaniline or triethanolamine.
Preferably, the non-reactive diluent is one or a combination of two or more of acetone, dimethylformamide, ethylenediamine or dibutyl ester.
The invention also aims to provide a preparation method of the adhesive formula for sealing the pipeline, which comprises the following steps:
step one, adding the additive and the reactive diluent into the epoxy resin at the temperature of 80-90 ℃ while stirring according to the parts by weight, adding the filler after stirring for 0.3-0.5h, and continuously stirring for 0.5-0.8h to obtain a component A;
step two, adding the curing agent into the non-diluent while stirring, and uniformly mixing to obtain a component B;
and step three, mixing the component A and the component B according to the weight ratio, and uniformly stirring for 2-5h to obtain the product.
Compared with the prior art, the invention has the beneficial effects that:
the adhesive obtained by the invention is applied to pipeline online sealing components, has excellent performances such as high elastic modulus, high tensile strength, high creep resistance and the like, can reduce stress and strain at pipeline defects, and recovers and improves the bearing capacity of pipelines; the welding-free and fire-free pipeline can be repaired under the condition of operating under pressure, and is safe and reliable; the construction is simple and quick, the conveying and setting modes are flexible, the operation time is short (curing within two hours at normal temperature), the corrosion resistance is excellent, the bonding performance with various materials is good, the design life is long, the thickness is not increased, and the subsequent heat preservation and corrosion prevention treatment are convenient.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments of the present invention, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Example 1
Pouring 100 parts of epoxy resin E-51, 10 parts of polysulfide rubber and 10 parts of epoxypropane butyl ether into a three-neck flask, stirring for 0.5h at 90 ℃, then adding 20 parts of iron powder (200 meshes), and stirring for 0.8h to obtain a component A; adding 10 parts of polythiol epoxy curing agent into 15 parts of dimethylformamide while stirring, and stirring for 0.5h to obtain a component B; and stirring and mixing the component A/B for 3 hours at room temperature according to the weight ratio of 4:1 to obtain the product.
Example 2
Pouring 110 parts of epoxy resin E-44, 15 parts of liquid butyronitrile and 10 parts of alkylene glycidyl ether into a three-neck flask, stirring for 0.4h at 80 ℃, then adding 15 parts of titanium dioxide, and stirring for 0.5h to obtain a component A; adding 20 parts of N, N-dimethylaniline into 15 parts of acetone while stirring, and stirring for 1.0h to obtain a component B; and stirring the component A/component B for 2 hours at room temperature according to the weight ratio of 3:1 to obtain the product.
Example 3
Pouring 100 parts of epoxy resin E-51, 10 parts of liquid butyronitrile and 10 parts of o-tolyl glycidyl ether into a three-neck flask, stirring at 85 ℃ for 0.5h, then adding 10 parts of ceramic powder, and stirring for 0.8h to obtain a component A; adding 35 parts of N, N-dimethylaniline into 15 parts of o-tolyl glycidyl ether while stirring, and stirring for 1.0h to obtain a component B; and stirring the component A/component B for 3 hours at room temperature according to the weight ratio of 4:1 to obtain the product.
Example 4
Pouring 80 parts of epoxy resin E-51, 20 parts of epoxy resin E-44, 5 parts of polysulfide rubber and 15 parts of epoxypropane butyl ether into a three-neck flask, stirring for 0.3h at 90 ℃, then adding 20 parts of alumina powder and 5 parts of white carbon black, and stirring for 0.6h to obtain a component A; adding 30 parts of polythiol epoxy curing agent into 15 parts of o-tolyl glycidyl ether while stirring, and stirring for 0.5h to obtain a component B; and stirring the component A/component B for 5 hours at room temperature according to the weight ratio of 4:1 to obtain the product.
Example 5
Pouring 40 parts of epoxy resin E-51, 70 parts of epoxy resin E-44, 10 parts of polysulfide rubber and 15 parts of epoxypropane butyl ether into a three-neck flask, stirring at 85 ℃ for 0.5h, then adding 20 parts of steel, and stirring for 0.6h to obtain a component A; adding 40 parts of polythiol epoxy curing agent into 15 parts of o-tolyl glycidyl ether while stirring, and stirring for 0.5h to obtain a component B; and stirring the component A/component B for 3 hours at room temperature according to the weight ratio of 4:1 to obtain the product.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (8)
1. The adhesive formula for sealing the pipeline is characterized by comprising a component A and a component B, wherein the component A comprises, by weight, 130 parts of epoxy resin 100, 5-15 parts of an additive, 10-15 parts of an active diluent and 10-40 parts of a filler; the component B comprises 8-40 parts of curing agent and 5-15 parts of non-reactive diluent; the weight ratio of the component A to the component B is 3-5: 1.
2. the adhesive formulation for sealing a pipe according to claim 1, wherein the epoxy resin is one or a combination of two or more of glycidyl ether type epoxy resin, novolac epoxy resin, glycidyl amine type epoxy resin, or p-aminophenol triglycidyl epoxy resin; further, one or a combination of two or more of bisphenol a type epoxy resin, bisphenol F monoglycidyl ether, and double AD diglycidyl ether is preferable.
3. The adhesive formulation of claim 1, wherein the additive is one or a combination of two or more of polysulfide rubber, cyanoacrylate, liquid nitrile, or polyamide.
4. The adhesive formulation for sealing a pipe according to claim 1, wherein the reactive diluent is one or a combination of two or more of butyl ether of propylene oxide, diglycidyl ether, alkylene glycidyl ether, ethylene glycol diglycidyl ether, and o-tolyl glycidyl ether.
5. The formula of the adhesive for sealing the pipeline according to claim 1, wherein the filler is one or a combination of more than two of titanium dioxide, iron powder, steel powder, white carbon black, polyurethane plastic, ceramic powder and alumina powder.
6. The formula of the pipeline sealing adhesive according to claim 1, wherein the curing agent is one or a combination of two or more of aliphatic amine curing agent and/or epoxy curing agent; the epoxy curing agent is polythiol epoxy curing agent or low molecular weight polyamide curing agent, and the aliphatic amine curing agent is N, N-dimethylaniline or triethanolamine.
7. The adhesive formulation for sealing a pipe according to claim 1, wherein the non-reactive diluent is one or a combination of two or more of acetone, dimethylformamide, ethylenediamine and dibutyl ester.
8. A method of preparing an adhesive formulation for pipe sealing according to any of claims 1 to 7, comprising the steps of:
step one, adding the additive and the reactive diluent into the epoxy resin at the temperature of 80-90 ℃ while stirring according to the parts by weight, adding the filler after stirring for 0.3-0.5h, and continuously stirring for 0.5-0.8h to obtain a component A;
step two, adding the curing agent into the non-diluent while stirring, and uniformly mixing to obtain a component B;
and step three, mixing the component A and the component B according to the weight ratio, and uniformly stirring for 2-5h to obtain the product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911248352.8A CN110951433A (en) | 2019-12-09 | 2019-12-09 | Formula and preparation method of adhesive for pipeline sealing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911248352.8A CN110951433A (en) | 2019-12-09 | 2019-12-09 | Formula and preparation method of adhesive for pipeline sealing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110951433A true CN110951433A (en) | 2020-04-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911248352.8A Pending CN110951433A (en) | 2019-12-09 | 2019-12-09 | Formula and preparation method of adhesive for pipeline sealing |
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| Country | Link |
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| CN (1) | CN110951433A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115651489A (en) * | 2022-11-18 | 2023-01-31 | 武汉鼎业环保工程技术有限公司 | Polymer nano material for repairing metal piece and preparation method thereof |
Citations (3)
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|---|---|---|---|---|
| CN1766400A (en) * | 2004-10-27 | 2006-05-03 | 中国石油天然气集团公司 | Method for reinforcing defective pipeline and composite material therefor |
| CN102464861A (en) * | 2010-11-18 | 2012-05-23 | 中国石油天然气集团公司 | Pipeline repairing carbon fiber composite material system and application thereof |
| CN109058648A (en) * | 2018-06-29 | 2018-12-21 | 中国石油天然气集团有限公司 | A method of with composite material to the continuous pipe reinforcement recovery of surface damage |
-
2019
- 2019-12-09 CN CN201911248352.8A patent/CN110951433A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1766400A (en) * | 2004-10-27 | 2006-05-03 | 中国石油天然气集团公司 | Method for reinforcing defective pipeline and composite material therefor |
| CN102464861A (en) * | 2010-11-18 | 2012-05-23 | 中国石油天然气集团公司 | Pipeline repairing carbon fiber composite material system and application thereof |
| CN109058648A (en) * | 2018-06-29 | 2018-12-21 | 中国石油天然气集团有限公司 | A method of with composite material to the continuous pipe reinforcement recovery of surface damage |
Non-Patent Citations (4)
| Title |
|---|
| 孔杰: "含缺陷输油管道复合材料修复技术的研究", 《中国优秀硕士学位论文全文数据库 工程科技Ⅰ辑》 * |
| 罗道成等: "高效环氧胶粘剂在煤气管道修补中的应用 ", 《煤化工》 * |
| 贺曼罗: "《环氧树脂胶粘剂》", 30 April 2004, 中国石化出版社 * |
| 陈平等: "《环氧树脂及其应用》", 28 February 2004, 化学工业出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115651489A (en) * | 2022-11-18 | 2023-01-31 | 武汉鼎业环保工程技术有限公司 | Polymer nano material for repairing metal piece and preparation method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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Application publication date: 20200403 |